Heat dissipation shell and guide rail type power supply

Abstract

The utility model belongs to the technical field of switching power supplies, and discloses a heat dissipation shell and a guide rail type power supply, the heat dissipation shell is used for heat dissipation of the guide rail type power supply, and the heat dissipation shell comprises a main heat dissipation plate, a side heat dissipation plate, a side plate, a cover shell and a heat dissipation plate; the main heat dissipation plate can be slidably connected to a mounting rail of the guide rail type power supply; the main heat dissipation plate, the side heat dissipation plates, the side plates and the housing are enclosed to form an accommodating cavity, and the accommodating cavity is used for accommodating components of the guide rail type power supply; the heat dispersion plate is arranged in the accommodating cavity and is vertically connected with the main heat dissipation plate so as to divide the accommodating cavity into a high-voltage space and a low-voltage space, the high-voltage space is used for accommodating a high-voltage device of the guide rail type power supply, and the low-voltage space is used for accommodating a low-voltage device of the guide rail type power supply; and high-temperature components of the guide rail type power supply are arranged on the main heat dissipation plate, the side heat dissipation plates or the heat dissipation plates. The heat dissipation shell can improve the heat dissipation effect of the guide rail type power supply, realizes high-low voltage electrical isolation, and improves the safety.

Description

Technical Field

[0001] The utility model relates to the technical field of switching power supplies, and particularly relates to a heat dissipation housing and a rail-mounted power supply. Background Art

[0002] A switching power supply is a power supply that utilizes power electronics technology to control a switching tube through a circuit for high-speed conduction and cut-off, and converts direct current into high-frequency alternating current to be supplied to a transformer for voltage transformation to maintain a stable output voltage; it is widely used in various terminal devices, communication devices and other electronic devices dominated by electronic computers due to its characteristics of small size, light weight and high efficiency, and is an indispensable power supply method for the rapid development of the current electronic information industry. In order to facilitate the installation and disassembly of the switching power supply, the rail-mounted power supply came into being.

[0003] With the continuous increase in the power of the rail-mounted power supply, the heat dissipation requirement gradually increases. However, due to the limited space of the rail-mounted power supply and the large number of components that need to be cooled inside, the overall temperature is relatively high during use. On the contrary, if there are fewer heat dissipation components in the rail-mounted power supply, the heat dissipation effect will be poor. And the layout of high-voltage components and low-voltage components in the rail-mounted power supply cannot achieve effective electrical isolation, resulting in high potential safety hazards.

[0004] Therefore, there is an urgent need for a heat dissipation housing and a rail-mounted power supply to solve the above technical problems. Summary of the Utility Model

[0005] An object of the utility model is to provide a heat dissipation housing, which can increase the heat dissipation area, improve the heat dissipation effect, and at the same time achieve electrical isolation between high and low voltages, thereby improving safety.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] A heat dissipation housing for dissipating heat of a rail-mounted power supply, the heat dissipation housing includes a main heat dissipation plate, side heat dissipation plates, side plates, a cover shell and a dispersion heat plate; wherein,

[0008] The main heat dissipation plate is slidably connected to the installation rail of the rail-mounted power supply;

[0009] The main heat dissipation plate, the side heat dissipation plates, the side plates and the cover shell enclose a receiving cavity for receiving the components of the rail-mounted power supply;

[0010] The dispersion heat plate is disposed in the receiving cavity and is vertically connected to the main heat dissipation plate to divide the receiving cavity into a high-voltage space and a low-voltage space, the high-voltage space is used for receiving the high-voltage devices of the rail-mounted power supply, and the low-voltage space is used for receiving the low-voltage devices of the rail-mounted power supply;

[0011] The high-temperature components of the above-mentioned rail power supply are arranged on the above-mentioned main heat dissipation plate, the above-mentioned side heat dissipation plate or the above-mentioned distributed heat dissipation plate.

[0012] Optionally, the main heat dissipation plate, the side heat dissipation plate and the distributed heat dissipation plate are all provided with air ducts in a penetrating manner.

[0013] Optionally, the housing includes two opposite heat dissipation side walls, and a plurality of heat dissipation holes are provided in the heat dissipation side walls, and at least part of the heat dissipation holes are communicated with the air ducts.

[0014] Optionally, the opening area of the heat dissipation holes communicated with the air ducts is larger than the opening area of the remaining heat dissipation holes.

[0015] Optionally, the two heat dissipation side walls are arranged opposite to each other along the extension direction perpendicular to the installation track of the rail power supply.

[0016] Optionally, the main heat dissipation plate, the side heat dissipation plate and the distributed heat dissipation plate all include heat dissipation connection plates and a plurality of heat dissipation fins arranged at intervals on the heat dissipation connection plates. Air ducts are formed between adjacent heat dissipation fins. The heat dissipation connection plates are attached to the high-temperature components of the rail power supply for conducting heat to the heat dissipation fins, and the heat dissipation fins are used to dissipate heat.

[0017] Optionally, the distributed heat dissipation plate is provided with two heat dissipation connection plates, and the two heat dissipation connection plates are respectively used to connect the high-temperature structures of the high-voltage devices and the high-temperature structures of the low-voltage devices.

[0018] Optionally, it further includes a rail bracket, and the rail bracket is arranged on the side of the main heat dissipation plate away from the accommodation cavity, and the rail bracket is slidably connected to the installation track of the rail power supply.

[0019] Optionally, a baffle is provided on the side of the side heat dissipation plate away from the accommodation cavity.

[0020] Another object of the present utility model is to provide a rail power supply, which can increase the heat dissipation area, improve the heat dissipation effect, and at the same time achieve electrical isolation between high and low voltages, improving safety.

[0021] To achieve this purpose, the present utility model adopts the following technical solutions:

[0022] A rail power supply, including a high-voltage device group, a low-voltage device group and the heat dissipation housing described in any of the above solutions; the high-voltage device group is arranged in the high-voltage space, the low-voltage device group is arranged in the low-voltage space, and the high-temperature components of the high-voltage device group and the high-temperature components of the low-voltage device group are all arranged on the main heat dissipation plate, the side heat dissipation plate or the distributed heat dissipation plate.

[0023] The beneficial effects of the present utility model:

[0024] The utility model provides a heat dissipation housing and a rail type power supply. On the basis of the main heat dissipation plate, a side heat dissipation plate and a dispersion heat dissipation plate are added. The accommodation cavity is separated into a high-pressure space and a low-pressure space by the dispersion heat dissipation plate, realizing the electrical isolation of the rail type power supply and improving the safety. At the same time, the arrangement of the side heat dissipation plate and the dispersion heat dissipation plate increases the heat exchange area of the high-temperature components inside the heat dissipation housing, enabling the heat of the high-temperature components to be dissipated through the main heat dissipation plate, the side heat dissipation plate and the dispersion heat dissipation plate, improving the heat dissipation effect. Moreover, the heat of the high-temperature components in the low-pressure space and the high-pressure space will not conduct to each other, avoiding the influence on other components during the heat dissipation process and further improving the heat dissipation effect of the heat dissipation housing and the rail type power supply. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is an isometric view of a rail type power supply from one perspective provided by a specific embodiment of the utility model;

[0026] Figure 2 is an isometric view of the rail type power supply from another perspective provided by a specific embodiment of the utility model;

[0027] Figure 3 is a front view of the rail type power supply provided by a specific embodiment of the utility model;

[0028] Figure 4 is a front view of the rail type power supply with the housing removed provided by a specific embodiment of the utility model.

[0029] In the figures:

[0030] 101, accommodation cavity; 1011, high-pressure space; 1012, low-pressure space;

[0031] 10, main heat dissipation plate; 11, first heat dissipation connecting plate; 12, first heat dissipation fin;

[0032] 20, side heat dissipation plate; 21, second heat dissipation connecting plate; 22, second heat dissipation fin;

[0033] 30, side plate;

[0034] 40, housing; 41, heat dissipation side wall; 411, heat dissipation hole; 42, bottom wall;

[0035] 50, dispersion heat dissipation plate; 51, third heat dissipation connecting plate; 52, third heat dissipation fin;

[0036] 60, rail bracket; 70, baffle;

[0037] 200, high-temperature component; 300, circuit board. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0038] The present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only for explaining the present utility model, rather than limiting the present utility model. In addition, it should be noted that for the sake of description, only the parts related to the present utility model are shown in the drawings, rather than all the structures.

[0039] In the description of the present utility model, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0040] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "over", and "on top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "beneath", and "under" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0041] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "right", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for distinction in description and do not have special meanings.

[0042] Please refer to Figures 1 to 4This embodiment provides a guide rail power supply, which includes a high-voltage device group, a low-voltage device group and the heat dissipation housing described in this embodiment; the high-voltage device group is arranged in the high-voltage space 1011, and the low-voltage device group is arranged in the low-voltage space 1012. The high-temperature components 200 of the high-voltage device group and the high-temperature components 200 of the low-voltage device group are both arranged on the main heat dissipation plate 10, the side heat dissipation plate 20 or the heat dissipation plate 50. By separating the high-voltage device group and the low-voltage device group, the high and low voltages of the guide rail power supply are effectively electrically isolated, thereby improving safety. At the same time, due to the use of the heat dissipation housing described in this embodiment, the high-temperature components 200 in the guide rail power supply are reasonably planned, and a better heat dissipation effect is obtained, thereby ensuring the reliability of the guide rail power supply during operation.

[0043] Furthermore, the guide rail power supply further includes a plurality of circuit boards 300 , and the circuit boards 300 are arranged close to the heat dissipation housing so as to dissipate heat from high-temperature structures on the circuit boards 300 .

[0044] In order to achieve the heat dissipation and space separation functions of the heat dissipation housing, this embodiment provides a heat dissipation housing for heat dissipation of a guide rail power supply.

[0045] Specifically, the heat dissipation shell includes a main heat dissipation plate 10, a side heat dissipation plate 20, a side plate 30, a cover shell 40 and a heat dissipation plate 50; wherein the main heat dissipation plate 10 can be slidably connected to the mounting track of the guide-rail power supply; the main heat dissipation plate 10, the side heat dissipation plate 20, the side plate 30 and the cover shell 40 enclose a accommodating cavity 101, and the accommodating cavity 101 is used to accommodate components of the guide-rail power supply; the heat dissipation plate 50 is arranged in the accommodating cavity 101 and is vertically connected to the main heat dissipation plate 10 to separate the accommodating cavity 101 into a high-pressure space 1011 and a low-pressure space 1012, the high-pressure space 1011 is used to accommodate high-voltage components of the guide-rail power supply, and the low-pressure space 1012 is used to accommodate low-voltage components of the guide-rail power supply; the high-temperature components 200 of the guide-rail power supply are arranged on the main heat dissipation plate 10, the side heat dissipation plate 20 or the heat dissipation plate 50.

[0046] Optionally, the high temperature components 200 are connected to the main heat sink 10, and the circuit board 300 with a high temperature structure is arranged close to the side heat sink 20 and the heat dissipation plate 50 over a large area to reduce the heat conduction path and improve the heat dissipation effect.

[0047] For the heat dissipation housing of this embodiment, a side heat dissipation plate 20 and a distributed heat dissipation plate 50 are added on the basis of the main heat dissipation plate 10. The distributed heat dissipation plate 50 divides the accommodation cavity 101 to form a high-pressure space 1011 and a low-pressure space 1012, realizing the electrical isolation of the rail power supply and improving safety. At the same time, the arrangement of the side heat dissipation plate 20 and the distributed heat dissipation plate 50 increases the heat exchange area of the high-temperature components 200 inside the heat dissipation housing, enabling the heat of the high-temperature components 200 to be dissipated through the main heat dissipation plate 10, the side heat dissipation plate 20, and the distributed heat dissipation plate 50, improving the heat dissipation effect. Moreover, the heat of the high-temperature components 200 in the low-pressure space 1012 and the high-pressure space 1011 will not conduct to each other, avoiding the influence on other components during the heat dissipation process and further improving the heat dissipation effect of the heat dissipation housing and the rail power supply.

[0048] Optionally, the bottom wall 42 is arranged opposite to the main heat dissipation plate 10 in the first direction, the side plate 30 and the side heat dissipation plate 20 are arranged opposite to each other in the second direction, and the two heat dissipation side walls 41 are arranged opposite to each other in the third direction. The first direction, the second direction, and the third direction are perpendicular to each other in pairs, and thus can enclose the accommodation cavity 101.

[0049] Please continue to refer to Figures 1 to 4 , in this embodiment, the main heat dissipation plate 10, the side heat dissipation plate 20, and the distributed heat dissipation plate 50 are all provided with air ducts. The heat in the rail power supply can not only be conducted to the main heat dissipation plate 10 through the side heat dissipation plate 20 and the distributed heat dissipation plate 50 for heat dissipation or directly conducted to the main heat dissipation plate 10 for heat dissipation, but also be dissipated by the side heat dissipation plate 20 and the distributed heat dissipation plate 50 contacting the outside world themselves, shortening the heat dissipation path and improving the heat dissipation effect.

[0050] Furthermore, the housing 40 includes two opposite heat dissipation side walls 41. A plurality of heat dissipation holes 411 are provided in the heat dissipation side walls 41, and at least part of the heat dissipation holes 411 are communicated with the air duct, so that the air duct is communicated with the outside to increase the heat exchange area between the main heat dissipation plate 10, the side heat dissipation plate 20, and the distributed heat dissipation plate 50 and the external air.

[0051] Specifically, the housing 40 further includes a bottom wall 42, and the heat dissipation side walls 41 are arranged on the bottom wall 42 to form a U-shaped structure for enclosing with the main heat dissipation plate 10, the side plate 30, and the side heat dissipation plate 20.

[0052] Optionally, the opening area of the heat dissipation holes 411 communicated with the air duct is larger than that of the remaining heat dissipation holes 411, so that there are fewer obstacles between the external air and the air duct, increasing the air intake volume, thereby improving the heat exchange effect and making the heat dissipation effect of the main heat dissipation plate 10, the side heat dissipation plate 20, and the distributed heat dissipation plate 50 better.

[0053] Since multiple rail power supplies may be arranged on one orbit, in order to ensure that the rail power supplies do not affect each other, optionally, the two heat dissipation side walls 41 are oppositely arranged along the direction perpendicular to the extension direction of the installation orbit of the rail power supply, that is, the heat dissipation side wall 41 does not contact other rail power supplies, does not absorb the heat dissipation air of other rail power supplies, and does not affect the heat dissipation of other rail power supplies at the same time.

[0054] Further, a baffle 70 is provided on the side of the side heat dissipation plate 20 away from the accommodation cavity 101 to prevent the side heat dissipation plate 20 from directly contacting the outside in this direction and avoid heat affecting the heat dissipation of other rail power supplies.

[0055] In this embodiment, the main heat dissipation plate 10, the side heat dissipation plate 20 and the distributed heat dissipation plate 50 all include heat dissipation connection plates and a plurality of heat dissipation fins arranged at intervals on the heat dissipation connection plates. Air ducts are formed between adjacent heat dissipation fins. The heat dissipation connection plate is attached to the high-temperature components 200 of the rail power supply for conducting heat to the heat dissipation fins, and the heat dissipation fins are used to dissipate heat.

[0056] Optionally, the heat dissipation fins extend in a wavy shape along the extension direction of the air duct to increase the length of the air duct, so that the heat exchange area between the external air and the heat dissipation fins is increased, thereby accelerating the heat dissipation rate of the heat dissipation fins and improving the heat dissipation effect.

[0057] Specifically, the main heat dissipation plate 10 includes a first heat dissipation connection plate 11 and a plurality of first heat dissipation fins 12. The first heat dissipation fins 12 are arranged on the side of the first heat dissipation connection plate 11 away from the accommodation cavity 101. The heat of the high-temperature components 200 in the heat dissipation housing is conducted to the plurality of first heat dissipation fins 12 through the first heat dissipation connection plate 11 and dissipated.

[0058] Further, the side heat dissipation plate 20 includes a second heat dissipation connection plate 21 and a plurality of second heat dissipation fins 22. The second heat dissipation fins 22 are arranged on the side of the second heat dissipation connection plate 21 away from the accommodation cavity 101. The heat of the high-temperature components 200 in the heat dissipation housing is conducted to the plurality of second heat dissipation fins 22 through the second heat dissipation connection plate 21 and dissipated. Specifically, the baffle 70 is arranged at one end of the plurality of heat dissipation fins away from the second heat dissipation connection plate 21, blocking the direct contact between the second heat dissipation fins 22 and the external air, that is, the external air can only be heat-exchanged with the second heat dissipation fins 22 through the heat dissipation holes 411 of the heat dissipation side wall 41 of the housing 40.

[0059] Still further, the distributed heat dissipation plate 50 includes a third heat dissipation connection plate 51 and a plurality of third heat dissipation fins 52. The third heat dissipation fins 52 are arranged on the side of the third heat dissipation connection plate 51 away from the accommodation cavity 101. The heat of the high-temperature components 200 in the heat dissipation housing is conducted to the plurality of third heat dissipation fins 52 through the third heat dissipation connection plate 51 and dissipated.

[0060] Optionally, the dispersion heat plate 50 is provided with two heat dissipation connection plates, that is, the dispersion heat plate 50 is provided with two third heat dissipation connection plates 51. The two heat dissipation connection plates are respectively used to connect the high-temperature structures of high-voltage devices and the high-temperature structures of low-voltage devices, so as to prevent the heat between the high-voltage and low-voltage spaces from affecting and diffusing each other, and at the same time, the heat dissipation of the heat in their respective spaces can be realized.

[0061] In this embodiment, the heat dissipation housing further includes a guide rail bracket 60. The guide rail bracket 60 is disposed on the side of the main heat dissipation plate 10 away from the accommodation cavity 101. The guide rail bracket 60 is slidably connected to the installation rail of the rail-type power supply, so as to realize the sliding connection between the heat dissipation housing and the installation rail of the rail-type power supply, and achieve the convenience of installation and disassembly of the rail-type power supply.

[0062] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, rather than limiting the implementation manners of the present invention. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. Heat dissipation housing, characterized in that, For heat dissipation of a rail-mounted power supply, the heat dissipation housing includes a main heat dissipation plate (10), side heat dissipation plates (20), side plates (30), a cover housing (40), and a dispersion heat plate (50); wherein, The main heat dissipation plate (10) is slidably connected to the installation rail of the rail-mounted power supply; The main heat dissipation plate (10), the side heat dissipation plates (20), the side plates (30), and the cover housing (40) enclose to form a receiving cavity (101), and the receiving cavity (101) is used to receive the components of the rail-mounted power supply; The dispersion heat plate (50) is disposed in the receiving cavity (101) and is perpendicularly connected to the main heat dissipation plate (10) to divide the receiving cavity (101) into a high-voltage space (1011) and a low-voltage space (1012). The high-voltage space (1011) is used to receive the high-voltage devices of the rail-mounted power supply, and the low-voltage space (1012) is used to receive the low-voltage devices of the rail-mounted power supply; The high-temperature components (200) of the rail-mounted power supply are disposed on the main heat dissipation plate (10), the side heat dissipation plates (20), or the dispersion heat plate (50).

2. The heat dissipation housing according to claim 1, wherein The main heat dissipation plate (10), the side heat dissipation plates (20), and the dispersion heat plate (50) are all provided with air ducts therethrough.

3. The heat dissipation housing according to claim 2, wherein, The cover housing (40) includes two relatively arranged heat dissipation side walls (41), and a plurality of heat dissipation holes (411) are provided in the heat dissipation side walls (41), and at least part of the heat dissipation holes (411) are communicated with the air ducts.

4. The heat dissipation housing according to claim 3, characterized in that, The opening area of the heat dissipation holes (411) communicated with the air ducts is larger than the opening area of the remaining heat dissipation holes (411).

5. The heat dissipation housing according to claim 3, wherein The two heat dissipation side walls (41) are relatively arranged along the extension direction perpendicular to the installation rail of the rail-mounted power supply.

6. The heat dissipation housing according to claim 1, characterized in that, The main heat dissipation plate (10), the side heat dissipation plates (20), and the dispersion heat plate (50) each include a heat dissipation connection plate and a plurality of heat dissipation fins spaced apart on the heat dissipation connection plate. An air duct is formed between adjacent heat dissipation fins. The heat dissipation connection plate is attached to the high-temperature components (200) of the rail-mounted power supply for conducting heat to the heat dissipation fins, and the heat dissipation fins are used to dissipate heat.

7. The heat dissipation housing according to claim 6, wherein The dispersion heat plate (50) is provided with two heat dissipation connection plates, and the two heat dissipation connection plates are respectively used to connect the high-temperature structures of the high-voltage devices and the high-temperature structures of the low-voltage devices.

8. The heat dissipation housing according to claim 1, characterized in that, It further includes a rail bracket (60). The rail bracket (60) is disposed on the side of the main heat dissipation plate (10) away from the receiving cavity (101), and the rail bracket (60) is slidably connected to the installation rail of the rail-mounted power supply.

9. The heat dissipation housing according to any one of claims 1-8, characterized in that, A baffle (70) is provided on the side of the side heat dissipation plate (20) away from the receiving cavity (101).

10. Rail-mounted power supply, characterized in that, It includes a high-voltage device group, a low-voltage device group, and a heat dissipation housing as described in any one of claims 1-9; the high-voltage device group is arranged in the high-voltage space (1011), the low-voltage device group is arranged in the low-voltage space (1012), and the high-temperature components (200) of the high-voltage device group and the high-temperature components (200) of the low-voltage device group are both arranged on the main heat dissipation plate (10), the side heat dissipation plate (20), or the discrete heat dissipation plate (50).

Images