Power module, motor controller and vehicle

Abstract

The utility model provides a power module, motor controller and vehicle, the power module includes: a substrate including a first surface and a second surface opposite to each other, the first surface is provided with a plurality of conductive areas, the plurality of conductive areas include: a first DC transmission area, a second DC transmission area, an AC area and a temperature control area, the temperature control area is arranged along the edge of the substrate, and the first DC transmission area and the second DC transmission area are arranged on the substrate. At least one of the first DC transmission area, the second DC transmission area and the AC area is arranged adjacent to the temperature control area; the plurality of power elements form a plurality of bridge arms, the bridge arms comprise upper bridges and lower bridges, the power elements corresponding to the plurality of upper bridges are all arranged in the first DC transmission area, and the power elements corresponding to the plurality of lower bridges are arranged in the corresponding AC areas; and the temperature monitoring element is arranged in the temperature control area. The power module provided by the utility model can better monitor the heating state of the power element, and is suitable for being applied to a vehicle-specification-level high-voltage power module.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a power module, a motor controller and a vehicle. Background Art

[0002] Power modules are widely used in motor control inverters in fields such as photovoltaic power generation, wind power generation, and industrial frequency conversion, and are gradually developing towards high reliability and high power density. One or more power devices such as metal oxide semiconductor field effect transistors (MOSFETs), insulated gate bipolar transistors (IGBTs), and fast recovery diodes (FRDs), as well as integrated circuits, are integrated inside the power module.

[0003] At present, there are few automotive-grade power modules on the market. Since a large amount of heat is generated when an automotive-grade power module operates under high voltage and high current, if the heat is not dissipated in time, it may cause the performance of the power module to decline or even be damaged. Therefore, it is necessary to provide an automotive-grade power module that is more suitable for the usage requirements of new energy vehicles. Summary of the Utility Model

[0004] In view of the above problems, the utility model provides a power module, a motor controller and a vehicle. The temperature control area is located at the edge of the substrate and is arranged adjacent to at least one of the first DC transmission area and the AC area. A temperature monitoring element is arranged in the temperature control area, and the temperature monitoring element can more sensitively sense the heating state of the power element. In this way, the power module is more suitable for application in automotive-grade high-voltage power modules.

[0005] In a first aspect, the utility model provides a power module, including: a substrate including opposite first and second surfaces, the first surface being provided with a plurality of conductive areas, the plurality of conductive areas including: a first DC transmission area, a second DC transmission area, an AC area, and a temperature control area, the temperature control area being arranged along the edge of the substrate, and at least one of the first DC transmission area, the second DC transmission area, and the AC area being arranged adjacent to the temperature control area; power elements, the power elements being multiple, the multiple power elements forming a plurality of bridge arms, the bridge arms including an upper bridge and a lower bridge, wherein, the power elements corresponding to the multiple upper bridges are all arranged in the first DC transmission area, and the power elements corresponding to the multiple lower bridges are arranged in the corresponding AC area; a temperature monitoring element, the temperature monitoring element being arranged in the temperature control area.

[0006] According to the power module of the present utility model, by dividing a temperature control area on the first surface of the substrate, the temperature control area is located at the edge of the substrate and is arranged adjacent to at least one of the first DC transmission area and the AC area, and a temperature monitoring element is arranged in the temperature control area. In this way, the temperature monitoring element can more sensitively sense the heating state of the power element. In this way, when the power module is applied to a high-voltage scenario, such as a vehicle-grade high-voltage power module, it is beneficial to better sense the operating state of the power module, improve the electrical performance and safety of the device.

[0007] In some embodiments, a plurality of the conductive areas together form a conductive metal layer. The outer contour of the conductive metal layer includes a first side and a second side opposite to each other in a first direction, and a third side and a fourth side opposite to each other in a second direction. The first direction is perpendicular to the second direction; at least a part of the first DC transmission area is arranged along the first side, and the temperature control area is arranged between one of the third side and the fourth side and the first DC transmission area; the second DC transmission area is arranged along the second side, and one end of it extends to the fourth side. The second DC transmission area is spaced apart from the first DC transmission area in the first direction.

[0008] In some embodiments, at least a part of the AC area is arranged between the first DC transmission area and the second DC transmission area

[0009] In some embodiments, the first DC transmission area includes a first sub-region and a second sub-region. The first sub-region is arranged along the first side, and the second sub-region is arranged along the third side and is connected to the first sub-region; the second DC transmission area is spaced apart from the first sub-region and the second sub-region respectively; the AC area is located in the area between the first sub-region, the second sub-region and the second DC transmission area.

[0010] In some embodiments, the temperature control area is located in the intersection area of the first sub-region and the second sub-region, or the temperature control area is located in the corner area defined by the first sub-region and the AC area.

[0011] In some embodiments, there are three bridge arms. The AC area includes three AC sub-areas arranged side by side and spaced apart in the second direction. The three bridge arms form a three-phase full-bridge circuit. The three bridge arms respectively correspond to the U phase, the V phase and the W phase. The power elements corresponding to the multiple upper bridges are arranged side by side in the second direction and are respectively connected to the corresponding AC sub-areas through bonding wires.

[0012] In some embodiments, there are two temperature control areas, and the two temperature control areas are arranged adjacent to each other.

[0013] In some embodiments, the power module further includes: a plurality of connection terminals, and the plurality of connection terminals are respectively disposed on the first side and the second side, and each connection terminal is connected to the corresponding conductive region or power element.

[0014] In some embodiments, the connection terminals include: power terminals and signal terminals, and both the power terminals and the signal terminals are plural; the plurality of power terminals are disposed on the substrate along the second side, and are respectively connected to the first DC transmission region, the second DC transmission region, and the AC region; the plurality of signal terminals are respectively disposed on the substrate along the first side, and each signal terminal is respectively connected to the power element or the temperature control region.

[0015] In some embodiments, the cross-sectional area of the power terminal along a reference plane is larger than the cross-sectional area of the signal terminal along the reference plane, the reference plane is parallel to the second direction and perpendicular to the substrate.

[0016] In some embodiments, the plurality of signal terminals are divided into several terminal groups arranged at intervals along the second direction, and one of the terminal groups corresponds to and is connected to the temperature control region, and the remaining terminal groups respectively correspond to and are connected to the power elements, and each terminal group includes two signal terminals, and the distance between the two signal terminals belonging to the same terminal group is different from the distance between adjacent two terminal groups.

[0017] In some embodiments, the distance between adjacent two power terminals along the second direction is a, the distance between adjacent two terminal groups along the second direction is b, and the distance between the two signal terminals belonging to the same terminal group is c; wherein, b and a satisfy: b < a; and / or, b and c satisfy: b < c.

[0018] In some embodiments, at least one transfer region (107) is further provided on the first surface, the projection of the transfer region on the first surface is offset from the projection of the power element in the first DC transmission region in the first surface along the second direction, and at least one power element and the corresponding signal terminal are respectively connected to the transfer region.

[0019] In some embodiments, the first DC transmission region surrounds the transfer region, and the transfer region and the power element disposed in the first DC transmission region are arranged side by side along the second direction.

[0020] In some embodiments, among the plurality of connection terminals, the connection terminals at least located at both ends of the first side and the second side along the second direction are provided with installation limiting structures.

[0021] In some embodiments, the installation limiting structure protrudes along the second direction to form a limiting convex portion.

[0022] In some embodiments, the power module further includes: a plastic package, the plastic package wraps the substrate, the connection terminals extend out from the plastic package, and the plastic package separates any two adjacent connection terminals.

[0023] In some embodiments, the plastic package is provided with a groove structure at a position between any two adjacent power terminals, and the groove structure penetrates through the plastic package along the thickness direction of the substrate.

[0024] In some embodiments, a heat dissipation metal layer is further provided on the second surface of the substrate; the power module further includes: a heat dissipation substrate, the heat dissipation metal layer is in contact with the heat dissipation substrate, the plastic package is provided with mounting holes on both sides along the second direction, the heat dissipation substrate is provided with mating holes, and the plastic package and the heat dissipation substrate are connected by fasteners passing through the mounting holes and the mating holes in sequence.

[0025] In a second aspect, the present utility model provides a motor controller, including: the above-mentioned power module.

[0026] In a third aspect, the present utility model provides a vehicle, including: the above-mentioned motor controller. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0028] Figure 1 It is a schematic structural diagram of a power module according to an embodiment of the present utility model from one angle;

[0029] Figure 2 It is a schematic structural diagram of a power module according to an embodiment of the present utility model from another angle;

[0030] Figure 3 It is a schematic structural diagram of a power module according to an embodiment of the present utility model from yet another angle;

[0031] Figure 4 It is a schematic structural diagram of a power module according to an embodiment of the present utility model from still another angle;

[0032] Figure 5 It is a schematic internal structural diagram of a power module according to some embodiments of the present utility model;

[0033] Figure 6 Schematic diagram of the internal structure of the power module of other embodiments of the utility model;

[0034] Figure 7 Schematic diagram of the internal structure of the power module of some other embodiments of the utility model;

[0035] Figure 8 Schematic diagram of the internal structure of the power module of some other embodiments of the utility model;

[0036] Figure 9 This is a schematic diagram of the structure of a substrate in an embodiment of the utility model;

[0037] Figure 10 It is a schematic diagram of the arrangement of the power components on the substrate according to an embodiment of the utility model;

[0038] Figure 11 This is a diagram of the internal current flow of the power module according to an embodiment of the utility model;

[0039] Figure 12 The figure is a schematic diagram of the arrangement of the connection terminals of the power module according to the embodiment of the present utility model.

[0040] Description of reference numerals:

[0041] 400-power module;

[0042] 100-substrate;

[0043] 101-ceramic layer; 102-conductive metal layer;

[0044] 1021 - first side; 1022 - second side; 1023 - third side; 1024 - fourth side;

[0045] 103 - first DC transmission area; 1031 - first sub-area; 1032 - second sub-area;

[0046] 104-AC area; 1041-first AC sub-area; 1042-second AC sub-area; 1043-third AC sub-area;

[0047] 105-second DC transmission area; 106-temperature control area; 107-transfer area;

[0048] 108-connection terminal; 1080-installation limit structure;

[0049] 1081-power terminal; 1-DC positive terminal; 2-U phase AC terminal; 3-V phase AC terminal; 4-W phase AC terminal; 5-DC negative terminal;

[0050] 1082 - Signal terminal; 6 - First signal terminal; 7 - Second signal terminal; 8 - Third signal terminal; 9 - Fourth signal terminal; 10 - Fifth signal terminal; 11 - Sixth signal terminal; 12 - Seventh signal terminal; 13 - Eighth signal terminal; 14 - Ninth signal terminal; 15 - Tenth signal terminal; 16 - Eleventh signal terminal; 17 - Twelfth signal terminal; 18 - Thirteenth signal terminal; 19 - Fourteenth signal terminal;

[0051] 200 - Power element; 200a - First power element; 200b - Second power element; 200c - Third power element; 200d - Fourth power element; 200e - Fifth power element; 200f - Sixth power element;

[0052] 300 - Plastic package; 301 - Groove structure; 302 - Mounting hole. Detailed implementation manner

[0053] In order to make the above - mentioned objects, features, and advantages of the embodiments of the present application more obvious and understandable, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present application.

[0054] Power modules are widely used in motor control inverters in fields such as photovoltaic power generation, wind power generation, and industrial frequency conversion, and are gradually developing towards the direction of high reliability and high power density. The power module internally integrates one or more power devices such as metal - oxide - semiconductor field - effect transistors (MOSFETs), insulated - gate bipolar transistors (IGBTs), fast - recovery diodes (FRDs), and integrated circuits. Currently, there are few automotive - grade power modules on the market. Since automotive - grade power module components generate a large amount of heat when operating under high voltage and high current, if the heat is not dissipated to the environment in time, it may lead to a decline in the performance of the power module or even damage. Therefore, it is necessary to provide an automotive - grade power module that is more suitable for the usage requirements of new energy vehicles.

[0055] In view of this, the present utility model provides a power module, a motor controller, and a vehicle. By dividing a temperature - controlled area on the first surface of the substrate, the temperature - controlled area is located at the edge of the substrate and is arranged adjacent to at least one of the first DC transmission area and the AC area, and a temperature monitoring element is arranged in the temperature - controlled area. In this way, the temperature monitoring element can more sensitively sense the heating state of the power element. Thus, when the power module is applied to a high - voltage scenario, such as an automotive - grade high - voltage power module, it is beneficial to better sense the operating states of the power module and the energy storage system, and improve the electrical performance and safety of the equipment.

[0056] The following will combine Figures 1-11 to describe the power module 400 according to the embodiments of the first aspect of the present utility model.

[0057] Referring to Figures 9-11 , the power module 400 of this embodiment includes: a substrate 100, a power element 200, and a temperature monitoring element.

[0058] Among them, the substrate 100 may include opposite first and second surfaces. For example, taking the substrate 100 being horizontally arranged as an example, the first surface may be the upper surface of the substrate 100, and the second surface may be the lower surface of the substrate 100. The substrate 100 may be square. The first surface is provided with a plurality of spaced-apart conductive regions, and the plurality of conductive regions may jointly form a conductive metal layer 102. The outer contour of the conductive metal layer 102 may be square. The conductive metal layer 102 may be a copper layer. Correspondingly, the second surface may also be provided with a copper layer.

[0059] For example, the substrate 100 may be a direct bonding copper (DBC) ceramic substrate. The substrate 100 may include a ceramic layer 101 and copper layers on both sides of the ceramic layer 101. The ceramic layer 101 may be at least one of alumina, silicon nitride, and aluminum nitride. One of the copper layers may be used as the above-mentioned conductive metal layer 102, and the conductive metal layer 102 may be used to arrange module circuits and power elements 200. The conductive metal layer 102 may be divided into a plurality of conductive regions according to the circuit layout requirements, and the other copper layer may be used as the heat dissipation surface of the module.

[0060] The plurality of conductive regions may include: a first DC transmission region 103, a second DC transmission region 105, an AC region 104, and a temperature control region 106.

[0061] It can be understood that under normal operating conditions, the first DC transmission region 103 may be used as the positive pole of direct current for direct current input, the second DC transmission region 105 may be used as the negative pole of direct current for direct current output, and the AC region 104 may output alternating current; while under the inverter operating condition, the AC region 104 may be used for alternating current input, and the first DC transmission region 103 and the second DC transmission region 105 may be used for direct current transmission. When there is one AC region 104, the power module 400 may be a single-phase power module 400. When there are three AC regions 104, the power module 400 may be a three-phase power module 400. The first DC transmission region 103, the second DC transmission region 105, and the AC region 104 may respectively form circuits to achieve their respective current transmission functions.

[0062] There can be multiple power components 200, and the multiple power components 200 can include at least one of a silicon carbide MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) and a silicon-based IGBT (Insulated Gate Bipolar Transistor). One side of each power component 200 facing the substrate 100 (i.e., the back of the power component 200) is the collector (for IGBT) or the drain (for MOSFET), which can be directly connected to the conductive region where it is located; one side of each power component 200 away from the substrate 100 (i.e., the front of the power component 200) has an emitter (for IGBT) or a source (for MOSFET), which can be connected to the conductive region where another power component 200 is located through a bonding wire to connect to the collector (for IGBT) or the drain (for MOSFET) of the power component 200 on another conductive region; one side of each power component 200 away from the substrate 100 (i.e., the front of the power component 200) also has a gate, which can be connected to the signal terminal in the connection terminal 108.

[0063] The multiple power components 200 form several bridge arms. For example, there can be two power components 200, and the two power components 200 form a half-bridge; there can be six power components 200, and the six power components 200 can form three half-bridges. The three half-bridges can be connected in parallel to form a single-phase half-bridge power module 400 with a current specification three times that of a single half-bridge; alternatively, the three half-bridges can also be formed into a three-phase full-bridge power module 400. Under the control of an external drive circuit, the inverter circuit formed by the multiple power components 200 can convert direct current into alternating current with a specific frequency for use by electrical appliances.

[0064] A bridge arm can include an upper bridge and a lower bridge. Among them, the power components 200 corresponding to the multiple upper bridges are all arranged in the first DC transmission region 103, and the power components 200 corresponding to the multiple lower bridges are arranged in the AC region 104.

[0065] For example Figure 10As shown, there are six power components 200. The upper bridge part includes a first power component 200a, a second power component 200b, and a third power component 200c that are sequentially distributed from the second side 1022 towards the fourth side 1024. The lower bridge part includes a sixth power component 200f, a fifth power component 200e, and a fourth power component 200d that are sequentially distributed from the second side 1022 towards the fourth side 1024. The first power component 200a and the sixth power component 200f form a bridge arm, the second power component 200b and the fifth power component 200e form a bridge arm, and the third power component 200c and the fourth power component 200d form a bridge arm. The backs of the first power component 200a, the second power component 200b, and the third power component 200c are connected to the first DC transmission area 103 by welding or sintering. The fronts of the first power component 200a, the second power component 200b, and the third power component 200c are respectively connected to the AC area 104. The backs of the sixth power component 200f, the fifth power component 200e, and the fourth power component 200d are connected to their respective corresponding AC areas 104 by welding or sintering. The fronts of the sixth power component 200f, the fifth power component 200e, and the fourth power component 200d are respectively connected to the second DC transmission area 105. Among them, the connection method can be at least one of bonding wires (such as aluminum wires, copper wires, gold wires, silver wires, etc.), metal tapes (such as aluminum tapes, copper tapes, etc.), and metal connection sheets.

[0066] The temperature control area 106 is arranged along the edge of the substrate 100, that is, at least one side of the temperature control area 106 constitutes a part of the outer contour of the conductive metal layer 102. Here, the outer contour of the conductive metal layer 102 refers to the connection line of the sides that are not opposite to other conductive areas on each conductive area, and is also the connection line of the outer edges of the outermost conductive areas among multiple conductive areas that are not opposite to other conductive areas.

[0067] For example, the temperature control area 106 can be arranged along one side edge of the conductive metal layer 102 in the second direction (such as Figure 9 the X direction shown), or the temperature control area 106 can be arranged along one side edge of the conductive metal layer 102 in the second direction. In this way, it is convenient for the temperature control area 106 to be connected to the external circuit, which is beneficial to shortening the signal transmission length between the temperature control area 106 and the external circuit and improving the sensitivity of temperature monitoring. There can be two temperature control areas 106, and the two temperature control areas 106 are arranged adjacent to each other.

[0068] At least one of the first DC transmission area 103, the second DC transmission area 105, and the AC area 104 is arranged adjacent to the temperature control area 106, and a temperature monitoring element is arranged in the temperature control area 106. For example, the temperature control area 106 may be arranged adjacent to only the first DC transmission area 103; or, the temperature control area 106 may be arranged adjacent to only the AC area 104; or, the temperature control area 106 may be arranged adjacent to only the second DC transmission area 105; or, any two or all of the first DC transmission area 103, the second DC transmission area 105, and the AC area 104 may be arranged adjacent to the temperature control area 106.

[0069] The temperature monitoring element is arranged in the temperature control area 106. The temperature monitoring element may be one of a negative temperature coefficient thermistor (NTC thermistor) and a positive temperature coefficient thermistor (PTC thermistor), and preferably a negative temperature coefficient thermistor.

[0070] Since the power element 200 is the main component in the power module 400 that bears voltage and current, and is also the main heat-generating component, and in this embodiment, the temperature control area 106 is arranged adjacent to at least one of the first DC transmission area 103 and the AC area 104 where the power element 200 is arranged, so that the temperature monitoring element is closer to the heat-generating area of the power module 400, and can more quickly and accurately feedback the heat-generating state of the power element 200. In addition, arranging at least one of the first DC transmission area 103, the second DC transmission area 105, and the AC area 104 adjacent to the temperature control area 106 is beneficial to compact the layout of the connection terminals 108 led out from each conductive area, optimize the overall layout, and reduce the space occupation.

[0071] According to the power module 400 of the embodiment of the present invention, by dividing the temperature control area 106 on the conductive metal layer 102 of the substrate 100, the temperature control area 106 is located at the edge of the conductive metal layer 102 and is arranged adjacent to at least one of the first DC transmission area 103, the second DC transmission area 105, and the AC area 104, and a temperature monitoring element is arranged in the temperature control area 106. In this way, the temperature monitoring element can more sensitively sense the heat-generating state of the power element 200. In this way, when the power module 400 is applied to a high-voltage scenario, such as being used as a vehicle-grade high-voltage power module 400, it is beneficial to better sense the operating state of the power module 400 and the energy storage system, and improve the electrical performance and safety of the equipment.

[0072] In some embodiments, in combination with Figures 5-11, the outer contour of the conductive metal layer 102 can be square. For example, the outer contour of the conductive metal layer 102 can include a first side 1021, a second side 1022, a third side 1023, and a fourth side 1024. Among them, the first side 1021 and the second side 1022 are opposite to each other along a first direction (for example, the width direction of the substrate 100, that is Figure 9 the Y direction shown in a certain figure), the third side 1023 and the fourth side 1024 are opposite to each other along a second direction (for example, the length direction of the substrate 100, that is Figure 9 the X direction shown in a certain figure), and the first direction and the second direction are perpendicular to each other. At least part of the first DC transmission region 103 is disposed along the first side 1021, and the temperature control region 106 is disposed between one of the third side 1023 and the fourth side 1024 and the first DC transmission region 103. For example, the temperature control region 106 can be located on the side of the first DC transmission region 103 close to the third side 1023, or the temperature control region 106 can be located on the side of the first DC transmission region 103 close to the fourth side 1024.

[0073] The second DC transmission region 105 can be disposed along the second side 1022, and one end of the second DC transmission region 105 extends to the fourth side 1024. The second DC transmission region 105 is spaced apart from the first DC transmission region 103 along the first direction. At least part of the AC region 104 is disposed between the first DC transmission region 103 and the second DC transmission region 105. At this time, at least part of the structures of the second DC transmission region 105, the AC region 104, and the first DC transmission region 103 are arranged along the first direction. Correspondingly, the upper bridge and the lower bridge can be arranged along the first direction. At this time, at least it can be ensured that the distance between the temperature monitoring element and the power element 200 in the first DC transmission region 103 is relatively close, thereby improving the sensitivity of sensing the heating state of the first DC transmission region 103. And, arranging the first DC transmission region 103 and the AC region 104 along the first direction can disperse a plurality of power elements 200 along the first direction, which is beneficial to heat dissipation.

[0074] In some embodiments, referring to Figure 9 , the first DC transmission region 103 can include a first sub-region 1031 and a second sub-region 1032. Among them, the first sub-region 1031 is disposed along the first side 1021, and a plurality of power elements 200 corresponding to the lower bridge can be arranged side by side and spaced apart along the second direction in the first sub-region 1031. The second sub-region 1032 is disposed along the third side 1023 and is connected to the first sub-region 1031. At this time, the first DC transmission region 103 is generally in an L-shaped structure, and the second sub-region 1032 can be used to arrange connection terminals 108 connected to an external circuit.

[0075] The second DC transmission area 105 is spaced apart from the first sub-region 1031 and the second sub-region 1032 respectively, that is, the second DC transmission area 105 is spaced apart from the first sub-region 1031 along the first direction, and the second DC transmission area 105 is spaced apart from the second sub-region 1032 along the second direction.

[0076] The AC area 104 is located in the area between the first sub-region 1031, the second sub-region 1032 and the second DC transmission area 105. At this time, a part of the AC area 104 is located between the second DC transmission area 105 and the first sub-region 1031, and another part of the AC area 104 is located between the second DC transmission area 105 and the second sub-region 1032. In this way, the part of the AC area 104 located between the second DC transmission area 105 and the second sub-region 1032 can be used to connect to the connection terminal 108 for connecting an external circuit, and the overall layout is relatively regular and simple.

[0077] Reference Figures 7-8 , in some embodiments, the temperature control area 106 can be located in the intersection area of the first sub-region 1031 and the second sub-region 1032, that is, the temperature control area 106 can be the corner between the first side 1021 and the third side 1023. At this time, the distance between the temperature monitoring element and the power element 200 on the first DC transmission area 103 is relatively close, and the feedback on the heating state of the power element 200 on the first DC transmission area 103 is more sensitive and accurate.

[0078] In other embodiments, reference Figure 9 , the temperature control area 106 is located in the corner area defined by the first sub-region 1031 and the AC area 104. At this time, the distance between the temperature monitoring element and the multiple power elements 200 of the first sub-region 1031 and the AC area 104 is relatively close, and the heating states of the respective power elements 200 can be better feedback.

[0079] In some embodiments, reference Figures 5-11 , there are three bridge arms, and the AC area 104 includes three AC sub-areas arranged side by side and spaced apart along the second direction. The three AC sub-areas are the first AC sub-area 1041, the second AC sub-area 1042 and the third AC sub-area 1043 respectively. The three bridge arms form a three-phase full-bridge circuit. The three bridge arms correspond to the U phase, the V phase and the W phase respectively. The power elements 200 corresponding to the multiple upper bridges are arranged side by side along the second direction and are respectively connected to the corresponding AC sub-areas through bonding wires. In this way, the power module 400 of this embodiment can convert direct current into three-phase alternating current.

[0080] In some embodiments, the power module 400 may further include connection terminals 108. Specifically, there may be multiple connection terminals 108, and the multiple connection terminals 108 are respectively disposed on the first side 1021 and the second side 1022, and each connection terminal 108 is connected to a corresponding conductive region or power element 200. In other words, the multiple connection terminals 108 are distributed on opposite sides of the power module 400 along the first direction. Compared with the solution of distributing multiple connection terminals 108 around the power module 400, it is beneficial to simplify the external circuit connected to the power module 400. The power module 400 is connected to the external circuit, and also makes the structural layout of the power module 400 more compact and occupies less space.

[0081] Optionally, the multiple connection terminals 108 may adopt one of the structures of Dual In-line Package (DIP), Small outline Package (SOP), Small outline J-lead Package (SOJ), Quad Flat Package (QFP), Plastic Leadless Chip Carrier (PLCC), Ball Grid Array (BGA).

[0082] In some embodiments, the connection terminal 108 may include a power terminal 1081 and a signal terminal 1082. Among them, both the power terminal 1081 and the signal terminal 1082 are multiple. The multiple power terminals 1081 are disposed on one side of the second side 1022 of the substrate 100 and are respectively connected to the first DC transmission region 103, the second DC transmission region 105, and the AC region 104; the multiple signal terminals 1082 are respectively disposed along the first side 1021 of the substrate 100, and each signal terminal 1082 is respectively connected to the power element 200 or the temperature control region 106 through a bonding wire. By separately disposing the power terminal 1081 and the signal terminal 1082 on both sides of the substrate 100, the power terminal 1081 on the power side has a larger arrangement space, which is beneficial to increasing the distance between adjacent power terminals 1081 to improve the electrical clearance and creepage distance under high voltage and high current, thereby improving the safety of the power module 400; and for the signal terminal 1082 on the signal side, the distance between the signal terminals 1082 adjacent to the same power element 200 can be smaller, which is beneficial to reducing the parasitic inductance between the two signal terminals 1082.

[0083] For example, when there is one AC area 104 and the power module 400 is a single-phase power module 400, there can be three power terminals 1081. The three power terminals 1081 are respectively a DC positive terminal 1, a DC negative terminal 5, and an AC terminal. The DC positive terminal 1 is connected to the first DC transmission area 103, the DC negative terminal 5 is connected to the second DC transmission area 105, and the AC terminal is connected to the AC area 104. The DC positive terminal 1, the DC negative terminal 5, and the AC terminal are all led out from one side of the second side 1022 of the conductive metal layer 102. A part of the multiple signal terminals 1082 is connected to the temperature control area 106 through bonding wires, and the other part is respectively connected to the gate and source of the MOSFET power element 200 (or the gate and emitter of the IGBT power element 200). The arrangement order of the DC positive terminal 1, the DC negative terminal 5, and the AC terminal along the second direction can be adjusted according to actual needs, and the present utility model does not limit this.

[0084] Or, when the AC area 104 includes three sub-areas such as a first AC sub-area 1041, a second AC sub-area 1042, and a third AC sub-area 1043, the power module 400 is a three-phase full-bridge power module 400, and there can be five power terminals 1081. The three power terminals 1081 are respectively a DC positive terminal 1, a DC negative terminal 5, a U-phase AC terminal 2, a V-phase AC terminal 3, and a W-phase AC terminal 4. The DC positive terminal 1 is connected to the first DC transmission area 103, the DC negative terminal 5 is connected to the second DC transmission area 105, the U-phase AC terminal 2 can be connected to the first AC sub-area 1041, the V-phase AC terminal 3 can be connected to the second AC sub-area 1042, and the W-phase AC terminal 4 can be connected to the third AC sub-area 1043. And the DC positive terminal 1, the DC negative terminal 5, the U-phase AC terminal 2, the V-phase AC terminal 3, and the W-phase AC terminal 4 can all be led out from one side of the second side 1022 of the conductive metal layer 102. A part of the multiple signal terminals 1082 is connected to the temperature control area 106 through bonding wires, and the other part is respectively connected to the gate and source of the MOSFET (or the gate and emitter of the IGBT). The arrangement order of the DC positive terminal 1, the DC negative terminal 5, the U-phase AC terminal 2, the V-phase AC terminal 3, and the W-phase AC terminal 4 along the second direction can be adjusted according to actual needs, and the present utility model does not limit this.

[0085] By respectively arranging the power terminals 1081 and the signal terminals 1082 on opposite sides of the power module 400, it is beneficial to simplify the layout of the connection terminals 108 of the power module 400 and the layout of the external circuit, facilitate the connection between the power module 400 and the external circuit, and is also beneficial to reducing the interference of the current on the power terminals 1081 to the signal terminals 1082.

[0086] Considering that the current on the power terminal 1081 is larger and the current on the signal terminal 1082 is smaller, in order to make the power terminal 1081 and the connection terminal 108 have matching overcurrent capabilities, in this embodiment, the cross-sectional area of the power terminal 1081 along the reference plane can be configured to be larger than the cross-sectional area of the signal terminal 1082 along the reference plane. The reference plane is parallel to the second direction and perpendicular to the substrate 100.

[0087] In some embodiments, the multiple signal terminals 1082 are divided into several terminal groups arranged at intervals along the second direction. One of the terminal groups corresponds to and is connected to the temperature control area 106, and the remaining terminal groups respectively correspond to and are connected to the power elements 200. Each terminal group includes two signal terminals 1082.

[0088] For example Figure 5 As shown, two temperature control areas 106 are arranged on one side of the first DC transmission area 103 facing the fourth side 1024. The two temperature control areas 106 are respectively connected to the first signal terminal 6 and the second signal terminal 7; the source of the third power element 200c is connected to the third signal terminal 8, and the gate or grid is connected to the fourth signal terminal 9; the source of the fourth power element 200d is connected to the fifth signal terminal 10, and the gate or grid is connected to the sixth signal terminal 11; the source of the second power element 200b is connected to the seventh signal terminal 12, and the gate or grid is connected to the eighth signal terminal 13; the source of the fifth power element 200e is connected to the ninth signal terminal 14, and the gate or grid is connected to the tenth signal terminal 15; the source of the first power element 200a is connected to the eleventh signal terminal 16, and the gate or grid is connected to the twelfth signal terminal 17; the source of the sixth power element 200f is connected to the thirteenth signal terminal 18, and the gate or grid is connected to the fourteenth signal terminal 19.

[0089] Or, as Figure 6 shown, two temperature control areas 106 are arranged on one side of the first DC transmission area 103 facing the fourth side 1024. The two temperature control areas 106 are respectively connected to the first signal terminal 6 and the second signal terminal 7. The source of the fourth power element 200d is connected to the third signal terminal 8, and the gate or grid is connected to the fourth signal terminal 9; the source of the third power element 200c is connected to the fifth signal terminal 10, and the gate or grid is connected to the sixth signal terminal 11; the source of the fifth power element 200e is connected to the seventh signal terminal 12, and the gate or grid is connected to the eighth signal terminal 13; the source of the second power element 200b is connected to the ninth signal terminal 14, and the gate or grid is connected to the tenth signal terminal 15; the source of the sixth power element 200f is connected to the eleventh signal terminal 16, and the gate or grid is connected to the twelfth signal terminal 17; the source of the first power element 200a is connected to the thirteenth signal terminal 18, and the gate or grid is connected to the fourteenth signal terminal 19;

[0090] Alternatively, as Figure 7 shown, the temperature monitoring element is disposed on one side of the first DC transmission area 103 facing the second side 1022, and the two temperature control areas 106 are respectively connected to the thirteenth signal terminal 18 and the fourteenth signal terminal 19. The source of the fourth power element 200d is connected to the second signal terminal 7, and the gate or the gate electrode is connected to the first signal terminal 6; the source of the third power element 200c is connected to the third signal terminal 8, and the gate or the gate electrode is connected to the fourth signal terminal 9; the source of the second power element 200b is connected to the fifth signal terminal 10, and the gate or the gate electrode is connected to the sixth signal terminal 11; the source of the fifth power element 200e is connected to the seventh signal terminal 12, and the gate or the gate electrode is connected to the eighth signal terminal 13; the source of the first power element 200a is connected to the ninth signal terminal 14, and the gate or the gate electrode is connected to the tenth signal terminal 15; the source of the sixth power element 200f is connected to the eleventh signal terminal 16, and the gate or the gate electrode is connected to the twelfth signal terminal 17.

[0091] Optionally, the distance between two signal terminals belonging to the same terminal group is different from the distance between two adjacent terminal groups. In this way, the interference of the control signals of two adjacent power elements 200 with each other can be reduced.

[0092] In some embodiments, referring to Figure 12 , the distance between two adjacent power terminals 1081 in the second direction is a, the distance between two signal terminals belonging to the same terminal group is b, and the distance between two adjacent terminal groups in the second direction is c. Among them, b and a satisfy: b < a. In this way, it is beneficial to increase the distance between two adjacent power terminals 1081, thereby increasing the electrical clearance and creepage distance between two adjacent power terminals 1081 under high voltage and high current, avoiding high voltage breakdown, and improving the safety of the power module 400.

[0093] Optionally, b and c satisfy b < c. In this way, the distance between two adjacent terminal groups is greater than the distance between two signal terminals within the terminal group, which is beneficial to reducing the mutual interference of the control signals of two adjacent power elements 200, and reducing the parasitic inductance between two signal terminals connected to the same power element 200.

[0094] Optionally, the following condition is satisfied between a and c: c ≤ a. In this way, the distance between the two power terminals 1081 can be maximized, so as to increase the distance between adjacent power terminals 1081, thereby increasing the electrical clearance and creepage distance between adjacent power terminals 1081 under high voltage and high current, improving the insulation between adjacent power terminals 1081, and avoiding the insulation layer between the two power terminals 1081 from being broken down due to too small a distance between the two power terminals 1081 in a high-voltage working environment. Furthermore, it can avoid abnormal functions and electrical failures of the power module 400 caused by the breakdown phenomenon, and may even cause permanent damage, which is beneficial to improving the overall safety of the power module 400.

[0095] Considering that the signal terminal 1082 and the AC area 104 are respectively located on both sides of the first DC transmission area 103 along the first direction, in some possible cases, the bonding wires of the power element 200 on the first DC transmission area 103 and its signal terminal 1082 will interfere with the arrangement of the bonding wires of the power element 200 on the AC area 104 and its signal terminal 1082. To avoid the bonding wires from interfering with or winding around each other and simplify the bonding wire structure and circuit layout. In this embodiment, the plurality of conductive areas may further include at least one transfer area 107. The projection of the transfer area 107 on the first surface is offset from the projection of the power element in the first DC transmission area 103 in the first surface along the second direction. For example, a second substrate may be provided on the first DC transmission area 103, and the second substrate is welded to the first DC transmission area 103. The second substrate and the power element in the first DC transmission area 103 are arranged at intervals along the second direction. The second substrate is provided with a conductive layer on the side facing away from the first DC transmission area 103, and the conductive layer may serve as the transfer area 107; alternatively, a part of the first DC transmission area 103 may be hollowed out, and the transfer area 107 is provided in the hollowed-out area. The power element 200 on at least one AC area 104 and the corresponding signal terminal 1082 are respectively connected to the transfer area 107, for example, by bonding wires, so as to realize the interconnection between the power element 200 and the signal terminal 1082.

[0096] Optionally, the first DC transmission area 103 surrounds the transfer area 107, and the transfer area 107 and the power element 200 provided in the first DC transmission area 103 are arranged side by side along the second direction, that is, a part of the first DC transmission area 103 may be hollowed out, and the transfer area 107 is provided in the hollowed-out area, so that the first DC transmission area 103 surrounds the transfer area 107. In this way, the structure is relatively simple and easy to implement.

[0097] As Figure 8As shown, the temperature monitoring element is disposed on one side of the first DC transmission area 103 facing the second side 1022, and the two temperature control areas 106 are respectively connected to the thirteenth signal terminal 18 and the fourteenth signal terminal 19. Among them, two transfer islands are added in the first DC transmission area 103, and the two transfer islands serve as a transfer area 107. The source of the fourth power element 200d is connected to the second signal terminal 7 through one of the transfer islands, and the gate or gate electrode is connected to the first signal terminal 6 through the other transfer island. The source of the third power element 200c is connected to the third signal terminal 8, and the gate or gate electrode is connected to the fourth signal terminal 9; the source of the second power element 200b is connected to the fifth signal terminal 10, and the gate or gate electrode is connected to the sixth signal terminal 11; the source of the fifth power element 200e is connected to the seventh signal terminal 12, and the gate or gate electrode is connected to the eighth signal terminal 13; the source of the first power element 200a is connected to the ninth signal terminal 14, and the gate or gate electrode is connected to the tenth signal terminal 15; the source of the sixth power element 200f is connected to the eleventh signal terminal 16, and the gate or gate electrode is connected to the twelfth signal terminal 17.

[0098] In some embodiments, among the plurality of connection terminals 108, the connection terminals 108 at least located at both ends of the first side 1021 and the second side 1022 along the second direction are provided with installation limiting structures 1080, such as Figure 2 As shown, installation limiting structures 1080 are respectively formed on the DC positive terminal 1, the DC negative terminal 5, the first signal terminal 6, and the signal terminal 19. The installation limiting structure 1080 is located on the side of the corresponding connection terminal 108 away from other connection terminals 108 along the second direction. The installation limiting structure 1080 can protrude along the second direction to form a limiting convex portion. When the power module 400 is connected to the circuit board, when each connection terminal 108 is inserted into the corresponding electrical connection hole of the circuit board, the installation limiting structure 1080 can abut against the circuit board, thereby preventing the connection terminal 108 from being inserted too deep into the electrical connection hole, resulting in deformation or damage of the circuit board or its own structure.

[0099] In some embodiments, referring to Figures 1-4 , the power module 400 may further include a plastic package 300. Specifically, the plastic package 300 can wrap the substrate 100, and the connection terminals 108 can be led out from the plastic package 300. The plastic package 300 can be injection-molded from an insulating material. The plastic package 300 can insulate and separate the connection terminals 108 from each other, and silicone gel can be poured inside the plastic package 300 to improve the insulation protection of the internal components. In this way, by providing the plastic package 300, the power elements 200 and the substrate 100 inside the power module 400 can be separated from the external environment, achieving insulation performance and better protecting the internal components.

[0100] Optionally, the plastic package 300 is a high-temperature resistant component to ensure the structural stability of the plastic package 300 when the power module 400 operates under high voltage and high current conditions.

[0101] In some embodiments, in combination with Figure 1 and Figure 2 , a groove structure 301 is provided at the position of the plastic package 300 between any two adjacent power terminals 1081. The groove structure 301 penetrates the plastic package 300 along the thickness direction of the substrate 100. By providing the groove structure 301, the creepage distance under high voltage and high current conditions can be increased, thereby improving the reliability and safety of the power module 400, making the power module 400 more suitable for application as a vehicle-grade high-voltage power module 400.

[0102] In some embodiments, a heat dissipation metal layer is further provided on the second surface of the substrate 100. For example, the heat dissipation metal layer can be a copper layer, and the heat dissipation metal layer can be a continuous surface structure. The power module 400 may further include: a heat dissipation substrate (not shown in the figure). Specifically, the heat dissipation metal layer is in contact with the heat dissipation substrate to improve the heat dissipation efficiency of the substrate 100 and ensure the normal operation of each power component. Optionally, the heat dissipation metal layer can be welded to the heat dissipation substrate, and heat is transferred between the heat dissipation metal layer and the heat dissipation substrate through a solder layer.

[0103] Referring to Figure 1 , mounting holes 302 are provided on both sides of the plastic package 300 along the second direction, and the heat dissipation substrate is provided with mating holes. The plastic package 300 and the heat dissipation substrate are connected by fasteners passing through the mounting holes 302 and the mating holes in sequence. In this way, the connection method between the plastic package 300 and the heat dissipation substrate is simple and reliable, and easy to assemble.

[0104] Next, the motor controller according to the second aspect embodiment of the present invention will be described.

[0105] The motor controller of this embodiment may include: the power module 400 in the above embodiment.

[0106] For example, the motor controller can convert the direct current generated by the energy storage device into alternating current for the motor to use, so as to better drive the motor to operate and provide power for the vehicle. The energy storage device can be a battery pack. Since a large number of single cells are integrated inside the energy storage device, the energy storage device has a relatively large current or voltage. During the operation of the power module 400, more heat will also be generated, and the temperature monitoring element on the power module 400 can monitor the heat generation state of the power module 400, thereby providing a basis for the vehicle to adjust the power distribution strategy.

[0107] The motor controller according to an embodiment of the present utility model can convert the direct current generated by the energy storage device into alternating current for use by the motor by providing the power module 400 in the above embodiment, thereby providing power for the vehicle to move forward. Moreover, the temperature monitoring element on the power module 400 can monitor the heating state of the power module 400, thereby providing a basis for the vehicle to adjust the power distribution strategy.

[0108] Next, the vehicle according to the third aspect embodiment of the present utility model will be described.

[0109] The vehicle of this embodiment may include: the motor controller in the above embodiment.

[0110] The vehicle according to an embodiment of the present utility model can convert the direct current generated by the energy storage device into alternating current for use by an electrical device such as a motor by providing the motor controller in the above embodiment, thereby providing power for the vehicle to move forward.

[0111] In this specification, the embodiments or implementation manners are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. For the same or similar parts among the various embodiments, reference can be made to each other.

[0112] It should be noted that the embodiments referred to as "an embodiment", "embodiment", "exemplary embodiment", "some embodiments", etc. in the specification may include specific features, structures or characteristics, but not necessarily every embodiment includes such specific features, structures or characteristics. Moreover, such phrases do not necessarily refer to the same embodiment. In addition, when combining specific features, structures or characteristics with an embodiment, implementing such features, structures or characteristics in combination with other embodiments, whether explicitly or implicitly described, is within the knowledge scope of those skilled in the art.

[0113] Generally speaking, terms should be understood at least in part based on their use in the context. For example, at least in part depending on the context, the term "one or more" used in the text can be used to describe any feature, structure or characteristic in the sense of a singular, or can be used to describe a combination of features, structures or characteristics in the sense of a plural. Similarly, at least in part depending on the context, terms such as "a" or "the" can also be understood to convey a singular usage or a plural usage.

[0114] It should be easily understood that the terms "on...", "above...", and "over..." in this disclosure should be interpreted in the broadest manner, so that "on..." not only means "directly on something", but also includes the meaning of "on something" with intermediate features or layers therebetween, and "above..." or "over..." not only includes the meaning of "above or over something", but also can include the meaning of "above or over something" with no intermediate features or layers therebetween (i.e., directly on something).

[0115] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than limiting them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A power module (400), characterized in that, Comprising: A substrate (100), including opposite first and second surfaces, wherein the first surface is provided with a plurality of spaced-apart conductive regions, and the plurality of conductive regions include: a first DC transmission region (103), a second DC transmission region (105), an AC region (104), and a temperature control region (106). The temperature control region (106) is disposed along the edge of the substrate (100), and at least one of the first DC transmission region (103), the second DC transmission region (105), and the AC region (104) is disposed adjacent to the temperature control region (106); Power elements (200), where there are a plurality of the power elements (200), and the plurality of power elements (200) form a plurality of bridge arms. Each bridge arm includes an upper bridge and a lower bridge. Among them, the power elements (200) corresponding to the plurality of upper bridges are all disposed in the first DC transmission region (103), and the power elements (200) corresponding to the plurality of lower bridges are disposed in the corresponding AC region (104); A temperature monitoring element, which is disposed in the temperature control region (106).

2. The power module (400) according to claim 1, characterized in that, The plurality of conductive regions together constitute a conductive metal layer (102). The outer contour of the conductive metal layer (102) includes a first side (1021) and a second side (1022) opposite to each other in a first direction, and a third side (1023) and a fourth side (1024) opposite to each other in a second direction. The first direction is perpendicular to the second direction; At least a part of the first DC transmission region (103) is disposed along the first side (1021), and the temperature control region (106) is disposed between one of the third side (1023) and the fourth side (1024) and the first DC transmission region (103); The second DC transmission region (105) is disposed along the second side (1022), and one end thereof extends to the fourth side (1024). The second DC transmission region (105) is spaced apart from the first DC transmission region (103) in the first direction.

3. The power module (400) according to claim 2, characterized in that, At least a part of the AC region (104) is disposed between the first DC transmission region (103) and the second DC transmission region (105).

4. The power module (400) according to claim 3, characterized in that, The first DC transmission region (103) includes a first sub-region (1031) and a second sub-region (1032). The first sub-region (1031) is disposed along the first side (1021), and the second sub-region (1032) is disposed along the third side (1023) and is connected to the first sub-region (1031); The second DC transmission region (105) is spaced apart from the first sub-region (1031) and the second sub-region (1032) respectively; The AC region (104) is located in the region between the first sub-region (1031), the second sub-region (1032), and the second DC transmission region (105).

5. The power module (400) according to claim 4, characterized in that, The temperature control zone (106) is located in the intersection area of ​​the first sub-area (1031) and the second sub-area (1032), or the temperature control zone (106) is located in a corner area defined by the first sub-area (1031) and the AC zone (104).

6. The power module (400) according to claim 5, characterized in that, There are three bridge arms, the AC region (104) comprises three AC sub-regions arranged side by side and at intervals along the second direction, the three bridge arms constitute a three-phase full-bridge circuit, and the three bridge arms correspond to the U phase, the V phase and the W phase respectively. The power elements (200) corresponding to the plurality of upper bridges are arranged side by side along the second direction and are respectively connected to the corresponding AC sub-areas.

7. The power module (400) according to claim 6, characterized in that, There are two temperature control zones (106), and the two temperature control zones (106) are arranged adjacent to each other.

8. The power module (400) according to any one of claims 2-7, characterized in that, Also includes: A plurality of connection terminals (108), wherein the plurality of connection terminals (108) are respectively arranged on the first side (1021) and the second side (1022), and each of the connection terminals (108) is connected to a corresponding conductive area or a power element (200).

9. The power module (400) according to claim 8, characterized in that, The connection terminal (108) comprises: a power terminal (1081) and a signal terminal (1082), and there are plural power terminals (1081) and plural signal terminals (1082); The plurality of power terminals (1081) are arranged on the substrate (100) along the second side edge (1022), and are respectively connected to the first DC transmission area (103), the second DC transmission area (105), and the AC area (104); The plurality of signal terminals (1082) are respectively arranged on the substrate (100) along the first side edge (1021), and each of the signal terminals (1082) is respectively connected to the power element (200) or the temperature control zone (106).

10. The power module (400) according to claim 9, characterized in that, The cross-sectional area of ​​the power terminal (1081) along the reference plane is greater than the cross-sectional area of ​​the signal terminal (1082) along the reference plane, The reference plane is parallel to the second direction and perpendicular to the substrate (100).

11. The power module (400) according to claim 9, characterized in that, The plurality of signal terminals (1082) are divided into a plurality of terminal groups arranged at intervals along the second direction, one of the terminal groups corresponds to and is connected to the temperature control zone (106), and the remaining terminal groups correspond to and are connected to the power elements (200), respectively, and each of the terminal groups includes two signal terminals (1082). The spacing between two signal terminals (1082) belonging to the same terminal group is different from the spacing between two adjacent terminal groups.

12. The power module (400) according to claim 11, characterized in that, The distance between two adjacent power terminals (1081) along the second direction is a, the distance between two signal terminals (1082) belonging to the same terminal group is b, and the distance between two adjacent terminal groups along the second direction is c; wherein, b and a satisfy: b < a; and / or, The b and the c satisfy: b c.

13. The power module (400) according to claim 9, characterized in that, The first surface is also provided with at least one transition area (107). A projection of the switching area (107) on the first surface and a projection of the power element (200) in the first DC transmission area (103) on the first surface are offset along the second direction, At least one of the power elements (200) and the corresponding signal terminals (1082) are respectively connected to the transfer area (107).

14. The power module (400) according to claim 13, characterized in that, The first DC transmission area (103) surrounds the transfer area (107), and the transfer area (107) and the power elements (200) provided in the first DC transmission area (103) are arranged side by side along the second direction.

15. The power module (400) according to claim 8, characterized in that, Among the plurality of connection terminals (108), at least the connection terminals (108) located at both ends of the first side (1021) and the second side (1022) along the second direction are provided with installation limiting structures (1080).

16. The power module (400) according to claim 15, characterized in that, The installation limiting structure (1080) protrudes along the second direction to form a limiting convex portion.

17. The power module (400) according to claim 9, characterized in that, Further included is: A plastic package (300) that wraps the substrate (100), the connection terminals (108) extend out from the plastic package (300), and the plastic package (300) separates any two adjacent connection terminals (108).

18. The power module (400) according to claim 17, characterized in that, The plastic package (300) is provided with a groove structure (301) at a position between any two adjacent power terminals (1081), and the groove structure (301) penetrates the plastic package (300) along the thickness direction of the substrate (100).

19. The power module (400) according to claim 17, characterized in that, A heat dissipation metal layer is further provided on the second surface of the substrate (100); The power module (400) further includes: a heat dissipation substrate, the heat dissipation metal layer is in contact with the heat dissipation substrate, the plastic package (300) is provided with mounting holes (302) on both sides along the second direction, the heat dissipation substrate is provided with mating holes, and the plastic package (300) and the heat dissipation substrate are connected by fasteners passing through the mounting holes (302) and the mating holes in sequence.

20. A motor controller, characterized in that, Including: The power module (400) according to any one of claims 1-19.

21. A vehicle, characterized in that, Including: The motor controller according to claim 20.

Images