Cleaning basket for soaking and separating wafer and slide glass

Abstract

The utility model discloses a cleaning basket for soaking and separating a wafer and a slide glass, which belongs to the technical field of semiconductor wafer cleaning and comprises a wafer bearing disc and a handheld support. The device is characterized in that M through holes are formed in the wafer bearing disc; m is a natural number greater than 0; n slide glass supports and L blocking cylinders are arranged on the upper surface of the wafer bearing disc, and both L and N are natural numbers greater than 1; the slide glass support is located around the M through holes, and the blocking column bodies are located around the slide glass support; a suspension fulcrum is arranged on the lower surface of the wafer bearing disc; and the height of the blocking column body is greater than that of the slide glass bracket. According to the utility model, the slide glass support is arranged at the inner side of the blocking column body and can support the slide glass, and a wafer falling space is formed between the slide glass support and the bearing disc, so that when the wafer is separated from the slide glass, the wafer can smoothly and accurately fall onto the wafer bearing disc, collision and friction are avoided, and the integrity of the wafer is protected.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor wafer cleaning, and particularly relates to a cleaning basket for soaking and separating wafers from carrier wafers. Background Art

[0002] Existing semiconductor wafer cleaning baskets only support the cleaning of individual wafers during the wafer cleaning process and do not support the soaking and separation process of adhered carrier wafers and wafers. Whether it is a vertical multi-wafer basket or a planar single-wafer basket, the safe soaking and separation after wafers of different thicknesses and different sizes are bonded together have not been solved. When the wafers need to be separated from the carrier wafers, the two are in the same space. Even after the interface is separated, the carrier wafers and the wafers will be crowded in the same space, and the contact surfaces will rub against each other and cause scratches. At the same time, various stains on the carrier wafers will also contaminate the wafers during the frictional contact with the wafers. The carrier wafers and the wafers are stacked together without a clamping space, which is not convenient to take out the separated wafers. Fragments are easily generated during the taking-out process, and the taking-out process of the wafers is likely to cause secondary contamination of the wafers. Summary of the Utility Model

[0003] In order to solve the technical problems existing in the known technology, the utility model provides a cleaning basket for soaking and separating wafers from carrier wafers, which is convenient for the soaking and separation of wafers from carrier wafers and improves the soaking and separation efficiency.

[0004] The purpose of the utility model is to provide a cleaning basket for soaking and separating wafers from carrier wafers, which includes a wafer carrier disk and a hand-held bracket; M through holes are formed in the wafer carrier disk; M is a natural number greater than 0; N carrier wafer brackets and L blocking columns are arranged on the upper surface of the wafer carrier disk, and both L and N are natural numbers greater than 1; the carrier wafer brackets are located around the M through holes, and the blocking columns are located around the carrier wafer brackets; a suspended fulcrum is arranged on the lower surface of the wafer carrier disk; the height of the blocking columns is greater than the height of the carrier wafer brackets.

[0005] Preferably, the wafer carrier disk is of a cylindrical structure, and an inscribed relationship exists between the blocking columns and the wafer carrier disk.

[0006] Preferably, the N carrier wafer brackets are evenly distributed on the same circumference.

[0007] Preferably, the L blocking columns are evenly distributed on the same circumference.

[0008] Preferably, the hand-held bracket is of a portal structure and is connected to the wafer carrier disk.

[0009] Preferably, the diameter of the through holes is greater than the diameter of the wafers.

[0010] Preferably, the number of the carrier wafer brackets is equal to the number of the L blocking columns.

[0011] The advantages and positive effects of the present utility model are as follows:

[0012] Through the wafer carrier bracket placed inside the blocking cylinder, the present utility model provides a suspended wafer carrying position. When the wafer is separated from the carrier, the wafer can smoothly and accurately fall onto the wafer carrier tray, improving the soaking and separation efficiency, avoiding collision and friction, and protecting the integrity of the wafer. Description of the Drawings

[0013] Figure 1 It is a structural diagram of a preferred embodiment of the present utility model;

[0014] Figure 2 It is a bottom structural diagram of the wafer carrier tray in a preferred embodiment of the present utility model;

[0015] Figure 3 It is an axial sectional view of a preferred embodiment of the present utility model.

[0016] Wherein: 1. Handheld bracket; 2. Suspended fulcrum; 3. Wafer carrier tray; 4. Wafer carrier bracket; 5. Blocking cylinder; 6. Through hole. Detailed Description of the Preferred Embodiment

[0017] In order to make the above objects, control system and advantages of the present utility model more clear and understandable, the present utility model will be further described in detail below in conjunction with the embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0018] The components described and shown in the drawings of the present embodiment can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present utility model provided in the drawings is not intended to limit the scope of the present utility model claimed, but merely represents the selected embodiments of the present utility model. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative efforts fall within the scope of protection of the present utility model.

[0019] In the description of the present utility model, it should also be noted that unless otherwise clearly defined and limited, the term "connection" should be understood in a broad sense. For example, it can be integrally formed, or it can be a detachable connection; it can be a mechanical connection, or it can be an electromagnetic connection; it can be directly connected, or it can be indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meaning of the above terms in the present utility model can be understood according to the applicable scenarios.

[0020] A wafer refers to any semiconductor characteristic material in the semiconductor industry, mainly including gallium arsenide, indium phosphide, silicon, and circular sheet materials prepared from group III-V compound semiconductors, group II-VI compound semiconductors, and semiconductor elemental materials in the periodic table of chemical elements;

[0021] In the prior art, during the process of cleaning wafers, only the cleaning of independent wafers is supported, and the process of soaking and separating the carrier and wafer adhered together is not supported. Whether it is a vertical multi-wafer basket or a planar single-wafer basket, the safe soaking and separation after bonding wafers of different thicknesses and different sizes are not solved. When the wafer needs to be separated from the carrier, the two are in the same space. Even after the interface is separated, the carrier and the wafer will be crowded in the same space, and the contact surfaces will rub against each other, causing scratches. At the same time, various stains on the carrier will also contaminate the wafer during the friction contact with the wafer. The carrier and the wafer are stacked together, there is no clamping space, it is not convenient to take out the separated wafer, fragments are easily generated during the taking-out process, and the wafer is easily secondarily contaminated during the taking-out process.

[0022] The technical solution of the present utility model is as follows:

[0023] Please refer to Figures 1 to 3 , a cleaning basket for soaking and separating wafers and carriers, including a wafer carrier plate 3 and a hand-held bracket 1; the hand-held bracket 1 can be selected in a portal structure, so that the two sides are evenly stressed during extraction, and the hand-held bracket 1 is fixedly connected or detachably connected to the wafer carrier plate 3;

[0024] One or more through holes 6 are provided on the wafer carrier plate 3, and the through holes are used to place wafers. The through holes 6 are circular or elliptical, and the diameter of the through holes 6 is slightly larger than the diameter of the wafers; a plurality of carrier supports 4 and a plurality of blocking columns 5 are arranged on the upper surface of the wafer carrier plate 3; the carrier supports 4 are located around the plurality of through holes 6, and the blocking columns 5 are located around the carrier supports 4; a suspended fulcrum 2 is arranged on the lower surface of the wafer carrier plate 3; the height of the blocking columns 5 is greater than the height of the carrier supports 4. The wafer carrier plate 3 is of a cylindrical structure, and the blocking columns 5 are in an inscribed relationship with the wafer carrier plate 3. A plurality of carrier supports 4 are evenly distributed on the same circumference. A plurality of blocking columns 5 are evenly distributed on the same circumference. The number of the carrier supports 4 is equal to the number of the L blocking columns 5.

[0025] In the above preferred embodiment: As Figure 3As shown, a stepped structure is formed between the upper surfaces of the blocking cylinder 5, the wafer carrier bracket 4, and the wafer carrier plate 3. Therefore, it is named a stepped wafer carrier basket hereinafter. The cleaning basket mainly includes a stepped wafer carrier basket and a handheld bracket. Among them, the stepped wafer carrier basket is provided with a suspended fulcrum 2 of a preset size, a wafer carrier plate 3, a wafer carrier bracket 4, a blocking cylinder 5, and a through hole 6. The handheld bracket 1 is connected to the edge of the wafer carrier plate 3.

[0026] Uniformly distributed suspended fulcrums 2 are provided at the bottom of the wafer carrier plate 3.

[0027] The suspended fulcrums 2 are uniformly distributed around the bottom of the wafer carrier plate 3. A through hole 6 of a preset size is opened in the central area of the surface of the wafer carrier plate 3. There are multiple through holes 6, which are uniformly distributed in the central area of the wafer carrier plate 3.

[0028] The size of the wafer carrier plate 3 is larger than the diameter of the wafer to be processed.

[0029] Multiple blocking cylinders 5 are uniformly distributed around the top of the wafer carrier plate 3, and the blocking cylinders 5 are inscribed in the edge of the wafer carrier plate 3. A wafer carrier bracket 4 is provided inside each blocking cylinder 5 adjacent to it.

[0030] The wafer carrier brackets 4 are distributed outside the set of all through holes 6 and inside all the blocking cylinders 5.

[0031] The wafer carrier plate 3, the wafer carrier bracket 4, and the blocking cylinder 5 are of an integrally formed structure.

[0032] The handheld bracket 1 is composed of a cross beam and two vertical beams connected. The cross beam is perpendicular to the vertical beams. The cross beam is located at the top of the two vertical beams and is connected to the inside of the two vertical beams. The height of the vertical beams can have different sizes according to the scenario.

[0033] The stepped wafer carrier basket is an integral part of the basket. The stepped wafer carrier basket is connected to the lower end of the handheld bracket 1 and is perpendicularly connected to the vertical beams of the handheld bracket. The overall diameter of the basket is slightly larger than the length of the cross beam.

[0034] The wafer carrier plate 3 can be the base of the stepped wafer carrier basket, or a raised or sunken position can be independently set inside the stepped wafer carrier basket as the wafer carrier plate 3. Its shape is circular, and its size is slightly larger than the wafer diameter, and it is used for the wafer bearing space after the wafer falls off.

[0035] The suspended fulcrums 2 are located at the bottom of the stepped wafer carrier basket, connected to the wafer carrier plate 3, uniformly distributed around the bottom edge of the stepped wafer carrier basket, with a diameter smaller than the difference between the wafer carrier plate and the stepped wafer carrier basket diameters, and the height is not specifically limited. It is based on saving the soaking space as much as possible, playing a supporting role, reserving the bottom space, so that the soaking solution can form a flowing space with the solution inside the stepped wafer carrier basket, increasing the solution disturbance area.

[0036] In order to restrain and fix the carrier wafer, a blocking column 5 is provided at the top of the stepped carrier wafer basket. A plurality of blocking columns 5 are evenly distributed around the top of the wafer carrier 3 to play a role in fixing the carrier.

[0037] During operation, the carrier wafer bonded with the wafer is buckled on the carrier wafer bracket 4. The carrier wafer brackets 4 are evenly arranged inside the blocking column 5. The evenly arranged carrier wafer brackets 4 enclose a circular space. The diameter of the circular space is slightly larger than the diameter of the wafer. When soaking and dewaxing, the wafer can smoothly fall into the circular space.

[0038] Circular through holes 6 are arranged within the circular space. During the soaking process, the solution circulates and disturbs through the through holes to dissolve the bonding medium until the wafer is separated from the carrier wafer.

[0039] In the embodiment of the present utility model, the components mentioned are made of polytetrafluoroethylene material. This material is a high molecular compound polymerized from tetrafluoroethylene and has excellent corrosion resistance, high lubrication and non-sticking property, electrical insulation property and good anti-aging ability. It can effectively extend the service life of the basket and improve the cleaning effect.

[0040] The above description is only a preferred embodiment of the present utility model, and does not impose any form of limitation on the present utility model. Any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present utility model are all within the scope of the technical solution of the present utility model.

Claims

1. A cleaning basket for wafer and carrier soaking separation, comprising a wafer carrier plate (3) and a hand-held bracket (1); characterized in that: The wafer carrier (3) is provided with M through holes (6); M is a natural number greater than 0; N wafer carriers (4) and L blocking cylinders (5) are arranged on the upper surface of the wafer carrier (3), and both L and N are natural numbers greater than 1; the wafer carriers (4) are located around the M through holes (6), and the blocking cylinders (5) are located around the wafer carriers (4); a suspended fulcrum (2) is arranged on the lower surface of the wafer carrier (3); the height of the blocking cylinder (5) is greater than the height of the wafer carrier (4).

2. The cleaning basket for wafer and carrier soaking separation according to claim 1, characterized in that, The wafer carrier (3) is of a cylindrical structure, and the blocking cylinder (5) is in an inscribed relationship with the wafer carrier (3).

3. The cleaning basket for wafer and carrier soaking separation according to claim 1, wherein The N wafer carriers (4) are evenly distributed on the same circumference.

4. The cleaning basket for wafer and carrier soaking separation according to claim 1, wherein The L blocking cylinders (5) are evenly distributed on the same circumference.

5. The cleaning basket for wafer and carrier soaking separation according to claim 1, characterized in that, The hand-held bracket (1) is of a portal structure, and the hand-held bracket (1) is connected to the wafer carrier (3).

6. The cleaning basket for wafer and carrier soaking separation according to claim 1, characterized in that, The diameter of the through hole (6) is greater than the diameter of the wafer.

7. The cleaning basket for wafer and carrier soaking separation according to claim 1, characterized in that, The number of the wafer carriers (4) is equal to the number of the L blocking cylinders (5).

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