Fixing assembly for semiconductor pressure welding treatment

Abstract

The utility model discloses a fixing assembly for semiconductor pressure welding processing, and relates to the technical field of semiconductor pressure welding. The fixing assembly for semiconductor pressure welding treatment comprises a workbench, the upper side surface of the workbench is fixedly connected with a mounting frame, the lower side surface of the mounting frame is provided with a pressure welding assembly, the upper side surface of the workbench is slidably connected with a displacement table, the upper side surface of the displacement table is fixedly connected with a pressure welding mold, and the pressure welding mold is arranged to be in a U shape; a groove is formed in the upper side surface of the pressure welding mold, a bottom plate is slidably connected into the groove, a fixing plate is slidably connected to the surfaces of the sides, close to each other, of two vertical plates of the pressure welding mold, a square groove is formed in the upper side surface of the fixing plate, a pull rod is fixedly connected to the upper side surface of the fixing plate, a linkage assembly is arranged on the bottom plate, and a driving assembly is arranged on the pull rod. The substrate and the chip can be taken out conveniently after pressure welding is completed, and the problem that efficiency is reduced due to the fact that materials are difficult to take out is effectively solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor bonding, and particularly relates to a fixing component for semiconductor bonding processing. Background Art

[0002] Bonding is a welding method that connects two metal surfaces together by applying pressure. It usually does not require filler materials and does not melt the base material.

[0003] In the prior art, bonding usually includes thermocompression bonding, ultrasonic bonding and cold pressure bonding. Since a certain pressure needs to be applied during the bonding process, in order to ensure the quality of bonding, the substrate is placed inside the mold groove to ensure alignment and pressure distribution during bonding. After bonding, the substrate is located inside the groove, and it is difficult to pick up the material, which has certain deficiencies. In view of this, we propose a fixing component for semiconductor bonding processing. Summary of the Utility Model

[0004] The purpose of the utility model is to solve at least one of the technical problems existing in the prior art, and provide a fixing component for semiconductor bonding processing, which can solve the problem that it is difficult to pick up the material when the substrate is located inside the groove.

[0005] To achieve the above purpose, the utility model provides the following technical scheme: A fixing component for semiconductor bonding processing, including a workbench, the upper surface of the workbench is fixedly connected with a mounting frame, the lower surface of the mounting frame is provided with a bonding component, the upper surface of the workbench is slidably connected with a displacement table, the upper surface of the displacement table is fixedly connected with a bonding mold, the bonding mold is set in a U shape, a groove is opened on the upper surface of the bonding mold, a bottom plate is slidably connected inside the groove, the inner sides of the two vertical plates of the bonding mold are slidably connected with a fixing plate, a square groove is opened on the upper surface of the fixing plate, a pull rod is fixedly connected to the upper surface of the fixing plate, a linkage component is arranged on the bottom plate, and a driving component is arranged on the pull rod.

[0006] Preferably, an L-shaped mounting plate is fixedly connected to the upper surface of the bonding mold, and the upper end of the pull rod penetrates through the upper surface of the L-shaped mounting plate.

[0007] Preferably, the linkage component includes a first telescopic cylinder, the first telescopic cylinder is fixedly connected to the upper surface of the bottom plate, a second telescopic cylinder is slidably sleeved inside the first telescopic cylinder, the upper end of the second telescopic cylinder is fixedly connected to the lower surface of the fixing plate, and a limiting plate is fixedly connected to one end of the second telescopic cylinder located inside the first telescopic cylinder.

[0008] Preferably, a spring is fixedly connected to the lower surface of the limiting plate, the lower end of the spring is fixedly connected to the bottom wall of the first telescopic cylinder, a protection groove is formed on the lower surface of the fixing plate, a second spring is fixedly connected to the top wall of the protection groove, and the lower end of the second spring is fixedly connected to a pressing frame.

[0009] Preferably, the pressing frame is slidably connected to the inner wall of the protection groove, mounting ears are respectively fixedly connected to the front and rear surfaces of the resistance welding die, and bolts for installation are threadedly sleeved on the mounting ears.

[0010] Preferably, a limiting rail is fixedly connected to the upper surface of the workbench, the displacement table is slidably sleeved on the outer surface of the limiting rail, a motor is fixedly connected to the left side surface of the workbench, the output end of the motor is fixedly connected to a threaded rod, and the right end of the threaded rod threadedly penetrates through the right side surface of the displacement table.

[0011] Preferably, the driving assembly includes a connecting frame, the connecting frame is fixedly connected to the upper end of the pull rod, connecting plates are respectively fixedly connected to the front and rear surfaces of the connecting frame, the connecting plates are arranged in a Z shape, rolling shafts are respectively rotatably connected to the opposite side surfaces of the two connecting plates, and two driving limiting plates are fixedly connected to the upper surface of the workbench.

[0012] Preferably, sliding grooves are respectively formed on the adjacent side surfaces of the two driving limiting plates, the sliding grooves are integrally arranged in a V shape, and the two rolling shafts are respectively movably connected to the interiors of the two sliding grooves.

[0013] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0014] (1). For the fixing component used for semiconductor resistance welding treatment, after the resistance welding is completed, the fixing plate is driven to rise by the contraction of the pull rod. After the fixing plate rises a certain distance, it drives the bottom plate to rise in cooperation with the linkage component. The rising of the bottom plate will drive the substrate and the semiconductor chip to rise together, so that the substrate and the semiconductor chip are separated from the groove. Through the above structure, it can be more convenient to take out the substrate and the chip after the resistance welding is completed, effectively avoiding the problem of reduced efficiency caused by difficult material taking.

[0015] (2). For the fixing component used for semiconductor resistance welding treatment, during the resistance welding process, the motor can be driven to rotate the threaded rod. Since the movement track of the displacement table is restricted by the limiting rail, the displacement table will be synchronously driven to move horizontally when the threaded rod rotates. With the help of the two resistance welding dies, the resistance welding and the loading and unloading can be carried out simultaneously. Through the above structure, not only can the resistance welding and the loading and unloading be carried out simultaneously, reducing the time wasted during disassembly and installation, but also after the substrate and the semiconductor chip are placed, they can be automatically pressed together, thereby reducing the overall process of the resistance welding and reducing the workload of the staff, improving the overall automation degree. Moreover, it can be adapted to products of different specifications with a detachable design. Brief Description of the Drawings

[0016] The present utility model will be further described below in conjunction with the drawings and embodiments:

[0017] Figure 1 It is a schematic structural diagram of a fixing component for semiconductor bonding processing of the present utility model;

[0018] Figure 2 It is a schematic diagram of the driving limit plate of the present utility model;

[0019] Figure 3 It is a schematic cross-sectional view of the bonding die of the present utility model;

[0020] Figure 4 It is a schematic diagram of the connecting plate of the present utility model;

[0021] Figure 5 It is a schematic cross-sectional view of the first telescopic cylinder of the present utility model;

[0022] Figure 6 It is a schematic diagram of the groove of the present utility model.

[0023] Reference numerals: 1, workbench; 2, mounting frame; 3, bonding component; 4, displacement table; 5, bonding die; 6, groove; 7, bottom plate; 8, fixing plate; 9, square groove; 10, pull rod; 11, L-shaped mounting plate; 12, first telescopic cylinder; 13, second telescopic cylinder; 14, limit plate; 15, spring; 16, protection groove; 17, second spring; 18, pressing frame; 19, mounting ear; 20, bolt; 21, limit rail; 22, motor; 23, threaded rod; 24, connecting frame; 25, connecting plate; 26, rolling shaft; 27, driving limit plate; 28, sliding groove. Detailed Description of the Preferred Embodiment

[0024] This part will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the drawings. The function of the drawings is to supplement the description of the text part of the specification, enabling people to intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but it cannot be construed as a limitation on the protection scope of the present utility model.

[0025] Please refer to Figure 1-6, the present utility model provides a technical solution: a fixing component for semiconductor bonding treatment, including a workbench 1, an installation frame 2 is fixedly connected to the upper surface of the workbench 1, a bonding component 3 is arranged on the lower surface of the installation frame 2, a displacement table 4 is slidably connected to the upper surface of the workbench 1, a bonding mold 5 is fixedly connected to the upper surface of the displacement table 4, the bonding mold 5 is arranged in a U shape, a groove 6 is opened on the upper surface of the bonding mold 5, a bottom plate 7 is slidably connected to the inside of the groove 6, a fixing plate 8 is slidably connected to the side surfaces of the two vertical plates of the bonding mold 5 close to each other, a square groove 9 is opened on the upper surface of the fixing plate 8, a pull rod 10 is fixedly connected to the upper surface of the fixing plate 8, a linkage component is arranged on the bottom plate 7, and a driving component is arranged on the pull rod 10.

[0026] When bonding a semiconductor, by placing the substrate inside the groove 6 and making the lower surface of the substrate contact the upper surface of the bottom plate 7, then placing the semiconductor chip through the square groove 9, and then driving the pull rod 10 to descend by means of the driving component, the pull rod 10 drives the fixing plate 8 to descend, and after the fixing plate 8 descends, the substrate is fixed. At this time, the bonding of the semiconductor can be completed by means of the bonding component 3.

[0027] After the bonding is completed, the fixing plate 8 is driven to rise by the rising of the pull rod 10. After the fixing plate 8 rises a certain distance, it cooperates with the linkage component to drive the bottom plate 7 to rise. The rising of the bottom plate 7 will drive the substrate and the semiconductor chip to rise together, so that the substrate and the semiconductor chip are separated from the groove 6. Through the above structure, it can be made that after the bonding is completed, the substrate and the chip can be taken out more conveniently, effectively avoiding the problem of reduced efficiency caused by difficult material taking.

[0028] Further, an L-shaped mounting plate 11 is fixedly connected to the upper side surface of the pressure welding die 5. The upper end of the pull rod 10 penetrates through the upper side surface of the L-shaped mounting plate 11. The linkage assembly includes a first telescopic cylinder 12, and the first telescopic cylinder 12 is fixedly connected to the upper side surface of the bottom plate 7. A second telescopic cylinder 13 is slidably sleeved inside the first telescopic cylinder 12. The upper end of the second telescopic cylinder 13 is fixedly connected to the lower side surface of the fixed plate 8. A limiting plate 14 is fixedly connected to one end of the second telescopic cylinder 13 located inside the first telescopic cylinder 12. A spring 15 is fixedly connected to the lower side surface of the limiting plate 14. The lower end of the spring 15 is fixedly connected to the bottom wall of the first telescopic cylinder 12. A protection groove 16 is opened on the lower side surface of the fixed plate 8. A second spring 17 is fixedly connected to the top wall of the protection groove 16. The lower end of the second spring 17 is fixedly connected to a pressing frame 18. The pressing frame 18 is slidably connected to the inner wall of the protection groove 16. Mounting ears 19 are respectively fixedly connected to the front and rear side surfaces of the pressure welding die 5. Bolts 20 for installation are threadedly sleeved on the mounting ears 19. A limiting rail 21 is fixedly connected to the upper side surface of the workbench 1. The displacement table 4 is slidably sleeved on the outer surface of the limiting rail 21. A motor 22 is fixedly connected to the left side surface of the workbench 1. The output end of the motor 22 is fixedly connected to a threaded rod 23. The right end of the threaded rod 23 threadedly penetrates through the right side surface of the displacement table 4. The driving assembly includes a connecting frame 24, and the connecting frame 24 is fixedly connected to the upper end of the pull rod 10. Connecting plates 25 are respectively fixedly connected to the front and rear side surfaces of the connecting frame 24. The connecting plates 25 are arranged in a Z shape. Rolling shafts 26 are respectively rotatably connected to one side surfaces of the two connecting plates 25 that are opposite to each other. Two driving limiting plates 27 are fixedly connected to the upper side surface of the workbench 1. Sliding grooves 28 are respectively opened on the side surfaces of the two driving limiting plates 27 that are close to each other. The sliding grooves 28 are integrally arranged in a V shape. The two rolling shafts 26 are respectively movably connected inside the two sliding grooves 28.

[0029] When fixing the substrate, place the substrate and the semiconductor chip, and then use the motor 22 to drive the threaded rod 23 to rotate. Since the movement track of the displacement table 4 is restricted by the limit rail 21, when the threaded rod 23 rotates, it will synchronously drive the displacement table 4 to move horizontally. When the displacement table 4 moves, it will synchronously drive the bonding die 5 to move as a whole. Since the sliding groove 28 is set in a V shape, and the rolling shaft 26 is movably connected inside the sliding groove 28, and the driving limit plate 27 is fixedly arranged and cannot move, so when the bonding die 5 moves, the rolling shaft 26 descends by means of the inclined surface of the sliding groove 28. The descent of the rolling shaft 26 drives the connecting plate 25 and the connecting frame 24 to descend. When the connecting frame 24 descends, it synchronously drives the pull rod 10 to descend, and then uses the pull rod 10 to drive the fixed plate 8 to descend. When the fixed plate 8 descends, it will synchronously drive the pressing frame 18 to descend. After the pressing frame 18 contacts the substrate, the second spring 17 is compressed, and the buffer of the second spring 17 is used to prevent the substrate from being damaged. At the same time, when the fixed plate 8 descends, it will also synchronously drive the second telescopic cylinder 13 to descend, and the second telescopic cylinder 13 descends and synchronously compresses the spring 15.

[0030] After the bonding is completed, the fixed plate 8 rises. At this time, the spring 15 gradually recovers. After the second telescopic cylinder 13 continues to rise, it drives the first telescopic cylinder 12 to rise by means of the limit plate 14. After the first telescopic cylinder 12 rises, it drives the bottom plate 7 to rise. And at this time, the distance between the bottom plate 7 and the fixed plate 8 is pulled to the maximum. When replacing products of different specifications, the bonding die 5 can be removed by the bolt 20 and then replaced as a whole. Through the above structure, not only can the bonding and loading / unloading be carried out simultaneously, reducing the time wasted during disassembly and installation, but also after the substrate and the semiconductor chip are placed, the pressing of the two can be automatically completed, thereby reducing the overall bonding process and the workload of the staff, improving the overall automation degree, and also can be adapted to products of different specifications by means of the detachable design.

[0031] Working principle: When bonding the semiconductor, place the substrate inside the groove 6 and make the lower surface of the substrate contact the upper surface of the bottom plate 7. Then place the semiconductor chip through the square groove 9. Subsequently, use the driving component to drive the pull rod 10 to drive the fixed plate 8 to descend. After the fixed plate 8 descends, the fixation of the substrate is completed. At this time, the bonding of the semiconductor can be completed by means of the bonding component 3;

[0032] After the pressure welding is completed, the contraction of the pull rod 10 drives the fixed plate 8 to rise. After the fixed plate 8 rises a certain distance, it cooperates with the linkage assembly to drive the bottom plate 7 to rise. The rising of the bottom plate 7 will drive the substrate and the semiconductor chip to rise together, thereby separating the substrate and the semiconductor chip from the groove 6. When fixing the substrate, place the substrate and the semiconductor chip. Then, use the motor 22 to drive the threaded rod 23 to rotate. Since the movement track of the displacement table 4 is restricted by the limit rail 21, when the threaded rod 23 rotates, it will synchronously drive the displacement table 4 to move horizontally. When the displacement table 4 moves, it will synchronously drive the pressure welding die 5 to move as a whole. Since the sliding groove 28 is set in a V shape, and the rolling shaft 26 is movably connected inside the sliding groove 28, and the driving limit plate 27 is fixedly arranged and cannot move, so when the pressure welding die 5 moves, the rolling shaft 26 descends by means of the inclined surface of the sliding groove 28. The descending of the rolling shaft 26 drives the connecting plate 25 and the connecting frame 24 to descend. When the connecting frame 24 descends, it synchronously drives the pull rod 10 to descend, and then uses the pull rod 10 to drive the fixed plate 8 to descend. When the fixed plate 8 descends, it will synchronously drive the pressing frame 18 to descend. After the pressing frame 18 contacts the substrate, it compresses the second spring 17, and the buffer of the second spring 17 is used to prevent the substrate from being damaged. At the same time, when the fixed plate 8 descends, it will also synchronously drive the second telescopic cylinder 13 to descend. The descending of the second telescopic cylinder 13 synchronously compresses the spring 15. After the pressure welding is completed, the fixed plate 8 rises. At this time, the spring 15 gradually recovers. After the second telescopic cylinder 13 continues to rise, it drives the first telescopic cylinder 12 to rise by means of the limit plate 14. After the first telescopic cylinder 12 rises, it drives the bottom plate 7 to rise. And at this time, the distance between the bottom plate 7 and the fixed plate 8 is pulled to the maximum. When replacing products of different specifications, the pressure welding die 5 can be removed by the bolt 20 and then replaced as a whole.

[0033] The above has described the embodiments of the present invention in detail with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those of ordinary skill in the art in the said technical field, various changes can be made without departing from the gist of the present invention.

Claims

1. A fixing component for semiconductor wire bonding processing, comprising a workbench (1), characterized in that: The upper side surface of the workbench (1) is fixedly connected with a mounting frame (2). The lower side surface of the mounting frame (2) is provided with a pressure welding assembly (3). The upper side surface of the workbench (1) is slidably connected with a displacement table (4). The upper side surface of the displacement table (4) is fixedly connected with a pressure welding die (5). The pressure welding die (5) is arranged in a U shape. The upper side surface of the pressure welding die (5) is provided with a groove (6). The bottom plate (7) is slidably connected inside the groove (6). The side surfaces of the two vertical plates of the pressure welding die (5) that are close to each other are slidably connected with a fixing plate (8). The upper side surface of the fixing plate (8) is provided with a square groove (9). The upper side surface of the fixing plate (8) is fixedly connected with a pull rod (10). A linkage assembly is arranged on the bottom plate (7), and a driving assembly is arranged on the pull rod (10).

2. The fixed component for semiconductor pressure welding treatment according to claim 1, characterized in that: The upper side surface of the pressure welding die (5) is fixedly connected with an L-shaped mounting plate (11). The upper end of the pull rod (10) penetrates through the upper side surface of the L-shaped mounting plate (11).

3. The fixing component for semiconductor pressure welding treatment according to claim 1, characterized in that: The linkage assembly includes a first telescopic cylinder (12). The first telescopic cylinder (12) is fixedly connected to the upper side surface of the bottom plate (7). A second telescopic cylinder (13) is slidably sleeved inside the first telescopic cylinder (12). The upper end of the second telescopic cylinder (13) is fixedly connected to the lower side surface of the fixing plate (8). One end of the second telescopic cylinder (13) located inside the first telescopic cylinder (12) is fixedly connected with a limiting plate (14).

4. The fixing component for semiconductor pressure welding treatment according to claim 3, characterized in that: The lower side surface of the limiting plate (14) is fixedly connected with a spring (15). The lower end of the spring (15) is fixedly connected to the bottom wall of the first telescopic cylinder (12). The lower side surface of the fixing plate (8) is provided with a protection groove (16). The top wall of the protection groove (16) is fixedly connected with a second spring (17). The lower end of the second spring (17) is fixedly connected with a pressing frame (18).

5. The fixing component for semiconductor pressure welding treatment according to claim 4, characterized in that: The pressing frame (18) is slidably connected to the inner wall of the protection groove (16). The front and rear side surfaces of the pressure welding die (5) are respectively fixedly connected with mounting ears (19). Bolts (20) for installation are threadedly sleeved on the mounting ears (19).

6. The fixing component for semiconductor pressure welding treatment according to claim 1, characterized in that: The upper side surface of the workbench (1) is fixedly connected with a limiting rail (21). The displacement table (4) is slidably sleeved on the outer surface of the limiting rail (21). The left side surface of the workbench (1) is fixedly connected with a motor (22). The output end of the motor (22) is fixedly connected with a threaded rod (23). The right end of the threaded rod (23) threadedly penetrates through the right side surface of the displacement table (4).

7. A fixing component for semiconductor pressure welding treatment according to claim 1, characterized in that: The driving assembly includes a connecting frame (24). The connecting frame (24) is fixedly connected to the upper end of the pull rod (10). The front and rear side surfaces of the connecting frame (24) are respectively fixedly connected with connecting plates (25). The connecting plates (25) are arranged in a Z shape. The opposite side surfaces of the two connecting plates (25) are respectively rotatably connected with rolling shafts (26). Two driving limiting plates (27) are fixedly connected to the upper side surface of the workbench (1).

8. The fixing component for semiconductor pressure welding treatment according to claim 7, characterized in that: Sliding grooves (28) are respectively opened on the side surfaces of the two driving limiting plates (27) that are close to each other. The sliding grooves (28) are integrally arranged in a V shape. The two rolling shafts (26) are respectively movably connected inside the two sliding grooves (28).

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