Structure for protecting fine wires on FPC from being broken

By setting up a closed trace diagram and transparent reinforced adhesive protection structure on the FPC circuit board, the problem of fine trace breaking during bending is solved, and the reliability of FPC is improved.

CN223093942UActive Publication Date: 2025-07-11TRULY OPTO ELECTRONICS
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202421528442.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-28
Publication Date
2025-07-11
Estimated Expiration
2034-06-28

AI Technical Summary

Technical Problem

The fine wiring on the FPC is prone to break during bending, resulting in poor product and affecting the normal use of the AMOLED display.

Method used

Designing a protective structure includes setting a first thick circuit trace on the FPC circuit board to form a closed trace diagram around the edge, the thin circuit trace is located in the center, and the transparent reinforcement glue is applied at the bending position, and the second thick circuit trace wraps the thin circuit trace to enhance the bending resistance.

Benefits of technology

Effectively prevent the wiring breakage at the FPC bends, reduce product bad conditions, and improve product reliability.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223093942U_ABST
    Figure CN223093942U_ABST
Patent Text Reader

Abstract

A structure for protecting fine wires on an FPC from being broken comprises the FPC, and a plurality of fine circuit wires, a first thick circuit wire and a plurality of second thick circuit wires are arranged on the front face of an FPC circuit board; the first thick circuit traces are respectively arranged on the periphery of the front surface of the FPC circuit board, and the thin circuit traces are arranged at the central part of the front surface of the FPC circuit board and are positioned at the central parts of the first thick circuit traces. According to the structure for protecting the fine wires on the FPC from being broken off, the first thick circuit wires are arranged to surround the surface of the whole FPC to carry out surrounding wiring, and the fine circuit wires are arranged in the first thick circuit wires, so that the wires in a bending area are protected; therefore, the situation that the wiring at the bending part of the PFC is easy to break can be prevented, and the situation of bad products is reduced.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model relates to the technical field of FPC, in particular to a structure for protecting fine circuit traces on an FPC from being broken. Background Art

[0002] At present, due to the characteristics of bright display effect, high contrast and small screen size of AMOLED, it is widely applied to smart watch projects. The functions of smart watches are becoming more and more comprehensive, integrating a series of functions such as touch control, display, NFC payment, etc. Moreover, the space of smart watches is relatively limited. When designing FPC, the smaller and thinner it is, the better. Therefore, various circuit traces of FPC will be made thinner and denser. However, during the installation process of the product, the FPC needs to be bent. Therefore, the circuit traces at the bending position are very likely to be micro-broken, resulting in product defects and affecting the normal use of the AMOLED display screen. Summary of the Utility Model

[0003] The purpose of the utility model is to overcome the deficiencies in the prior art and provide a structure for protecting fine circuit traces on an FPC from being broken.

[0004] The purpose of the utility model is achieved by the following technical solutions:

[0005] A structure for protecting fine circuit traces on an FPC from being broken, comprising: an FPC, on the front surface of the FPC circuit board, there are provided a plurality of fine circuit traces, a first thick circuit trace and a plurality of second thick circuit traces; the first thick circuit traces are respectively arranged on the periphery of the front surface of the FPC circuit board, the fine circuit traces are arranged in the central part of the front surface of the FPC circuit board and are located in the central part of the first thick circuit traces, and a plurality of the second thick circuit traces are arranged in the center of the fine circuit traces on the front surface of the FPC circuit board.

[0006] In one embodiment, the first thick circuit traces form a closed circuit trace pattern around the edge of the front surface of the FPC circuit board, and the shape and size of the front surface of this trace pattern are in line with the shape and size of the front surface of the FPC.

[0007] In one embodiment, a transparent reinforcing glue is attached to the back of the bending position of the FPC, and the shape of the transparent reinforcing glue is in line with the shape and size of the bending position.

[0008] In one embodiment, a plurality of the fine circuit traces are divided into two groups and evenly arranged in the circular circuit formed by the first thick circuit traces, and the distance between adjacent fine circuit traces is the same.

[0009] In one embodiment, a plurality of the second thick circuit traces are disposed between two adjacent sets of the thin circuit traces, and the plurality of the second thick circuit traces respectively wrap the two sets of the thin circuit traces in the middle thereof.

[0010] In one embodiment, the diameter of the thin circuit trace is 1 / 4 of the diameter of the second thick circuit trace.

[0011] In one embodiment, electronic components are disposed on the left side of the top of the front surface of the FPC.

[0012] In one embodiment, a ZIF connector is disposed at the bottom of the front surface of the FPC, and a reinforcing copper sheet is disposed at a position corresponding to the back thereof.

[0013] In one embodiment, an IC is disposed on the top of the front surface of the FPC, and an IC protection paper is disposed on the front surface of the IC.

[0014] In one embodiment, the diameter of the second thick circuit trace is greater than the diameter of the first thick circuit trace.

[0015] Compared with the prior art, the present utility model has at least the following advantages:

[0016] The structure for protecting the fine traces on the FPC of the present utility model enables the first thick circuit traces to be routed around the entire surface of the FPC. At the same time, the thin circuit traces are disposed in the first thick circuit traces and divided into two groups. A plurality of second thick circuit traces are disposed among the two groups of thin circuit traces, and a transparent reinforcing adhesive is bonded to the back of the area where the FPC needs to be bent, thereby protecting the traces in the bending area, so as to prevent the traces at the bending part of the PFC from being easily broken and reduce the occurrence of defective products. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required in the embodiments. It should be understood that the following drawings only show some embodiments of the present utility model and should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0018] Figure 1 It is a schematic diagram of the overall front surface of the structure for protecting the fine traces on the FPC of the present utility model;

[0019] Figure 2 It is a partial schematic diagram of the structure for protecting the fine traces on the FPC of the present utility model;

[0020] Figure 3The present utility model protects the fine traces on the FPC from being broken Figure 2 Schematic diagram of point A

[0021] In the figure: 1. FPC; 11. Transparent reinforcing glue; 12. Reinforcing copper sheet; 13. Electronic component; 111. First thick circuit trace; 112. Fine circuit trace; 113. Second thick circuit trace Specific implementation manner

[0022] To facilitate the understanding of the present utility model, the present utility model will be described more comprehensively with reference to the relevant drawings. The preferred embodiments of the present utility model are given in the drawings. However, the present utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the disclosure of the present utility model more thorough and comprehensive

[0023] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application

[0024] Unless otherwise clearly defined and limited, the terms "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection or an integral body; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present utility model belongs. The terms used in the description of the present utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items

[0026] Such as Figures 1-3As shown in the figure, a structure for protecting the fine circuit traces on the FPC from being broken includes: an FPC1. On the front side of the FPC1 circuit board, there are a number of fine circuit traces 112, a first thick circuit trace 111, and a number of second thick circuit traces 113. The first thick circuit trace 111 is respectively arranged on the periphery of the front side of the FPC1 circuit board. The fine circuit traces 112 are arranged in the central part of the front side of the FPC1 circuit board and are located in the central part of the first thick circuit trace 111. A number of second thick circuit traces 113 are arranged in the center of the fine circuit traces 112 on the front side of the FPC1 circuit board. It should be noted that the lines of the second thick circuit trace 113 and the first thick circuit trace 111 at the curved position of the FPC1 can be thickened to a certain extent, so that it can have better anti-bending ability.

[0027] As Figures 1-3 shown in an embodiment, the first thick circuit trace 111 forms a closed trace pattern around the edge of the front side of the FPC1 circuit board, and the shape and size of the front side of this trace pattern match the shape and size of the front side of the FPC1. It should be noted that the first thick circuit trace 111 is set on the FPC1 by means of yellow light etching.

[0028] As Figures 1-3 shown in an embodiment, a transparent reinforcing glue 11 is attached to the back of the bending position of the FPC1, and the shape of the transparent reinforcing glue 11 matches the shape and size of the bending position. It should be noted that both sides of the transparent reinforcing glue 11 and the FPC1 that are in contact with each other are connected together by optical glue.

[0029] As Figures 1-3 shown in an embodiment, a number of fine circuit traces 112 are evenly divided into two groups and arranged in the circular circuit formed by the first thick circuit trace 111, and the distance between adjacent fine circuit traces 112 is the same. A number of second thick circuit traces 113 are arranged between two groups of adjacent fine circuit traces 112, and a number of second thick circuit traces 113 respectively wrap the two groups of fine circuit traces 112 in the middle. It should be noted that both the first thick circuit trace 111 and the second thick circuit trace 113 are ground wires. This design enables the first thick circuit trace 111 and the second thick circuit trace 113 to effectively resist the concentration of stress, so that when the FPC1 is bent multiple times, the data lines and signal lines inside the FPC1 will not be broken.

[0030] As Figures 1-3 shown in an embodiment, the diameter of the fine circuit trace 112 is 1 / 4 of the diameter of the second thick circuit trace 113. It should be noted that the fine circuit trace 112 is generally a data line and a signal line.

[0031] As Figures 1-3As shown, in one embodiment, an electronic component 13 is provided on the left side at the top of the front surface of the FPC1. A ZIF connector is provided at the bottom of the front surface of the FPC1, and a reinforcing copper sheet 12 is provided at the corresponding position on its back surface. An IC is provided at the top of the front surface of the FPC1, and an IC protection paper is provided on the front surface of the IC.

[0032] As Figures 1-3 shown, in one embodiment, the diameter of the second thick circuit trace 113 is greater than the diameter of the first thick circuit trace 111. It should be noted that the diameters of the second thick circuit trace 113 and the first thick circuit trace 111 are both set according to the size of the FPC1.

[0033] The above-described embodiments merely represent several implementation manners of the present utility model. The description thereof is relatively specific and detailed, but it should not be construed as a limitation to the scope of the utility model patent. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the present utility model patent shall be subject to the appended claims.

Claims

1. A structure for protecting the fine traces on an FPC from being broken, characterized in that, Including: An FPC (1), on the front side of the circuit board of the FPC (1), there are provided a plurality of fine circuit traces (112), a first thick circuit trace (111), and a plurality of second thick circuit traces (113); The first thick circuit trace (111) is respectively provided on the periphery of the front side of the FPC (1) circuit board, the fine circuit traces (112) are provided in the central part of the front side of the FPC (1) circuit board, and are located in the central part of the first thick circuit trace (111), and a plurality of the second thick circuit traces (113) are provided in the center of the fine circuit traces (112) on the front side of the FPC (1) circuit board.

2. The structure for protecting the fine traces on the FPC from being broken according to claim 1, wherein The first thick circuit trace (111) forms a closed trace pattern around the edge of the front side of the FPC (1) circuit board, and the shape and size of the front side of this trace pattern match the shape and size of the front side of the FPC (1).

3. The structure for protecting the fine traces on the FPC from being broken according to claim 1, wherein At the bending position of the FPC (1), a transparent reinforcing adhesive (11) is attached to the back, and the shape of the transparent reinforcing adhesive (11) matches the shape and size of the bending position.

4. The structure for protecting the fine traces on the FPC from being broken according to claim 1, wherein A plurality of the fine circuit traces (112) are evenly divided into two groups and arranged in the circular circuit formed by the first thick circuit trace (111), and the distance between adjacent fine circuit traces (112) is the same.

5. The structure for protecting the fine traces on the FPC from being broken according to claim 1, wherein A plurality of the second thick circuit traces (113) are provided between two adjacent fine circuit traces (112), and a plurality of the second thick circuit traces (113) respectively wrap the two groups of fine circuit traces (112) in the middle.

6. The structure for protecting the fine traces on the FPC from being broken according to claim 1, wherein The diameter of the fine circuit trace (112) is 1 / 4 of the diameter of the second thick circuit trace (113).

7. The structure for protecting the fine traces on the FPC from being broken according to claim 1, wherein On the left side of the top of the front side of the FPC (1), an electronic component (13) is provided.

8. The structure for protecting the fine traces on the FPC from being broken according to claim 1, characterized in that, At the bottom of the front side of the FPC (1), a ZIF connector is provided, and a reinforcing copper sheet (12) is provided at the corresponding position on the back.

9. The structure for protecting the fine traces on the FPC from being broken according to claim 1, wherein An IC is provided on the top of the front side of the FPC (1), and an IC protection paper is provided on the front side of the IC.

10. The structure for protecting the fine traces on the FPC from being broken according to claim 1, wherein, The diameter of the second thick circuit trace (113) is larger than the diameter of the first thick circuit trace (111).