Hardware firewall
By separating the hardware firewall host from the heat dissipation rack, using thermal conductivity structure and cold air heat dissipation, the problems of poor heat dissipation and messy wiring of the hardware firewall are solved, and more efficient heat dissipation and convenient maintenance are achieved.
Patent Information
- Application Number
- CN202421716051.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-18
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-07-18
AI Technical Summary
The existing hardware firewalls have poor heat dissipation effects, resulting in degradation of equipment performance and messy wiring at the interfaces and difficult to repair.
Separate the hardware firewall host from the heat dissipation rack, use contactless lifting and fixing, add thermal conductivity structure and cold air heat dissipation, and coordinate the wiring design to regular wiring.
It achieves a more effective heat dissipation effect, avoids equipment crashes, and has regular interface wiring, which is convenient for maintenance operations.
Smart Images
Figure CN223094074U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of communication technologies and devices, and particularly relates to a hardware firewall. Background Art
[0002] A hardware firewall is a security routing device that embeds firewall software into a Linux customized system, burns the entire system program into a specific exclusive chip, and performs security protection and isolation detection on network transmission data. To detect and isolate potential vulnerability intrusions in the application layer system (i.e., the lower computer), enterprise-level hard firewalls need to run without downtime all the time. Considering costs, on the premise of realizing the firewall function, the exclusive chip is generally designed to operate at full power and perform saturated calculations. Therefore, the internal circuit board and electronic components (mainly the exclusive chip) of this device will continuously dissipate heat to the packaging shell. If the heat cannot be dissipated and cooled in time, the heat accumulation will affect the performance of the hardware device itself, the service life of the components, and the data processing efficiency of the downstream application layer. The existing heat dissipation design of hardware firewalls is the same as that of ordinary routers or switches, mainly relying on the air-cooling heat dissipation method of directly blowing with a cooling fan integrally installed on the hardware body. Due to the different operating intensities and functions of the two, this heat dissipation method is extremely likely to cause the firewall to freeze and data to break. In addition, as the wiring of the downstream hosts increases, the firewalls gradually become entangled and messy with each other. When a data break occurs, it is not easy to identify and detect the corresponding interface. Content of the Utility Model
[0003] The technical problem to be solved by the utility model is to overcome the defects that the integrated cooling fan of the existing ordinary routing design has poor heat dissipation effect on the chip packaging shell of the hard firewall and the wiring at the interface is messy. A hardware firewall is provided, which separates the body from the rack and uses non-contact hoisting and fixing. By adding a heat conduction structure on the body and cooperating with the cold air heat dissipation of the rack, the cold flow cooling of each surface of the body is realized. In addition, through the wire row design, the wiring at the interface is made regular, which is convenient for finding the corresponding interface and performing maintenance operations.
[0004] This hardware firewall includes a hardware host and a heat dissipation rack. The hardware host is hoisted inside the heat dissipation rack, and there are gaps between the upper, lower, left, right, and rear sides of the hardware host and the inner wall of the heat dissipation rack. Among them, the main body of the hardware host uses a plastic shell, and the upper, lower, two sides, and rear panels of the main body are covered by heat dissipation aluminum shells. Short fins extending towards the main board are provided inside the aluminum shells, and long fins extending towards the corresponding inner walls of the heat dissipation rack are provided outside the aluminum shells. Among them, a temperature sensor is provided in the area where the chips are arranged on the circuit board inside the upper aluminum shell. The aluminum shell and the long and short fins are integrally formed aluminum profiles; the heat dissipation rack is a hollow shell with an open front side and a card wire row formed at the lower edge, and the rear side is arc-shaped. Fan groups are installed on both sides of the front side of the heat dissipation rack. Slots are opened on the arc-shaped back panel at the rear of the heat dissipation rack, and a semiconductor refrigeration sheet is embedded in the slots. The fan group includes a pair of speed-adjustable fans, and the speed-adjustable fans blow from both sides of the heat dissipation rack towards the arc-shaped back panel at the rear of the heat dissipation rack. A number of obliquely arranged wire inlet slots are arranged on the card wire row, and a circular wire placement slot is formed below the wire routing slot.
[0005] Further, four hanging rod mechanisms are installed at the four corners of the top plate of the heat dissipation rack. The hanging rod mechanism includes a hanging rod with a threaded part in the center, an adjusting nut, and a bearing platform. The bearing platform is fixed at the bottom of the hanging rod, and the adjusting nut is screwed onto the threaded part of the hanging rod above the heat dissipation rack.
[0006] Further, a cushion made of polyurethane soft material is provided on the bearing platform.
[0007] Further, it also includes a controller. The controller includes a main control single-chip microcomputer, a relay module, and a power conversion module. The main control single-chip microcomputer is connected to the fan group and the semiconductor refrigeration sheet through the relay module. The input end of the main control single-chip microcomputer is connected to the temperature sensor, and the power conversion module supplies power to the fan group and the semiconductor refrigeration sheet respectively.
[0008] A hardware firewall of the present utility model overcomes the defects that the integrated cooling fan of the existing ordinary routing design has poor heat dissipation effect on the chip packaging shell of the hard firewall and the wiring at the interface is messy. It separates the body from the rack and uses non-contact hoisting and fixing. By adding a heat conduction structure on the body and cooperating with the cold air cooling of the rack, it realizes the cold flow cooling of each surface of the body. In addition, through the wire row design, the wiring at the interface is regular, which is convenient for finding the corresponding interface and performing maintenance operations. Brief Description of the Drawings
[0009] The following further describes a hardware firewall of the present utility model with reference to the drawings:
[0010] Figure 1 is a three-dimensional structural schematic diagram of this hardware firewall;
[0011] Figure 2 is Figure 1 a first explosion structural schematic diagram of
[0012] Figure 3 is Figure 1 the schematic diagram of the secondary explosion structure;
[0013] Figure 4 is Figure 3 the enlarged view of the local structure of part A in
[0014] Figure 5 the logic structure and connection principle wireframe diagram of this hardware firewall.
[0015] In the figure:
[0016] 1 - Hardware host; 11 - Main body, 12 - Heat dissipation aluminum shell, 13 - Temperature sensor; 121 - Short fins, 122 - Long fins;
[0017] 2 - Heat dissipation frame; 21 - Fan group, 22 - Semiconductor refrigeration chip; 201 - Wire clamping row, 202 - Arc-shaped backplane, 203 - Inlet wire groove, 204 - Wire placement groove, 211 - Speed control fan;
[0018] 3 - Suspender mechanism; 31 - Suspender, 32 - Adjusting nut, 33 - Bearing platform; 311 - Threaded part, 331 - Support pad;
[0019] 4 - Controller; 41 - Main control single-chip microcomputer, 42 - Relay module, 43 - Power conversion module. Specific implementation manners
[0020] In the present utility model, unless otherwise clearly defined and limited, terms such as "installation", "connection", "connection", "fixation" and other terms shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be directly connected, or indirectly connected through an intermediate medium, and can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.
[0021] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as "left", "right", "front", "rear", "top", "bottom", "inner", "outer", etc. are all based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present utility model.
[0022] The following further describes the technical solution of the present utility model with specific embodiments, but the protection scope of the present utility model is not limited to the following embodiments.
[0023] Embodiment 1: As shown in Figures 1 to 4 , this hardware firewall includes a hardware host 1 and a heat dissipation rack 2. The hardware host 1 is hoisted inside the heat dissipation rack 2, and there are gaps between the upper, lower, left, right, and rear sides of the hardware host 1 and the inner wall of the heat dissipation rack 2. Among them, the main body 11 of the hardware host 1 is made of a plastic shell, and the upper, lower, two side, and rear panels of the main body 11 are covered by heat dissipation aluminum shells 12. Short fins 121 extending towards the main board are provided on the inner side of the aluminum shell 12, and long fins 122 extending towards the corresponding inner wall of the heat dissipation rack 2 are provided on the outer side of the aluminum shell 12. Among them, a temperature sensor 13 is provided in the area where the chips are arranged on the circuit board on the inner side of the upper aluminum shell. The aluminum shell 12 and the long and short fins are integrally formed aluminum profiles; the heat dissipation rack 2 is a hollow shell that is open at the front side and has a wire clamping row 201 formed at the lower edge, and the rear side is arc-shaped. Fan groups 21 are installed on both sides of the front side of the heat dissipation rack 2. Slots are formed on the arc-shaped back panel 202 of the rear side of the heat dissipation rack 2, and a semiconductor refrigeration sheet 22 is embedded in the slots. The fan group 21 includes a pair of speed-adjustable fans 211, and the speed-adjustable fans 211 blow from both sides of the heat dissipation rack 2 towards the arc-shaped back panel 202 of the rear side of the heat dissipation rack 2. A number of obliquely arranged wire inlet grooves 203 are arranged on the wire clamping row 201, and a circular wire placement groove 204 is formed below the wiring groove.
[0024] Embodiment 2: Four suspension rod mechanisms 3 are installed through the four corners of the top plate of the heat dissipation rack 2 of this hardware firewall. The suspension rod mechanism 3 includes a suspension rod 31 with a threaded part 311 in the center, an adjusting nut 32, and a bearing platform 33. The bearing platform 33 is fixed at the bottom of the suspension rod 31, and the adjusting nut 32 is screwed onto the threaded part on the suspension rod 31 above the heat dissipation rack 2. The suspension rod mechanism is used for hoisting the hardware host. Among them, the four bearing platforms are used to support the lower part of the hardware host, and the adjusting nut is used to adjust the height of each bearing platform, so as to realize the horizontal hoisting of the hardware host and the adjustment of the gap between the upper and lower surfaces of the hardware host and the upper and lower inner walls of the heat dissipation rack. The rest of the structures and components are as described in Embodiment 1 and will not be repeated.
[0025] Embodiment 3: A cushion 331 made of polyurethane soft material is provided on the bearing platform 33 of this hardware firewall. The polyurethane soft material has a certain memory deformation function, can compensate for small-angle deviations on the surface of the bearing platform at the bottom of the hardware host during the adjustment of the suspension rod, and at the same time has a shock absorption effect, and can isolate the low-frequency vibration generated during the operation of the fan and the refrigeration sheet from being transmitted to the hardware host. The rest of the structures and components are as described in Embodiment 1 and will not be repeated.
[0026] Embodiment 4: As shown in Figure 5As shown in the figure, the hardware firewall further includes a controller 4, which includes a main control single-chip microcomputer 41, a relay module 42 and a power conversion module 43. The main control single-chip microcomputer 41 is connected to the fan group 21 and the semiconductor refrigeration sheet 22 through the relay module 42. The input end of the main control single-chip microcomputer (41) is connected to the temperature sensor 13, and the power conversion module 43 supplies power to the fan group 21 and the semiconductor refrigeration sheet 22 respectively. The signal input end of the main control single-chip microcomputer is connected to the temperature sensor inside the hardware host. The power conversion module converts, steps down and stabilizes the external power supply and then supplies power to the fan group and the semiconductor refrigeration sheet respectively. The controller drives the motors of the fan group and the semiconductor refrigeration sheet to operate by controlling the corresponding relays on the relay module. The remaining structures and components are the same as those in Embodiment 1 and will not be described repeatedly.
[0027] During operation: Place the cold surface of the semiconductor refrigeration sheet inside the heat dissipation frame housing and the hot surface outside the heat dissipation frame housing. The hardware host continuously collects the heat inside the main body through the aluminum cover and the short fins and conducts it to the long fins outside the main body shell. The controller then drives two speed-regulating fans to operate and send air to dissipate heat from the aluminum fins. When the controller receives that the temperature of the aluminum plate collected by the temperature sensor is too high, it drives the semiconductor refrigeration sheet to operate to cool the air behind the hardware host. The controller then drives to turn off one fan of the fan group to reduce the air volume and slowly press out the refrigerated air behind the hardware host, so that the cold flow covers the cooling fins on all sides of the entire host body. After the temperature drops, first turn off the operation of the semiconductor refrigeration sheet in sequence and turn on the second speed-regulating fan for enclosed pure air-cooled heat dissipation. When a new lower computer is connected, the network cable is pressed into the wiring groove through the wire inlet groove. In this way, the layout of each network cable at the wiring place is regular, and when the interface falls off, it can hold the connector to prevent the wiring from coming out of the heat dissipation frame, thus facilitating the search for the corresponding interface and performing maintenance operations.
[0028] This hardware firewall overcomes the defects that the integrated cooling fan of the existing ordinary routing design has poor heat dissipation effect on the chip packaging shell of the hard firewall and the wiring at the interface is messy. It separates the main body from the rack and uses non-contact hoisting and fixing. By adding a heat conduction structure on the main body and cooperating with the cold air heat dissipation of the rack, it realizes the cold flow cooling of all surfaces of the main body. In addition, through the wire row design, the wiring at the interface is regular, which is convenient for finding the corresponding interface and performing maintenance operations.
[0029] The above description shows the main features, basic principles, and advantages of the present utility model. For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above-described exemplary embodiments or examples, and can be implemented in other specific forms without departing from the spirit or basic features of the present utility model. Therefore, the above-described embodiments or examples should be regarded as exemplary and non-limiting. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present utility model. Any reference signs in the claims should not be construed as limiting the claims involved.
[0030] In addition, it should be understood that although this specification is described in terms of embodiments, not every embodiment only contains an independent technical solution. This narrative manner of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
Claims
1. A hardware firewall, characterized in that: It includes a hardware host (1) and a heat dissipation rack (2). The hardware host (1) is hoisted inside the heat dissipation rack (2), and there are gaps between the upper, lower, left, right, and rear sides of the hardware host (1) and the inner wall of the heat dissipation rack (2). Among them, the main body (11) of the hardware host (1) is made of a plastic shell. The upper and lower, two sides, and rear panels of the main body (11) are covered by heat dissipation aluminum shells (12). Short fins (121) extending towards the main board are provided inside the aluminum shell (12), and long fins (122) extending towards the corresponding inner wall of the heat dissipation rack (2) are provided outside the aluminum shell (12). Among them, a temperature sensor (13) is provided in the area where the chips are arranged on the circuit board inside the upper aluminum shell. The aluminum shell (12) and the long and short fins are integrally formed aluminum profiles; the heat dissipation rack (2) is a hollow shell that is open at the front side and has a wire clamping row (201) formed at the lower edge, and the rear side is arc-shaped. Fan groups (21) are installed on both sides of the front side of the heat dissipation rack (2). Slots are formed on the arc-shaped back panel (202) at the rear side of the heat dissipation rack (2), and a semiconductor refrigeration sheet (22) is embedded in the slots. The fan group (21) includes a pair of speed-regulating fans (211). The speed-regulating fans (211) blow from both sides of the heat dissipation rack (2) towards the arc-shaped back panel (202) at the rear side of the heat dissipation rack (2). A number of obliquely arranged wire inlet slots (203) are arranged on the wire clamping row (201), and a circular wire placement slot (204) is formed below the wire routing slot.
2. The hardware firewall according to claim 1, characterized in that: Four suspension rod mechanisms (3) are penetrated through the four corners of the top plate of the heat dissipation rack (2). The suspension rod mechanism (3) includes a suspension rod (31) with a threaded part (311) in the center, an adjusting nut (32), and a bearing platform (33). The bearing platform (33) is fixed at the bottom of the suspension rod (31), and the adjusting nut (32) is screwed onto the threaded part on the suspension rod (31) above the heat dissipation rack (2).
3. The hardware firewall according to claim 2, wherein: A cushion (331) made of polyurethane soft material is provided on the bearing platform (33).
4. The hardware firewall according to claim 3, characterized in that: It also includes a controller (4). The controller includes a main control single-chip microcomputer (41), a relay module (42), and a power conversion module (43). The main control single-chip microcomputer (41) is connected to the fan group (21) and the semiconductor refrigeration sheet (22) through the relay module (42). The input end of the main control single-chip microcomputer (41) is connected to the temperature sensor (13). The power conversion module (43) supplies power to the fan group (21) and the semiconductor refrigeration sheet (22) respectively.