Solder resist ink brushing device for circuit board printing

Through the design of dot brushed solder-resistant ink coating components and positioning components, the problem of low printing accuracy of the circuit board is solved, and the precise coating of solder-resistant ink and the improvement of welding quality is achieved.

CN223093986UActive Publication Date: 2025-07-11SHENZHEN LINGBANG CIRCUIT TECH CO LTD
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Patent Information

Application Number
CN202422072611.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-26
Publication Date
2025-07-11
Estimated Expiration
2034-08-26

AI Technical Summary

Technical Problem

In the prior art, the circuit board solder mask ink coating method has low accuracy, resulting in contamination of the parts that do not require the brushing, affecting subsequent high-precision welding.

Method used

The dot brushed solder shield ink application and positioning components are used to accurately position the solder shield ink to avoid overflow caused by large-scale application. Combined with the flexible brushing tube and fixture auxiliary positioning components, ensure the brushing accuracy.

Benefits of technology

Accurate application of solder shield ink is achieved, avoiding brushing spills, and improving brushing accuracy and welding quality of circuit boards.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a solder resist ink painting device for circuit board printing, which comprises a base and further comprises a spot-brush solder resist ink painting assembly, the spot-brush solder resist ink painting assembly comprises frames arranged on two sides of the base, a sliding groove is arranged in each frame, a sliding plate is slidably mounted in each sliding groove, a cylinder is mounted on the side edge of each frame, and the cylinder is connected with the spot-brush solder resist ink painting assembly. The output end of the air cylinder is connected to one side of the sliding plate, the base is movably installed on one side of the sliding plate in a positioned mode, the telescopic cylinder is arranged on one side of the base, the painting machine is installed at the output end of the telescopic cylinder, the ink tank is installed on one side of the painting machine in a butt joint mode, and the painting pipe is arranged on one side of the painting machine in a butt joint mode. According to the utility model, through the arrangement of the spot welding type solder resist ink smearing assembly, the ink of the device is accurately smeared on a part needing solder resist ink in a precise positioning mode, and the phenomenon of smearing overflow caused by large-area smearing in the prior art is avoided. And the phenomenon of coating overflow is avoided through the arranged clamp auxiliary positioning assembly.
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Description

Technical Field

[0001] The utility model relates to the technical field of solder mask ink brushing for circuit boards, and particularly relates to a solder mask ink brushing device for circuit board printing. Background Art

[0002] A solder mask ink brushing device for circuit board printing is a device specifically designed to evenly apply solder mask ink on a printed circuit board (PCB). This device can ensure the precise distribution of the solder mask ink on the circuit board surface, thereby improving the insulation performance and soldering quality of the circuit board. By using this solder mask ink brushing device for circuit board printing, the production efficiency and quality of the circuit board can be greatly improved, ensuring the uniform distribution of the solder mask ink and reducing the defective rate during the production process.

[0003] The Chinese invention patent with the application number CN114423181A discloses an intelligent and energy-efficient circuit board solder mask process and its device. This patent belongs to the solder mask field. An intelligent and energy-efficient circuit board solder mask process and its device include the following process steps: Step S1: Pretreatment before solder masking; Step S2: Convey the processed PCB board to the solder mask brushing device through a feeding conveyor belt for ink brushing. The advantages of the present invention compared with the prior art are as follows: Before coating, mixing and stirring are carried out inside the inner drum to prevent the raw materials from caking, precipitating, etc.; Before coating, the central rotating shaft rotates to stir the inside of the inner drum. When the rotation speed is relatively high, the buffer layer contacts the inner wall of the inner drum. At this time, the buffer layer pushes the arc-shaped slider to open the material seepage hole, and then the feeding is carried out to prevent the occurrence of material leakage and other situations.

[0004] During the process of brushing solder mask ink on the existing circuit boards, a large-area brushing method is mainly adopted; this brushing method may cause the parts that do not need to be brushed with ink to be contaminated. That is to say, the coating accuracy of this coating method is very low, which hinders the subsequent high-precision soldering. Content of the Utility Model

[0005] The purpose of the present utility model is to solve the disadvantages existing in the prior art, and a solder mask ink brushing device for circuit board printing is proposed.

[0006] In order to achieve the above purpose, the present utility model adopts the following technical solutions:

[0007] A solder mask ink brushing device for circuit board printing includes a base, and further includes:

[0008] Dot-brush type solder mask ink application component. The dot-brush type solder mask ink application component includes frames arranged on both sides of the base. A chute is arranged inside the frame. A slide plate is slidably installed inside the chute. A cylinder is installed on the side of the frame. The output end of the cylinder is connected to one side of the slide plate. A base is movably and positionedly installed on one side of the slide plate. A telescopic cylinder is arranged on one side of the base. The output end of the telescopic cylinder is installed with an applicator. An ink tank is butt-joint installed on one side of the applicator. A brushing tube is butt-joint arranged on one side of the applicator.

[0009] Further technical solution: A support rod is connected and installed between the frames. A guide rod is connected and installed between the support rods. The guide rod is slidably installed inside the slide plate.

[0010] Further technical solution: Baffles are installed at both ends of the slide plate.

[0011] Further technical solution: The brushing tube is made of flexible tube material. The inside of the ink tank is pre-filled with solder mask ink material.

[0012] Further technical solution: It further includes:

[0013] A positioning component. The positioning component includes a fixture fixed on one side of the base. Embedded grooves are arranged on both sides of the fixture. An embedded slider is slidably installed inside the embedded groove. A guiding groove is penetratedly arranged on one side of the embedded slider. A limiting plate is arranged on one side of the embedded slider.

[0014] Further technical solution: The size of the guiding groove is consistent with the size of the brushing tube. The embedded slider is of a "C" type structure.

[0015] Further technical solution: A circuit board is clamped and installed inside the fixture. Gaskets are arranged in an array at the bottom of the base.

[0016] Compared with the prior art, the utility model provides a solder mask ink brushing device for circuit board printing, having the following beneficial effects:

[0017] Through the set dot-welding type solder mask ink application component, the ink of the device is accurately applied to the parts that need solder mask ink in a precise positioning manner, without causing the brushing overflow phenomenon caused by large-area brushing in the prior art.

[0018] Through the set fixture auxiliary positioning component, a guiding groove for positioning the application position is slidably installed on the surface of the circuit board to be applied, which can correct the brushing position of the brushing tube, and further increases the brushing accuracy and avoids the brushing overflow phenomenon. Description of the Drawings

[0019] Figure 1 It is a schematic structural diagram of a solder mask ink brushing device for circuit board printing proposed by the utility model;

[0020] Figure 2 This is a schematic structural diagram of the longitudinal section of a solder mask ink brushing device for circuit board printing proposed by the present utility model;

[0021] Figure 3 This is a schematic structural diagram of the side view of a solder mask ink brushing device for circuit board printing proposed by the present utility model;

[0022] Figure 4 This is a schematic structural diagram of the positioning component of a solder mask ink brushing device for circuit board printing proposed by the present utility model.

[0023] In the figure: 1, base; 2, dot-brush type solder mask ink application component; 3, positioning component; 4, frame; 5, chute; 6, sliding plate; 7, baffle; 8, cylinder; 9, base; 10, telescopic cylinder; 11, ink tank; 12, brushing machine; 13, brushing tube; 14, guide rod; 16, support rod; 17, fixture; 18, slot; 19, embedded slider; 20, guiding groove; 21, limiting plate; 22, gasket. Specific embodiments

[0024] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments.

[0025] Embodiment 1: Refer to Figure 1 - Figure 4 A solder mask ink brushing device for circuit board printing includes a base 1. The base 1 is the bottom support component of this device, and further includes:

[0026] Dot-brush type solder mask ink application component 2, which achieves a dot-brush application effect and avoids the phenomenon of ink overflow in the prior art. The dot-brush type solder mask ink application component 2 includes frames 4 arranged on both sides of the base 1. The chute 5 inside the frame 4 is the part where the slide plate 6 slides, thereby adjusting the Y-direction accuracy of the application part. A chute 5 is arranged inside the frame 4, and a slide plate 6 is slidably installed inside the chute 5. A cylinder 8 is installed on the side of the frame 4. The cylinder 8 controls the slide plate 6 to reciprocate inside the chute 5 through the cylinder head, thereby achieving the effect of Y-direction movement. The output end of the cylinder 8 is connected to one side of the slide plate 6. A base 9 is movably and positioned on one side of the slide plate 6. The base 9 needs to adjust its position and be fixed on the surface of the slide plate 6 to set the position in the X direction. A telescopic cylinder 10 is arranged on one side of the base 9. The telescopic cylinder 10 can control the height change of the coater 12 in the Z direction, thereby approaching or moving away from the circuit board. The output end of the telescopic cylinder 10 is installed with a coater 12. The coater 12 inputs the ink inside the ink tank 11 into the inside of the brushing tube 13. An ink tank 11 is butt-connected to one side of the coater 12, and a brushing tube 13 is butt-connected to one side of the coater 12.

[0027] A solder mask ink brushing device for circuit board printing. A support rod 16 is connected and installed between the frames 4. The function of the support rod 16 is to limit the distance between the frames 4 and achieve a positioning effect. A guide rod 14 is connected and installed between the support rods 16. The guide rod 14 is a positioning component for the sliding of the slide plate 6. The guide rod 14 is slidably installed inside the slide plate 6.

[0028] A solder mask ink brushing device for circuit board printing. Baffles 7 are installed at both ends of the slide plate 6. The baffles 7 are positioning components for the slide plate 6 to slide inside the chute 5.

[0029] A solder mask ink brushing device for circuit board printing. The brushing tube 13 is made of flexible tube material, so that the brushing tube 13 can perform a brushing operation on the surface of the circuit board. The inside of the ink tank 11 is pre-filled with solder mask ink material.

[0030] A solder mask ink brushing device for circuit board printing further includes:

[0031] A positioning component 3 for positioning the circuit board to be brushed. The positioning component 3 includes a fixture 17 fixed on one side of the base 1. The fixture 17 is a clamping component for the circuit board. Embedded grooves 18 are arranged on both sides of the fixture 17. The function of the embedded grooves 18 is to increase the sliding limit effect of the embedded slider 19. An embedded slider 19 is slidably installed inside the embedded groove 18. A guiding groove 20 is arranged through one side of the embedded slider 19. The function of the guiding groove 20 is to align with the brushing tube 13 to achieve precise positioning and brushing of the brushing tube 13. A limiting plate 21 is arranged on one side of the embedded slider 19 for positioning the position of the embedded slider 19.

[0032] A solder resist ink coating device for circuit board printing, the size of the guide groove 20 is consistent with the size of the coating tube 13, so that the coating tube 13 can be smoothly inserted into the guide groove 20. The embedded slider 19 is a "C"-shaped structure.

[0033] A solder resist ink brushing device for circuit board printing, a circuit board is mounted inside a fixture 17, and the circuit board is the main component of the device that needs to be brushed with ink. A gasket 22 is arranged at the bottom array of the base 1, and the gasket 22 is used to increase the stability of the device during operation.

[0034] Working principle:

[0035] In the actual creation process of the utility model, in order to avoid the following defects existing in the prior art: "In the process of applying solder mask ink to the circuit board of the prior art, a large-area brushing method is mainly adopted; this brushing method may cause the parts that do not need to be applied with ink to be contaminated, that is, the application accuracy of this application method is very low, which hinders the subsequent high-precision welding." A spot brush type solder mask ink component 2 and a positioning component 3 are specifically proposed;

[0036] When in use, the circuit board to be painted with ink is inserted and installed in the positioning hole of the fixture 17 to achieve positioning, and the ink is pre-filled in the ink tank 11. The telescopic length of the cylinder 8 and the telescopic cylinder 10 is predetermined according to the part to be painted. Under the action of the cylinder 8 and the telescopic cylinder 10, the slide plate 6 changes its lateral position inside the slide groove 5, and the installation position of the base 9 on the surface of the slide plate 6 is adjusted; finally, the telescopic cylinder 10 controls the coating tube 13 at the end to descend to the painting part, and the solder resist ink inside the ink tank 11 is output to the inside of the coating tube 13 under the extrusion of the coating machine 12, and then painted on the specific part of the circuit board.

[0037] In order to increase the accuracy of the circuit board surface painting process, we set grooves 18 on both sides of the clamp 17, and installed an embedded slider 19 inside the groove 18. The guide groove 20 on the top of the embedded slider 19 serves as the embedding part of the painting tube 13, which can accurately locate the specific part of the painting.

[0038] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. The above is only the preferred specific embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution and the inventive concept of the present utility model, makes equivalent substitutions or changes, and should be covered by the protection scope of the present utility model.

Claims

1. A solder mask ink brushing device for circuit board printing, including a base (1), characterized in that, Further included are: A dot-brush type solder mask ink application assembly (2), the dot-brush type solder mask ink application assembly (2) includes frames (4) arranged on both sides of the base (1), a chute (5) is arranged inside the frame (4), a slide plate (6) is slidably installed inside the chute (5), a cylinder (8) is installed on the side of the frame (4), the output end of the cylinder (8) is connected to one side of the slide plate (6), a base (9) is movably and positionedly installed on one side of the slide plate (6), a telescopic cylinder (10) is arranged on one side of the base (9), a painting machine (12) is installed at the output end of the telescopic cylinder (10), an ink tank (11) is butt-joint installed on one side of the painting machine (12), and a painting tube (13) is butt-joint arranged on one side of the painting machine (12).

2. The solder resist ink brushing device for circuit board printing according to claim 1, wherein, A support rod (16) is connected and installed between the frames (4), a guide rod (14) is connected and installed between the support rods (16), and the guide rod (14) is slidably installed inside the slide plate (6).

3. A solder resist ink brushing device for circuit board printing according to claim 1, characterized in that, Baffles (7) are installed at both ends of the slide plate (6).

4. A solder resist ink brushing device for circuit board printing according to claim 1, characterized in that, The painting tube (13) is made of flexible tube material, and the inside of the ink tank (11) is pre-filled with solder mask ink material.

5. A soldermask ink brushing device for circuit board printing according to claim 1, characterized in that, Further included are: A positioning assembly (3), the positioning assembly (3) includes a fixture (17) fixed on one side of the base (1), grooves (18) are arranged on both sides of the fixture (17), an embedded slider (19) is slidably installed inside the grooves (18), a guiding slot (20) is penetrated and arranged on one side of the embedded slider (19), and a limiting plate (21) is arranged on one side of the embedded slider (19).

6. The solder resist ink brushing device for circuit board printing according to claim 5, characterized in that, The size of the guiding slot (20) is consistent with the size of the painting tube (13), and the embedded slider (19) is of a "C" type structure.

7. A solder mask ink brushing device for circuit board printing according to claim 5, characterized in that, A circuit board is clamped and installed inside the fixture (17), and gaskets (22) are arranged in an array at the bottom of the base (1).

Citation Information

Patent Citations

  • Intelligent high-efficiency energy-saving circuit board resistance welding process and device thereof

    CN114423181A