Immersion type chip heat dissipation structure

Abstract

The utility model relates to the technical field of chip heat dissipation, and discloses a soaking type chip heat dissipation structure. The soaking type chip heat dissipation structure comprises an upper cover and a PCB substrate fixedly connected to the bottom face of the upper cover in a sealed mode, a chip is electrically connected to the PCB substrate, a plurality of installation columns are arranged around the chip at equal intervals, a water inlet and a water outlet are formed in the top face of the upper cover, and a containing cavity is formed in the bottom face of the upper cover; a sealing groove is formed around the containing cavity, and a sealing piece is arranged in the sealing groove. A plurality of mounting holes matched with the mounting columns are further formed in the circumferential edge of the upper cover, the PCB substrate is fixedly connected with the upper cover in a sealed mode through the mounting columns, and the chip is packaged in the containing cavity. According to the soaking type chip heat dissipation structure, the chip is sealed in the containing cavity, heat is conducted in a direct contact mode with the cooling liquid, a middle heat conduction layer is omitted, and the heat conduction efficiency and the heat dissipation efficiency of the chip are higher.

Description

Technical Field

[0001] The utility model relates to the technical field of chip heat dissipation, and particularly relates to an immersion type chip heat dissipation structure. Background Technique

[0002] With the rapid development of science and technology, chips show a development trend of high integration, complexity and high frequency. However, the increasing heat generation of chips has become a key factor hindering the improvement of chip performance and reliability. To ensure that the chips can exert their maximum performance and stability, conventional air-cooled radiators cannot effectively take away the heat generated by the chips under high-power operation. Therefore, the liquid-cooling heat dissipation method has been adopted by most manufacturers.

[0003] In a traditional liquid-cooled radiator, a heat conduction layer is usually arranged between the water-cooling block and the chip to conduct the heat generated by the chip to the water-cooling block for heat dissipation. However, the heat conduction efficiency of the heat conduction layer will have a certain loss, resulting in a low heat dissipation effect.

[0004] Therefore, there is an urgent need for an immersion type chip heat dissipation structure to solve the above problems. Content of the Utility Model

[0005] Based on the above, the purpose of the utility model is to provide an immersion type chip heat dissipation structure to solve the problem of low heat dissipation effect caused by the heat conduction layer in the traditional liquid-cooled radiator.

[0006] To solve the above technical problems, the utility model adopts the following technical scheme:

[0007] An immersion type chip heat dissipation structure provided by the utility model includes:

[0008] An upper cover, the top surface of which is provided with a water inlet and a water outlet, and the bottom surface of which is provided with a receiving cavity;

[0009] A sealing groove, which is arranged around the receiving cavity, and a sealing member is arranged in the sealing groove;

[0010] A PCB substrate, which is connected to the bottom surface of the upper cover, a chip is installed on the PCB substrate, and a plurality of mounting posts are fixedly arranged around the chip;

[0011] Wherein, a plurality of mounting holes matching the mounting posts are further arranged at the circumferential edge of the upper cover, the PCB substrate is hermetically and fixedly connected to the upper cover through the mounting posts, and the chip is encapsulated in the receiving cavity.

[0012] As an optional technical solution of the immersion type chip heat dissipation structure, the mounting post is an integral combined structure composed of a first cylinder and a second cylinder with different diameters; wherein, the first cylinder is located above the second cylinder.

[0013] As an alternative technical solution of the immersion chip heat dissipation structure, a threaded hole is provided on the central axis of the first cylinder.

[0014] As an alternative technical solution of the immersion chip heat dissipation structure, the mounting hole is a tapered through hole, a first shoulder portion, and a second shoulder portion that are sequentially opened from top to bottom. The diameter of the first shoulder portion is the same as that of the first cylinder, and the diameter of the second shoulder portion is the same as that of the second cylinder.

[0015] As an alternative technical solution of the immersion chip heat dissipation structure, the abutting surface between the upper cover and the PCB substrate is adhesively connected.

[0016] As an alternative technical solution of the immersion chip heat dissipation structure, the mounting post is made of copper alloy, and the mounting post and the PCB substrate are fixed by welding.

[0017] As an alternative technical solution of the immersion chip heat dissipation structure, the seal is a sealing ring made of rubber or silica gel.

[0018] The beneficial effects of the present utility model are as follows:

[0019] The present utility model provides an immersion chip heat dissipation structure, which includes: an upper cover and a PCB substrate hermetically fixed to the bottom surface of the upper cover, a chip cell is connected to the PCB substrate, a plurality of mounting posts are arranged at equal intervals around the chip, a water inlet and a water outlet are provided on the top surface of the upper cover, and a receiving cavity is provided on the bottom surface; a sealing groove is arranged around the receiving cavity, and a seal is installed in the sealing groove; a plurality of mounting holes matching the mounting posts are further provided at the circumferential edge of the upper cover, and the PCB substrate is hermetically and fixedly connected to the upper cover through the mounting posts, and the chip is encapsulated in the receiving cavity. Under the above structure, a screw passes through the mounting hole and is threadedly locked with the threaded hole on the mounting post; the sealing ring is compressed during the threaded locking of the upper cover and the PCB substrate and tightly fits with the sealing groove and the upper surface of the PCB substrate under its own elastic force. At this time, a sealed cavity is formed between the receiving cavity and the PCB substrate; on the other hand, the abutting surface between the bottom surface of the upper cover and the PCB substrate is adhesively connected to make the sealing performance stronger; a coolant is injected into the receiving cavity through the water inlet and output from the water outlet to form a liquid cooling circulation system. The immersion chip heat dissipation structure conducts heat by directly contacting the chip sealed in the receiving cavity with the coolant, eliminating the intermediate heat conduction layer, making the heat conduction efficiency and heat dissipation efficiency of the chip higher; in addition, this structure is simpler than the traditional liquid cooling heat dissipation structure and occupies a smaller volume, making its applicability wider. Description of the Drawings

[0020] Figure 1 It is a schematic diagram of the overall structure of the immersion chip heat dissipation structure of the present utility model;

[0021] Figure 2 This is the exploded view of the immersion chip heat dissipation structure of the present utility model;

[0022] Figure 3 This is the present utility model Figure 2 The enlarged schematic view of part A in it;

[0023] Figure 4 This is the bottom view of the upper cover in the embodiment of the present utility model;

[0024] Figure 5 This is the cross-sectional schematic view of the upper cover in the embodiment of the present utility model;

[0025] Figure 6 This is the present utility model Figure 5 The enlarged schematic view of part B in it.

[0026] In the figure:

[0027] 1. Upper cover; 11. Water inlet; 12. Water outlet; 13. Mounting hole; 131. Tapered through hole; 132. First shoulder; 133. Second shoulder; 15. Accommodating cavity; 16. Sealing groove; 161. Sealing member;

[0028] 2. PCB substrate; 3. Mounting post; 31. Threaded hole; 32. First cylinder; 33. Second cylinder; 4. Chip. Detailed implementation manners

[0029] The following further describes the present utility model in detail with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present utility model, rather than limiting the present utility model. In addition, it should be noted that for the convenience of description, only the parts related to the present utility model rather than all the structures are shown in the drawings.

[0030] In the description of the present utility model, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0031] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may also include the case where the first and second features are not in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "beneath" and "underneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0032] In the description of this embodiment, the orientation or positional relationship terms such as "above", "below", "left" and "right" are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model.

[0033] In the description of the present utility model, unless otherwise specified, the meaning of "a plurality of" is two or more. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0034] As Figures 1-6 shown, the present utility model provides an immersion type chip heat dissipation structure, and the immersion type chip heat dissipation structure includes: an upper cover 1, on the top surface of which there are a water inlet 11 and a water outlet 12, and on the bottom surface of which there is a receiving cavity 15; a sealing groove 16, which is arranged around the receiving cavity 15, and a sealing member 161 is arranged in the sealing groove 16; a PCB substrate 2, which is connected to the bottom surface of the upper cover 1, a chip 4 is installed on the PCB substrate 2, and a plurality of mounting posts 3 are fixedly arranged around the chip 4; wherein, a plurality of mounting holes 13 matching the mounting posts 3 are further arranged at the circumferential edge of the upper cover 1, and the PCB substrate 2 is hermetically and fixedly connected to the upper cover 1 through the mounting posts 3, and the chip 4 is encapsulated in the receiving cavity 15.

[0035] An immersion-type chip heat dissipation structure provided by the utility model is installed through screws passing through the mounting holes 13 and is thread-locked with the threaded holes 31 on the mounting posts 3; the sealing ring is compressed during the process of thread-locking the upper cover 1 and the PCB substrate 2 and closely fits with the sealing groove 16 and the upper surface of the PCB substrate 2 under its own elastic force. At this time, a sealed cavity is formed between the accommodating cavity 15 and the PCB substrate 2; on the other hand, the abutting surface between the bottom surface of the upper cover 1 and the PCB substrate 2 is adhesively connected to make its sealing performance stronger; coolant is injected into the accommodating cavity 15 through the water inlet 11 and output from the water outlet 12 to form a liquid cooling circulation system. This immersion-type chip heat dissipation structure conducts heat by directly contacting the chip 4 sealed in the accommodating cavity 15 with the coolant, eliminating the intermediate heat conduction layer, making the heat conduction efficiency and heat dissipation efficiency of the chip 4 higher, and this structure is relatively simpler than the traditional liquid cooling heat dissipation structure, occupies a smaller volume, and has a wider applicability.

[0036] Specifically, as Figure 1 and Figure 2 shown, the water inlet 11 and the water outlet 12 are symmetrically arranged on the surface of the upper cover 1 and are conductively connected to the accommodating cavity 15. The water inlet 11, the water outlet 12 and the upper cover 1 are of an integrally formed structure. The coolant is injected into the accommodating cavity 15 through the water inlet 11 and then flows out from the water outlet 12 to form a liquid cooling circulation system, enabling the chip 4 sealed in the accommodating cavity 15 to directly contact the coolant for heat conduction, improving the heat dissipation efficiency of the chip 4.

[0037] In this embodiment, as Figure 2 and Figure 4 shown, the sealing groove 16 is formed around the accommodating cavity 15 on the bottom surface of the upper cover 1, and a sealing member 161 is installed therein. The sealing member 161 can be a sealing ring or a sealing strip made of rubber or silica gel. Rubber or silica gel materials have good compression and elastic force. After the upper cover 1 and the PCB substrate 2 are fixedly locked and connected, the sealing member 161 closely fits with the sealing groove 16 and the upper surface of the PCB substrate 2 under its own elastic force, forming a sealed space between the accommodating cavity 15 and the PCB substrate 2 to prevent the coolant from overflowing; the number of the sealing grooves 16 can be adjusted according to actual applications to achieve the best sealing effect.

[0038] Furthermore, an adhesive layer is coated on the abutting surface between the upper cover 1 and the PCB substrate 2. On the one hand, the adhesive connection makes the sealing performance between the upper cover 1 and the PCB substrate 2 better. On the other hand, when this chip 4 heat dissipation structure is used for a long time, there will be no risk of liquid leakage due to the deformation of the PCB substrate 2 and the upper cover 1 caused by temperature or external factors. That is to say, the adhesive connection method makes the stability of the chip heat dissipation structure better and its service life longer.

[0039] In this embodiment, asFigure 3 and Figures 5-6 As shown in Figures 5-6 , the mounting post 3 is made of copper alloy. The mounting post 3 and the PCB substrate 2 are connected by soldering with solder paste. A plurality of mounting posts 3 are provided around the chip 4, preferably three mounting posts 3 are arranged at equal intervals on each side. The number can also be set according to actual applications. In this structure, when the upper cover 1 and the PCB substrate 2 are locked by screws, the force can be more evenly distributed, avoiding damage to the electronic components due to uneven force when the PCB substrate 2 and the upper cover 1 are fixedly locked, and at the same time improving the sealing performance between the upper cover 1 and the PCB substrate 2.

[0040] Specifically, the mounting post 3 is an integral combined structure composed of a first cylinder 32 and a second cylinder 33 with different diameters, and the first cylinder 32 is located above the second cylinder 33. A threaded hole 31 is provided on the central axis of the first cylinder 32; the mounting hole 13 is a tapered through hole 131, a first shoulder 132 and a second shoulder 133 opened from top to bottom in sequence. The diameter of the first shoulder 132 is the same as the diameter of the first cylinder 32, and the height from the first shoulder 132 to the second shoulder 133 is the same as the height of the first cylinder 32. The diameter of the second shoulder 133 is the same as the diameter of the second cylinder 33, and the height from the second shoulder 133 to the bottom surface of the upper cover 1 is the same as the height of the second cylinder 33. Thus, when a screw with a tapered nut passes through the mounting hole 13 and is threadedly connected to the threaded hole 31 on the first cylinder 32, the tapered nut and the tapered through hole 131 are in close contact, the top surface of the first cylinder 32 is in close contact with the first shoulder, and the top surface of the second cylinder 33 is located at the circumferential edge of the outer diameter of the first cylinder 32 and is in close contact with the second shoulder 133, so that the mounting post 3 and the mounting hole 13 can be tightly connected, preventing the coolant from leaking through the gap of the mounting hole 13. At the same time, the setting of the mounting post 3 can also improve the stability between the upper cover 1 and the PCB substrate 2.

[0041] The above is only a preferred embodiment of the present invention, and it is not intended to limit the present invention in any form. Although the present invention is disclosed above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art, without departing from the technical solution of the present invention, when making some changes or modifications using the above-disclosed technical content as equivalent change equivalent embodiments, but as long as it does not depart from the technical solution content of the present invention, any simple modification, equivalent change and modification made to the above embodiments according to the technical meaning of the present invention shall fall within the scope of the technical solution of the present invention.

Claims

1. An immersion chip heat dissipation structure, characterized in that, Including: An upper cover, on whose top surface there are a water inlet and a water outlet, and on whose bottom surface there is a receiving cavity; A sealing groove, arranged around the receiving cavity, and a sealing member is arranged in the sealing groove; A PCB substrate, connected to the bottom surface of the upper cover, a chip is installed on the PCB substrate, and a plurality of mounting posts are fixedly arranged around the chip; Wherein, a plurality of mounting holes matching the mounting posts are further arranged at the circumferential edge of the upper cover, the PCB substrate is hermetically and fixedly connected to the upper cover through the mounting posts, and the chip is encapsulated in the receiving cavity.

2. The immersion chip heat dissipation structure according to claim 1, characterized in that, The mounting post is an integrated combined structure composed of a first cylinder and a second cylinder with different diameters; wherein, the first cylinder is located above the second cylinder.

3. The immersion-type chip heat dissipation structure according to claim 2, characterized in that, A threaded hole is arranged on the central axis of the first cylinder.

4. The immersion chip heat dissipation structure according to claim 3, characterized in that, The mounting hole is a tapered through hole, a first shoulder portion and a second shoulder portion successively opened from top to bottom, the diameter of the first shoulder portion is the same as that of the first cylinder, and the diameter of the second shoulder portion is the same as that of the second cylinder.

5. The immersion chip heat dissipation structure according to claim 1, wherein, The abutting surface between the upper cover and the PCB substrate is adhesively connected.

6. The immersion chip heat dissipation structure according to claim 1, wherein, The mounting post is made of copper alloy, and the mounting post and the PCB substrate are fixedly connected by welding.

7. The immersion chip heat dissipation structure according to claim 1, characterized in that, The sealing member is a sealing ring made of rubber material or silica gel material.

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