Welding wire damping device for chip lead bonding
The damping seat with zirconia cylinders and through-holes in the damping device addresses wire contamination and oscillation issues, enhancing stability and reliability in chip wire bonding.
Patent Information
- Application Number
- CN202422166531.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-04
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-09-04
AI Technical Summary
The conventional wire sliding resistance device is easily contaminated by water vapor when applying compressed air to float, and the wire swings violently, resulting in poor device stability.
The zirconia cylinder and through-hole are provided on the surface of the damping seat, and the damping force between the zirconia cylinder and the welding wire is changed by moving the damping seat left and right. Combining the fixed groove hole and guide groove, it provides stable sliding resistance.
Effectively avoid the welding wire being contaminated by compressed air water vapor, reduce the swing of the welding wire, and improve the stability and reliability of the device.
Smart Images
Figure CN223098340U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of damping devices, in particular to a wire damping device for chip wire bonding. Background Technique
[0002] Wire bonding is a process that uses thin metal wires and utilizes heat, pressure, and ultrasonic energy to tightly bond the metal leads to the substrate pads, achieving electrical interconnection between the chip and the substrate and information communication between chips. The role of wire bonding is to introduce and export electrical connections from the core components. Generally, three wire bonding positioning platform technologies are adopted in the industry: thermocompression wire bonding, wedge ultrasonic wire bonding, and thermosonic wire bonding. Damping helps reduce the resonance amplitude of mechanical structures, thereby avoiding structural damage caused by vibration stress reaching the limit. Moreover, damping helps reduce the ability of the structure to transmit vibration. The wire damping device for wire bonding adjusts the damping force by applying compressed air along the wire to make the wire float and controlling the fluid flow rate of the compressed air.
[0003] When using the existing wire damping device for chip wire bonding, the traditional wire sliding resistance device applies compressed air along the wire to make the wire float and controls the fluid flow rate of the compressed air to adjust the damping force. However, the wire is easily contaminated by the water vapor of the compressed air, and at the same time, the wire swings violently during floating. Content of the Utility Model
[0004] The purpose of the utility model is to provide a wire damping device for chip wire bonding to solve the problems in the above background technique that the traditional wire sliding resistance device applies compressed air along the wire to make the wire float and controls the fluid flow rate of the compressed air to adjust the damping force, but the wire is easily contaminated by the water vapor of the compressed air, and at the same time, the wire swings violently during floating.
[0005] To achieve the above purpose, the utility model provides the following technical solution: a wire damping device for chip wire bonding, including a damping seat:
[0006] A zirconia cylinder is arranged on the surface of the damping seat, a wire is arranged inside the zirconia cylinder, through holes are formed on the surface of the damping seat, a fixed groove-shaped hole is arranged on one side of the surface of the damping seat, and a guiding groove is arranged on the back surface of the damping seat.
[0007] Preferably, one end of the zirconia cylinder is connected to the inside of the through hole, and seven through holes with a diameter of 1.5 mm are arranged on the surface of the damping seat.
[0008] Preferably, seven zirconia cylinders are arranged and are respectively connected to the inside of the through holes.
[0009] Preferably, the through holes provided on the surface of the damping seat are arranged in two columns and the two columns are tangent to each other in a circle.
[0010] Preferably, the outer diameter of the circle between the through holes provided on the surface of the damping seat is equal to the diameter of the through holes, and the length of the zirconia cylinder is set to 15 mm.
[0011] Preferably, the end of the zirconia cylinder is provided with a spherical structure, and the fixed groove-shaped hole is arranged on the right surface of the damping seat.
[0012] Preferably, the slidable range of the fixed groove-shaped hole is ±0.5 mm.
[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0014] 1. By providing seven through holes with a diameter of 1.5 mm on the surface of the damping seat, connecting one end of the zirconia cylinder to the inside of the through holes, providing a fixed groove-shaped hole on the right surface of the damping seat, and providing a guiding groove on the back surface of the damping seat, by moving the position of the damping seat in the left-right direction, the damping force between the zirconia cylinder and the welding wire changes, providing resistance for the sliding of the welding wire, realizing simple, stable and reliable, avoiding the problem that the welding wire is easily polluted by the water vapor of the compressed air, and at the same time, the problem that the welding wire swings violently when floating. Description of the Drawings
[0015] Figure 1 is a front three-dimensional schematic diagram of the structure of the present utility model;
[0016] Figure 2 is a side three-dimensional schematic diagram of the structure of the present utility model;
[0017] Figure 3 is a front plan schematic diagram of the structure of the present utility model;
[0018] Figure 4 is a side plan schematic diagram of the structure of the present utility model;
[0019] Figure 5 is a back three-dimensional schematic diagram of the structure of the present utility model.
[0020] In the figure: 1. Damping seat; 2. Zirconia cylinder; 3. Welding wire; 4. Through hole; 5. Groove-shaped hole; 6. Guiding groove. Detailed Embodiments
[0021] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.
[0022] Please refer to Figures 1-5 , an embodiment provided by the present utility model:
[0023] A wire damping device for chip wire bonding, including a damping seat 1:
[0024] On the surface of the damping seat 1, a zirconia cylinder 2 is provided. Inside the zirconia cylinder 2, a wire 3 is provided. On the surface of the damping seat 1, a through hole 4 is opened. On one side of the surface of the damping seat 1, a fixed groove-shaped hole 5 is provided. On the back surface of the damping seat 1, a guiding groove 6 is provided. The internal material of the wire 3 is of the prior art and can be purchased on the market, which is not the technical protection point of this application. Therefore, no excessive description is made.
[0025] Further, one end of the zirconia cylinder 2 is connected to the inside of the through hole 4. On the surface of the damping seat 1, seven through holes 4 with a diameter of 1.5 mm are provided, so that the diameter set through the through hole 4 matches that of the zirconia cylinder 2.
[0026] Further, the zirconia cylinder 2 is provided in seven groups and is respectively connected to the inside of the through hole 4, so as to realize the connection and fixation of one end of the through hole 4 through the zirconia cylinder 2.
[0027] Further, the through holes 4 provided on the surface of the damping seat 1 are arranged in two columns and the two columns are tangent to each other in a circle, so as to realize the limiting effect on the zirconia cylinder 2 through the through hole 4.
[0028] Further, the outer diameter of the circle between the through holes 4 provided on the surface of the damping seat 1 is equal to the diameter of the through hole 4, and the length of the zirconia cylinder 2 is set to 15 mm, so as to provide resistance to the wire 3 through the zirconia cylinder 2.
[0029] Further, the end of the zirconia cylinder 2 is set to a spherical structure, and the fixed groove-shaped hole 5 is provided on the right surface of the damping seat 1, so as to realize the restriction on the right side of the damping seat 1 through the fixed groove-shaped hole 5.
[0030] Further, the slidable range of the fixed groove-shaped hole 5 is ±0.5 mm, so as to realize the restriction on the sliding range.
[0031] Working principle: When using the wire damping device for chip wire bonding, by providing seven through holes 4 with a diameter of 1.5 mm on the surface of the damping seat 1, connecting one end of the zirconia cylinder 2 to the inside of the through hole 4, providing a fixed groove-shaped hole 5 on the right surface of the damping seat 1, and providing a guiding groove 6 on the back surface of the damping seat 1, by moving the position of the damping seat 1 in the left-right direction, the damping force between the zirconia cylinder 2 and the wire 3 changes, providing resistance for the sliding of the wire 3, and realizing simple and stable reliability.
[0032] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above-mentioned exemplary embodiments, and the present utility model can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present utility model. Any reference signs in the claims should not be construed as limiting the claims involved.
Claims
1. A wire damping device for chip wire bonding, comprising a damping seat (1), characterized in that: On the surface of the damping seat (1), a zirconia cylinder (2) is provided. Inside the zirconia cylinder (2), a wire (3) is provided. A through hole (4) is formed on the surface of the damping seat (1). On one side of the surface of the damping seat (1), a fixed groove-shaped hole (5) is provided. On the back surface of the damping seat (1), a guide groove (6) is provided.
2. The wire damping device for chip wire bonding according to claim 1, wherein: One end of the zirconia cylinder (2) is connected to the inside of the through hole (4). On the surface of the damping seat (1), seven through holes (4) with a diameter of 1.5 mm are provided.
3. The wire damping device for chip wire bonding according to claim 1, characterized in that: The zirconia cylinders (2) are provided in seven groups and are respectively connected to the inside of the through holes (4).
4. A wire damping device for chip wire bonding according to claim 1, characterized in that: The through holes (4) provided on the surface of the damping seat (1) are arranged in two columns and the circumferences of the two columns are tangent to each other.
5. A wire damping device for chip wire bonding according to claim 1, characterized in that: The outer diameter of the circle between the through holes (4) provided on the surface of the damping seat (1) is equal to the diameter of the through hole (4). The length of the zirconia cylinder (2) is set to 15 mm.
6. The wire damping device for chip wire bonding according to claim 5, characterized in that: The end of the zirconia cylinder (2) is set to a spherical structure. The fixed groove-shaped hole (5) is provided on the right surface of the damping seat (1).
7. A wire damping device for chip wire bonding according to claim 5, characterized in that: The slidable range of the fixed groove-shaped hole (5) is ±0.5 mm.