Colloid sheet manufacturing device

Abstract

The utility model relates to a colloid sheet manufacturing device which comprises a thermocuring platform, a glue applying mechanism and a light curing mechanism, the thermocuring platform is provided with a flat material carrying table top, the glue applying mechanism and the light curing mechanism can move to the position above the material carrying table top or leave from the position above the material carrying table top, the glue applying mechanism is used for printing an adhesive to the material carrying table top, and the light curing mechanism is used for printing the adhesive to the material carrying table top. The glue applying mechanism can do lifting motion relative to the thermocuring platform so as to be separated from the adhesive on the material carrying table top. According to the colloidal sheet manufacturing device, the requirement for manufacturing a thermosetting adhesive into the colloidal sheet can be met, the requirement for manufacturing a light-cured adhesive into the colloidal sheet can also be met, and then the colloidal sheet manufacturing device is wide in application range, can quickly adapt to the requirement for curing different types of adhesives, and is high in practicability. And the manufacturing efficiency of the colloid sheet is improved.

Description

Technical Field

[0001] The present application relates to the technical field of photovoltaics, and particularly to an apparatus for manufacturing a colloidal sheet. Background Art

[0002] As a key material newly added to the main-grid-free module, the adhesive plays a bonding role in module manufacturing. The sheet formed by the adhesive has requirements for transparency, and its light transmittance is similar to that of the encapsulation film. Since the adhesive is a non-Newtonian fluid and its light transmittance cannot be directly measured, it is necessary to first print it into a colloidal body of a certain size, then cure it into a colloidal sheet of a certain thickness, and then test the light transmittance of the sheet. The curing types of the adhesive are divided into two types: thermosetting process and photocuring process.

[0003] In the related art, for the production of the colloidal sheet with light transmittance of the adhesive, generally, the backplane is used as the printing mold. The operator manually cuts a rectangular opening on the backplane, squeezes the adhesive into this rectangular opening, and scrapes it in one direction with a tooling to make the adhesive evenly distributed in the rectangular opening, and then cures the adhesive into the colloidal sheet required for light transmittance testing by heating in an oven or irradiating with an ultraviolet lamp. However, this production method is inefficient. Summary of the Invention

[0004] Based on this, the present application provides an apparatus for manufacturing a colloidal sheet to solve the technical problem of how to improve the production efficiency of the colloidal sheet.

[0005] The present application provides an apparatus for manufacturing a colloidal sheet, including a thermal curing platform, a glue application mechanism, and a photocuring mechanism. The thermal curing platform has a flat material-carrying tabletop. The glue application mechanism and the photocuring mechanism can both move above the material-carrying tabletop or leave above the material-carrying tabletop. The glue application mechanism is used to print the adhesive onto the material-carrying tabletop, and the glue application mechanism can move up and down relative to the thermal curing platform to separate from the adhesive on the material-carrying tabletop.

[0006] In one embodiment, the thermal curing platform includes a heating device and a high-temperature resistant non-stick film. The heating device is arranged below the material-carrying tabletop, and the heating device can raise the temperature of the material-carrying tabletop to heat the adhesive. The non-stick film is covered on the material-carrying tabletop.

[0007] In one embodiment, the material of the non-stick film is silicone oil or polytetrafluoroethylene.

[0008] In one embodiment, the heating device is connected with a control switch, and the control switch is used to control the heating device to be turned on or off.

[0009] In one embodiment, the sizing mechanism includes a positioning frame, a screen plate, and a squeegee. The screen plate is installed in the positioning frame and has an opening for filling the adhesive. The positioning frame is rotatably located above the material loading table, and the positioning frame can move up and down relative to the thermal curing platform so that the screen plate is placed on the material loading table or leaves the material loading table. The squeegee can move relative to the positioning frame, and the squeegee can scrape the adhesive from the opening onto the material loading table.

[0010] In one embodiment, the screen plate is detachably connected to the positioning frame.

[0011] In one embodiment, the light curing mechanism includes a rotating bracket and ultraviolet LED lamps. The ultraviolet LED lamps are suspended above the thermal curing platform through the rotating bracket, and the rotating bracket can rotate from above the thermal curing platform to the outside of the thermal curing platform.

[0012] In one embodiment, the light curing mechanism includes a protective cover. The protective cover is connected to the rotating bracket, the ultraviolet LED lamps are installed in the space enclosed by the protective cover and the rotating bracket, and the protective cover is provided with a light passing part for the light emitted by the ultraviolet LED lamps to be emitted to the thermal curing platform.

[0013] In one embodiment, the power of the ultraviolet LED lamps is 500W - 2000W.

[0014] In one embodiment, the height from the ultraviolet LED lamps to the material loading table is 10mm - 30mm.

[0015] The above-mentioned colloidal sheet manufacturing device includes a thermal curing platform, a sizing mechanism, and a light curing mechanism. The sizing mechanism and the light curing mechanism can both move above the material loading table or leave above the material loading table, so that the sizing mechanism will not be interfered by the light curing mechanism when printing the adhesive on the material loading table, and the light curing mechanism will not be interfered by the sizing mechanism when curing the adhesive on the material loading table. Moreover, the thermal curing platform and the light curing mechanism can respectively meet the requirements of thermally curing and light curing the adhesive printed on the material loading table by the sizing mechanism. Therefore, the colloidal sheet manufacturing device of the present application can not only meet the need of making thermosetting adhesives into colloidal sheets, but also meet the need of making photocuring adhesives into colloidal sheets. Subsequently, the applicable surface of the colloidal sheet manufacturing device is wide, and it can quickly adapt to the need of curing different types of adhesives, improving the manufacturing efficiency of colloidal sheets. Description of the Drawings

[0016] To more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following will briefly introduce the drawings required for use in the description of the embodiments or related technologies. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0017] Figure 1 It is a schematic structural diagram of a colloidal sheet manufacturing device according to an embodiment of the present application.

[0018] Figure 2 It is a schematic structural diagram when the light curing mechanism rotates above the thermal curing platform in a colloidal sheet manufacturing device according to an embodiment of the present application.

[0019] Explanation of reference numerals:

[0020] 100, colloidal sheet manufacturing device; 10, thermal curing platform; 11, loading table surface; 12, heating device; 13, non-stick film; 20, sizing mechanism; 21, positioning frame; 22, screen plate; 221, opening; 23, scraper; 30, light curing mechanism; 31, rotating bracket; 32, UV LED lamp. Specific embodiments

[0021] To make the above objects, features, and advantages of the present application more obvious and understandable, the following will make a detailed description of the specific embodiments of the present application in conjunction with the drawings. Many specific details are set forth in the following description in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein. Those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0022] In the description of the present application, it should be understood that if these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present application.

[0023] In addition, if the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0024] In this application, unless otherwise clearly specified and defined, if terms such as "installed", "connected", "joined", "fixed", etc. appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0025] In this application, unless otherwise clearly specified and defined, if there is a description such as a first feature being "on" or "under" a second feature, its meaning can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature can be that the first feature is above or obliquely above the second feature, or simply means that the first feature is at a higher level than the second feature in terms of horizontal height. The first feature being "under", "beneath" and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is at a lower level than the second feature in terms of horizontal height.

[0026] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If so, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in this application are only for illustrative purposes and do not represent the only implementation.

[0027] Combined with Figure 1 and Figure 2As shown in the figure, a colloidal sheet manufacturing device 100 provided by an embodiment of the present application can be used to manufacture an adhesive light transmittance sheet, so as to obtain the light transmittance of the adhesive by using the manufactured adhesive light transmittance sheet for light transmittance testing. Of course, the colloidal sheet manufacturing device 100 can also be used for the manufacture of other types of sheets, and the types of sheets suitable for the colloidal sheet manufacturing device 100 are not limited herein.

[0028] Continuing to refer to Figure 1 and Figure 2 As shown in the figure, the colloidal sheet manufacturing device 100 includes a thermal curing platform 10, a glue application mechanism 20, and a light curing mechanism 30. Among them, the thermal curing platform 10 has a flat loading table surface 11, and the loading table surface 11 is used to carry the adhesive to be processed. The glue application mechanism 20 is used to print the adhesive onto the loading table surface 11. For example, the glue application mechanism 20 releases the adhesive onto the thermal curing platform 10 and levels the adhesive on the thermal curing platform 10.

[0029] Both the glue application mechanism 20 and the light curing mechanism 30 can move above the loading table surface 11 or away from above the loading table surface 11, so that the operations of the glue application mechanism 20 and the light curing mechanism 30 on the thermal curing platform 10 do not interfere with each other. Referring to Figure 1 As shown in the figure, when the glue application mechanism 20 is located above the loading table surface 1, the glue application mechanism 20 can print the adhesive onto the loading table surface 11. At this time, the light curing mechanism 30 can be moved to the outside of the thermal curing platform 10 to leave a space above the loading table surface 11. In this way, the light curing mechanism 30 will not interfere with the glue application operation of the glue application mechanism 20. Correspondingly, referring to Figure 2 As shown in the figure, after the printing is completed, the glue application mechanism 20 can leave above the loading table surface 11, so that the light curing mechanism 30 can move above the loading table surface 11. Thus, when the light curing mechanism 30 irradiates the adhesive on the loading table surface 11, it will not be interfered by the glue application mechanism 20.

[0030] It should be noted that the glue application mechanism 20 can move up and down relative to the thermal curing platform 10 to adjust to the height of the loading table surface 11. For the sake of easy understanding, the height at which the glue application mechanism 20 prints the adhesive onto the loading table surface 11 is called the "glue application height". Then, when it is necessary to use the glue application mechanism 20 to print the adhesive onto the loading table surface 11, the glue application mechanism 20 descends to the glue application height. When the glue application mechanism 20 completes the printing operation, the glue application mechanism 20 moves upward relative to the thermal curing platform 10 to leave the glue application height, so that the glue application mechanism 20 is separated from the adhesive on the loading table surface 11 to avoid the adhesive sticking to the glue application mechanism 20 after curing to form a colloidal sheet.

[0031] The thermal curing platform 10 can cure the thermosetting adhesive by heating the thermosetting adhesive. The light curing mechanism 30 can cure the photo-curing adhesive by irradiating the photo-curing adhesive. Of course, for adhesives that can be cured by both thermal curing and light curing methods, the thermal curing platform 10 and the light curing mechanism 30 in the colloidal sheet manufacturing device 100 of the present application can act together to improve the adhesive curing efficiency. It can be understood that in the colloidal sheet manufacturing device 100 of the present application, since the thermal curing platform 10 and the light curing mechanism 30 can respectively meet the thermal curing and light curing requirements of the corresponding types of adhesives, the colloidal sheet manufacturing device 100 can not only meet the need to manufacture thermosetting adhesives into colloidal sheets, but also meet the need to manufacture photo-curing adhesives into colloidal sheets. Subsequently, the colloidal sheet manufacturing device 100 has a wide range of applications and can quickly adapt to the need to cure different types of adhesives, improving the manufacturing efficiency of colloidal sheets.

[0032] Using the colloidal sheet manufacturing device 100 of the present application to replace manual production of colloidal sheets by operators can also avoid the problems of air bubbles being easily introduced due to unstable operation methods and uneven scraping of the adhesive film by operators during manual scraping. Therefore, compared with traditional manual production of colloidal sheets, the quality of the colloidal sheets produced by the colloidal sheet manufacturing device 100 of the present application is more guaranteed.

[0033] The material of the loading table 11 can be stainless steel, so that the structure of the loading table 11 has good wear resistance and is not easy to rust.

[0034] In some embodiments, the thermal curing platform 10 includes a heating device 12 and a high-temperature resistant non-stick film 13. The heating device 12 is disposed below the loading table 11. The heating device 12 is used to heat the loading table 11 so that the temperature of the loading table 11 rises to heat the adhesive. For example, when using the thermal curing platform 10 to manufacture a colloidal sheet with a light transmittance of the adhesive, the heating device 12 controls the temperature of the loading table 11 at 100°C - 200°C, that is, the heating temperature of the loading table 11 for thermally curing the adhesive is 100°C - 200°C. The heating temperature of the loading table 11 can specifically be 100°C, 110°C, 120°C, 130°C, 140°C, 150°C, 160°C, 170°C, 180°C, 190°C or 200°C, which is not limited herein.

[0035] The high-temperature resistant non-stick film 13 is covered on the material loading table surface 11. Since the non-stick film 13 is high-temperature resistant, it can withstand the heat when the material loading table surface 11 heats the adhesive without being damaged. The setting of the non-stick film 13 enables the adhesive cured on the material loading table surface 11 to be conveniently separated from the material loading table surface 11. The material of the non-stick film 13 can be non-stick materials such as silicone oil or polytetrafluoroethylene, which is not limited herein.

[0036] It should be noted that the heating device 12 is connected with a control switch, and the heating device 12 can be turned on or off at any time by using the control switch, so that the heating function of the heat curing platform 10 is controllable. For example, when it is necessary to heat and cure the adhesive by using the heat curing platform 10, the heating device 12 is turned on through the control switch, so that the temperature of the material loading table surface 11 rises to heat the adhesive carried thereon. After the adhesive is cured, the heating device 12 can be turned off through the control switch. It should be noted that during the process of the glue applying mechanism 20 printing the adhesive onto the material loading table surface 11, the heating device 12 is in the off state to avoid the adhesive curing before being leveled. After the glue applying mechanism 20 finishes leveling the adhesive on the heat curing platform 10, the heating device 12 is turned on so that the temperature of the material loading table surface 11 rises to heat the adhesive.

[0037] In some embodiments, the control switch is a PLC (Programmable Logic Controller) switch to achieve automatic temperature control. For example, in some embodiments, during the process of the glue applying mechanism 20 printing the adhesive onto the material loading table surface 11, the control switch automatically controls the heating device 12 to be in the off state. When the glue applying mechanism 20 finishes leveling the adhesive on the heat curing platform 10, the control switch automatically controls the heating device 12 to be turned on, so that the heating device 12 heats up to the set temperature to heat and cure the adhesive. It should be noted that when the adhesive cures to form a colloidal sheet, the control switch can turn off the heating device 12.

[0038] Continue to refer to Figure 1 As shown, the glue applying mechanism 20 includes a positioning frame 21, a screen plate 22 and a squeegee 23. The screen plate 22 is installed on the positioning frame 21 and has an opening 221 for filling the adhesive. The squeegee 23 can move relative to the positioning frame 21, so as to scrape the adhesive from the opening 221 on the screen plate 22 onto the material loading table surface 11 and level the adhesive, so that the adhesive is evenly located in the opening 221. It can be understood that the opening 221 has a shaping effect on the adhesive therein, so that the shape of the colloidal sheet formed by curing the adhesive is consistent with the shape of the opening 221.

[0039] The positioning frame 21 is rotatably located above the material loading table surface 11. The positioning frame 21 can move up and down relative to the thermal curing platform 10, so that the stencil 22 is placed on the material loading table surface 11 or leaves the material loading table surface 11. In this embodiment, when printing the adhesive is required, the positioning frame 21 places the stencil 22 on the material loading table surface 11. After the printing is completed, the positioning frame 21 drives the stencil 22 to leave the material loading table surface 11, and then the stencil 22 is separated from the adhesive printed on the material loading table surface 11.

[0040] It should be noted that the material of the stencil 22 includes but is not limited to stainless steel or aluminum alloy.

[0041] In some embodiments, the shapes of both the stencil 22 and the opening 221 are rectangular. For example, the size of the stencil 22 is 200mm * 200mm, and the size of the opening 221 is 50mm * 25mm, so that the adhesive scraped from the opening 221 onto the material loading table surface 11 has a suitable size, and this size is also the size of the colloidal sheet formed by the curing of the adhesive. For example, when the size of the opening 221 is 50mm * 25mm, the size of the colloidal sheet formed by the adhesive scraped onto the material loading table surface 11 through the opening 221 is 50mm * 25mm. Regarding the size of the opening 221, it can be set according to the required size of the colloidal sheet, and no limitation is made here. The stencil 22 is detachably connected to the positioning frame 21. When colloidal sheets of different sizes need to be produced, only the stencil 22 with different sizes of the opening 221 needs to be replaced, so that the colloidal sheet manufacturing device 100 of the present application can specifically produce colloidal sheets of the required size.

[0042] The thickness of the stencil 22 is 0.05mm - 0.2mm. It has been verified that when using a stencil 22 with a thickness of 0.05mm - 0.2mm to print the adhesive, after the squeegee 23 scrapes the adhesive onto the opening 221 of the stencil 22, the adhesive fills the opening 221 and the printing thickness on the thermal curing platform 10 can be controlled within 0.2mm - 0.3mm. In some embodiments, the thickness of the stencil 22 can specifically be 0.05mm, 0.1mm, 0.15mm, or 0.2mm. Regarding the thickness of the stencil 22, no limitation is made here.

[0043] The light curing mechanism 30 includes a rotating bracket 31 and an ultraviolet LED lamp 32. The ultraviolet LED lamp 32 is suspended above the thermal curing platform 10 through the rotating bracket 31, and the rotating bracket 31 can rotate from above the thermal curing platform 10 to the outside of the thermal curing platform 10. Here, it should be noted that the rotating bracket 31 rotating to the outside of the thermal curing platform 10 means that there is no overlap between the rotating bracket 31 and the thermal curing platform 10 in the vertical direction. In other words, the rotating bracket 31 leaves the space above the loading table surface 11 of the thermal curing platform 10. In this embodiment, when the gluing mechanism 20 prints the adhesive on the loading table surface 11, the rotating bracket 31 can rotate relative to the thermal curing platform 10 to the outside of the thermal curing platform 10, so as to leave the movement space required for the gluing mechanism 20 to print the adhesive on the loading table surface 11, avoiding interference between the gluing mechanism 20 and the light curing mechanism 30.

[0044] The height of the ultraviolet LED lamp 32 is below the gluing mechanism 20. The height from the ultraviolet LED lamp 32 to the loading table surface 11 is 10 mm - 30 mm. The height from the ultraviolet LED lamp 32 to the loading table surface 11 can specifically be 10 mm, 15 mm, 20 mm, 25 mm or 30 mm. The height from the ultraviolet LED lamp 32 to the loading table surface 11 can also be understood as the distance from the ultraviolet LED lamp 32 to the loading table surface 11 along the vertical direction. It should be noted that the closer the ultraviolet LED lamp 32 is to the loading table surface 11, the smaller the irradiation surface, and the more likely it is that some areas of the adhesive cannot be irradiated, resulting in poor curing effect of the adhesive in this area. In this embodiment, since the height from the ultraviolet LED lamp 32 to the loading table surface 11 is 10 mm - 30 mm, the ultraviolet LED lamp 32 can cure the adhesive at a suitable position from the loading table surface 11 when curing the adhesive, so that the ultraviolet LED lamp 32 has a sufficiently large irradiation surface to ensure the light curing effect; at the same time, within this height range, the ultraviolet LED lamp 32 is not too far from the loading table surface 11, resulting in too large light energy loss, and then the energy of the ultraviolet light emitted by the ultraviolet LED lamp 32 can be fully utilized to cure the adhesive to improve the curing efficiency.

[0045] The power of the ultraviolet LED lamp 32 can be 500 W - 2000 W, and the wavelength of the ultraviolet light it emits can be 365 nm - 380 nm. The power of the ultraviolet LED lamp 32 can specifically be 500 W, 1000 W, 1500 W or 2000 W.

[0046] In some embodiments, when the ultraviolet LED lamp 32 is used to cure the adhesive, the curing time can be 2 S - 10 S. The curing time can be set according to actual needs. For example, the curing time can be set to 2 S, 5 S, 7 S, 8 S or 10 S.

[0047] In some embodiments, the light curing mechanism 30 includes a protective cover, which is connected to the rotating bracket 31. The UV LED lamp 32 is installed in the space enclosed by the protective cover and the rotating bracket 31. The protective cover is provided with a light passing portion for the light emitted by the UV LED lamp 32 to exit to the thermal curing platform 10. In this embodiment, the protective cover shields the periphery of the UV LED lamp 32, so that the light emitted by the UV LED lamp 32 can only exit to the thermal curing platform 10 through the light passing portion, so as to reduce the light from entering the working environment of the colloid sheet manufacturing device 100 and hurting the eyes of the staff.

[0048] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0049] The above embodiments only represent several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation to the patent scope of the present application. It should be noted that for those of ordinary skill in the art, without departing from the inventive concept of the present application, several deformations and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A colloidal sheet manufacturing apparatus (100), characterized in that, It includes a thermal curing platform (10), a sizing mechanism (20) and a light curing mechanism (30). The thermal curing platform (10) has a flat material loading tabletop (11). The sizing mechanism (20) and the light curing mechanism (30) can both move above the material loading tabletop (11) or leave from above the material loading tabletop (11). The sizing mechanism (20) is used to print an adhesive onto the material loading tabletop (11), and the sizing mechanism (20) can move up and down relative to the thermal curing platform (10) to separate from the adhesive on the material loading tabletop (11).

2. The colloidal sheet manufacturing apparatus (100) according to claim 1, characterized in that, The thermal curing platform (10) includes a heating device (12) and a high-temperature resistant non-stick film (13). The heating device (12) is arranged below the material loading tabletop (11). The heating device (12) can raise the temperature of the material loading tabletop (11) to heat the adhesive. The non-stick film (13) is covered on the material loading tabletop (11).

3. The colloidal sheet manufacturing apparatus (100) according to claim 2, wherein, The material of the non-stick film (13) is silicone oil or polytetrafluoroethylene.

4. The colloidal sheet manufacturing apparatus (100) according to claim 2 or 3, characterized in that The heating device (12) is connected with a control switch, and the control switch is used to control the heating device (12) to turn on or off.

5. The colloidal sheet manufacturing apparatus (100) according to claim 1, wherein, The sizing mechanism (20) includes a positioning frame (21), a screen plate (22) and a squeegee (23). The screen plate (22) is installed in the positioning frame (21) and has an opening (221) for filling the adhesive. The positioning frame (21) is rotatably located above the material loading tabletop (11). The positioning frame (21) can move up and down relative to the thermal curing platform (10) so that the screen plate (22) is placed on the material loading tabletop (11) or leaves from the material loading tabletop (11). The squeegee (23) can move relative to the positioning frame (21), and the squeegee (23) can scrape the adhesive from the opening (221) onto the material loading tabletop (11).

6. The colloidal sheet manufacturing apparatus (100) according to claim 5, characterized in that, The screen plate (22) is detachably connected to the positioning frame (21).

7. The colloidal sheet manufacturing apparatus (100) according to claim 1, characterized in that, The light curing mechanism (30) includes a rotating bracket (31) and an ultraviolet LED lamp (32). The ultraviolet LED lamp (32) is suspended above the thermal curing platform (10) through the rotating bracket (31), and the rotating bracket (31) can rotate from above the thermal curing platform (10) to the outside of the thermal curing platform (10).

8. The colloidal sheet manufacturing apparatus (100) according to claim 7, characterized in that, The light curing mechanism (30) includes a protective cover. The protective cover is connected to the rotating bracket (31). The ultraviolet LED lamp (32) is installed in the space enclosed by the protective cover and the rotating bracket (31). The protective cover is provided with a light passing part for the light emitted by the ultraviolet LED lamp (32) to be emitted to the thermal curing platform (10).

9. The colloidal sheet manufacturing apparatus (100) according to claim 7 or 8, characterized in that, The power of the ultraviolet LED lamp (32) is 500W - 2000W.

10. The colloidal sheet manufacturing apparatus (100) according to claim 9, characterized in that, The height of the ultraviolet LED lamp (32) from the material loading tabletop (11) is 10mm - 30mm.

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