Surface acoustic wave filter

By employing a platinum and aluminum interdigitated electrode structure in the surface acoustic wave (SAW) filter, combined with a titanium or chromium diffusion barrier layer, the problem of insufficient resonant performance of the SAW filter was solved, achieving structural miniaturization and improved electrical performance, extending device lifespan, and reducing cost and process complexity.

CN224459764UActive Publication Date: 2026-07-03NINGBO SEMICON INT CORP
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Patent Information

Application Number
CN202521675210.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-08-07
Publication Date
2026-07-03
Estimated Expiration
2035-08-07

AI Technical Summary

Technical Problem

Existing surface acoustic wave filters have the problem of needing to improve their resonant performance.

Method used

An interdigitated electrode structure is adopted, wherein the first metal layer uses platinum or an alloy with platinum as the main component, and the second metal layer uses aluminum or an alloy with aluminum as the main component. By optimizing the material combination through stacking, the mechanical strength and chemical stability of the interdigitated electrode are enhanced, and the risk of interlayer delamination is reduced. Furthermore, by setting a third and fourth metal layer, such as titanium or chromium, as a diffusion barrier layer, the structural stability and electrical performance are further improved.

Benefits of technology

This achievement enables the miniaturization of the interdigital electrode structure, improves electrical performance and long-term operational stability, extends the device's lifespan, reduces material costs and process complexity, and ensures the acoustic performance stability of the piezoelectric layer.

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Abstract

The utility model provides a surface acoustic wave filter, which comprises a piezoelectric layer and an interdigital electrode, and the interdigital electrode is arranged on the piezoelectric layer and comprises a first metal layer and a second metal layer which are at least laminated; wherein the first metal layer is made of platinum or an alloy with platinum as a main component, and the second metal layer is made of aluminum or an alloy with aluminum as a main component. The second metal layer is made of aluminum or an alloy taking aluminum as a main component, so that the metal covering uniformity of the electrode structure can be effectively improved, and overlarge local resistance or structural defects caused by poor covering are avoided; the first metal layer is made of platinum or alloy with platinum as the main component, reliable support can be provided for the second metal layer, and the risk of deformation or corrosion of the aluminum layer in the follow-up process is reduced. The interdigital electrode is arranged through a laminated structure formed by complementing two materials, so that the structure miniaturization is realized, and the overall electrical performance and the structural reliability of the interdigital electrode are improved.
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