Multifunctional microelectronic component chip classifier

Abstract

The utility model relates to the technical field of classifiers, in particular to a multifunctional microelectronic component chip classifier. The device comprises a base, a rectangular groove is formed in the top of the base, an annular hole groove is formed in the upper side of a perforated plate, the top of the base is fixedly connected with the bottom of a side plate, the outer side of the side plate is fixedly connected with the inner end of a columnar block, the outer surface of the columnar block is fixedly connected with the interior of a fixing plate, and the top of the fixing plate is rotationally connected with an L-shaped plate; and the inner side of the L-shaped plate is slidably connected with the inner surface of a porous plate. The fixing plate is fixed to the columnar block, the L-shaped plate rotates at the top of the fixing plate, the L-shaped plate is driven to rotate to clamp the perforated plate in the L-shaped plate, fine adjustment is conducted through the bolt, when clamping is tight, the bolt is screwed inwards to enable the perforated plate to move inwards, and when clamping is loose, the perforated plate is screwed inwards to clamp the perforated plate. And the perforated plate moves outwards by screwing the bolts outwards, so that the clamping width of the chip can be finely adjusted, and the application range is widened.

Description

Technical Field

[0001] The utility model relates to the technical field of classifiers, and specifically, to a multi-functional microelectronic component chip classifier. Background Art

[0002] Due to the increasingly complex structure of electronic products and the increasing demand for various types of chips, a large number of chips are also derived and need to be transferred and classified between different workstations during the production and manufacturing process. A chip is encapsulated by an internal wafer (a dense integrated circuit) plus a small shell. When under pressure, the outer black shell similar to plastic is damaged first (at this time the chip can still work). After greater pressure, the internal wafer is damaged and the chip cannot work.

[0003] For chip classifiers, there are many existing technologies, such as:

[0004] Chinese Patent Application No. 202011195720.X discloses a chip ejector located on one side of a carrier table, and a classifier located between the carrier table and the sorting table, with a carrier table and a sorting table arranged at intervals from each other. The carrier table is used to hold a soft film and a plurality of chips arranged on the soft film. When the classifier is in a suction position, the classifier faces the chip ejector, and the chip ejector repeatedly operates to push a plurality of the chips towards the classifier, so that the classifier holds a plurality of the chips by gravity and its suction force. When the classifier is in a sorting position, the classifier faces the sorting table and is used to synchronously arrange a plurality of the chips it holds on the sorting table. Accordingly, the classifier can effectively utilize gravity and its suction force to hold a plurality of chips, thereby achieving a large-scale transfer effect of a plurality of chips.

[0005] However, when the existing technology chip classifier is reading, the device may undergo various angular changes, resulting in the chips falling off or being unstable due to inertia, and the chips cannot be overly squeezed, otherwise they will be damaged. If the squeezing is small, they may fall off, and it cannot be adjusted with high precision, and the applicable range is small. In view of this, we propose a multi-functional microelectronic component chip classifier. Summary of the Utility Model

[0006] The purpose of the present utility model is to solve the above-mentioned drawbacks and provide a multi-functional microelectronic component chip classifier;

[0007] To achieve the above object, the present utility model provides a multi-functional microelectronic component chip classifier, which includes a base. A rectangular groove is opened at the top of the base. An annular hole groove is opened on the upper side of the porous plate. The bottom of the side plate is fixedly connected to the top of the base. The inner end of the columnar block is fixedly connected to the outer side of the side plate. The inner part of the fixing plate is fixedly connected to the outer surface of the columnar block. The top of the fixing plate is rotatably connected to the L-shaped plate. The inner surface of the porous plate is slidably connected to the inner side of the L-shaped plate. The inner outer surface of the L-shaped plate is threadedly connected to a bolt, and the bolt is threadedly connected to the inside of the porous plate.

[0008] As a further improvement of the technical solution, the top of the porous plate is fixedly connected to the bottom of the slider. The bottom of the slider is slidably connected to the inside of the rectangular groove. Both ends of the spring are fixedly connected to the inside of the slider.

[0009] As a further improvement of the technical solution, an arc-shaped groove is opened at the top of the L-shaped plate. An arc-shaped plate is fixedly connected to the top of the L-shaped plate. The outer surface of the columnar rod is rotatably connected to the inside of the arc-shaped groove. A circular hole is opened on the outer surface of the columnar rod. A square block is slidably connected to the outer surface of the columnar rod. A support plate is fixedly connected to the bottom of the square block.

[0010] As a further improvement of the technical solution, one side of the U-shaped block is slidably connected to the inside of the circular hole. The other side of the U-shaped block is slidably connected to the inside of the square block, and the inner end of the U-shaped block is slidably connected to the inside of the annular hole groove.

[0011] As a further improvement of the technical solution, both ends of the bidirectional telescopic plate are fixedly connected to the inside of the porous plate. A support plate is fixedly connected to the top of the bidirectional telescopic plate. A motor is fixedly connected to the outer side of the support plate. The inner end of the rotating shaft is fixedly connected to the output shaft end of the motor. The end of the fan is fixedly connected to the outer end of the rotating shaft.

[0012] Compared with the prior art, the beneficial effects of the present utility model are:

[0013] Fixed on the columnar block through the fixing plate, the L-shaped plate rotates on the top of the fixing plate, driving the rotation of the L-shaped plate to clamp the porous plate inside the L-shaped plate. Fine adjustment is carried out through the bolt. When the clamping is tight, the porous plate is moved inward by screwing the bolt inward. When the clamping is loose, the porous plate is moved outward by screwing the bolt outward, so that the chip can achieve fine adjustment of the clamping width and improve the applicable range. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the present utility model;

[0015] Figure 2 It is a schematic diagram of the clamping structure of the present utility model;

[0016] Figure 3 Schematic diagram of the moving structure of the present utility model;

[0017] Figure 4 Schematic diagram of the heat dissipation structure of the present utility model.

[0018] The meanings of each label in the figure are as follows:

[0019] 1. Base; 11. Side plate; 12. Perforated plate; 13. Annular hole groove; 14. Rectangular groove;

[0020] 2. L-shaped plate; 21. Bolt; 22. Columnar block; 23. Fixed plate; 24. Arc-shaped plate; 25. Arc-shaped groove; 26. Slide block; 27. Spring;

[0021] 3. Support plate; 31. Columnar rod; 32. Square block; 33. U-shaped block; 34. Circular hole; 4. Fan; 41. Rotating shaft; 42. Motor; 43. Double-sided telescopic plate; 44. Support plate. Specific embodiments

[0022] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0023] Due to the increasingly complex structure of electronic products and the increasing demand for various types of chips, a large number of chips need to be transferred and classified between different workstations during the production and manufacturing process. A chip is composed of an internal wafer (a dense integrated circuit) plus a small shell for encapsulation. When under pressure, the outer black shell similar to plastic is damaged first (at this time the chip can still work). After greater pressure, the internal wafer is damaged and the chip can no longer work.

[0024]

[0025] Please refer to Figures 1-4 ​As shown in the figure, this embodiment provides a multi-functional microelectronic component chip sorter, including a base 1. A rectangular groove 14 is opened at the top of the base 1, and an annular hole groove 13 is opened on the upper side of the perforated plate 12. Considering that the chip clamping accuracy is insufficient, specifically as follows: The top of the base 1 is fixedly connected to the bottom of the side plate 11. The outer side of the side plate 11 is fixedly connected to the inner end of the columnar block 22. The outer surface of the columnar block 22 is fixedly connected to the inside of the fixing plate 23. The top of the fixing plate 23 is rotatably connected to the L-shaped plate 2. The inner side of the L-shaped plate 2 is slidably connected to the inner surface of the perforated plate 12. The outer surface of the inner side of the L-shaped plate 2 is threadedly connected to the bolt 21, and the bolt 21 is threadedly connected to the inside of the perforated plate 12. However, when the existing technology chip sorter reads, the device may undergo various angular changes, resulting in the chip falling off or being unstable due to inertia, and the chip cannot be overly squeezed, otherwise it will be damaged. If the extrusion is small, the chip may fall off, and it cannot be adjusted with high precision, and the applicable range is small. By rotating the L-shaped plate 2, the perforated plate 12 is clamped inside the L-shaped plate 2, and fine adjustment is performed through the bolt 21 to achieve fine adjustment of the clamping width of the chip.

[0026] The improvement of this embodiment lies in:

[0027] It is fixed on the columnar block 22 through the fixing plate 23. The L-shaped plate 2 rotates on the top of the fixing plate 23, driving the rotation of the L-shaped plate 2 to clamp the perforated plate 12 inside the L-shaped plate 2. Fine adjustment is performed through the bolt 21. When the clamping is tight, the perforated plate 12 is moved inward by screwing the bolt 21 inward. When the clamping is loose, the perforated plate 12 is moved outward by screwing the bolt 21 outward to achieve fine adjustment of the clamping width of the chip and improve the applicable range.

[0028] Considering that the movement of the perforated plate 12 is not convenient, therefore, the top of the slider 26 is fixedly connected to the bottom of the perforated plate 12, the bottom of the slider 26 is slidably connected to the inside of the rectangular groove 14, and both ends of the spring 27 are fixedly connected to the inside of the slider 26. The slider 26 is rebounded by the spring 27, so that the slider 26 drives the perforated plate 12 to be extruded outward, enabling the bottom of the perforated plate 12 to also clamp the chip, realizing convenient movement of the perforated plate 12.

[0029] Considering that the chip is likely to slide out from the front and back sides, therefore, an arc-shaped groove 25 is opened at the top of the L-shaped plate 2, an arc-shaped plate 24 is fixedly connected to the top of the L-shaped plate 2, the outer surface of the columnar rod 31 is rotatably connected to the inside of the arc-shaped groove 25, a circular hole 34 is opened on the outer surface of the columnar rod 31, a square block 32 is slidably connected to the outer surface of the columnar rod 31, and a support plate 3 is fixedly connected to the bottom of the square block 32. By sliding the square block 32 on the columnar rod 31 back and forth, the support plate 3 is driven to slide back and forth, making it difficult for the chip to slide out from the front and back sides.

[0030] Considering that the square block 32 is prone to move back and forth, on one side, a U-shaped block 33 is slidably connected inside the circular hole 34, on the other side of the U-shaped block 33, it is slidably connected inside the square block 32, and the inner end of the U-shaped block 33 is slidably connected inside the annular hole groove 13. By inserting the inner end of the U-shaped block 33 into the annular hole groove 13, the columnar rod 31 cannot rotate randomly. The U-shaped block 33 is fixed on the square block 32 and the circular hole 34, so that the square block 32 cannot move back and forth.

[0031] Considering that the chip generates heat during operation, at both ends, a bidirectional telescopic plate 43 is fixedly connected to the inner side of the porous plate 12. At the top of the bidirectional telescopic plate 43, a support plate 44 is fixedly connected. On the outer side of the support plate 44, a motor 42 is fixedly connected. At the end of the output shaft of the motor 42, the inner end of a rotating shaft 41 is fixedly connected. At the end of the outer end of the rotating shaft 41, the end of a fan 4 is fixedly connected. By the rotation of the motor 42 driving the rotation of the rotating shaft 41, the rotation of the fan 4 is driven, so as to realize the heat dissipation of the chip.

[0032] In summary, the working principle of this solution is as follows:

[0033] Manually place the chip between the side plate 11 and the porous plate 12, and fix it on the columnar block 22 through the fixing plate 23. The L-shaped plate 2 rotates on the top of the fixing plate 23, and drives the rotation of the L-shaped plate 2 to clamp the porous plate 12 inside the L-shaped plate 2. Fine adjustment is carried out through the bolt 21. When the clamping is relatively tight, by screwing the bolt 21 inward, the porous plate 12 moves inward, driving the slider 26 to move inward. When the clamping is relatively loose, by screwing the bolt 21 outward, the porous plate 12 moves outward, driving the slider 26 to move outward. Through the resilience of the spring 27 to the slider 26, the slider 26 drives the clamping of the bottom of the porous plate 12, so that the chip can achieve fine adjustment of the clamping width. By manually sliding the square block 32 on the columnar rod 31 back and forth, the support plate 3 is driven to slide back and forth, so that the chip is not easily slid out from the front and back sides. By manually inserting the U-shaped block 33 on the square block 32 and the circular hole 34, the square block 32 cannot move back and forth, and the chip is stably clamped from the front and back. By the movement of the porous plate 12 driving the bidirectional telescopic plate 43 to expand and contract, the bidirectional telescopic plate 43 does not affect the clamping of the porous plate 12. Connect the motor 42 to the power supply, and by the rotation of the motor 42 driving the rotation of the rotating shaft 41, the rotation of the fan 4 is driven, so as to realize the heat dissipation of the chip. Multiple chips can be installed, and precision clamping can be carried out, improving the practicability and expanding the scope of application.

[0034] The above has shown and described the basic principles, main features and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. The above embodiments and the descriptions in the specification are only preferred examples of the present utility model and are not used to limit the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed. The scope of protection claimed by the present utility model is defined by the appended claims and their equivalents.

Claims

1. A multi-functional microelectronic component chip sorter, comprising a base (1), wherein a rectangular groove (14) is formed at the top of the base (1), and it is characterized in that: The top of the base (1) is fixedly connected to the bottom of the side plate (11). The outer side of the side plate (11) is fixedly connected to the inner end of the columnar block (22). The outer surface of the columnar block (22) is fixedly connected to the inside of the fixing plate (23). The top of the fixing plate (23) is rotatably connected to the L-shaped plate (2). The inner side of the L-shaped plate (2) is slidably connected to the inner surface of the perforated plate (12). The outer surface of the inner side of the L-shaped plate (2) is threadedly connected to a bolt (21). The bolt (21) is threadedly connected to the inside of the perforated plate (12). An annular hole groove (13) is provided on the upper side of the perforated plate (12).

2. The multi-functional microelectronic component chip sorter according to claim 1, characterized in that: The bottom of the perforated plate (12) is fixedly connected to the top of the slider (26). The bottom of the slider (26) is slidably connected to the inside of the rectangular groove (14). The inner side of the slider (26) is fixedly connected to both ends of a spring (27).

3. The multi-functional microelectronic component chip sorter according to claim 1, characterized in that: An arc-shaped groove (25) is provided at the top of the L-shaped plate (2). The top of the L-shaped plate (2) is fixedly connected to an arc-shaped plate (24). The outer surface of a columnar rod (31) is rotatably connected to the inside of the arc-shaped groove (25). A circular hole (34) is provided on the outer surface of the columnar rod (31). A square block (32) is slidably connected to the outer surface of the columnar rod (31). The bottom of the square block (32) is fixedly connected to a support plate (3).

4. The multi-functional microelectronic component chip sorter according to claim 3, characterized in that: One side of a U-shaped block (33) is slidably connected to the inside of the circular hole (34). The other side of the U-shaped block (33) is slidably connected to the inside of the square block (32). The inner end of the U-shaped block (33) is slidably connected to the inside of the annular hole groove (13).

5. The multi-functional microelectronic component chip sorter according to claim 3, characterized in that: Both ends of a bidirectional telescopic plate (43) are fixedly connected to the inner side of the perforated plate (12). A support plate (44) is fixedly connected to the top of the bidirectional telescopic plate (43). A motor (42) is fixedly connected to the outer side of the support plate (44). The inner end of the output shaft of the motor (42) is fixedly connected to the outer end of a rotating shaft (41). The outer end of the rotating shaft (41) is fixedly connected to the end of a fan (4).

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