Tool clamp capable of achieving double-face dry etching and good in heat conduction in vacuum state
By designing tool fixtures using high-purity metal indium sheets and vacuum silicon grease adhesives, the fragmentation problem caused by uneven force of the substrate during dry etching is solved, and the uniform force and thermal conductivity of the substrate in the vacuum state is achieved, and double-sided patterned etching is supported.
Patent Information
- Application Number
- CN202421987681.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-15
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-08-15
AI Technical Summary
In the prior art During dry etching, the fragile and thermally poor substrate is subjected to uneven stress in a vacuum state, resulting in fragmentation phenomenon, and the etching of double-sided patterned products cannot be achieved.
High-purity indium metal sheets are used as thermal conductivity sheets, combined with vacuum silicon grease adhesive, and the pressure plate is fixed by bolts to apply pressure evenly to ensure that the substrate and the cooling platform are in good contact and maintain thermal conductivity in a vacuum state.
It realizes uniform stress and good heat conduction of the substrate in a vacuum state, avoids debris, and supports etching of double-sided patterned products.
Smart Images
Figure CN223092859U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of lithography fixtures, and specifically relates to a tooling fixture that can be dry-etched on both sides and has good heat conduction in a vacuum state. Background Technique
[0002] In the lithography - patterning process, it is necessary to use dry etching (IBE) to remove the unnecessary film layer to form a design pattern. The mechanism of dry etching is that Ar is introduced in a vacuum state, and after being ionized to form a plasma, it is led out in a beam shape through the grid. After the ions are accelerated, they impact the surface of the material, causing the material atoms to sputter. This process is a pure physical process. Usually, a photoresist is used as a mask on the surface of the sample, and a large amount of heat will accumulate on the surface during the entire dry etching process; for materials such as ceramic substrates and silicon substrates that are fragile and have poor heat conduction, if the temperature is too high, the product will break, the photoresist on the surface will denature or even carbonize, and the photoresist cannot be removed subsequently. Since the dry etching equipment operates in a vacuum, heat conduction can only be achieved by contacting the substrate with the water-cooled platform.
[0003] Currently, the common practice in the industry is as follows:
[0004] 1) Use a compression spring to press the product, so that the product is in close contact with the cooling platform to achieve temperature reduction;
[0005] 2) Apply a viscous thermal conductor, a viscous thermal pad, etc. on the back of the product for bonding and heat conduction to achieve temperature reduction.
[0006] The above practices are not applicable to substrates with a relatively thin thickness or poor matrix strength, and there is a situation of uneven stress, resulting in fragmentation; poor heat conduction causes the photoresist to carbonize; using the bonding technology of thermal conductors or viscous thermal pads, the etching application of double-sided patterned products cannot be achieved, and it is necessary to re-spin coat the photoresist and align it. Content of the Utility Model
[0007] The purpose of the utility model is to provide a tooling fixture that can be dry-etched on both sides and has good heat conduction in a vacuum state, so as to solve the problem of uneven stress and resulting fragmentation phenomenon proposed in the above background technique.
[0008] To solve the above technical problems, the utility model provides the following technical solution: A tooling fixture that can be dry-etched on both sides and has good heat conduction in a vacuum state, including a cooling platform and a wafer slot on the cooling platform. A sample is placed in the wafer slot, and a pressure plate is placed on the sample. The pressure plate is fixed on the cooling platform by bolts.
[0009] Further, a heat-conducting thin sheet is provided at the position below the pressure plate between the cooling platform and the sample, and the heat-conducting thin sheet is located in the wafer slot.
[0010] Further, the heat-conducting thin sheet is a high-purity indium sheet.
[0011] Further, an adhesive is provided between the heat-conducting sheet and the cooling platform, and the adhesive is located in the sheet slot.
[0012] Further, the adhesive is vacuum silicone grease.
[0013] Compared with the prior art, the beneficial effects achieved by the present utility model are as follows: two special heat-conducting materials that can exist in a vacuum state and have good heat conductivity; a tablet pressing design that can evenly apply force, can evenly apply pressure to fix the sample, and can maximize the contact between the sample and the cooling platform. Description of the Drawings
[0014] The drawings are used to provide a further understanding of the present utility model, and constitute a part of the specification. Together with the embodiments of the present utility model, they are used to explain the present utility model, and do not constitute a limitation to the present utility model. In the drawings:
[0015] Figure 1 is a three-dimensional structural schematic diagram of a tooling fixture of a patent of the present utility model that can perform double-sided dry etching and has good heat conduction in a vacuum state;
[0016] Figure 2 is a top view of a tooling fixture of a patent of the present utility model that can perform double-sided dry etching and has good heat conduction in a vacuum state;
[0017] Figure 3 is an installation structural schematic diagram of the adhesive and the heat-conducting sheet of a tooling fixture of a patent of the present utility model that can perform double-sided dry etching and has good heat conduction in a vacuum state.
[0018] Labels in the drawings:
[0019] 100, cooling platform; 200, adhesive; 300, heat-conducting sheet; 400, sample; 500, pressing plate; 600, bolt. Detailed Embodiments
[0020] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.
[0021] Please refer to Figures 1 - 3, the present utility model provides a technical solution: a tooling fixture that can be dry-etched on both sides and has good heat conduction in a vacuum state, including a cooling platform 100 and a wafer slot on the cooling platform 100. The cooling platform 100 and the wafer slot are designed with corresponding specifications according to the product size range and product thickness. A sample 400 is placed in the wafer slot, and a pressing plate 500 is placed on the sample 400. The pressing plate 500 is fixed to the cooling platform 100 by bolts 600.
[0022] During use, the sample 400 under the pressing plate 500 is fixed to the cooling platform 100 by bolts 600. The pressing plate 500 can apply pressure evenly to fix the sample 400 and maximize the contact between the sample 400 and the cooling platform 100.
[0023] Among them, a heat-conducting thin sheet 300 is provided at the position below the pressing plate 500 between the cooling platform 100 and the sample 400. The heat-conducting thin sheet 300 is located in the wafer slot and is used to fill the part between the substrate and the cooling platform 100 to ensure good heat conduction in a vacuum state.
[0024] The heat-conducting thin sheet 300 is a high-purity indium sheet. Using a high-purity indium sheet, it is soft, non-sticky, and has good heat conductivity.
[0025] An adhesive 200 is provided between the heat-conducting thin sheet 300 and the cooling platform 100. The adhesive 200 is located in the wafer slot, and the adhesive 200 is vacuum silicone grease.
[0026] It has good heat conduction and can exist and be used in a vacuum.
[0027] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "including", "comprising" or any other variation thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or elements inherent to such process, method, article or device.
[0028] Finally, it should be noted that the above are only preferred embodiments of the present utility model and are not used to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.
Claims
1. A tooling fixture that can be dry etched on both sides and has good heat conduction in a vacuum state, including a cooling platform (100) and a wafer slot on the cooling platform (100), characterized in that, A sample (400) is placed in the chip slot, and a pressure plate (500) is placed on the sample (400). The pressure plate (500) is fixed to the cooling platform (100) by bolts (600).
2. The tooling fixture that can be dry etched on both sides and has good heat conduction in a vacuum state according to claim 1, wherein: A heat-conducting thin sheet (300) is provided at a position below the pressure plate (500) between the cooling platform (100) and the sample (400). The heat-conducting thin sheet (300) is located in the chip slot.
3. The tooling fixture according to claim 2, which is capable of double-sided dry etching and has good heat conduction under vacuum conditions, is characterized in that: The heat-conducting thin sheet (300) is a high-purity indium sheet.
4. The tooling fixture according to claim 2, which is capable of double-sided dry etching and has good heat conduction under vacuum conditions, is characterized in that: An adhesive (200) is provided between the heat-conducting thin sheet (300) and the cooling platform (100). The adhesive (200) is located in the chip slot.
5. The tooling fixture capable of double-sided dry etching and having good heat conduction under vacuum according to claim 4, wherein: The adhesive (200) is vacuum silicone grease.