SMD3030 surface acoustic wave device shell suitable for flip-chip bonding

Abstract

The utility model discloses an SMD3030 surface acoustic wave device shell suitable for flip-chip bonding, and relates to the technical field of surface acoustic wave device application. Comprising a shell, and a pair of opposite side edges of a square chassis of the shell extend upwards to form vertical side walls; the bottom of the chassis is provided with a bottom layer bonding pad group, the bottom layer bonding pad group is used for being welded with a complete machine mainboard, the top of the chassis is provided with an inner cavity bonding pad group between the two side walls, and the inner cavity bonding pad group is connected with an electrode of a chip in a ball mounting and flip-chip bonding packaging mode; the inner cavity bonding pad group is provided with six independent bonding pads, the six independent bonding pads are respectively an A bonding pad, a B bonding pad, a C bonding pad, a D bonding pad, an E bonding pad and an F bonding pad, and the six bonding pads are symmetrically arranged between the two side walls; the B bonding pad and the E bonding pad serve as signal input ends and are arranged on the side wall corresponding to the middle portion, the A bonding pad and the C bonding pad are arranged on the two sides of the B bonding pad, and the D bonding pad and the F bonding pad are arranged on the two sides of the E bonding pad.

Description

Technical Field

[0001] The utility model relates to the technical field of application of surface acoustic wave devices, and particularly relates to an SMD3030 surface acoustic wave device housing suitable for flip-chip soldering. Background Art

[0002] Flip-Chip is an advanced electronic packaging technology mainly used in integrated circuits (ICs) and microelectronic systems. In flip-chip soldering, the pins (or solder joints) of the chip are placed on the front side of the chip instead of the traditional edges. This technology can increase the connection density, reduce the signal transmission delay, and help improve the overall electrical performance.

[0003] Surface acoustic wave devices are devices that use surface acoustic waves to analog-process electrical signals. They mainly include related devices such as surface acoustic wave filters and surface acoustic wave resonators. With the development of technology, the packaging of surface acoustic wave devices has changed from the initial metal packaging to SMD packaging. The current SMD packaging housing ( Figures 1-3 ) realizes assembly by means of chip mounting and soldering lead wires 17 ( Figure 7 ). The lead inductance of this packaging method will cause the Q value of the surface acoustic wave filter and resonator to decrease. Summary of the Utility Model

[0004] Therefore, an embodiment of the utility model provides an SMD3030 surface acoustic wave device housing suitable for flip-chip soldering to solve the problems existing in the above technology.

[0005] In order to achieve the above object, the embodiment of the utility model provides the following technical solutions:

[0006] An SMD3030 surface acoustic wave device housing suitable for flip-chip soldering, characterized in that: it includes a housing, and the housing is formed by upwardly extending a pair of opposite side edges of a square chassis to form vertical side walls;

[0007] A bottom layer pad group is arranged at the bottom of the chassis, and the bottom layer pad group is used for soldering with the main board of the whole machine. An inner cavity pad group is arranged at the top of the chassis between the two side walls, and the chip realizes electrode connection with the inner cavity pad group through the methods of ball planting and flip-chip soldering;

[0008] The inner cavity pad group is provided with six independent pads, and the six independent pads are respectively pad A, pad B, pad C, pad D, pad E, and pad F, and the six pads are symmetrically arranged between the two side walls;

[0009] Among them, pad B and pad E are used as signal input ends and are arranged at the corresponding middle parts of the side walls. Pad A and pad C are arranged on both sides of pad B, and pad D and pad F are arranged on both sides of pad E.

[0010] Optionally, the housing is suitable for encapsulating surface acoustic wave filters and resonators.

[0011] Optionally, the surfaces of the inner cavity pad group and the bottom layer pad group are gold-plated.

[0012] Optionally, the six independent pads of the inner cavity pad group are connected to the pads of the bottom layer pad group in one-to-one correspondence.

[0013] Optionally, the housing is made of ceramic material.

[0014] The utility model has at least the following beneficial effects:

[0015] In the utility model, wiring pads are arranged in the inner cavity pad group on the chassis. The inner cavity is connected to the chip through ball planting for chip wiring, and the bottom layer pad group is the connection wiring for welding to the main board of the whole machine. The development of this housing is beneficial for encapsulating larger surface acoustic wave filter chips with the same size housing, and at the same time reduces the distributed parameters caused by using welding leads in conventional packaging, thereby improving the Q value of the resonator and meeting the needs of the current market trend. Description of the Drawings

[0016] In order to more clearly illustrate the prior art and the present utility model, the drawings required for describing the prior art and the embodiments of the present utility model will be briefly introduced below. Obviously, the drawings in the following description are only exemplary. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained according to the provided drawings.

[0017] The structures, ratios, sizes, etc. shown in this specification are only used to cooperate with the content disclosed in the specification for those who are familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present utility model. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that the present utility model can produce and the purposes that can be achieved, should still fall within the scope covered by the technical content disclosed in the present utility model.

[0018] Figure 1 Schematic diagram of the first perspective structure of a conventional SMD3030 housing Figure 2

[0019] Figure 2 Schematic diagram of the second perspective structure of a conventional SMD3030 housing Figure 2

[0020] Figure 3 Schematic diagram of the third perspective structure of a conventional SMD3030 housing Figure 2

[0021] Figure 4 Schematic diagram of the fourth perspective structure of the housing of an embodiment of the present utility modelFigure 2

[0022] Figure 5 Schematic diagram of the fifth perspective of the housing of an embodiment of the present utility model Figure 2

[0023] Figure 6 Schematic diagram of the sixth perspective of the housing of an embodiment of the present utility model Figure 2

[0024] Figure 7 For the assembly of a conventional SMD3030 housing chip Figure 2

[0025] Figure 8 Assembly drawing of the housing chip of an embodiment of the present utility model.

[0026] Explanation of the reference numerals in the drawings:

[0027] 1. Chassis; 2. Side wall; 3. Pad A; 4. Pad B; 5. Pad C; 6. Pad D; 7. Pad E; 8. Pad F; 9. Pad a; 10. Pad b; 11. Pad c; 12. Pad d; 13. Pad e; 14. Pad f; 15. Gold ball; 16. Chip; 17. Welding lead. Detailed implementation manners

[0028] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0029] In the description of the present utility model, unless otherwise specified, the meaning of "a plurality of" is two or more. Terms such as "first", "second", "third", "fourth", etc. (if any) in the description and claims of the present utility model and the above-mentioned drawings are intended to distinguish the objects being referred to. For a solution with a time sequence process, such a term expression does not necessarily need to be understood as describing a specific order or sequence, and for a solution of a device structure, such a term expression also does not distinguish the importance level, positional relationship, etc.

[0030] In addition, the terms "comprising", "having" and any deformation thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units does not necessarily have to be limited to those steps or units that are clearly listed, but may also include other steps or units that are inherent to these processes, methods, products or devices although not clearly listed, or steps or units added based on further optimized solutions conceived according to the present utility model.

[0031] Such as Figures 4-6 AndFigure 8 As shown in the figure, Figure 8 is a housing for an SMD3030 surface acoustic wave device applicable to flip-chip soldering, including a housing. The housing consists of a square chassis 1, and a pair of opposite side edges of the chassis 1 extend upward to form vertical side walls 2.

[0032] A bottom layer pad group is arranged at the bottom of the chassis 1. The bottom layer pad group is used for soldering with the main board of the whole machine. An inner cavity pad group is arranged at the top of the chassis 1 between the two side walls 2. The inner cavity pad group is connected to the electrodes of the chip 16 through the method of ball planting and flip-chip soldering.

[0033] The inner cavity pad group is provided with six independent pads, namely pad A 3, pad B 4, pad C 5, pad D 6, pad E 7 and pad F 8. And the six pads are symmetrically arranged between the two side walls 2.

[0034] Among them, pad B 4 and pad E 7 are used as signal input ends and are arranged at the corresponding middle parts of the side walls 2. Pad A 3 and pad C 5 are arranged on both sides of pad B 4, and pad D 6 and pad F 8 are arranged on both sides of pad E 7.

[0035] The above-mentioned housing is made of ceramic material. The chassis 1 and the side walls 2 are of an integral structure. Compared with Figure 1 the conventional housing, the housing of this embodiment removes the step structure, and directly arranges the inner wall pad group at the position between the upper side walls 2 of the chassis 1, which can be suitable for a larger chip 16; while in the conventional housing, since the pads are arranged on the steps, only wire bonding 17 can be used between the pads and the chip 16, and in this embodiment, after the chip 16 is placed between the two side walls 2, it can be directly connected to the inner cavity pads by flip-chip soldering.

[0036] The above-mentioned pad B 4 and pad E 7 are used for signal input, and pad A 3, pad C 5, pad D 6 and pad F 8 are generally grounding pins. For radio frequency signals, the grounding design is particularly important.

[0037] For the above-mentioned bottom layer pad group, since it is soldered with the main board of the whole machine, for the universality of the whole machine, a conventional design structure is adopted. It includes pad a 9, pad b 10, pad c 11, pad d 12, pad e 13, pad f 14. And there is a corresponding connection relationship between pad a 9 of the bottom layer pad group and pad A 3 of the inner cavity pad group, pad b 10 corresponds to pad B 4, pad c 11 corresponds to pad C 5, pad d 12 corresponds to pad D 6, pad e 13 corresponds to pad E 7, and pad f 14 corresponds to pad F 8.

[0038] Pad A 3, pad C 5, pad D 6 and pad F 8 are independently and separately arranged. In order to adapt to the situation of having a common ground when designing the chip 16, this separate arrangement can place multiple gold ball 15 solder joints.

[0039] Using a gold ball 15 for welding can not only fix the chip 16, but also achieve electrical performance connection.

[0040] The housing is suitable for encapsulating surface acoustic wave filters and resonators.

[0041] The surfaces of the inner cavity pad group and the bottom layer pad group are gold-plated to increase solderability.

[0042] The surface acoustic wave chip 16 is electrode-connected through ball planting with a gold ball 15, flip-chip bonding, and the inner cavity pad group.

[0043] The ceramic base and the wiring pads thereon in this embodiment, the inner cavity is the wiring for connecting the chip 16 by ball planting the chip 16, and the bottom layer is the connection wiring for welding to the main board of the whole machine. The development of this housing is beneficial to encapsulating a larger surface acoustic wave filter chip 16 in a housing of the same size, and at the same time reduces the distributed parameters caused by using welding leads 17 in conventional packaging, thereby improving the Q value of the resonator and meeting the needs of the current market trend.

[0044] The above several specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described in some embodiments.

[0045] The technical features of the above embodiments can be combined arbitrarily (as long as there is no contradiction in the combination of these technical features). For the sake of concise description, not all possible combinations of the technical features in the above embodiments are described; these embodiments not explicitly written out should also be considered to be within the scope described in this specification.

[0046] In the above text, the present invention has been described in a relatively specific and detailed manner through general descriptions and specific embodiments. It should be noted that without departing from the concept of the present invention, it is obvious that several modifications and improvements can still be made to these specific embodiments, and these all belong to the protection scope of this application. Therefore, the protection scope of the patent of this application should be subject to the appended claims.

Claims

1. An SMD3030 surface acoustic wave device housing applicable to flip chip bonding, characterized in that: It includes a housing, which is formed by a square chassis with a pair of opposite side edges extending upward to form vertical side walls; The bottom of the chassis is provided with a bottom layer pad group for welding with the main board of the whole machine. The top of the chassis is provided with an inner cavity pad group between the two side walls. The chip realizes electrode connection with the inner cavity pad group through the methods of ball planting and flip-chip soldering; The inner cavity pad group is provided with six independent pads, namely pad A, pad B, pad C, pad D, pad E and pad F, and the six pads are symmetrically arranged between the two side walls; Among them, pad B and pad E are used as signal input ends and are arranged at the corresponding middle parts of the side walls. Pad A and pad C are arranged on both sides of pad B, and pad D and pad F are arranged on both sides of pad E.

2. The SMD3030 surface acoustic wave device housing applicable to flip chip bonding according to claim 1, characterized in that: The housing is suitable for packaging surface acoustic wave filters and resonators.

3. The SMD3030 surface acoustic wave device housing applicable to flip chip bonding according to claim 1, wherein: The surfaces of the inner cavity pad group and the bottom layer pad group are gold-plated.

4. The SMD3030 surface acoustic wave device housing applicable to flip chip bonding according to claim 1, wherein: The six independent pads of the inner cavity pad group are connected to the pads of the bottom layer pad group in one-to-one correspondence.

5. The SMD3030 surface acoustic wave device housing applicable to flip chip bonding according to claim 1, characterized in that: The housing is made of ceramic material.

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