Heat dissipation support and power conversion device

Abstract

The utility model relates to the technical field of heat dissipation, and discloses a heat dissipation support and a power conversion device. The heat dissipation support comprises a support body and a heat dissipation piece. The frame body is provided with a mounting groove. The mounting groove is configured to mount a semiconductor power device. A first positioning part is arranged on the frame body; the heat dissipation piece is connected with the frame body and seals the installation groove. The heat sink is configured to abut the semiconductor power device. The semiconductor power device is connected through the mounting groove of the frame body, and the heat dissipation piece can seal the mounting groove, so that the semiconductor power device and the heat dissipation piece form heat conduction connection after abutting against each other. Therefore, heat generated by the semiconductor power device can be taken away through the heat dissipation piece, rapid heat dissipation of the semiconductor power device is achieved, the performance of the power conversion device is improved, and potential safety hazards are prevented.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation, and particularly relates to a heat dissipation bracket and a power conversion device. Background Art

[0002] A power conversion device is used to convert an AC power supply into a DC power supply, and is widely used in new energy vehicles. The power conversion device includes a plurality of power transistors, and the external power supply is converted into an AC / DC power supply with a voltage level that can be used by the vehicle through the power transistors. When the power conversion device is in a working state, the power transistors will generate a large amount of heat. Excessive temperature will affect the performance of the power conversion device and even pose a safety hazard. Utility Model Content

[0003] This application aims to provide a heat dissipation bracket and a power conversion device, which can take away the heat generated by semiconductor power devices through heat dissipation components, realize the rapid heat dissipation of semiconductor power devices, thereby improving the performance of the power conversion device and preventing safety hazards.

[0004] An embodiment of this application provides a heat dissipation bracket, including:

[0005] A frame body is configured with an installation groove, the installation groove is configured to install a semiconductor power device, and a first positioning portion is provided on the frame body;

[0006] A heat dissipation component is connected to the frame body and closes the installation groove, and the heat dissipation component is configured to abut against the semiconductor power device.

[0007] In some embodiments, one side of the frame body is configured with an assembly groove communicating with the notch of the installation groove. Along a first direction, the projection of the assembly groove covers the projection of the installation groove, wherein the heat dissipation component is arranged in the assembly groove.

[0008] In some embodiments, the frame body is further configured with a relief channel communicating with the installation groove, the relief channel is also communicated with the assembly groove, and the relief channel is configured to pass through the pins of the semiconductor power device.

[0009] In some embodiments, a partition is arranged in the installation groove, and the partition divides the installation groove into at least two installation areas, and each installation area is configured to install the semiconductor power device.

[0010] In some embodiments, the heat dissipation component includes a thermally conductive silicone layer and / or a ceramic sheet.

[0011] An embodiment of this application further provides a power conversion device, including:

[0012] The heat dissipation bracket as described above;

[0013] The base is configured with a connecting groove, and the frame body is installed in the connecting groove;

[0014] The semiconductor power device is installed in the installation groove.

[0015] In some embodiments, the base is configured with an assembly opening communicating with the connecting groove, and the frame body passes through the connecting groove from the assembly opening.

[0016] In some embodiments, the pins of the semiconductor power device pass through the connecting groove from the relief channel of the frame body and the assembly opening of the base, and the pins are electrically connected to the circuit board.

[0017] In some embodiments, the connecting groove has a first mating surface relative to the assembly opening, and the first mating surface is configured with a second positioning portion that mates with the first positioning portion. Among them, one of the first positioning portion and the second positioning portion is a positioning post, and the other is a positioning hole.

[0018] In some embodiments, the base is configured with a stop portion that extends toward the connecting groove and partially blocks the notch of the connecting groove. Among them, the stop portion abuts against the frame body.

[0019] In some embodiments, a process hole communicating with the installation groove is configured on a side of the frame body away from the heat dissipation member. The base is detachably connected with a locking member. The locking member is configured with an elastic portion extending toward the frame body. The elastic portion passes through the process hole and abuts against the semiconductor power device.

[0020] In some embodiments, the base is configured with a mounting hole, and the locking member is configured with a connection hole. The connection hole and the mounting hole are connected by a fastener.

[0021] The heat dissipation bracket and the power conversion device provided by the embodiments of the present application connect the semiconductor power device through the installation groove of the frame body. The heat dissipation member can enclose the installation groove so that the semiconductor power device forms a heat conduction connection after abutting against the heat dissipation member. Thus, the heat generated by the semiconductor power device can be taken away by the heat dissipation member, realizing the rapid heat dissipation of the semiconductor power device, thereby improving the performance of the power conversion device and preventing potential safety hazards. Description of the Drawings

[0022] The following will clearly show the technical solutions and other beneficial effects of the present application by describing the specific embodiments of the present application in detail in conjunction with the drawings.

[0023] Figure 1 It is a schematic structural diagram of the frame body provided by the embodiments of the present application.

[0024] Figure 2Schematic structural diagram of the heat dissipation bracket provided by the embodiment of the present application.

[0025] Figure 3 is Figure 2 exploded view of.

[0026] Figure 4 Schematic structural diagram of the power conversion device provided by the embodiment of the present application.

[0027] Figure 5 is Figure 4 exploded view of.

[0028] Figure 6 Cross-sectional view of the power conversion device provided by the embodiment of the present application.

[0029] Reference numerals:

[0030] 10 - Frame body, 110 - Installation groove, 120 - Assembly groove, 130 - Relief channel, 140 - Partition, 150 - Second mating surface, 160 - Positioning post, 170 - Process hole, 20 - Heat dissipation component, 210 - Thermal conductive silicone layer, 220 - Ceramic sheet, 30 - Semiconductor power device, 310 - Pin, 40 - Base, 410 - Connection groove, 420 - Assembly port, 430 - First mating surface, 440 - Positioning hole, 450 - Stopping portion, 460 - Mounting hole, 50 - Circuit board, 60 - Locking member, 610 - Elastic portion. Detailed implementation manners

[0031] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application.

[0032] In the description of the present application, it should be understood that the orientation or positional relationships indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. are based on the orientation or positional relationships shown in the drawings. These are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more, unless otherwise specifically defined.

[0033] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "mounted", "connected" and "coupled" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection or an integral connection; it may be a mechanical connection, an electrical connection or a connection capable of mutual communication; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0034] In the present application, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely means that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely means that the horizontal height of the first feature is lower than that of the second feature.

[0035] The following disclosure provides many different embodiments or examples for implementing different structures of the present application. To simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are only examples and are not intended to limit the present application. In addition, the present application may repeat reference numerals and / or reference letters in different examples. This repetition is for the purpose of simplification and clarity and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0036] Specifically, please refer to Figures 1 to 3 , an embodiment of the present application provides a heat dissipation bracket. The heat dissipation bracket is applied to a semiconductor power device 30. The heat dissipation bracket includes a frame body 10 and a heat dissipation member 20. The frame body 10 is configured with a mounting groove 110. The mounting groove 110 is configured to mount the semiconductor power device 30. A first positioning portion is configured on the frame body 10. The heat dissipation member 20 is connected to the frame body 10 and closes the mounting groove 110. The heat dissipation member 20 is configured to abut against the semiconductor power device 30.

[0037] In some embodiments, the semiconductor power device 30 is connected through the mounting groove 110 of the frame body 10, and the heat dissipation member 20 can close the mounting groove 110 so that a thermal connection is formed after the semiconductor power device 30 abuts against the heat dissipation member 20. Thus, the heat generated by the semiconductor power device 30 can be taken away by the heat dissipation member 20, realizing the rapid heat dissipation of the semiconductor power device 30, thereby improving the performance of the power conversion device and preventing potential safety hazards.

[0038] Among them, the frame body 10 can be made of an insulating material such as plastic. After the semiconductor power device 30 is mounted in the mounting groove 110 of the frame body 10, the insulating frame body 10 can increase the creepage distance between the semiconductor power device 30 and the base 40 of the power conversion device, improving safety.

[0039] The semiconductor power device 30 includes a power transistor. The heat dissipation member 20 can only be attached to the semiconductor power device 30, and the two do not need to be bonded.

[0040] Among them, the mounting groove 110 can be set as a square groove, and its notch is located on one side of the frame body 10. The semiconductor power device 30 can be mounted into the mounting groove 110 from the notch, and then the notch is closed by the heat dissipation member 20 and is thermally connected to the semiconductor power device 30.

[0041] Among them, the heat dissipation bracket can be mounted on the following base 40 after assembling the semiconductor power device 30. The heat dissipation bracket and the base 40 are connected in a split manner and are simply assembled, and the two are not integrally formed.

[0042] It is understandable that the first positioning portion can realize the positioning and installation of the frame 10, so that it can be quickly assembled. For example, the frame 10 has a second mating surface 150 away from the clearance channel 130, and the second mating surface 150 is configured with a first positioning portion. When the frame 10 is installed on the base 40, the first positioning portion can be matched with the second positioning portion of the base 40 to realize the rapid positioning and assembly of the frame 10.

[0043] The first positioning portion is used to achieve positioning and installation of the frame 10 , and is disposed on the surface of the frame 10 , but not on the wall surface of the installation groove 110 .

[0044] like Figure 1 and Figure 2 As shown, in some embodiments, a mounting groove 120 connected to the notch of the mounting groove 110 is configured on one side of the frame 10. Along the first direction, the projection of the mounting groove 120 covers the projection of the mounting groove 110. The heat sink 20 is disposed in the mounting groove 120.

[0045] It is understandable that the heat sink 20 is arranged in the assembly groove 120. Since the projection of the assembly groove 120 covers the projection of the mounting groove 110, the heat sink 20 installed in the assembly groove 120 can cover all areas of the mounting groove 110. Thus, all semiconductor power devices 30 installed in the mounting groove 110 can be cooled by one heat sink 20, which is convenient for assembly.

[0046] For example, the installation groove 110 and the assembly groove 120 are both configured as square grooves. The length of the installation groove 110 is L1 and the width is D1. The length of the assembly groove 120 is L2 and the width is D2. The following conditions are satisfied: L1≤L2, D1≤D2.

[0047] like Figure 1 As shown, in some embodiments, the frame 10 is further configured with a clearance channel 130 communicating with the mounting groove 110 , and the clearance channel 130 is also communicated with the assembly groove 120 , and the clearance channel 130 is configured to penetrate the pins 310 of the semiconductor power device 30 .

[0048] The semiconductor power device 30 generally has a pin 310. A clearance channel 130 is constructed on the frame 10 to allow the pin 310 to pass through the mounting groove 110, so as to be electrically connected to the circuit board 50 disposed outside the frame 10.

[0049] The number of the clearance channels 130 is the same as the number of semiconductor power devices 30 that can be installed in the installation slot 110. For example, the installation slot 110 is divided into four installation areas for installing conductor power devices by three partitions 140, and four clearance channels 130 are provided. Each clearance channel 130 is connected to a installation area.

[0050] In some embodiments, the relief channel 130 may be set as a square channel. The relief channel 130 has a certain width so that all the pins 310 on a semiconductor power device 30 can pass through one relief channel 130.

[0051] Please continue to refer to Figure 1 , in some embodiments, a partition 140 is provided in the mounting groove 110. The partition 140 divides the mounting groove 110 into at least two mounting areas, and each mounting area is configured to mount a semiconductor power device 30.

[0052] It can be understood that the partition 140 is used to divide the mounting groove 110 into multiple mounting areas. Each mounting area can correspond to mounting a semiconductor power device 30 to achieve independent mounting of each semiconductor power device 30.

[0053] Among them, the partition 140 may be integrally formed on the frame 10. The height of the partition 140 may be less than the groove depth of the mounting groove 110.

[0054] In some embodiments, the partitions 140 may be spaced apart at least two to divide the mounting groove 110 into at least three mounting areas. Among them, the shape and size of multiple semiconductor power devices 30 mounted on the same heat dissipation bracket are usually the same, so the shape and size of each mounting area are the same. Of course, if the shape and size of multiple semiconductor power devices 30 mounted on the same heat dissipation bracket are different, it is only necessary to make the shape and size of each mounting area different accordingly.

[0055] For example, the partitions 140 are spaced apart three to divide the mounting groove 110 into four mounting areas.

[0056] As Figure 3 shown, in some embodiments, the heat dissipation member 20 includes a thermally conductive silicone layer 210 and / or a ceramic sheet 220.

[0057] For example, the heat dissipation member 20 is only a layer of thermally conductive silicone layer 210. Or, the heat dissipation member 20 is only a layer of ceramic sheet 220. Or, the heat dissipation member 20 includes a thermally conductive silicone layer 210 and a ceramic sheet 220 that are sequentially abutted. Or, the heat dissipation member 20 includes a layer of ceramic sheet 220 and thermally conductive silicone layers 210 disposed on both sides of the ceramic sheet 220.

[0058] In the embodiments of the present application, it is preferably to set the heat dissipation member 20 as a layer of ceramic sheet 220 and thermally conductive silicone layers 210 disposed on both sides of the ceramic sheet 220. Among them, the thermal conductivity of the ceramic sheet 220 can reach 20 W / mK - 24 W / mK (W is the unit of thermal power - watt, m is the unit of length - meter, K is the unit of absolute temperature - Kelvin).

[0059] An embodiment of the present application further provides a power conversion device. The power conversion device includes a base 40, a semiconductor power device 30, and the heat dissipation bracket in the foregoing embodiment. The base 40 is configured with a connection groove 410. The frame body 10 is installed in the connection groove 410. The semiconductor power device 30 is installed in the installation groove 110.

[0060] As Figure 4 and Figure 6 shown, in some embodiments, the semiconductor power device 30 is connected through the installation groove 110 of the frame body 10, and the heat dissipation member 20 can enclose the installation groove 110 so that the semiconductor power device 30 is in thermal contact with the heat dissipation member 20 after contact. Thus, the heat generated by the semiconductor power device 30 can be taken away by the heat dissipation member 20, realizing rapid heat dissipation of the semiconductor power device 30, thereby improving the performance of the power conversion device and preventing potential safety hazards.

[0061] It can be understood that the base 40 is a component on the housing of the power conversion device for fixing the heat dissipation bracket. The base 40 can be made of aluminum alloy or other metal materials. Among them, the semiconductor power device 30 includes a power transistor.

[0062] Among them, the groove width of the assembly groove 120 is the same as the width of the frame body 10. Alternatively, the groove width of the assembly groove 120 can be slightly larger than the width of the frame body 10. At this time, the frame body 10 can be assembled in the assembly groove 120 with a gap to prevent excessive resistance when the frame body 10 is assembled. Among them, the groove depth of the assembly groove 120 can be the same as the thickness of the frame body 10. The groove height of the assembly groove 120 can be the same as the height of the frame body 10.

[0063] As Figure 5 shown, in some embodiments, the base 40 is configured with an assembly port 420 communicating with the connection groove 410. The frame body 10 passes through the assembly port 420 and is installed in the connection groove 410.

[0064] It can be understood that since the connection groove 410 of the base 40 is at least partially blocked by the stopper 450, the frame body 10 cannot be installed in the connection groove 410 from the notch of the connection groove 410. By forming an assembly port 420 communicating with the connection groove 410 on the base 40, the frame body 10 can be slidably installed in the connection groove 410 from the assembly port 420.

[0065] The shape of the assembly port 420 is the same as the shape of the frame body 10. For example, the assembly port 420 is set as a rectangular hole.

[0066] As Figure 5 shown, in some embodiments, the pins 310 of the semiconductor power device 30 pass through the relief channel 130 of the frame body 10 and the assembly port 420 of the base 40 and extend out of the connection groove 410, and the pins 310 are electrically connected to the circuit board 50.

[0067] The semiconductor power device 30 typically has pins 310. The pins 310 pass through the relief channel 130 and the assembly port 420 and extend out of the connection slot 410, and are electrically connected to the circuit board 50, thereby realizing electrical transmission and electrical control.

[0068] Among them, the pins 310 can be soldered to the pads of the circuit board 50. For example, the pins 310 of the circuit board 50 and the semiconductor power device 30 are soldered by selective wave soldering.

[0069] When soldering the circuit board 50 and the pins 310, the heat dissipation bracket has been locked in the connection slot 410 by the locking member 60.

[0070] Among them, the circuit board 50 can also be fixedly installed on the base 40 through fasteners. For example, through holes can be formed on the circuit board 50, and threaded holes can be formed on the base 40. Align the through holes of the circuit board 50 with the threaded holes of the base 40, and pass the fasteners through the through holes and the threaded holes in sequence to realize the fixed connection between the circuit board 50 and the base 40. Among them, two through holes can be provided on the circuit board 50, and the two through holes are respectively located on both sides of the length direction of the circuit board 50. Correspondingly, two threaded holes are also provided on the base 40.

[0071] The circuit board 50 is usually installed above the semiconductor power device 30. In order to fix the circuit board 50 at a suitable height position, columns can be provided on the base 40, and the threaded holes are formed on the top surface of the columns. Based on the fixed height of the circuit board 50, the height of the columns is reasonably set.

[0072] As Figure 2 and Figure 5 shown, in some embodiments, the connection slot 410 has a first mating surface 430 relative to the assembly port 420. The first mating surface 430 is configured with a second positioning portion that mates with the first positioning portion. Among them, the first positioning portion is the positioning post 160, and the second positioning portion is the positioning hole 440.

[0073] It can be understood that the frame 10 can be slidably installed in the connection slot 410 from the assembly port 420. When the frame 10 is installed in place, the first mating surface 430 of the connection slot 410 abuts against the second mating surface 150 of the frame 10, and the positioning post 160 of the second mating surface 150 is snap-fitted into the positioning hole 440 of the first mating surface 430. Thus, the preliminary positioning between the frame 10 and the connection slot 410 is realized.

[0074] In some embodiments, the connection slot 410 has a first mating surface 430 relative to the assembly port 420. The first mating surface 430 is configured with a second positioning portion that mates with the first positioning portion. Among them, the first positioning portion is the positioning hole 440, and the second positioning portion is the positioning post 160.

[0075] It can be understood that the frame body 10 can be slidably installed in the connection groove 410 from the assembly port 420. After the frame body 10 is installed in place, the first mating surface 430 of the connection groove 410 abuts against the second mating surface 150 of the frame body 10, and the positioning post 160 of the first mating surface 430 is clamped in the positioning hole 440 of the second mating surface 150. Thus, the preliminary positioning between the frame body 10 and the connection groove 410 is realized.

[0076] As Figure 4 and Figure 5 shown, in some embodiments, the base 40 is configured with a stop portion 450. The stop portion 450 extends toward the notch of the connection groove 410 and partially shields the notch of the connection groove 410. Among them, the stop portion 450 abuts against the frame body 10.

[0077] It can be understood that the stop portion 450 can partially shield the notch of the connection groove 410 to prevent the frame body 10 from falling off from the notch of the connection groove 410, and enable the frame body 10 to be slidably installed in the connection groove 410 only from the assembly port 420.

[0078] Among them, the distance between the stop portion 450 and the bottom surface of the connection groove 410 can be equal to the thickness of the frame body 10, so that the stop portion 450 can also play a certain clamping effect, and further realize the positioning installation of the frame body 10 in the connection groove 410.

[0079] In some embodiments, the stop portion 450 is set as a square structure. Among them, the stop portion 450 can be arranged in two at intervals, and the two stop portions 450 are integrally formed on the base 40.

[0080] In some embodiments, a process hole 170 communicating with the installation groove 110 is formed on the side of the frame body 10 away from the heat dissipation member 20. A locking member 60 is detachably connected to the base 40. The locking member 60 is configured with an elastic portion 610 extending toward the frame body 10. The elastic portion 610 passes through the process hole 170 and abuts against the semiconductor power device 30.

[0081] Based on the fact that the heat dissipation member 20 and the frame body 10 are not fastened by fasteners and adhesive layers, by using the locking member 60 and the elastic portion 610, the locking member 60 and the elastic portion 610 can fix the frame body 10 to the base 40 while making the heat dissipation member 20 closely adhere to the semiconductor power device 30, ensuring the heat dissipation effect.

[0082] As Figure 6As shown, the elastic part 610 can apply a certain force to the semiconductor power device 30, causing the semiconductor power device 30 to closely adhere to the heat sink 20 and enabling the heat sink 20 to closely adhere to the bottom surface of the connection groove 410. It can be understood that after pre-installing the heat sink 20 on the frame body 10 to form a heat dissipation bracket, the entire heat dissipation bracket is then arranged in the connection groove 410 of the base 40, and then the frame body 10 and the heat sink 20 are locked by the locking part 60. Thus, the pre-installation steps can be simplified and the production efficiency can be improved.

[0083] Multiple elastic parts 610 can be configured on the locking part 60. The number of the elastic parts 610 is adapted to the number of the aforementioned installation areas. For example, if the installation groove 110 is divided into four installation areas by three partitions 140, then the elastic parts 610 are also set to four.

[0084] On the side of the frame body 10 away from the heat sink 20, multiple process holes 170 can be configured. The number of the process holes 170 is adapted to the number of the aforementioned installation areas. For example, if the installation groove 110 is divided into four installation areas by three partitions 140, then the process holes 170 are also set to four.

[0085] Among them, the process holes 170 can be set as square holes. Or, the process holes 170 can also be set as holes of any shape such as circular holes and oval holes, as long as the elastic part 610 can pass through the process holes 170 to abut against the semiconductor power device 30.

[0086] In some embodiments, installation holes 460 are configured on the base 40. Connection holes are configured on the locking part 60. The connection holes and the installation holes 460 are connected by fasteners.

[0087] The connection holes on the locking part 60 are installed in the installation holes 460 of the base 40 through fasteners to realize the mutual fixation of the locking part 60 and the base 40. Thus, it is not necessary to open holes for fixing the locking part 60 on the circuit board 50, and the processing technology of the circuit board 50 is simplified.

[0088] In the above embodiments, the descriptions of each embodiment have their own focuses. For the parts not detailed in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0089] The above has introduced in detail a heat dissipation bracket and a power conversion device provided by the embodiments of the present application. Specific examples are used herein to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the technical solution and its core idea of the present application; those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipation bracket, characterized in that, Comprising: A frame body, which is configured with an installation groove, the installation groove is configured to install a semiconductor power device, and a first positioning portion is provided on the frame body; A heat dissipation member, which is connected to the frame body and closes the installation groove, and the heat dissipation member is configured to abut against the semiconductor power device.

2. The heat dissipation bracket according to claim 1, wherein One side of the frame body is configured with an assembly groove communicating with the notch of the installation groove. Along a first direction, the projection of the assembly groove covers the projection of the installation groove, wherein the heat dissipation member is arranged in the assembly groove.

3. The heat dissipation bracket according to claim 2, characterized in that, The frame body is further configured with a relief channel communicating with the installation groove, the relief channel is also communicated with the assembly groove, and the relief channel is configured to pass through the pins of the semiconductor power device.

4. The heat dissipation bracket according to claim 1, wherein A partition is arranged in the installation groove, and the partition divides the installation groove into at least two installation areas, and each installation area is configured to install the semiconductor power device.

5. The heat dissipation bracket according to any one of claims 1-4, characterized in that, The heat dissipation member includes a thermal conductive silicone layer and / or a ceramic sheet.

6. A power conversion device, characterized in that, Comprising: The heat dissipation bracket according to any one of claims 1-5; A base, which is configured with a connection groove, and the frame body is installed in the connection groove; A semiconductor power device, which is installed in the installation groove.

7. The power conversion device according to claim 6, wherein An assembly port communicating with the connection groove is configured on the base, and the frame body passes through the connection groove from the assembly port.

8. The power conversion device according to claim 7, wherein, The pins of the semiconductor power device pass through the relief channel of the frame body and the assembly port of the base and out of the connection groove, and the pins are electrically connected to a circuit board.

9. The power conversion device according to claim 8, wherein, The connection groove has a first mating surface relative to the assembly port, and a second positioning portion mating with the first positioning portion is configured on the first mating surface, wherein one of the first positioning portion and the second positioning portion is a positioning post and the other is a positioning hole.

10. The power conversion device according to claim 6, characterized in that, The base is configured with a stop portion, the stop portion extends towards the connection groove and partially shields the notch of the connection groove, wherein the stop portion abuts against the frame body.

11. The power conversion device according to any one of claims 6-10, characterized in that, A process hole communicating with the installation groove is configured on the side of the frame body away from the heat dissipation member, and a locking member is detachably connected to the base. The locking member is configured with an elastic portion extending towards the frame body, and the elastic portion passes through the process hole and abuts against the semiconductor power device.

12. The power conversion device according to claim 11, characterized in that, The base is configured with an installation hole, and the locking member is configured with a connection hole, and the connection hole and the installation hole are connected by a fastener.

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