Fracture resistance testing device for integrated circuit

Abstract

The utility model relates to the technical field of integrated circuit detection, in particular to a bending resistance testing device for an integrated circuit, which comprises a bottom frame, linear modules are fixedly connected to the left side and the right side of the bottom frame, connecting blocks are fixedly connected to the output ends of the linear modules, one end of each connecting block is fixedly connected with an adjusting frame, and the other end of each connecting block is fixedly connected with a connecting rod. A support is fixedly connected to one side of the linear module, a cross rod is fixedly connected to the top end of the support, and a cover plate is fixedly connected to the bottom of the cross rod. The utility model has the advantages that the integrated circuit is clamped in the placing groove, then the linear module is started, the adjusting frame can be lifted upwards, the adjusting frame is moved to the bottom of the cover plate, the adjusting frame can be matched with the cover plate to wrap the integrated circuit board, fragments are prevented from splashing outwards, and the purpose of protecting workers is achieved; and the inclined surface directly guides the fragments into the collecting box in the clamping frame, so that the purpose of conveniently collecting and cleaning the fragments in the collecting box is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit detection, in particular to a bending resistance testing device for integrated circuits. Background Art

[0002] An integrated circuit is a miniature electronic device or component. It uses a certain process to interconnect the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit. It is manufactured on a small piece or several small pieces of semiconductor wafers or dielectric substrates, and then packaged in a tube shell to become a miniature structure with the required circuit function. The completed integrated circuit needs to be tested for its flexural performance, usually using a stamping device.

[0003] A corrugated cardboard flexural performance testing device disclosed in Chinese patent CN218470411U uses a hydraulic cylinder to apply pressure, and the applied pressure can be adjusted as needed. The bending condition of the corrugated cardboard is observed under multiple sets of pressure. Although the device can observe the bending condition of the material very well, integrated circuits with a certain plasticity may collapse when subjected to huge pressure, and the flying fragments may injure the inspectors. Utility Model Content

[0004] The purpose of the present invention is to solve at least one of the above technical deficiencies.

[0005] The purpose of the utility model is to overcome the shortcomings of the prior art, solve the problems mentioned in the background technology, and provide a bending resistance testing device for integrated circuits.

[0006] The purpose of the utility model is achieved through the following technical solutions: A bending resistance test device for integrated circuits, comprising a bottom frame, the left and right sides of the bottom frame are fixedly connected with linear modules, the output end of the linear module is fixedly connected with a connecting block, one end of the connecting block is fixedly connected with an adjusting frame, one side of the linear module is fixedly connected with a bracket, the top of the bracket is fixedly connected with a cross bar, and the bottom of the cross bar is fixedly connected with a cover plate;

[0007] The bottom of the bottom frame is fixedly connected to a bottom plate, the front and rear sides of the top of the bottom plate are provided with inclined surfaces, the center of the top of the bottom plate is fixedly connected to a detection platform, the top of the detection platform is fixedly connected to a vertical plate, the top of the vertical plate is provided with a placement groove, the side of the bottom frame close to the inclined surface is fixedly connected to a card frame, and the interior of the card frame is carded with a collection box.

[0008] Preferably, a hydraulic rod is fixedly connected to the center of the top of the cross bar, and a bending pressure plate is fixedly connected to the output end of the hydraulic rod, and the bending pressure plate is located directly above the top of the detection platform.

[0009] By adopting the above technical solution, the hydraulic rod can be started to bend and test the integrated circuit board through the descending bending pressure plate.

[0010] Preferably, the internal dimension of the card frame is adapted to the length of the bottom plate, the length of the card frame is the same as the length of the bottom frame, the size of the collection box is adapted to the internal dimension of the card frame, and pull plates are fixedly connected to both the left and right sides of the top of the collection box.

[0011] By adopting the above technical solution, the card frame can place the collection box, and the collection box can collect the debris sliding out on the inclined plane.

[0012] Preferably, the number of the linear modules is two, and the two linear modules are respectively located at the centers of the left and right sides of the bottom frame. A sliding groove is formed inside the bottom frame, and the adjustment frame is movably connected inside the sliding groove.

[0013] By adopting the above technical solution, the two linear modules can adjust the height of the adjustment frame inside the bottom frame.

[0014] Preferably, the size of the cover plate is adapted to the size of the top of the adjustment frame. The cross bar is welded to the cover plate. A through groove is formed at the center of the cover plate. The output end of the hydraulic rod is movably connected inside the through groove. Both the adjustment frame and the cover plate are transparent plates.

[0015] By adopting the above technical solution, the adjustment frame can cooperate with the cover plate to wrap the integrated circuit board to prevent debris from splashing outwards.

[0016] Preferably, the number of the vertical plates is two, and the two vertical plates are respectively welded to the left and right sides of the top of the detection platform. A placement groove is formed at the top of the vertical plate, and the placement groove is a rectangular groove.

[0017] By adopting the above technical solution, the integrated circuit can be clamped in the placement groove, and the positioning of the integrated circuit can be quickly completed.

[0018] Compared with the prior art, the utility model has the following advantages:

[0019] 1. For the anti-flexure performance test device for integrated circuits, by setting an adjustment frame, a connecting block is fixedly connected to the output end of the linear module, one end of the connecting block is fixedly connected to the adjustment frame, a cover plate is fixedly connected to the bottom of the cross bar, and both the adjustment frame and the cover plate are transparent plates. Clamp the integrated circuit in the placement groove, and then start the linear module to lift the adjustment frame upwards. When the adjustment frame moves to the bottom of the cover plate, the adjustment frame can cooperate with the cover plate to wrap the integrated circuit board to prevent debris from splashing outwards, achieving the purpose of protecting the staff.

[0020] 2. The anti-folding performance testing device for the integrated circuit is provided with inclined planes. The front and rear sides of the top of the bottom plate are both provided with inclined planes. A clamping frame is fixedly connected to one side of the bottom frame close to the inclined plane. A collection box is clamped inside the clamping frame. When the integrated circuit is crushed, some fragments directly fall on the inclined planes at the top of the bottom plate, and the fragments remaining on the top of the detection platform can also be swept onto the top of the bottom plate. The inclined planes directly guide the fragments into the collection box inside the clamping frame. The collection box can be taken out of the inside of the clamping frame by holding the pulling plate, and then the fragments inside the collection box can be cleaned, achieving the purpose of facilitating the collection and cleaning of the fragments. Description of the Drawings

[0021] Figure 1 is a schematic structural diagram of the present utility model;

[0022] Figure 2 is a schematic structural diagram of the adjustment frame of the present utility model;

[0023] Figure 3 is a schematic structural diagram of the bottom plate of the present utility model;

[0024] Figure 4 is a schematic structural diagram of the collection box of the present utility model.

[0025] In the figure: 1-bottom frame, 2-linear module, 3-connecting block, 4-adjustment frame, 5-bracket, 6-cross bar, 7-cover plate, 8-bottom plate, 9-inclined plane, 10-detection platform, 11-vertical plate, 12-placement groove, 13-clamping frame, 14-collection box, 15-hydraulic rod, 16-bent pressing plate, 17-pulling plate, 18-sliding groove. Detailed Embodiment

[0026] The additional aspects and advantages of the present utility model will be further given in the following description with reference to the drawings, and some will become obvious from the following description, or will be understood through the practice of the present utility model.

[0027] As Figure 1-2 shown, an anti-folding performance testing device for an integrated circuit includes a bottom frame 1. Linear modules 2 are installed on both the left and right sides of the bottom frame 1. A connecting block 3 is welded to the output end of the linear module 2. One end of the connecting block 3 is welded to an adjustment frame 4. A bracket 5 is welded to one side of the linear module 2. A cross bar 6 is welded to the top end of the bracket 5. A cover plate 7 is installed at the bottom of the cross bar 6 through screws.

[0028] Through the above settings, the integrated circuit is clamped in the placement groove 12, and then the linear module 2 is started to lift the adjustment frame 4 upward in height. The adjustment frame 4 moves to the bottom of the cover plate 7. The adjustment frame 4 can cooperate with the cover plate 7 to wrap the integrated circuit board, avoiding the fragments from splashing outwards, achieving the purpose of protecting the staff;

[0029] As Figure 1 andFigure 3-4 As shown in the figure, a bottom plate 8 is welded to the bottom of the bottom frame 1. Slopes 9 are provided on both the front and rear sides of the top of the bottom plate 8. A detection platform 10 is welded at the center of the top of the bottom plate 8. A vertical plate 11 is welded to the top of the detection platform 10. A placement groove 12 is provided at the top of the vertical plate 11. A clamping frame 13 is welded to one side of the bottom frame 1 close to the slope 9. A collection box 14 is clamped inside the clamping frame 13;

[0030] With the above settings, when the integrated circuit is crushed, some of the fragments directly fall on the slope 9 at the top of the bottom plate 8, and the fragments remaining on the top of the detection platform 10 can also be swept onto the top of the bottom plate 8. The slope 9 directly guides the fragments into the collection box 14 inside the clamping frame 13. The collection box 14 can be taken out of the inside of the clamping frame 13 by holding the pull plate 17, and then the fragments inside the collection box 14 can be cleaned, achieving the purpose of facilitating the collection and cleaning of the fragments;

[0031] As a preferred technical solution of the present utility model, a hydraulic rod 15 is fixedly connected to the center of the top of the cross bar 6. The output end of the hydraulic rod 15 is fixedly connected to a bent pressing plate 16, and the bent pressing plate 16 is located directly above the top of the detection platform 10.

[0032] As a preferred technical solution of the present utility model, the internal size of the clamping frame 13 is adapted to the length of the bottom plate 8. The length of the clamping frame 13 is the same as the length of the bottom frame 1. The size of the collection box 14 is adapted to the internal size of the clamping frame 13. Pull plates 17 are fixedly connected to both the left and right sides of the top of the collection box 14.

[0033] As a preferred technical solution of the present utility model, the number of the linear modules 2 is two. The two linear modules 2 are respectively located at the centers of the left and right sides of the bottom frame 1. A sliding groove 18 is provided inside the bottom frame 1, and the adjusting frame 4 is movably connected inside the sliding groove 18.

[0034] As a preferred technical solution of the present utility model, the size of the cover plate 7 is adapted to the size of the top of the adjusting frame 4. The cross bar 6 and the cover plate 7 are connected by welding. A through groove is provided at the center of the cover plate 7. The output end of the hydraulic rod 15 is movably connected inside the through groove. Both the adjusting frame 4 and the cover plate 7 are transparent plates.

[0035] As a preferred technical solution of the present utility model, the number of the vertical plates 11 is two. The two vertical plates 11 are respectively welded to the left and right sides of the top of the detection platform 10. A placement groove 12 is provided at the top of the vertical plate 11, and the placement groove 12 is a rectangular groove.

[0036] The working process of the present utility model is as follows:

[0037] S1. Clamp the integrated circuit in the placement groove 12;

[0038] S2. Start the linear module 2 to lift the adjustment frame 4 upward. When the adjustment frame 4 moves to the bottom of the cover plate 7, the adjustment frame 4 can cooperate with the cover plate 7 to wrap the integrated circuit board.

[0039] S3. Start the hydraulic rod 15, and the bending pressure plate 16 that descends can be used to perform a bending test on the integrated circuit board.

[0040] S4. Some of the fragments directly fall on the inclined surface 9 at the top of the bottom plate 8, and the fragments remaining on the top of the detection platform 10 can also be swept onto the top of the bottom plate 8. The inclined surface 9 directly guides the fragments into the collection box 14 inside the card frame 13.

[0041] S5. Hold the pull plate 17 to take out the collection box 14 from inside the card frame 13, and then the fragments inside the collection box 14 can be cleaned up.

[0042] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A flexure resistance test device for integrated circuits, characterized in that: It includes a bottom frame (1). Linear modules (2) are fixedly connected to both the left and right sides of the bottom frame (1). The output end of the linear module (2) is fixedly connected to a connecting block (3). One end of the connecting block (3) is fixedly connected to an adjustment frame (4). A support (5) is fixedly connected to one side of the linear module (2). The top of the support (5) is fixedly connected to a cross bar (6). The bottom of the cross bar (6) is fixedly connected to a cover plate (7). The bottom of the bottom frame (1) is fixedly connected to a bottom plate (8). Inclined surfaces (9) are provided on both the front and rear sides of the top of the bottom plate (8). A detection platform (10) is fixedly connected to the center of the top of the bottom plate (8). A vertical plate (11) is fixedly connected to the top of the detection platform (10). A placement groove (12) is provided on the top of the vertical plate (11). A clamping frame (13) is fixedly connected to one side of the bottom frame (1) close to the inclined surface (9). A collection box (14) is clamped inside the clamping frame (13).

2. The anti-flexure performance testing device for an integrated circuit according to claim 1, characterized in that: A hydraulic rod (15) is fixedly connected to the center of the top of the cross bar (6). The output end of the hydraulic rod (15) is fixedly connected to a bent pressing plate (16). The bent pressing plate (16) is located directly above the top of the detection platform (10).

3. The anti-flexure performance testing device for an integrated circuit according to claim 1, wherein: The internal dimension of the clamping frame (13) is adapted to the length of the bottom plate (8). The length of the clamping frame (13) is the same as the length of the bottom frame (1). The dimension of the collection box (14) is adapted to the internal dimension of the clamping frame (13). Pulling plates (17) are fixedly connected to both the left and right sides of the top of the collection box (14).

4. The anti-flexure performance testing device for an integrated circuit according to claim 1, wherein: The number of the linear modules (2) is two. The two linear modules (2) are respectively located at the centers of the left and right sides of the bottom frame (1). A sliding groove (18) is provided inside the bottom frame (1). The adjustment frame (4) is movably connected to the inside of the sliding groove (18).

5. The anti-flexure performance testing device for an integrated circuit according to claim 2, wherein: The dimension of the cover plate (7) is adapted to the dimension of the top of the adjustment frame (4). The connection mode between the cross bar (6) and the cover plate (7) is welding. A through groove is provided at the center of the cover plate (7). The output end of the hydraulic rod (15) is movably connected to the inside of the through groove. Both the adjustment frame (4) and the cover plate (7) are transparent plates.

6. The anti-flexure performance testing device for an integrated circuit according to claim 1, wherein: The number of the vertical plates (11) is two. The two vertical plates (11) are respectively welded to the left and right sides of the top of the detection platform (10). A placement groove (12) is provided on the top of the vertical plate (11). The placement groove (12) is a rectangular groove.

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