High-efficiency waterproof high-temperature-resistant FPC board

Abstract

The utility model discloses a high-efficiency waterproof high-temperature-resistant FPC board which comprises a PI film, a copper foil layer, an ink layer, a first waterproof layer, a high-temperature-resistant layer, a second waterproof layer and a cover film protection layer. Through the arrangement of the first waterproof layer and the second waterproof layer, the waterproof performance of the FPC board can be greatly improved through the double-waterproof-layer structure, when an electronic product is accidentally soaked in water or located in a humid environment, moisture and other humid factors are not prone to corroding a circuit on the FPC board, the problems of short circuit and corrosion are avoided, the FPC board is not prone to being damaged, and the service life of the electronic product is prolonged. The normal use of the FPC board is ensured, and the product quality is improved; moreover, the arrangement of the high-temperature-resistant layer can effectively improve the high-temperature-resistant performance of the FPC board, the conductivity of the copper foil layer on the FPC board cannot be reduced in a high-temperature environment, the normal operation of a circuit is ensured, the signal transmission quality is ensured, the safety performance during use is improved, the service life of a product is prolonged, convenience is brought to the use of a user, the functions are richer, and the existing requirements are met.

Description

Technical Field

[0001] The utility model relates to the technical field of FPC boards, in particular to a high-temperature resistant FPC board with high waterproof efficiency. Background Art

[0002] With the continuous development of social economy, the electronics industry is becoming more and more developed, the quality of people's life is constantly improving, and electronic products are everywhere in our daily life and work. Many electronic products will apply FPC boards. FPC board is short for Flexible Printed Circuit, which is a printed circuit board made of flexible insulating substrate with high reliability and excellent flexibility. The FPC board provides excellent electrical performance, can meet the design requirements of smaller and higher density installation, and also helps to reduce the assembly process and enhance reliability. The FPC board is a good solution to meet the miniaturization and mobility requirements of electronic products. It can be freely bent, wound, and folded, can withstand millions of dynamic bends without damaging the wires, can be arranged arbitrarily according to the space layout requirements, and can move and stretch arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection; The FPC board can greatly reduce the volume and weight of electronic products, and is suitable for the development needs of electronic products towards high density, miniaturization, and high reliability.

[0003] At present, the general FPC board usually uses a PI film as the substrate, a copper foil layer is arranged on the substrate, and a cover film protective layer is arranged on the copper foil layer. The structure of this FPC board is relatively simple. Although it can basically realize the function of connecting and conducting the circuit of the FPC board, the current FPC board has a single function, poor waterproof performance. When an electronic product accidentally gets soaked in water or is in a humid environment, moisture and other humid factors are likely to erode the circuit on the FPC board, resulting in problems such as short circuit and corrosion, easily damaging the FPC board, affecting the normal use of the FPC board, and the quality of the product is poor; in addition, the current FPC board has poor high-temperature resistance. In a high-temperature environment, the copper foil layer on the FPC board may be affected by thermal expansion, resulting in a decrease in electrical conductivity, thus affecting the normal operation of the circuit, may lead to a decrease in signal transmission quality, and even cause circuit failures. The service life of the product is short, which brings inconvenience to users and cannot meet the existing needs. Therefore, it is necessary to study a new technical solution to improve the current FPC board. Summary of the Utility Model

[0004] In view of this, in view of the deficiencies of the existing technology, the main purpose of the present utility model is to provide a high-temperature resistant FPC board with high waterproof efficiency, which can effectively solve the problems that the existing FPC board has a single function, poor waterproof performance, poor high-temperature resistance, affects the normal use of the FPC board, poor product quality, and short service life.

[0005] To achieve the above object, the utility model adopts the following technical solutions:

[0006] A high-temperature resistant FPC board with high-efficiency waterproofing, comprising a PI film, a copper foil layer, an ink layer, a first waterproof layer, a high-temperature resistant layer, a second waterproof layer, and a cover film protective layer; the copper foil layer is laminated on the upper surface of the PI film, the ink layer is laminated on the upper surface of the copper foil layer, the first waterproof layer is laminated on the upper surface of the ink layer, the high-temperature resistant layer is laminated on the upper surface of the first waterproof layer, the second waterproof layer is laminated on the upper surface of the high-temperature resistant layer, and the cover film protective layer is laminated on the upper surface of the second waterproof layer.

[0007] As a preferred solution, a 3M adhesive layer and a backing paper are further provided. The 3M adhesive layer is laminated on the lower surface of the PI film, and the backing paper is laminated on the lower surface of the 3M adhesive layer. The 3M adhesive layer has strong adhesion and extremely high bonding strength, can firmly bond various different materials, is convenient to use, and has good weather resistance and chemical resistance.

[0008] As a preferred solution, a silk-screened character layer is further provided. The silk-screened character layer is arranged on the upper surface of the cover film protective layer. The silk-screened characters can provide product and usage information, and the silk-screened characters can include the product name, manufacturer information, production cycle, specifications, working voltage, production batch number, certification mark, etc., which provides convenience for use and maintenance.

[0009] As a preferred solution, the PI film and the copper foil layer are bonded through an adhesive layer.

[0010] As a preferred solution, the first waterproof layer is an epoxy resin layer, and the epoxy resin layer has good waterproof performance, wear resistance, corrosion resistance, tensile resistance, high strength and high stiffness.

[0011] As a preferred solution, the second waterproof layer is a polyvinyl chloride waterproof layer, and polyvinyl chloride has good waterproof and moisture-proof performance, wear resistance, impact resistance, fireproof and flame-retardant performance, and acid and alkali corrosion resistance, and is green and environmentally friendly.

[0012] As a preferred solution, the high-temperature resistant layer is a PI-EP nano composite layer, and the PI-EP nano composite layer has good high-temperature resistance, chemical corrosion resistance, and electrical insulation performance.

[0013] As a preferred solution, the cover film protective layer is a PI film or a PET film.

[0014] The utility model has obvious advantages and beneficial effects compared with the prior art. Specifically, as can be seen from the above technical solutions:

[0015] By setting the first waterproof layer and the second waterproof layer, the structure of this double waterproof layer can greatly improve the waterproof performance of the FPC board. When the electronic product accidentally gets soaked in water or is in a humid environment, moisture and other humid factors are not likely to erode the circuit on the FPC board, and problems such as short circuit and corrosion will not occur. The FPC board is not easily damaged, ensuring the normal use of the FPC board and improving the product quality. Moreover, setting the high-temperature resistant layer can effectively improve the high-temperature resistant performance of the FPC board. In a high-temperature environment, the conductivity of the copper foil layer on the FPC board will not decrease, ensuring the normal operation of the circuit, guaranteeing the signal transmission quality, improving the safety performance during use, extending the service life of the product, bringing convenience to the user, making the function more abundant, and meeting the existing needs.

[0016] To more clearly elaborate the structural features and functions of the present invention, the following will combine the attached drawings and specific embodiments to describe the present invention in detail. Brief Description of the Drawings

[0017] Figure 1 is the top view of the preferred embodiment of the present invention;

[0018] Figure 2 is the cross-sectional view of the preferred embodiment of the present invention.

[0019] Explanation of the Reference Numerals in the Drawings:

[0020] 10. PI film 20. Copper foil layer

[0021] 30. Ink layer 40. First waterproof layer

[0022] 50. High-temperature resistant layer 60. Second waterproof layer

[0023] 70. Cover film protection layer 80. 3M adhesive layer

[0024] 90. Backing paper 100. Screen printing character layer

[0025] 110. Adhesive layer. Detailed Description of the Embodiment

[0026] Please refer to Figure 1 and Figure 2 as shown, which shows the specific structure of the preferred embodiment of the present invention, including a PI film 10, a copper foil layer 20, an ink layer 30, a first waterproof layer 40, a high-temperature resistant layer 50, a second waterproof layer 60, and a cover film protection layer 70.

[0027] The copper foil layer 20 is laminated on the upper surface of the PI film 10; in this embodiment, a 3M adhesive layer 80 and a backing paper 90 are further provided. The 3M adhesive layer 80 is laminated on the lower surface of the PI film 10, and the backing paper 90 is laminated on the lower surface of the 3M adhesive layer 80. The 3M adhesive layer 80 has strong adhesion and extremely high bonding strength, can firmly bond various different materials, is convenient to use, and has good weather resistance and chemical resistance; the PI film 10 and the copper foil layer 20 are bonded through an adhesive layer 110; the upper surface of the copper foil layer 20 is treated with OSP antioxidant, which can effectively prevent copper oxidation, and at the same time has good heat shock resistance and moisture resistance; the copper foil layer 20 is made of electrolytic copper.

[0028] The ink layer 30 is laminated on the upper surface of the copper foil layer 20. The ink layer 30 mainly plays a protective role and helps to improve the reliability and durability of the FPC board; the first waterproof layer 40 is laminated on the upper surface of the ink layer 30; in this embodiment, the first waterproof layer 40 is an epoxy resin layer, and the epoxy resin layer 40 has good waterproof performance, wear resistance, corrosion resistance, tensile resistance, high strength and high stiffness.

[0029] The high-temperature resistant layer 50 is laminated on the upper surface of the first waterproof layer 40; in this embodiment, the high-temperature resistant layer 50 is a PI-EP nanocomposite layer, and the PI-EP nanocomposite layer has good high-temperature resistance, chemical corrosion resistance and electrical insulation performance.

[0030] The second waterproof layer 60 is laminated on the upper surface of the high-temperature resistant layer 50; in this embodiment, the second waterproof layer 60 is a polyvinyl chloride waterproof layer, and polyvinyl chloride has good waterproof and moisture-proof performance, wear resistance, impact resistance, fire prevention and flame retardant performance, and acid and alkali corrosion resistance, and is green and environmentally friendly.

[0031] The cover film protective layer 70 is laminated on the upper surface of the second waterproof layer 60; in this embodiment, a silk-screened character layer 100 is further provided. The silk-screened character layer 100 is provided on the upper surface of the cover film protective layer 70. The silk-screened character layer 100 can provide product and usage information. The silk-screened characters can include the product name, manufacturer information, production cycle, specifications, working voltage, production batch number, certification mark, etc., which provides convenience for use and maintenance; the cover film protective layer 70 is a PI film or a PET film.

[0032] The design focus of the present utility model lies in:

[0033] By setting the first waterproof layer and the second waterproof layer, the structure of this double waterproof layer can greatly improve the waterproof performance of the FPC board. When the electronic product accidentally gets soaked in water or is in a humid environment, moisture and other humid factors are not likely to erode the circuit on the FPC board, and problems such as short circuit and corrosion will not occur. The FPC board is not easily damaged, ensuring the normal use of the FPC board and improving the quality of the product. In addition, setting the high-temperature resistant layer can effectively improve the high-temperature resistant performance of the FPC board. In a high-temperature environment, the conductivity of the copper foil layer on the FPC board will not decrease, ensuring the normal operation of the circuit, ensuring the signal transmission quality, improving the safety performance during use, extending the service life of the product, bringing convenience to the user, making the function more abundant, and meeting the existing needs.

[0034] The above is only a preferred embodiment of the present invention, and does not impose any limitation on the technical scope of the present invention. Therefore, any minor modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A high-temperature resistant FPC board with high-efficiency waterproof performance, characterized in that: It includes a PI film, a copper foil layer, an ink layer, a first waterproof layer, a high-temperature resistant layer, a second waterproof layer, and a cover film protective layer; the copper foil layer is laminated on the upper surface of the PI film, the ink layer is laminated on the upper surface of the copper foil layer, the first waterproof layer is laminated on the upper surface of the ink layer, the high-temperature resistant layer is laminated on the upper surface of the first waterproof layer, the second waterproof layer is laminated on the upper surface of the high-temperature resistant layer, and the cover film protective layer is laminated on the upper surface of the second waterproof layer.

2. The high-temperature resistant FPC board with high-efficiency waterproofing according to claim 1, characterized in that: A 3M adhesive layer and a back adhesive paper are further provided; the 3M adhesive layer is laminated on the lower surface of the PI film, and the back adhesive paper is laminated on the lower surface of the 3M adhesive layer.

3. The high-temperature resistant FPC board with high-efficiency waterproofing according to claim 1, wherein: A screen-printed character layer is further provided, and the screen-printed character layer is provided on the upper surface of the cover film protective layer.

4. The high-temperature resistant FPC board with high-efficiency waterproofing according to claim 1, characterized in that: The PI film and the copper foil layer are bonded through an adhesive layer.

5. The high-temperature resistant FPC board with high-efficiency waterproofing according to claim 1, wherein: The first waterproof layer is an epoxy resin layer.

6. The high-temperature resistant FPC board with high efficiency in waterproofing according to claim 1, wherein: The second waterproof layer is a polyvinyl chloride waterproof layer.

7. The high-temperature resistant FPC board with high efficiency waterproofing according to claim 1, characterized in that: The high-temperature resistant layer is a PI-EP nano composite layer.

8. The high-temperature resistant FPC board with high efficiency in waterproofing according to claim 1, characterized in that: The cover film protective layer is a PI film or a PET film.

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