Water-cooling heat dissipation system and radio frequency power supply

Abstract

The utility model discloses a cold heat dissipation system, which is applied to a radio frequency power supply and comprises a first water cooling plate and a second water cooling plate which are both arranged in the radio frequency power supply. The first water cooling plate is provided with a water inlet channel and a water outlet channel; the side face of the second water-cooling plate is arranged on the top face of the first water-cooling plate, and different PCBs are installed on the plate face of the second water-cooling plate in an attached mode. The second water cooling plate is provided with a transition water receiving port, a transition water outlet and a water cooling channel for communicating the transition water receiving port with the transition water outlet; the water cooling channel is arranged in the second water cooling plate; the water inlet channel is communicated with the transition water receiving opening, and the water outlet channel is communicated with the transition water outlet. By arranging the water-cooling heat dissipation system on the inner wall of the radio frequency power supply, heat dissipation can be quickly performed on the PCB, the service life of the radio frequency power supply is further prolonged, the water-cooling effect is good, and the cost is low. The utility model also discloses a radio frequency power supply using the cold heat dissipation system.

Description

Technical Field

[0001] The utility model relates to the technical field of radio frequency power supplies, and particularly relates to a water-cooled heat dissipation system and a radio frequency power supply. Background Art

[0002] A radio frequency power supply is a power supply that can generate a sinusoidal voltage with a fixed frequency, has a certain power within the radio frequency range (about 3KHz - 300GHz), and has been widely used in semiconductor process equipment; LED and solar photovoltaic industries; plasma generation in scientific experiments; radio frequency induction heating; medical beauty; atmospheric pressure plasma disinfection and cleaning, etc.

[0003] Existing radio frequency power supplies have requirements such as small volume, light weight, and high efficiency. To meet these requirements, many internal components of the radio frequency power supply are integrated on the PCB board. There are many high-heat-generating components on the PCB board, such as high-frequency components and MOS transistors. The existing radio frequency power supply has a poor heat dissipation effect on the PCB board. Therefore, how to improve the heat dissipation ability of the radio frequency power supply is a technical problem that needs to be urgently solved for the radio frequency power supply. Summary of the Utility Model

[0004] In view of this, the utility model provides a water-cooled heat dissipation system. By setting up the water-cooled heat dissipation system and using the flow of the water-cooled liquid for heat dissipation, the PCB board can be quickly cooled.

[0005] The utility model also provides a radio frequency power supply including the above-mentioned water-cooled heat dissipation system.

[0006] To achieve the above object, the utility model provides the following technical solutions:

[0007] A water-cooled heat dissipation system applied to a radio frequency power supply, comprising: a first water-cooled plate and a second water-cooled plate both arranged in the radio frequency power supply;

[0008] The first water-cooled plate is provided with a water inlet channel and a water outlet channel;

[0009] The side surface of the second water-cooled plate is arranged on the top surface of the first water-cooled plate, and different PCB boards are respectively and fittingly installed on the plate surface of the second water-cooled plate;

[0010] The second water-cooled plate is provided with a transition water inlet, a transition water outlet, and a water-cooled channel connecting the transition water inlet and the transition water outlet; and the water-cooled channel is arranged inside the second water-cooled plate;

[0011] The water inlet channel is communicated with the transition water inlet, and the water outlet channel is communicated with the transition water outlet.

[0012] In some embodiments, two openings are formed on the side surface of the second water-cooled plate, one is the transition water inlet, and the other is the transition water outlet;

[0013] Both the water inlet channel and the water outlet channel are arranged inside the first water cooling plate;

[0014] Two openings are provided on the top surface of the first water cooling plate, one being the water outlet of the water inlet channel and the other being the water connection port of the water outlet channel;

[0015] Among them, the water outlet of the water inlet channel is communicated with the transition connection port, and the water connection port of the water outlet channel is communicated with the transition water outlet.

[0016] In some embodiments, the number of the second water cooling plates is two arranged in parallel at intervals, and the two surfaces of the second water cooling plates are respectively attached and installed with different PCB boards;

[0017] A connection channel is provided inside the first water cooling plate;

[0018] The connection channel is arranged between the two second water cooling plates and connects the two second water cooling plates.

[0019] In some embodiments, the water cooling channel includes: a first horizontal channel, a second horizontal channel, and a vertical channel connecting the first horizontal channel and the second horizontal channel;

[0020] The first horizontal channel is located above the second horizontal channel, and the first horizontal channel is communicated with the transition connection port, and the second horizontal channel is communicated with the transition water outlet.

[0021] In some embodiments, the number of the vertical channels is multiple;

[0022] The multiple vertical channels are evenly arranged at intervals between the first horizontal channel and the second horizontal channel, and the head end of each vertical channel is communicated with the first horizontal channel, and the tail end of each vertical channel is communicated with the second horizontal channel.

[0023] In some embodiments, the material of the first water cooling plate and / or the second water cooling plate is aluminum alloy.

[0024] In some embodiments, a limiting surface is formed by partial depression of the surface of the second water cooling plate, and the PCB board is attached and installed on the limiting surface.

[0025] In some embodiments, it further includes; a power supply board arranged on the top surface of the first water cooling plate;

[0026] The water outlet channel arranged inside the first water cooling plate is an S-shaped channel, and the power supply board is located directly above the S-shaped channel so that the power supply board can transfer heat to the S-shaped channel.

[0027] In some embodiments, a channel water inlet and a channel water outlet are provided on the same side of the first water-cooling plate;

[0028] The water inlet channel disposed inside the first water-cooling plate communicates with the channel water inlet, and the water outlet channel communicates with the channel water outlet.

[0029] A radio frequency power supply includes the above-mentioned water-cooling heat dissipation system.

[0030] As can be seen from the above technical solutions, the water-cooling heat dissipation system provided by the present utility model can quickly dissipate heat from the PCB board by arranging the water-cooling heat dissipation system on the inner wall of the radio frequency power supply, and has good water-cooling effect and low cost.

[0031] The present utility model also provides a radio frequency power supply. Since the above-mentioned water-cooling heat dissipation system is adopted, it also has corresponding beneficial effects, which can be specifically referred to the previous description and will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0033] Figure 1 It is a schematic diagram of the overall structure of the water-cooling heat dissipation system provided by the embodiment of the present utility model;

[0034] Figure 2 It is a schematic diagram of the specific structure of the second water-cooling plate provided by the embodiment of the present utility model;

[0035] Figure 3 It is a schematic diagram of the principle of the water-cooling heat dissipation system provided by the embodiment of the present utility model.

[0036] Among them, 1 is the first water-cooling plate, 11 is the water inlet channel, 12 is the water outlet channel, 13 is the connection channel; 14 is the channel water inlet, 15 is the channel water outlet;

[0037] 2 is the second water-cooling plate, 21 is the transition water inlet, 22 is the transition water outlet, 23 is the water-cooling channel, 231 is the first horizontal channel, 232 is the second horizontal channel, 233 is the vertical channel, 24 is the limiting surface;

[0038] 3 is the PCB board;

[0039] 4 is the power supply board. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0041] The water-cooled heat dissipation system provided by the embodiment of the present utility model is applied to a radio frequency power supply, such as Figures 1 - 3 shown, and includes: a first water-cooled plate 1 and a second water-cooled plate 2 both arranged inside the radio frequency power supply;

[0042] The first water-cooled plate 1 is provided with a water inlet channel 11 and a water outlet channel 12;

[0043] The side surface of the second water-cooled plate 2 is arranged on the top surface of the first water-cooled plate 1, and different PCB boards 3 are respectively and fittingly installed on the plate surface of the second water-cooled plate 2;

[0044] The second water-cooled plate 2 is provided with a transition water inlet 21, a transition water outlet 22, and a water-cooling channel 23 connecting the transition water inlet 21 and the transition water outlet 22; and the water-cooling channel 23 is arranged inside the second water-cooled plate 2;

[0045] The water inlet channel 11 is communicated with the transition water inlet 21, and the water outlet channel 12 is communicated with the transition water outlet 22.

[0046] In the above technical solution, as Figure 2 and Figure 3 shown (the arrow direction in the figure is the flow direction of the water-cooling liquid), after the water-cooling liquid flows into from the water inlet channel 11, it sequentially flows through the transition water inlet 21, the water-cooling channel 23, and the transition water outlet 22, and flows out from the water outlet channel 12; during the above water-cooling liquid flow process, the water-cooling channel 23 absorbs the heat on the PCB board 3, playing a role in heat dissipation, and the heat absorbed by the water-cooling channel 23 is dissipated along with the flow of the water-cooling liquid.

[0047] Compared with the prior art, by arranging the water-cooled heat dissipation system on the inner wall of the radio frequency power supply, the PCB board can be quickly cooled (the heat of the PCB board is absorbed by the water-cooling channel 23 to achieve the heat dissipation effect), thereby improving the service life of the radio frequency power supply, and having good water-cooling effect and low cost.

[0048] Optimizing the above technical solution, as Figure 2 shown, two openings are provided on the side surface of the second water-cooled plate 2, one is the transition water inlet 21, and the other is the transition water outlet 22; the side surface of the second water-cooled plate 2 is vertically arranged on the top surface of the first water-cooled plate 1;

[0049] Both the water inlet channel 11 and the water outlet channel 12 are arranged inside the first water cooling plate 1;

[0050] Two openings are provided on the top surface of the first water cooling plate 1, one being the water outlet of the water inlet channel 11 and the other being the water connection port of the water outlet channel 12;

[0051] Among them, the water outlet of the water inlet channel 11 is communicated with the transition connection port 21, and the water connection port of the water outlet channel 12 is communicated with the transition water outlet 22.

[0052] In the above technical solution, by arranging the water inlet channel 11 and the water outlet channel 12 inside the first water cooling plate 1, space can be saved and the heat dissipation effect can be improved; the water outlet of the water inlet channel 11 is communicated with the transition connection port 21, and the water connection port of the water outlet channel 12 is communicated with the transition water outlet 22; with such an arrangement, the structure is compact, the connection is simple, the leakage points of the coolant in the waterway system are reduced, and the failure rate of the equipment is lowered; preferably, the coolant is cooling water.

[0053] Optimizing the above technical solution, as Figure 2 and Figure 3 shown, the number of the second water cooling plates 2 is two arranged in parallel at intervals, and different PCB boards 3 are respectively attached and installed on the surfaces of the two second water cooling plates 2;

[0054] A connection channel 13 is provided inside the first water cooling plate 1;

[0055] The connection channel 13 is arranged between the two second water cooling plates 2 and connects the two second water cooling plates 2.

[0056] In the above solution, the setting of the connection channel 13 makes the connection structure compact, reduces the leakage points of the cooling water in the waterway system, and lowers the failure rate of this water cooling and heat dissipation system; it should be noted that different PCB boards 3 are respectively attached and installed on the surfaces of the two second water cooling plates 2, making full use of the usage area of the second water cooling plate 2, achieving the purpose of making this radio frequency power supply small in volume, light in weight, and high in efficiency, and improving the service life of the product.

[0057] In this technical solution, as Figure 2 shown, the water cooling channel 23 includes: a first horizontal channel 231, a second horizontal channel 232, and a vertical channel 233 that connects the first horizontal channel 231 and the second horizontal channel 232;

[0058] The first horizontal channel 231 is located above the second horizontal channel 232, and the first horizontal channel 231 is communicated with the transition connection port 21, and the second horizontal channel 232 is communicated with the transition water outlet 22.

[0059] In the above technical solution, through the arrangement of the first horizontal channel 231, the second horizontal channel 232, and the vertical channel 233, the water-cooling heat dissipation area is increased, and the water-cooling heat dissipation efficiency is improved.

[0060] Optimize the above technical solution, such as Figure 2 As shown, the number of vertical channels 233 is multiple;

[0061] Multiple vertical channels 233 are arranged at equal intervals between the first horizontal channel 231 and the second horizontal channel 232, and the head end of each vertical channel 233 communicates with the first horizontal channel 231, and the tail end of each vertical channel 233 communicates with the second horizontal channel 232.

[0062] In the above technical solution, multiple vertical channels 233 increase the water-cooling heat dissipation area, improve the water-cooling heat dissipation efficiency, and can make the coolant flow more smoothly, further improving the water-cooling heat dissipation efficiency; it should be noted that multiple vertical channels 233 and the first horizontal channel 231 and the second horizontal channel 232 form multiple paths, further improving the water-cooling heat dissipation efficiency.

[0063] In this technical solution, the material of the first water-cooling plate 1 and / or the second water-cooling plate 2 is aluminum alloy. Aluminum alloy has a high thermal conductivity, which improves the water-cooling heat dissipation efficiency; preferably, the materials of the water-cooling plates are all aluminum alloy 6063 (with high thermal conductivity and low cost).

[0064] In this technical solution, a part of the surface of the second water-cooling plate 2 is recessed to form a limiting surface 24, and the PCB board 3 is fitted and installed on the limiting surface 24. Through the arrangement of the limiting surface 24, the PCB board 3 can be quickly installed on the surface of the second water-cooling plate 2. Preferably, the thickness of the recessed part of the surface of the second water-cooling plate 2 is equal to the thickness of the PCB board 3.

[0065] In this technical solution, it further includes; a power supply board 4 arranged on the top surface of the first water-cooling plate 1; the bottom surface of the power supply board 4 is arranged on the top surface of the first water-cooling plate 1, and a radio frequency power working component is arranged on the top surface of the power supply board 4;

[0066] The water outlet channel 12 arranged inside the first water-cooling plate 1 is an S-shaped channel, and the power supply board 4 is located directly above the S-shaped channel, so that the power supply board 4 can transfer heat to the S-shaped channel; the arrangement of the S-shaped channel increases the water-cooling heat dissipation area and improves the water-cooling heat dissipation efficiency;

[0067] In the above technical solution, when the radio frequency power is working, the radio frequency power working component generates heat, and the heat generated by the working component is absorbed by the water outlet channel 12 through the power supply board 4. During the flow of the water-cooling liquid, the heat is carried away. Therefore, through the arrangement of the power supply board 4 and the S-shaped channel, the working components on the power supply board 4 can be cooled.

[0068] Optimize the above technical solution, such as Figure 1 and Figure 3 As shown, a channel water inlet 14 and a channel water outlet 15 are provided on the same side of the first water cooling plate 1;

[0069] The water inlet channel 11 provided inside the first water cooling plate 1 communicates with the channel water inlet 14, and the water outlet channel 12 communicates with the channel water outlet 15.

[0070] In the above technical solution, by arranging the above channel water inlet 14 and channel water outlet 15 in this way, the structure is compact and the water inlet and cooling are convenient and fast; preferably, one of the channel water inlet 14 and the channel water outlet 15 is connected to a water pump to accelerate the flow rate of the coolant and improve the heat dissipation effect.

[0071] A radio frequency power supply, the above water cooling system. Since this solution adopts the above water cooling system, it accordingly has corresponding beneficial effects. For details, please refer to the previous description and will not be elaborated here.

[0072] In this specification, the various embodiments are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. For the same or similar parts among the various embodiments, reference can be made to each other.

[0073] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A water-cooled heat dissipation system, applied to a radio frequency power supply, is characterized in that, Including: A first water-cooling plate (1) and a second water-cooling plate (2) both disposed within the radio frequency power supply; The first water-cooling plate (1) is provided with a water inlet channel (11) and a water outlet channel (12); The side surface of the second water-cooling plate (2) is disposed on the top surface of the first water-cooling plate (1), and different PCB boards (3) are respectively and fittingly mounted on the plate surface of the second water-cooling plate (2); The second water-cooling plate (2) is provided with a transition water inlet (21), a transition water outlet (22), and a water-cooling channel (23) that connects the transition water inlet (21) and the transition water outlet (22); and the water-cooling channel (23) is disposed inside the second water-cooling plate (2); The water inlet channel (11) communicates with the transition water inlet (21), and the water outlet channel (12) communicates with the transition water outlet (22).

2. The water-cooled heat dissipation system according to claim 1, wherein Two openings are formed on the side surface of the second water-cooling plate (2), one is the transition water inlet (21), and the other is the transition water outlet (22); Both the water inlet channel (11) and the water outlet channel (12) are disposed inside the first water-cooling plate (1); Two openings are formed on the top surface of the first water-cooling plate (1), one is the water outlet of the water inlet channel (11), and the other is the water inlet of the water outlet channel (12); Wherein, the water outlet of the water inlet channel (11) communicates with the transition water inlet (21), and the water inlet of the water outlet channel (12) communicates with the transition water outlet (22).

3. The water-cooled heat dissipation system according to claim 1, characterized in that, The number of the second water-cooling plates (2) is two arranged in parallel at intervals, and different PCB boards (3) are respectively and fittingly mounted on the plate surfaces of the two second water-cooling plates (2); A connection channel (13) is provided inside the first water-cooling plate (1); The connection channel (13) is disposed between the two second water-cooling plates (2) and connects the two second water-cooling plates (2).

4. The water-cooled heat dissipation system according to claim 1, wherein The water-cooling channel (23) includes: a first horizontal channel (231), a second horizontal channel (232), and a vertical channel (233) that connects the first horizontal channel (231) and the second horizontal channel (232); The first horizontal channel (231) is located above the second horizontal channel (232), and the first horizontal channel (231) communicates with the transition water inlet (21), and the second horizontal channel (232) communicates with the transition water outlet (22).

5. The water-cooled heat dissipation system according to claim 4, wherein The number of the vertical channels (233) is multiple; The multiple vertical channels (233) are uniformly arranged at intervals between the first horizontal channel (231) and the second horizontal channel (232), and the head end of each vertical channel (233) communicates with the first horizontal channel (231), and the tail end of each vertical channel (233) communicates with the second horizontal channel (232).

6. The water-cooled heat dissipation system according to claim 1, wherein The material of the first water-cooling plate (1) and / or the second water-cooling plate (2) is aluminum alloy.

7. The water-cooled heat dissipation system according to claim 1, characterized in that, A limiting surface (24) is formed by partial depression of the plate surface of the second water-cooling plate (2), and the PCB board (3) is fittingly mounted on the limiting surface (24).

8. The water-cooling heat dissipation system according to any one of claims 1-7, characterized in that, Further included is a power board (4) disposed on the top surface of the first water-cooling plate (1); The water outlet channel (12) disposed inside the first water-cooling plate (1) is an S-shaped channel, and the power board (4) is located directly above the S-shaped channel so that the power board (4) can transfer heat to the S-shaped channel.

9. The water-cooled heat dissipation system according to claim 8, characterized in that, A channel water inlet (14) and a channel water outlet (15) are formed on the same side surface of the first water-cooling plate (1); The water inlet channel (11) disposed inside the first water-cooling plate (1) communicates with the channel water inlet (14), and the water outlet channel (12) communicates with the channel water outlet (15).

10. A radio frequency power supply, characterized in that, Comprising: The water-cooling and heat-dissipating system according to any one of claims 1-9.

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