Cabinet device capable of detecting local temperature

Abstract

The utility model provides a cabinet device capable of detecting local temperature. The cabinet device comprises a cabinet main body, a main control module, a communication module, a junction box module, a first temperature acquisition module, a second temperature acquisition module and a power supply module for supplying power, a plurality of heating points are distributed in the cabinet main body, and the first temperature acquisition module and the second temperature acquisition module are used for detecting temperatures of different heating points in the cabinet main body; and the main control module is used for acquiring temperature signals fed back by the first temperature acquisition module and the second temperature acquisition module through the junction box module and determining a heating point with abnormal temperature. According to the cabinet device capable of detecting the local temperature, the temperatures of multiple positions in the cabinet are detected through the multiple temperature collection modules, comprehensive temperature information can be collected, the accuracy and precision of local temperature detection are improved, and the local part with abnormal temperature can be conveniently found.

Description

Technical Field

[0001] This application relates to the technical field of communication cabinets, and particularly to a cabinet device capable of local temperature detection. Background Art

[0002] A cabinet is a metal cabinet or box used to install, store, and organize electronic devices, network devices, servers, etc.; it is usually used in environments such as data centers, computer rooms, offices, etc., providing a safe and orderly space for storing devices.

[0003] On the one hand, electronic devices, network devices, and servers are sensitive to the temperature inside the cabinet and need to operate smoothly within an appropriate temperature range. On the other hand, if the devices overheat and the heat dissipation is insufficient, it is easy to cause a fire; once a fire occurs, servers, network devices, storage devices, etc. may be damaged or completely destroyed by the fire, and the data stored in them may also be lost, resulting in huge economic losses. Therefore, it is necessary to detect the temperature of the cabinet to improve safety performance.

[0004] In the prior art, the circuit used for cabinet temperature detection cannot accurately detect local temperature anomalies in the cabinet, and when the device has a temperature anomaly, it is also difficult to accurately locate the specific position where the problem occurs. The temperature collection is not comprehensive enough, and it cannot provide sufficient data support for in-depth analysis and optimization of the temperature management strategy inside the cabinet.

[0005] Therefore, there is a need for a solution to solve at least one of the above problems. Summary of the Utility Model

[0006] In view of the deficiencies in the prior art, this application proposes a cabinet device capable of local temperature detection, which has a good detection range and a more accurate effect of capturing obstacle detection information.

[0007] The technical solution adopted by this application to solve at least one of the above technical problems is as follows:

[0008] A cabinet device capable of local temperature detection includes: a cabinet main body, a main control module, a communication module, a distribution box module, a first temperature acquisition module, a second temperature acquisition module, and a power supply module for power supply;

[0009] The main control module is respectively connected to the power supply module, the communication module, and the distribution box module, and the distribution box module is connected to one or more of the first temperature acquisition modules and one or more of the second temperature acquisition modules;

[0010] A plurality of heat generation points are distributed in the cabinet main body, and the first temperature acquisition module and the second temperature acquisition module are used to detect the temperatures of different heat generation points in the cabinet main body;

[0011] The main control module is used to obtain the temperature signals fed back by the first temperature acquisition module and the second temperature acquisition module through the distribution box module, and determine the heating point with abnormal temperature.

[0012] In a specific embodiment, there are multiple distribution box modules. Each distribution box module is connected to one or more of the first temperature acquisition modules, and / or each distribution box module is connected to one or more of the second temperature acquisition modules. The multiple distribution box modules are connected in series to form a distribution box module group, and the main control module is connected to each of the first temperature acquisition modules and / or each of the second temperature acquisition modules through the distribution box module group.

[0013] In a specific embodiment, the second temperature acquisition module is connected to the power supply module or the power supply inside the cabinet body.

[0014] In a specific embodiment, the power supply module includes a first voltage stabilizing circuit and a second voltage stabilizing circuit;

[0015] The input end of the first voltage stabilizing circuit is connected to an external power supply, and the output end of the first voltage stabilizing circuit is connected to the main control module, for providing the main control module with the electric energy that has undergone the first voltage stabilizing process.

[0016] The input end of the second voltage stabilizing circuit is connected to the first voltage stabilizing circuit, and the output end of the second voltage stabilizing circuit is connected to the main control module, for providing the main control module with the electric energy that has undergone the second voltage stabilizing process.

[0017] In a specific embodiment, the first voltage stabilizing circuit includes: a first capacitor, a first voltage stabilizing chip, and a second capacitor;

[0018] The second voltage stabilizing circuit includes: a third capacitor, a second voltage stabilizing chip, and a fourth capacitor;

[0019] The input end of the first voltage stabilizing chip is connected to the first capacitor, and the output end of the first voltage stabilizing chip is connected to the second capacitor; the output end of the second capacitor is connected to the input end of the third capacitor, the output end of the third capacitor is connected to the input end of the second voltage stabilizing chip, and the output end of the second voltage stabilizing chip is connected to the input end of the fourth capacitor;

[0020] The first capacitor, the first voltage stabilizing chip, the second capacitor, the third capacitor, the second voltage stabilizing chip, and the fourth capacitor are all grounded;

[0021] The second capacitor and the fourth capacitor are also respectively connected to the main control module.

[0022] In a specific embodiment, the first voltage stabilizing circuit further includes: a first inductor, a first resistor, a diode, and a second resistor;

[0023] The input end of the first inductor is connected to the first voltage regulator chip, and the output end of the first inductor is connected to the second capacitor; one end of the second resistor is connected to the first voltage regulator chip, the other end of the second resistor is connected to the second capacitor, the anode of the diode is connected to the input end of the first inductor, the cathode of the diode is connected to the first resistor, the other end of the first resistor is connected to the end of the second resistor far away from the second capacitor, and the diode is also grounded.

[0024] In a specific embodiment, the distribution box module includes: a data acquisition signal channel socket, a temperature sensor socket, and a signal channel selection switch;

[0025] The signal channel selection switch is respectively connected to the data acquisition signal channel socket and the temperature sensor socket for selecting the data acquisition signal channel;

[0026] Both the data acquisition signal channel socket and the temperature sensor socket are grounded; both the data acquisition signal channel socket and the temperature sensor socket include at least two, the data acquisition signal channel sockets are arranged in parallel, and the temperature sensor sockets are arranged in parallel.

[0027] In a specific embodiment, the first temperature acquisition module includes a fifth capacitor, a temperature sensor, a first temperature sensor socket, a second temperature sensor socket, and a third resistor;

[0028] The input end of the fifth capacitor is connected to the distribution box module, and the output end of the fifth capacitor is connected to the first temperature sensor socket, the second temperature sensor socket, and the temperature sensor. One end of the third resistor is respectively connected to the first temperature sensor socket and the second temperature sensor socket, and the other end of the third resistor is connected to the temperature sensor;

[0029] The first temperature sensor socket is grounded.

[0030] In a specific embodiment, the communication module includes a signal conversion chip, a sixth capacitor, a matching network, and a network socket;

[0031] The sixth capacitor is respectively connected to the signal conversion chip and the matching network. The input end of the signal conversion chip is connected to the main control module, the output end of the signal conversion chip is connected to the matching network, and the matching network is connected to the network socket;

[0032] Both the signal conversion chip, the matching network, and the network socket are grounded.

[0033] In a specific embodiment, the matching network includes a fourth resistor, a fifth resistor, a sixth resistor, a seventh resistor, and an eighth resistor;

[0034] The fourth resistor, the fifth resistor, and the sixth resistor are connected in series with the sixth capacitor. The seventh resistor and the eighth resistor are connected in parallel to the signal conversion chip, and the fifth resistor is also connected to the seventh resistor and the eighth resistor respectively.

[0035] Beneficial effects:

[0036] The present application provides a cabinet device capable of local temperature detection. By using multiple temperature acquisition modules to detect the temperatures at multiple locations inside the cabinet, the accuracy and precision of local temperature detection are improved, and relatively comprehensive temperature information can be collected, facilitating the search for local areas with abnormal temperatures. Specifically, the distribution box module can be connected to one or more first temperature acquisition modules and one or more second temperature acquisition modules, enhancing the expandability of the circuit, increasing the sources of temperature acquisition, and facilitating the integration of temperature information from multiple sources. Description of the Drawings

[0037] To more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only show some embodiments of the present application and should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can also be obtained based on these drawings without creative efforts.

[0038] Figure 1 Schematic diagram of the composition of the cabinet device capable of local temperature detection for this embodiment;

[0039] Figure 2 First voltage stabilization circuit diagram for this embodiment;

[0040] Figure 3 Second voltage stabilization circuit diagram for this embodiment;

[0041] Figure 4 Circuit diagram of the distribution box module for this embodiment;

[0042] Figure 5 Circuit diagram of the first temperature acquisition module for this embodiment;

[0043] Figure 6 Circuit diagram of the communication module for this embodiment.

[0044] Reference Signs:

[0045] 1 - Main control module; 2 - Power supply module; 3 - Distribution box module; 4 - Communication module; 5 - First temperature acquisition module; 6 - Second temperature acquisition module; 7 - Cabinet main body. Detailed Implementation Modes

[0046] In the following, various embodiments of the present disclosure will be described more comprehensively. The present disclosure can have various embodiments and adjustments and changes can be made therein. However, it should be understood that there is no intention to limit the various embodiments of the present disclosure to the specific embodiments disclosed herein, but the present disclosure should be understood to cover all adjustments, equivalents, and / or alternative options that fall within the spirit and scope of the various embodiments of the present disclosure.

[0047] In the following, the term "comprising" or "may comprise" that can be used in various embodiments of the present disclosure indicates the presence of the disclosed functions, operations, or elements, and does not limit the addition of one or more functions, operations, or elements. Further, as used in various embodiments of the present disclosure, the terms "comprising", "having" and their cognates are only intended to indicate a specific feature, number, step, operation, element, component, or combination of the foregoing items, and should not be construed as precluding the existence of one or more other features, numbers, steps, operations, elements, components, or the possibility of adding one or more features, numbers, steps, operations, elements, components, or combinations of the foregoing items.

[0048] In various embodiments of the present disclosure, the expression "or" or "at least one of A or / and B" includes any combination or all combinations of the words listed simultaneously. For example, the expression "A or B" or "at least one of A or / and B" may include A, may include B, or may include both A and B.

[0049] Expressions (such as "first", "second", etc.) used in various embodiments of the present disclosure may modify various constituent elements in the various embodiments, but do not limit the corresponding constituent elements. For example, the above expressions do not limit the order and / or importance of the elements. The above expressions are only used for the purpose of distinguishing one element from other elements. For example, the first user device and the second user device indicate different user devices, although both are user devices. For example, without departing from the scope of the various embodiments of the present disclosure, the first element may be referred to as the second element, and similarly, the second element may also be referred to as the first element.

[0050] It should be noted that if it is described that one constituent element is "connected" to another constituent element, the first constituent element may be directly connected to the second constituent element, and a third constituent element may be "connected" between the first constituent element and the second constituent element. Conversely, when one constituent element is "directly connected" to another constituent element, it can be understood that there is no third constituent element between the first constituent element and the second constituent element.

[0051] The term "user" used in various embodiments of the present disclosure may refer to a person using an electronic device or a device using an electronic device (e.g., an artificial intelligence electronic device).

[0052] The terms used in various embodiments of the present disclosure are for the purpose of describing specific embodiments only and are not intended to limit the various embodiments of the present disclosure. As used herein, the singular forms are intended to include the plural forms as well, unless the context clearly indicates otherwise. Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the various embodiments of the present disclosure pertain. The terms (such as those defined in a commonly used dictionary) will be interpreted as having the same meaning as the contextual meaning in the relevant technical field and will not be interpreted as having an idealized meaning or an overly formal meaning, unless clearly defined in the various embodiments of the present disclosure.

[0053] Embodiment

[0054] An embodiment of the present application provides a cabinet device capable of local temperature detection. Specifically, refer to Figure 1 As shown, it includes: a cabinet main body 7, a main control module 1, a communication module 4, a distribution box module 3, a first temperature acquisition module 5, a second temperature acquisition module 6, and a power supply module 2 for power supply;

[0055] The main control module 1 is respectively connected to the power supply module 2, the communication module 4, and the distribution box module 3. The distribution box module 3 is connected to one or more first temperature acquisition modules 5 and one or more second temperature acquisition modules 6;

[0056] Specifically, in some embodiments of the present application, the communication module 4 may also be connected to one or more second temperature acquisition modules 6; at this time, the second temperature acquisition module 6 is used to detect the cabinet temperature and / or the ambient temperature and correspondingly output a temperature signal to the communication module 4, and then transmit it to the main control module 1;

[0057] Exemplarily, the communication module 4 may be a wireless communication module, such as a Bluetooth module, a Wi-Fi module, a LoRa module, etc. The communication module 4 may also be a wired communication module, through wired communication, such as an SPI communication module, an I2C communication module, or an RS-485 communication module.

[0058] The main control module 1 refers to a microcontroller unit (MCU) that integrates functions such as a microprocessor core, a memory, an input / output interface, and a timer.

[0059] Exemplarily, the main control module 1 can be the main control module 1 of the Arduino Uno, Arduino Mega, Arduino Nano models using the Arduino series, or the main control module 1 of the STM32F103, STM32F407 models using the STM32 series, or the main control module 1 of the ESP8266 and ESP32 using the ESP series; of course, there is no limitation on the specific model selection of the main control module 1.

[0060] There are multiple heat generation points distributed in the cabinet body 7, and the first temperature acquisition module 5 and the second temperature acquisition module 6 are used to detect the temperatures of different heat generation points in the cabinet body 7;

[0061] The above-mentioned heat generation points include preset points that are prone to temperature anomalies, and the points that are prone to temperature anomalies can be determined according to historical maintenance records or circuit operation characteristics.

[0062] The power supply module 2 is used to provide appropriate and stable voltage to the main control module 1, the communication module 4, the distribution box module 3, and the first temperature acquisition module 5;

[0063] Specifically, in some embodiments of the present application, the power supply module 2 is used to receive external electrical energy, and through the internal first voltage stabilization circuit and the second voltage stabilization circuit, maintain the voltage at a reasonable level; and transmit the electrical energy after voltage conversion to the main control module 1, and then through the main control module 1, transmit the electrical energy to other modules, such as the communication module 4, the distribution box module 3, the first temperature acquisition module 5, etc.;

[0064] Exemplarily, the power supply module 2 can receive the electrical energy provided by the external power supply by connecting to the external power supply.

[0065] The first temperature acquisition module 5 and the second temperature acquisition module 6 are used to detect the cabinet temperature and / or the ambient temperature and correspondingly output temperature signals to the distribution box module 3, and then transmit them to the main control module 1;

[0066] The main control module 1 is used to obtain the temperature signals fed back by the first temperature acquisition module 5 and the second temperature acquisition module 6 through the distribution box module 3, and determine the heat generation points with temperature anomalies;

[0067] In some embodiments of the present application, the main control module 1 is used to obtain the temperature signal fed back by the second temperature acquisition module 6 through the communication module 4, so as to determine the heat generation points with temperature anomalies.

[0068] Understandably, by connecting the first temperature acquisition module 5 and the second temperature acquisition module 6 through the distribution box module 3, the expansion of the temperature acquisition module is realized, enriching the data sources for temperature detection. When local temperature anomalies occur, it is possible to accurately locate the specific local position where the problem occurs. By analyzing and determining the temperature information through the main control module 1, it is convenient to take targeted solutions in a timely manner.

[0069] Among them, the first temperature acquisition module 5 mainly refers to a circuit including a temperature probe and a temperature sensor. The second temperature acquisition module 6 can be the same or similar circuit as the first temperature acquisition module 5. The second temperature acquisition module 6 can also be other circuits including an infrared sensor, a thermocouple or a thermistor sensor, etc. The second temperature acquisition module 6 can also exist in other forms capable of collecting and summarizing temperature signals. The connection between the second temperature acquisition module 6 and the communication module 4 can be achieved either by wire or wirelessly.

[0070] Certainly, no restrictions are imposed on the specific forms of the first temperature acquisition module 5 and the second acquisition module.

[0071] Both the first temperature acquisition module 5 and the second temperature acquisition module 6 can be used to collect the cabinet temperature or the ambient temperature. Specifically, in some embodiments of the present application, the first temperature acquisition module 5 is used to collect the temperature information inside the cabinet, and the second temperature acquisition module 6 is used to collect the ambient temperature information. The cabinet temperature information and the ambient temperature information are sent to the main control module 1. After comprehensive processing by the main control module 1, it is convenient to determine whether there is a temperature anomaly, the specific location of the temperature anomaly, improving the timeliness of temperature anomaly discovery, the effectiveness and accuracy of temperature anomaly handling.

[0072] Furthermore, the cabinet device for local temperature detection includes a plurality of distribution box modules 3. Each distribution box module 3 is connected to one or more first temperature acquisition modules 5, and / or each distribution box module 3 is connected to one or more second temperature acquisition modules 6. The plurality of distribution box modules 3 are connected in series to form a distribution box module group. The main control module 1 is connected to each first temperature acquisition module 5 and / or each second temperature acquisition module 6 through the distribution box module group.

[0073] Each distribution box module 3 is connected to one or more first temperature acquisition modules 5, and / or each distribution box module 3 is connected to one or more second temperature acquisition modules 6. The circuit can be expanded to support more first temperature acquisition modules 5 or second temperature acquisition modules 6, meeting the demand for a large amount of temperature acquisition data in the circuit, improving the scalability and application scope of the system, and further enabling precise and detailed monitoring of the temperature in different areas of the cabinet. By promptly detecting potential overheating points with local temperature anomalies, the modular design of the distribution box module 3, the first temperature acquisition module 5, and the second temperature acquisition module 6 facilitates the expansion and maintenance of the distribution box module 3, and further facilitates the expansion of the first temperature acquisition module 5 and the second temperature acquisition module 6, contributing to more refined temperature monitoring.

[0074] Further, the second temperature acquisition module 6 is connected to the power module 2 or the power supply inside the cabinet body 7.

[0075] To monitor the temperature at each position inside the cabinet, when the second temperature acquisition module 6 is connected to the communication module 4, the distribution range may be relatively wide and the distance from the power module 1 may be far. When the second temperature acquisition module 6 is connected to the distribution box module 3 and is close to the power module 2, it is powered by the power module 2. When the distance from the power module 2 is far, it is powered by other power supplies, realizing a flexible power supply method and facilitating the circuit layout design.

[0076] Further, the power module 2 includes a first voltage stabilization circuit and a second voltage stabilization circuit;

[0077] The input end of the first voltage stabilization circuit is connected to an external power supply, and the output end of the first voltage stabilization circuit is connected to the main control module 1, for providing the main control module 1 with the electric energy that has undergone the first voltage stabilization process;

[0078] The input end of the second voltage stabilization circuit is connected to the first voltage stabilization circuit, and the output end of the second voltage stabilization circuit is connected to the main control module 1, for providing the main control module 1 with the electric energy that has undergone the second voltage stabilization process.

[0079] Specifically, as Figure 2 and Figure 3 shown, the power module 2 includes a first voltage stabilization circuit and a second voltage stabilization circuit;

[0080] The first voltage stabilization circuit includes: a first capacitor C1, a first voltage stabilization chip U1, and a second capacitor C2;

[0081] The second voltage stabilization circuit includes: a third capacitor C3, a second voltage stabilization chip U2, and a fourth capacitor C4;

[0082] The input end of the first voltage stabilization chip U1 is connected to the first capacitor C1, and the output end of the first voltage stabilization chip U1 is connected to the second capacitor C2;

[0083] Understandably, the first capacitor C1 is used to receive external electrical energy. The output terminal of the first capacitor C1 is connected to the first voltage regulator chip U1, and the output terminal of the first voltage regulator chip U1 is connected to the second capacitor C2. After the voltage regulation process of the first voltage regulator chip U1, the input 12V voltage is converted into a 5V voltage.

[0084] The output terminal of the second capacitor C2 is connected to the input terminal of the third capacitor C3, and the output terminal of the third capacitor C3 is connected to the input terminal of the second voltage regulator chip U2. The output terminal of the second voltage regulator chip U2 is connected to the input terminal of the fourth capacitor C4;

[0085] Understandably, the third capacitor C3 is used to receive electrical energy from the second capacitor C2. The output terminal of the third capacitor C3 is connected to the second voltage regulator chip U2, and the output terminal of the second voltage regulator chip U2 is connected to the fourth capacitor C4. After the voltage regulation process of the second voltage regulator chip U2, the input 5V voltage is converted into a 3.3V voltage.

[0086] The first capacitor C1, the first voltage regulator chip U1, the second capacitor C2, the third capacitor C3, the second voltage regulator chip U2, and the fourth capacitor C4 are all grounded;

[0087] The grounding setting improves the anti-interference ability of the circuit, thereby enhancing the stability of the power supply and effectively reducing the noise in the circuit.

[0088] The second capacitor C2 and the fourth capacitor C4 are also respectively connected to the main control module 1.

[0089] In summary, after being processed by the power supply module 2, electrical energy of 5V and 3.3V can be provided to meet the usage requirements of each component in the circuit.

[0090] Specifically, the VIN pin of the second voltage regulator chip U2 is connected to the output terminal of the third capacitor C3, and both OUT pins of the second voltage regulator chip U2 are connected to the fourth capacitor C4.

[0091] Furthermore, the first voltage regulation circuit further includes: a first inductor L1, a first resistor R1, a diode D1, and a second resistor R2;

[0092] The input terminal of the first inductor L1 is connected to the first voltage regulator chip U1, and the output terminal of the first inductor L1 is connected to the second capacitor C2; one end of the second resistor R2 is connected to the first voltage regulator chip U1, the other end of the second resistor R2 is connected to the second capacitor C2, the anode of the diode D1 is connected to the input terminal of the first inductor L1, the cathode of the diode D1 is connected to the first resistor R1, the other end of the first resistor R1 is connected to the end of the second resistor R2 far from the second capacitor C2, and the diode D1 is also grounded.

[0093] Specifically, the VIN pin and the EN pin of the first voltage regulator chip U1 are connected to the first capacitor C1; the SW pin of the first voltage regulator chip U1 is connected to the first capacitor C1, and the first capacitor C1 is connected to the second capacitor C2; the FB pin of the first voltage regulator chip U1 is connected to the second resistor R2, and the second resistor R2 is connected to the second capacitor C2; the anode of the diode D1 is connected to the SW pin of the first voltage regulator chip U1, the cathode of the diode D1 is connected to the first resistor R1, and the first resistor R1 is connected to the EB pin of the first voltage regulator chip U1.

[0094] Thus, a protection circuit is formed. When the voltage exceeds a certain range, the connection of the first capacitor C1, the first resistor R1, the second resistor R2, and the feedback pin (FB) can limit the output voltage, thereby protecting the circuit from damage; by connecting the diode D1 to the output terminal, it is also possible to prevent the voltage regulator from being damaged due to the load reverse current; connecting multiple capacitors and resistors can also provide filtering and voltage regulation functions, protecting the load from the ripple voltage at the input end.

[0095] Further, the junction box module 3 includes: data acquisition signal channel sockets CN1, CN2, a temperature sensor socket CN3, and a signal channel selection switch SW1;

[0096] The signal channel selection switch SW1 is respectively connected to the data acquisition signal channel sockets CN1, CN2 and the temperature sensor socket CN3 for selecting the data acquisition signal channel;

[0097] The data acquisition signal channel sockets CN1, CN2, and the temperature sensor socket CN3 are all grounded.

[0098] Optionally, the models of the data acquisition signal channel sockets may include USB, RS232, RJ45, BNC, etc.; specifically, in some embodiments of the present application, the model of the data acquisition signal channel socket is RJ45.

[0099] Optionally, the temperature sensor socket can be a DHT series sensor socket, or a DS18B20 digital temperature sensor socket, or an LM35 analog temperature sensor socket.

[0100] Specifically, as Figure 4As shown in the figure, the distribution box module 3 includes two data acquisition signal channel sockets CN1 and CN2, namely the first data acquisition signal channel socket CN1 and the second data acquisition signal channel socket CN2. Both the first data acquisition signal channel socket CN1 and the second data acquisition signal channel socket CN2 have eight pins. Six of the pins are correspondingly connected and are all connected to the signal channel selection switch SW1 to realize the selection and switching of signal channels. One pin is connected to the temperature sensor socket to supply power to the temperature sensor socket CN3, and the other pin is used for grounding. In addition, the first data acquisition signal channel socket CN1 and the second data acquisition signal channel socket CN2 are also provided with pins for function expansion. Exemplarily, they can be used to provide electrical energy, ground, and connect other distribution box modules 3 in series to enhance the overall circuit function.

[0101] Power is supplied to the first temperature acquisition module 5 through the sensor socket CN3 and temperature data is acquired.

[0102] Furthermore, there are at least two data acquisition signal channel sockets and temperature sensor sockets. The data acquisition signal channel sockets are connected in parallel, and the temperature sensor sockets are connected in parallel.

[0103] Through the parallel connection between the data acquisition signal channel sockets and between the temperature sensor sockets, it is convenient to expand the circuit to connect more data acquisition signal channels or temperature sensors, enhancing the flexibility of the circuit and facilitating the detection of temperature conditions at multiple positions. It can also reduce the required wiring length and quantity, thereby reducing the installation cost.

[0104] Furthermore, specifically, as Figure 5 shown, the first temperature acquisition module 5 includes a fifth capacitor C5, a temperature sensor U3, a first temperature sensor socket CN4, a second temperature sensor socket CN5, and a third resistor R3;

[0105] The input end of the fifth capacitor C5 is connected to the distribution box module 3. The output end of the fifth capacitor C5 is connected to the first temperature sensor socket CN4, the second temperature sensor socket CN5, and the temperature sensor U3. One end of the third resistor R3 is respectively connected to the first temperature sensor socket CN4 and the second temperature sensor socket CN5, and the other end of the third resistor R3 is connected to the temperature sensor U3;

[0106] The first sensor socket CN4 is grounded.

[0107] The temperature sensor U3 detects the ambient temperature in real time. After internal processing by the chip, the temperature parameter is converted into a digital signal and then transmitted to the distribution box module 3 through the data line.

[0108] Furthermore, as Figure 6As shown, the communication module 4 includes a signal conversion chip U4, a sixth capacitor C6, a matching network, and a network socket CN3;

[0109] The sixth capacitor C6 is respectively connected to the signal conversion chip U4 and the matching network. The input end of the signal conversion chip U4 is connected to the main control module 1, the output end of the signal conversion chip U4 is connected to the matching network, and the matching network is connected to the network socket CN3;

[0110] The signal conversion chip U4, the matching network, and the network socket CN3 are all grounded.

[0111] By connecting the sixth capacitor C6 to the signal conversion chip U4, the signal from the temperature sensor U3 can be processed and converted to meet the input requirements of the main control module 1, which helps to ensure that the data collected by the sensor can be accurately read and processed. The matching network can be used to adjust the amplitude and frequency of the signal to match the requirements of the network socket CN3, which helps to ensure that the transmitted signal will not be lost or distorted during transmission, improving the stability and reliability of the system; the matching network can also help filter out noise from the environment or other external interference sources, thereby improving the quality and accuracy of the signal.

[0112] Further, the matching network includes a fourth resistor R20, a fifth resistor R21, a sixth resistor R22, a seventh resistor R23, and an eighth resistor R24;

[0113] The fourth resistor R20, the fifth resistor R21, and the sixth resistor R22 are in series with the sixth capacitor C6. The seventh resistor R23 and the eighth resistor R24 are in parallel with the signal conversion chip U4, and the fifth resistor R21 is also respectively connected to the seventh resistor R23 and the eighth resistor R24.

[0114] Specifically, in some embodiments of the present application, the signal conversion chip U4 is an RS485 chip. The signal conversion chip U4 receives the TTL signals TX and RX from the main control module 1 and modulates and demodulates them into RS485 signals. The RS485 signals pass through the matching network: the fourth resistor R20, the fifth resistor R21, the sixth resistor R22, the seventh resistor R23, and the eighth resistor R24 and are then output through the RJ45 network socket CN3;

[0115] The network sockets CN3 are arranged in parallel, and each network socket CN3 facilitates connecting in series with the second temperature acquisition module 6 to realize the expansion of the temperature acquisition function.

[0116] More specifically, in some embodiments of the present application, the communication module 4 is connected to one or more second temperature acquisition modules 6.

[0117] Through the communication module 4, the data collected by multiple second temperature acquisition modules 6 can be centrally managed, which is convenient for unified storage, processing and analysis. This helps to improve the visualization and utilization value of the data and facilitates the control of the cabinet temperature. Through the communication module 4, the main control module 1 can remotely access the connected second temperature acquisition modules 6. The ability of remote access improves the flexibility and convenience of circuit temperature detection; it can also further expand the data sources of the main control module 1, which helps to obtain more accurate and precise temperature information.

[0118] The embodiments of the present application at least have the following beneficial effects:

[0119] The embodiments of the present application provide a cabinet device capable of local temperature detection. By using multiple temperature acquisition modules to detect the temperatures at multiple locations inside the cabinet, the accuracy and precision of local temperature detection are improved, and relatively comprehensive temperature information can be collected, which is convenient for finding the local area with abnormal temperature. Specifically, the distribution box module 3 can be connected to one or more first temperature acquisition modules 5 and one or more second temperature acquisition modules 6, which enhances the expandability of the circuit, increases the temperature acquisition sources, and is convenient for integrating temperature information from multiple sources.

[0120] Those skilled in the art can understand that the drawings are only schematic diagrams of a preferred implementation scenario, and the modules or processes in the drawings are not necessarily essential for implementing the present application.

[0121] Those skilled in the art can understand that the modules in the device in the implementation scenario can be distributed in the device in the implementation scenario according to the description of the implementation scenario, or can be correspondingly changed and located in one or more devices different from this implementation scenario. The modules in the above implementation scenario can be combined into one module, or can be further split into multiple sub-modules.

[0122] The above serial numbers of the present application are only for description and do not represent the advantages or disadvantages of the implementation scenarios.

[0123] The above discloses only several specific implementation scenarios of the present application. However, the present application is not limited thereto, and any changes that can be thought of by those skilled in the art should fall within the protection scope of the present application.

Claims

1. A cabinet device capable of local temperature detection, characterized in that Including: A cabinet main body, a main control module, a communication module, a distribution box module, a first temperature acquisition module, a second temperature acquisition module, and a power supply module for power supply; The main control module is respectively connected to the power supply module, the communication module, and the distribution box module, and the distribution box module is connected to one or more of the first temperature acquisition modules and one or more of the second temperature acquisition modules; There are multiple heat generation points distributed in the cabinet main body, and the first temperature acquisition module and the second temperature acquisition module are used to detect the temperatures of different heat generation points in the cabinet main body; The main control module is used to obtain the temperature signals fed back by the first temperature acquisition module and the second temperature acquisition module through the distribution box module, and determine the heat generation points with abnormal temperatures.

2. The cabinet device capable of local temperature detection according to claim 1, wherein Including multiple distribution box modules, each distribution box module is connected to one or more of the first temperature acquisition modules, and / or each distribution box module is connected to one or more of the second temperature acquisition modules. The multiple distribution box modules are connected in series to form a distribution box module group, and the main control module is connected to each of the first temperature acquisition modules and / or each of the second temperature acquisition modules through the distribution box module group.

3. The cabinet device capable of local temperature detection according to claim 1, wherein The second temperature acquisition module is connected to the power supply module or the power supply inside the cabinet main body.

4. The cabinet device capable of local temperature detection according to claim 1, characterized in that, The power supply module includes a first voltage stabilizing circuit and a second voltage stabilizing circuit; The input end of the first voltage stabilizing circuit is connected to an external power supply, and the output end of the first voltage stabilizing circuit is connected to the main control module, and is used to provide the main control module with electrical energy that has been subjected to the first voltage stabilizing process; The input end of the second voltage stabilizing circuit is connected to the first voltage stabilizing circuit, and the output end of the second voltage stabilizing circuit is connected to the main control module, and is used to provide the main control module with electrical energy that has been subjected to the second voltage stabilizing process.

5. The cabinet device capable of local temperature detection according to claim 4, wherein The first voltage stabilizing circuit includes: a first capacitor, a first voltage stabilizing chip, and a second capacitor; The second voltage stabilizing circuit includes: a third capacitor, a second voltage stabilizing chip, and a fourth capacitor; The input end of the first voltage stabilizing chip is connected to the first capacitor, and the output end of the first voltage stabilizing chip is connected to the second capacitor; the output end of the second capacitor is connected to the input end of the third capacitor, the output end of the third capacitor is connected to the input end of the second voltage stabilizing chip, and the output end of the second voltage stabilizing chip is connected to the input end of the fourth capacitor; The first capacitor, the first voltage stabilizing chip, the second capacitor, the third capacitor, the second voltage stabilizing chip, and the fourth capacitor are all grounded; The second capacitor and the fourth capacitor are also respectively connected to the main control module.

6. The cabinet device capable of local temperature detection according to claim 5, wherein The first voltage stabilizing circuit further includes: a first inductor, a first resistor, a diode, and a second resistor; The input end of the first inductor is connected to the first voltage stabilizing chip, and the output end of the first inductor is connected to the second capacitor; one end of the second resistor is connected to the first voltage stabilizing chip, the other end of the second resistor is connected to the second capacitor, the anode of the diode is connected to the input end of the first inductor, the cathode of the diode is connected to the first resistor, the other end of the first resistor is connected to the end of the second resistor far from the second capacitor, and the diode is also grounded.

7. The cabinet device capable of local temperature detection according to claim 1, characterized in that, The distribution box module includes: a data acquisition signal channel socket, a temperature sensor socket, and a signal channel selection switch; The signal channel selection switch is respectively connected to the data acquisition signal channel socket and the temperature sensor socket to select the data acquisition signal channel; The data acquisition signal channel socket and the temperature sensor socket are both grounded; both the data acquisition signal channel socket and the temperature sensor socket include at least two, and the data acquisition signal channel sockets are arranged in parallel, and the temperature sensor sockets are arranged in parallel.

8. A cabinet device capable of local temperature detection according to claim 1, characterized in that, The first temperature acquisition module includes a fifth capacitor, a temperature sensor, a first temperature sensor socket, a second temperature sensor socket, and a third resistor; The input end of the fifth capacitor is connected to the distribution box module, the output end of the fifth capacitor is connected to the first temperature sensor socket, the second temperature sensor socket, and the temperature sensor, one end of the third resistor is respectively connected to the first temperature sensor socket and the second temperature sensor socket, and the other end of the third resistor is connected to the temperature sensor; the first temperature sensor socket is grounded.

9. A cabinet device capable of local temperature detection according to claim 1, wherein, The communication module includes a signal conversion chip, a sixth capacitor, a matching network, and a network socket; The sixth capacitor is respectively connected to the signal conversion chip and the matching network, the input end of the signal conversion chip is connected to the main control module, the output end of the signal conversion chip is connected to the matching network, and the matching network is connected to the network socket; The signal conversion chip, the matching network, and the network socket are all grounded.

10. The cabinet device capable of local temperature detection according to claim 9, wherein The matching network includes a fourth resistor, a fifth resistor, a sixth resistor, a seventh resistor, and an eighth resistor; The fourth resistor, the fifth resistor, and the sixth resistor are connected in series with the sixth capacitor, the seventh resistor and the eighth resistor are connected in parallel to the signal conversion chip, and the fifth resistor is also respectively connected to the seventh resistor and the eighth resistor.

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