Screen protection film, two-liquid mixed hardened adhesive layer and electronic equipment

Abstract

One of the technical problems solved by the embodiment of the utility model is to provide a screen protection film, a two-liquid mixed hardened adhesive layer and electronic equipment, the screen protection film is applied to a screen with an under-screen ultrasonic fingerprint identification function, and the screen protection film comprises a glass layer and the two-liquid mixed hardened adhesive layer, the glass layer is attached to the surface of the screen through the two-liquid mixed hardened adhesive layer, and the two-liquid mixed hardened adhesive layer comprises a semi-cured photosensitive adhesive layer, a base material layer and a silica gel layer which are arranged in sequence. According to the embodiment of the invention, the influence of the protective film on fingerprint identification under the ultrasonic screen can be improved, and fingerprint identification can be better realized.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of fingerprint recognition, and in particular, to a screen protector, a two-component curing adhesive layer, and an electronic device. Background Art

[0002] With the popularization of ultrasonic in-screen fingerprint technology in electronic devices such as smart phones, how to obtain a more accurate fingerprint recognition effect has become the focus of research on ultrasonic in-screen fingerprint technology. However, in order to protect the screen, users usually stick a protective film on the screen surface, and the protective film will seriously affect the recognition effect of ultrasonic in-screen fingerprint.

[0003] Therefore, how to improve the influence of the protective film on ultrasonic in-screen fingerprint recognition and better achieve fingerprint recognition has become an urgent technical problem to be solved. Summary of the Utility Model

[0004] In view of this, one of the technical problems solved by the embodiments of the present application is to provide a screen protector, a two-component curing adhesive layer, and an electronic device, which can improve the influence of the protective film on ultrasonic in-screen fingerprint recognition and better achieve fingerprint recognition.

[0005] In a first aspect, a screen protector is provided, which is applied to a screen with an in-screen ultrasonic fingerprint recognition function. The screen protector is characterized in that it includes: a glass layer and a two-component curing adhesive layer. The glass layer is attached to the surface of the screen through the two-component curing adhesive layer. The two-component curing adhesive layer includes a semi-cured photosensitive adhesive layer, a substrate layer, and a silica gel layer arranged in sequence.

[0006] In some optional embodiments of the present application, the propagation time of the ultrasonic wave in the two-component curing adhesive layer is equal to Or; the sum of the propagation times of the ultrasonic wave in the semi-cured photosensitive adhesive layer and the substrate layer is equal to Or; the propagation time of the ultrasonic wave in the semi-cured photosensitive adhesive layer is equal to Where N is a positive integer and T0 is the period of the ultrasonic wave.

[0007] In a second aspect, a two-component curing adhesive layer is provided, which is applied to attach a glass layer to the surface of a screen with an in-screen ultrasonic fingerprint recognition function. The two-component curing adhesive layer includes an optical adhesive layer, a substrate layer, and a silica gel layer arranged in sequence. Upper release films and lower release films are respectively arranged on both sides of the two-component curing adhesive layer.

[0008] In a third aspect, an electronic device is provided, which includes: a screen with an in-screen ultrasonic fingerprint recognition function, any of the above screen protectors or two-component curing adhesive layers, and a glass layer attached through the two-component curing adhesive layer.

[0009] In the solution of the embodiment of the present application, the screen protector includes: a glass layer and a two-component mixed hardening glue layer. The glass layer is attached to the surface of the screen through the two-component mixed hardening glue layer. The two-component mixed hardening glue layer includes a semi-cured photosensitive glue layer, a substrate layer, and a silica gel layer arranged in sequence. In the embodiment of the present application, the semi-cured photosensitive glue layer avoids the attenuation of ultrasonic waves caused by a relatively thick optical glue layer, thereby improving the influence of the tempered glass protector on ultrasonic under-screen fingerprint recognition and better realizing fingerprint recognition. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Some specific embodiments of the embodiments of the present application will be described in detail hereinafter with reference to the drawings in an exemplary but non-limiting manner. The same reference numerals in the drawings denote the same or similar components or parts. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0011] Figure 1 is a schematic structural diagram of a display screen for ultrasonic under-screen fingerprint recognition according to an embodiment of the present application;

[0012] Figure 2 is a schematic structural diagram of a display screen for normal ultrasonic under-screen fingerprint recognition and a screen protector;

[0013] Figure 3 is a graph of the ultrasonic transmittance of the glass layer when the ultrasonic frequency is 11 MHz;

[0014] Figure 4 is a schematic structural diagram of a screen protector according to an embodiment of the present application;

[0015] Figure 5 is a schematic structural diagram of a screen protector according to another embodiment of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0016] See Figure 1 , the basic principle of ultrasonic under-screen fingerprint recognition is: the ultrasonic fingerprint module is installed under the OLED screen. The ultrasonic waves emitted by it pass through the OLED screen and reach the surface of the finger, and the fingerprint of the finger reflects the ultrasonic waves. Since the reflectivities of the valleys and ridges of the fingerprint to ultrasonic waves are different, the reflected echo passes through the OLED screen and is received by the ultrasonic fingerprint module, and the fingerprint image can be obtained according to the echo difference.

[0017] See Figure 2 , the structure of the mobile phone protector includes: a glass layer (Glass) and a two-component mixed hardening glue layer (AB glue). The two-component mixed hardening glue layer includes an optical glue layer, a substrate layer, and a silica gel layer arranged in sequence. The optical glue layer (OCA, Optically Clear Adhesive) and the silica gel layer have adhesiveness and are respectively attached to both sides of the substrate layer, so it is called a two-component mixed hardening glue layer.

[0018] In this embodiment, the substrate layer can be made of various organic substances. The substrate layer functions as a carrier board. For example, the substrate layer can be a PET (Polyethylene terephthalate) film. PET is the abbreviation of polyethylene terephthalate, and its full name is polyethylene glycol terephthalate, also known as polyester. PET is a common plastic material with good transparency, mechanical properties, and chemical corrosion resistance.

[0019] When the mobile phone protective film is attached to the screen surface, there will be "white edges" because the mobile phone protective film and the four sides of the screen cannot be fully attached. In the case of a curved screen scenario, due to the inconsistent curvature between the full-screen and the mobile phone protective film, the "white edges" will become very serious.

[0020] To eliminate this "white edge", it is necessary to thicken the optical adhesive layer. Since the optical adhesive layer is relatively soft, the optical adhesive layer can be used to absorb the white edge gap, thereby eliminating the white edge. Usually, the optical adhesive layer needs to reach a thickness of 250um to solve the problem of "white edges".

[0021] However, due to the relatively large attenuation of the optical adhesive layer to ultrasonic waves, when the optical adhesive layer is relatively thick, this attenuation has a great impact on the ultrasonic under-screen fingerprint recognition performance.

[0022] Furthermore, Table 1 shows the sound velocities of the materials used in each layer of the glass layer and the two-component mixed hardening adhesive layer in this embodiment. The glass layer is a high acoustic impedance material, and its acoustic impedance is, for example, 14Mrayl. The constituent materials of the two-component mixed hardening adhesive layer are all low acoustic impedance materials. The acoustic impedance of the optical adhesive layer is 2Mrayl, and the acoustic impedance of the substrate layer is 3.2Mrayl. Usually, 5 is considered as the dividing line between high acoustic impedance materials and low acoustic impedance materials.

[0023] Table 1

[0024]

[0025]

[0026] When sound waves are transmitted from medium 1 to medium 2, according to the sound wave reflection law: where Z1 and Z2 are the acoustic impedances of medium 1 and medium 2 respectively, and rf is the ultrasonic reflectivity when sound waves are transmitted from medium 1 to medium 2. Assuming that the average acoustic impedance of the two-component mixed hardening adhesive layer is 2, then when sound waves are transmitted from the glass layer to the two-component mixed hardening adhesive layer, the ultrasonic reflectivity rf = (14 - 2) / (14 + 2) = 75%, that is Figure 2The ultrasonic reflectivity of Reflection 1 is 75%. Similarly, it can be obtained that the ultrasonic reflectivity of Reflection 1 ≈ the ultrasonic reflectivity of Reflection 2 ≈ the ultrasonic reflectivity of Reflection 3 ≈ the ultrasonic reflectivity of Reflection 4 = 75%. Therefore, sticking a tempered protective film on the screen surface will cause only a very small proportion of the ultrasonic waves reflected by the finger to be received by the ultrasonic fingerprint module, resulting in a sharp deterioration in the fingerprint recognition effect.

[0027] In order to improve the transmittance of ultrasonic waves in different media, it is usually necessary to specially design its thickness based on the acoustic properties of the material. When ultrasonic waves penetrate from Medium 1 through Medium 2 and then enter Medium 3, the ultrasonic transmittance T1 is as shown in Formula 1:

[0028] Formula 1. Where Z1 and Z2, Z3 are the acoustic impedances of Medium 1 and Medium 2, Medium 3 respectively, D is the thickness of Medium 2, λ2 is the wavelength of the longitudinal wave of ultrasonic waves propagating in Medium 2.

[0029] When D is exactly N*λ2 / 2, where N is a positive integer and λ2 is the wavelength of ultrasonic waves in Medium 2, T1 has a maximum value of When ultrasonic waves are incident from Medium 3 back to Medium 1, the law is the same.

[0030] Moreover, in this embodiment, Medium 1 is the finger, Medium 2 is the glass layer, Medium 3 is the two-liquid mixed hardening glue layer, and the ultrasonic frequency is 11 MHz. Refer to Figure 3 , when the thickness of the glass layer is around 250 um and 500 um, the ultrasonic transmittance T1 has a maximum value, and the half-wavelength is exactly 250 um. When the thickness D of Medium 2 < λ2 / 8, the ultrasonic transmittance T1 decreases rapidly with the increase of the thickness. At the same time, when the thickness of Medium 2 is far from N*λ2 / 2, the ultrasonic transmittance T1 will decrease significantly. When the thickness D of Medium 2 = λ2 / 4 + N*λ2 / 2, the ultrasonic transmittance T1 will have a minimum value.

[0031] From the above analysis, it can be seen that when the thickness D of Medium 2 satisfies D = N*λ2 / 2, the ultrasonic transmittance T1 will be relatively high, or when D < λ2 / 8 and the smaller D is, the ultrasonic transmittance T1 will be relatively high. Keeping the thickness of Medium 2 away from D = λ2 / 4 + N*λ2 / 2 can avoid a significant decrease in the ultrasonic transmittance T1.

[0032] Since when the glass layer D < λ2 / 8 and the smaller D is, the strength of the glass layer is insufficient to protect the screen well. When the thickness of the glass layer is λ2 / 2, a certain thickness of the glass layer can be ensured to provide protection for the screen. When the thickness D of the glass layer = N * λ2 / 2 and N is greater than or equal to 2, the glass layer may be too thick, resulting in too long an ultrasonic propagation path and signal strength loss. In addition, too thick glass also affects the user experience. Therefore, when the thickness of the glass layer is λ2 / 2, it can ensure the protection of the screen while providing a better user experience. Specifically, the thickness of the glass layer can be 250um. In addition, since the ultrasonic penetration rate is more sensitive to the thickness of the glass, the floating range of the glass thickness design is plus or minus 10%.

[0033] See Figure 4 , an embodiment of the present application provides a screen protection film, which is applied to a screen with an ultrasonic fingerprint recognition function under the screen. The screen protection film includes: a glass layer and a two-component mixed hardening glue layer, and the two-component mixed hardening glue layer is used to attach the glass layer to the surface of the screen.

[0034] Specifically, a release film is arranged on one side of the two-component mixed hardening glue layer, or release films are arranged on both sides of the two-component mixed hardening glue layer.

[0035] When a release film is arranged on one side of the two-component mixed hardening glue layer, the other side of the two-component mixed hardening glue layer is directly attached to the glass layer. When the release film is peeled off from one side of the two-component mixed hardening glue layer, the two-component mixed hardening glue layer attaches the glass layer to the surface of the screen. When attaching, the semi-cured photosensitive glue layer is attached to the glass layer, and the silica gel layer is attached to the screen.

[0036] When release films are arranged on both sides of the two-component mixed hardening glue layer, when the release film is peeled off from one side of the two-component mixed hardening glue layer, one side of the two-component mixed hardening glue layer is attached to the surface of the screen; when the release film is peeled off from the other side of the two-component mixed hardening glue layer, the other side of the two-component mixed hardening glue layer is attached to the surface of the screen.

[0037] The two-component mixed hardening glue layer includes a semi-cured photosensitive glue layer, a substrate layer, and a silica gel layer arranged in sequence.

[0038] The photosensitive glue (UV glue) includes semi-cured and cured types. The semi-cured photosensitive glue layer needs to be irradiated with UV light to achieve curing; the cured photosensitive glue layer itself does not have an adhesive layer and requires an additional liquid photosensitive glue layer to achieve bonding, and it is more troublesome to bond to the screen.

[0039] An embodiment of the present application uses a semi-cured photosensitive glue layer to replace the optical surface layer, thereby avoiding the attenuation of ultrasonic waves caused by a relatively thick optical glue layer, improving the influence of the tempered protection film on ultrasonic fingerprint recognition under the screen, and better realizing fingerprint recognition.

[0040] In the embodiment of the present application, the semi-cured photosensitive adhesive layer presents a mechanical state similar to that of the optical adhesive layer under normal conditions, has good flexibility, and at the same time avoids the problem that the conventional liquid semi-cured photosensitive adhesive layer is easy to flow and difficult to control.

[0041] After the tempered film of the present invention is attached to the screen, the entire film is irradiated with UV light to completely cure the semi-cured photosensitive adhesive layer. After complete curing, this layer of adhesive presents a solid state, and the attenuation of ultrasonic waves by the solid semi-cured photosensitive adhesive layer will be significantly reduced. Therefore, the problem of ultrasonic wave attenuation by the optical adhesive layer can be solved.

[0042] The embodiment of the present application also provides a two-component mixed hardening adhesive layer, which includes a semi-cured photosensitive adhesive layer, a substrate layer, and a silica gel layer arranged in sequence. An upper release film and a lower release film are respectively arranged on both sides of the two-component mixed hardening adhesive layer.

[0043] When one side of the two-component mixed hardening adhesive layer is used to set the release film, the other side of the two-component mixed hardening adhesive layer is directly attached to the glass layer. When the release film is peeled off from one side of the two-component mixed hardening adhesive layer, the two-component mixed hardening adhesive layer will attach the glass layer to the surface of the screen.

[0044] When release films are arranged on both sides of the two-component mixed hardening adhesive layer, when the release film is peeled off from one side of the two-component mixed hardening adhesive layer, one side of the two-component mixed hardening adhesive layer will be attached to the surface of the screen; when the release film is peeled off from the other side of the two-component mixed hardening adhesive layer, the other side of the two-component mixed hardening adhesive layer will be attached to the surface of the screen.

[0045] In a specific implementation of the embodiment of the present application, the propagation time of the ultrasonic wave in the two-component mixed hardening adhesive layer is equal to or; the sum of the propagation times of the ultrasonic wave in the semi-cured photosensitive adhesive layer and the substrate layer is equal to or; the propagation time of the ultrasonic wave in the semi-cured photosensitive adhesive layer is equal to where N is a positive integer and T0 is the period of the ultrasonic wave. Where D UV is the thickness of the semi-cured photosensitive adhesive layer, u UV is the wave velocity of the longitudinal wave of the ultrasonic wave propagating in the semi-cured photosensitive adhesive layer, D PET is the thickness of the substrate layer, u PET is the wave velocity of the longitudinal wave of the ultrasonic wave propagating in the substrate layer, D SL is the thickness of the silica gel layer, u SL is the wave velocity of the longitudinal wave of the ultrasonic wave propagating in the silica gel layer. In one embodiment, the propagation time of the ultrasonic wave in the semi-cured photosensitive adhesive layer is equal to that is, the thickness of the semi-cured photosensitive adhesive layer is For example, the thickness of the semi-cured photosensitive adhesive layer is or an integer multiple thereof. Specifically, a certain error is allowed, for example, it can be 130 um or 260 um.

[0046] In one embodiment, the sum of the propagation times of ultrasonic waves in the semi-cured photosensitive adhesive layer and the substrate layer equals For example, the thickness of the semi-cured photosensitive adhesive layer is 60 um, and the thickness of the substrate layer is 50 um. At this time, the sum of the propagation times of ultrasonic waves in the semi-cured photosensitive adhesive layer and the substrate layer equals 50 um / (2.4 um / ns) + 60 um / (2.9 um / ns) = 41.5 ns, and the period T0 is about 90.91 ns. The integer multiple of the half period is the integer multiple of 45.5 ns. In this embodiment, specifically, a certain error is allowed in the value of the specific thickness.

[0047] In one embodiment, the propagation time of ultrasonic waves in the two-liquid mixed hardening adhesive layer That is, three times the half period is 136.4 ns, and the error is about 11.4%.

[0048] In this embodiment, the error of the propagation time is less than 15%, so that the attenuation of ultrasonic energy can be reduced. In the above embodiment, the specific implementation thickness combinations are shown in Table 2:

[0049] Table 2

[0050]

[0051] From the above analysis, it can be seen that the propagation time of ultrasonic waves in the two-liquid mixed hardening adhesive layer equals The ultrasonic penetration rate will be relatively high.

[0052] If the propagation time of ultrasonic waves in the two-liquid mixed hardening adhesive layer cannot be satisfied to equal Then the propagation time of ultrasonic waves in the semi-cured photosensitive adhesive layer and the substrate layer or the substrate layer and the silica gel layer or the semi-cured photosensitive adhesive layer equals

[0053] Specifically, if the frequency of ultrasonic waves is 11 MHz; the propagation time of ultrasonic waves in the two-liquid mixed hardening adhesive layer equals The material of the silica gel layer has a greater influence on the ultrasonic penetration rate, that is, the ultrasonic penetration rate is more sensitive to the material of the silica gel layer. Therefore, the thickness of the silica gel layer is set thinner than that of the optical adhesive layer and the substrate layer, which can reduce the attenuation of ultrasonic energy. For example, the thickness of the semi-cured photosensitive adhesive layer is 260 um; the thickness of the substrate layer is 50 um; and the thickness of the silica gel layer is 50 um.

[0054] In some specific implementations of the embodiments of the present application, if the sum of the propagation times of the ultrasonic wave in the semi-cured photosensitive adhesive layer and the substrate layer is equal to then the thickness of the silica gel layer is equal to λ1 / 2*M, or less than λ1 / 8. Alternatively, if the propagation time of the ultrasonic wave in the semi-cured photosensitive adhesive layer is equal to then the thickness of the silica gel layer is equal to λ1 / 2*M, or less than λ1 / 8 and the thickness of the substrate layer is equal to λ4 / 2*M, or less than λ4 / 8; where M is a positive integer, λ1 is the wavelength of the longitudinal wave of the ultrasonic wave propagating in the silica gel layer, and λ4 is the wavelength of the longitudinal wave of the ultrasonic wave propagating in the substrate layer.

[0055] The embodiments of the present application further set the thicknesses of the semi-cured photosensitive adhesive layer, the substrate layer, and the silica gel layer, so as to better improve the influence of the tempered glass protective film on ultrasonic in-screen fingerprint recognition and improve the fingerprint recognition effect.

[0056] In a specific implementation of the embodiments of the present application, the two-component mixed hardening adhesive layer includes a semi-cured photosensitive adhesive layer, a substrate layer, and a silica gel layer arranged in sequence. The thickness of the semi-cured photosensitive adhesive layer is equal to λ2 / 2*M, or less than λ2 / 8, the thickness of the substrate layer is equal to λ4 / 2*M, or less than λ4 / 8, and the thickness of the silica gel layer is equal to λ1 / 2*M, or less than λ1 / 8, where M is a positive integer, λ1 is the wavelength of the longitudinal wave of the ultrasonic wave propagating in the silica gel layer, λ2 is the wavelength of the longitudinal wave of the ultrasonic wave propagating in the cured semi-cured photosensitive adhesive layer, and λ4 is the wavelength of the longitudinal wave of the ultrasonic wave propagating in the substrate layer.

[0057] The embodiments of the present application set the thicknesses of the semi-cured photosensitive adhesive layer, the substrate layer, and the silica gel layer, so as to improve the influence of the tempered glass protective film on ultrasonic in-screen fingerprint recognition and better achieve fingerprint recognition.

[0058] In this embodiment, if the thickness errors of the optical adhesive layer, the silica gel layer, and the substrate layer are controlled within 10%, the attenuation of the ultrasonic wave is less, and the fingerprint recognition effect can be further improved.

[0059] In some other specific implementations of the embodiments of the present application, refer to Figure 5 , the two-component mixed hardening adhesive layer further includes an optical adhesive layer disposed between the semi-cured photosensitive adhesive layer and the substrate layer, that is, the two-component mixed hardening adhesive layer includes a semi-cured photosensitive adhesive layer, an optical adhesive layer, a substrate layer, and a silica gel layer arranged in sequence.

[0060] The embodiments of the present application set the semi-cured photosensitive adhesive layer and the optical adhesive layer, so that the arranged optical adhesive layer is thinner than using the optical adhesive layer alone, avoiding the attenuation of the ultrasonic wave caused by the relatively thick optical adhesive layer, thereby improving the influence of the tempered glass protective film on ultrasonic in-screen fingerprint recognition and better achieving fingerprint recognition.

[0061] In some further specific implementations of the embodiments of the present application, the thickness of the optical adhesive layer is equal to λ5 / 2 * R, and the thickness of the semi-cured photosensitive adhesive layer is λ2 / 4 or 3λ2 / 4. Alternatively, the sum of the propagation times of the ultrasonic wave in the semi-cured photosensitive adhesive layer and the optical adhesive layer is equal to wherein R and S are positive integers, T0 is the period of the ultrasonic wave, λ2 is the wavelength of the longitudinal wave of the ultrasonic wave propagating in the cured semi-cured photosensitive adhesive layer, and λ5 is the wavelength of the longitudinal wave of the ultrasonic wave propagating in the optical adhesive layer.

[0062] In one embodiment, the thickness of the optical adhesive layer is equal to λ5 / 2 * R. For example, λ5 is 163.64 microns, and the thickness of the optical adhesive layer can be an integer multiple of 81.82 microns. For example, it can be 80 microns. The thickness of the semi-cured photosensitive adhesive layer is λ2 / 4 or 3λ2 / 4. For example, λ2 is about 263.64 microns, and the thickness of the semi-cured photosensitive adhesive layer can be 65.91 um or 197.73 um. In this embodiment, the thickness can have an error range, for example, 20%, and the thickness of the semi-cured photosensitive adhesive layer can be 60 um or 180 um.

[0063] In one embodiment, the sum of the propagation times of the ultrasonic wave in the semi-cured photosensitive adhesive layer and the optical adhesive layer is equal to For example, D UV is 60 um, D OCR is The period T0 is about 90.9 ns. In this embodiment, S can be equal to 2. For another example, the propagation time of the ultrasonic wave in the semi-cured photosensitive adhesive layer is equal to The propagation time of the ultrasonic wave in the optical adhesive layer is equal to The thickness of the semi-cured photosensitive adhesive layer is The thickness of the optical adhesive layer is

[0064] In one embodiment, the sum of the propagation times of the ultrasonic wave in the substrate layer and the silica gel layer is equal to wherein W is a positive integer and T0 is the period of the ultrasonic wave.

[0065] Taking the specific thickness of the material as an example for illustration, the thickness of the silica gel layer can be 50 um, the thickness of the substrate layer can be 20 um, and the sum of the propagation times of the ultrasonic wave in the silica gel layer and the substrate layer The period T0 is approximately 90.9 ns. In this embodiment, W can be equal to 1, and the error of the sum of the propagation times is approximately 10%. In this embodiment, the thicknesses of the semi-cured photosensitive adhesive layer and the optical adhesive layer can meet the requirements mentioned in the foregoing embodiments, that is, the thickness of the semi-cured photosensitive adhesive layer is an odd multiple of λ2 / 4. For example, the thickness is λ2 / 4 or 3λ2 / 4, and can be an odd multiple of 65.9 um. In this embodiment, there can be a certain error range for the thickness. Taking integers as examples in Table 3, the thickness of the semi-cured photosensitive adhesive layer can be 60 um, 180 um, and 200 um. Additionally, the thickness of the optical adhesive layer is equal to λ5 / 2*R, and the thickness of the optical adhesive layer is an integer multiple of approximately 81.8 um. As shown in Table 3, for example, it is 80 um, 160 um, 240 um. In one embodiment, the sum of the propagation times of the ultrasonic waves in the optical adhesive layer and the substrate layer is equal to where T is a positive integer. For example, the thickness of the optical adhesive layer is 180 um, and the thickness of the substrate layer is 75 um. At this time, the sum of the propagation times of the ultrasonic waves in the optical adhesive layer and the substrate layer is equal to 180 um / (1.8 um / ns) + 75 um / (2.4 um / ns) = 131.2 ns, and the period T0 is approximately 90.91 ns, which is an integer multiple of half the period, that is, an integer multiple of 45.5 ns. In this embodiment, T is equal to 3, and the error of the propagation time is 3.88%. For example, the thickness of the optical adhesive layer is 120 um, and the thickness of the substrate layer is 50 um. At this time, the sum of the propagation times of the ultrasonic waves in the optical adhesive layer and the substrate layer is equal to 120 um / (1.8 um / ns) + 50 um / (2.4 um / ns) = 87.5 ns, and the period T0 is approximately 90.91 ns, which is an integer multiple of half the period, that is, an integer multiple of 45.5 ns. In this embodiment, T is equal to 2, and the error of the propagation time is 3.85%. Specifically, a certain error is allowed for the values of the specific thicknesses. Preferably, the error can be within 5%.

[0066] In one embodiment, the propagation time of the ultrasonic waves in the two-component mixed-curing adhesive layer that is, three times the half period is 136.4 ns, then the error is approximately 3.6%.

[0067] In this embodiment, the error of the propagation time is less than 10%. In this way, the attenuation of the ultrasonic wave energy can be reduced. In the foregoing embodiments, the specific implementation thickness combinations are shown in Table 3 as follows:

[0068] Table 3

[0069]

[0070] By adopting the above thickness setting in the embodiments of the present application, the attenuation of the optical adhesive layer and the semi-cured photosensitive adhesive layer to ultrasonic waves can be better reduced, the influence of the tempered glass protective film on ultrasonic in-screen fingerprint recognition can be further improved, and fingerprint recognition can be better realized. It should be noted that when each layer of the tempered glass film meets the above requirements for thickness or propagation time, the quality of the received ultrasonic signal is the best.

[0071] Currently, the application frequency of ultrasonic in-screen fingerprint is generally 10 - 13 MHz. Considering the manufacturing process of the glass layer, the thickness of the glass layer is set to λ3 / 2, where λ3 is the wavelength of the longitudinal wave of ultrasonic waves propagating in the glass.

[0072] Specifically, the thickness of the glass layer is 250 um.

[0073] Due to the process requirements of actual manufacturing, the thickness of each material has fluctuations. Therefore, the floating range of the thickness and the sum of thicknesses in the embodiments of the present application is plus or minus 20%.

[0074] Since the ultrasonic penetration rate is more sensitive to the thickness of the glass, the floating range of the glass thickness design is plus or minus 10%.

[0075] Another embodiment of the present application further provides an electronic device, which includes: a screen with an in-screen ultrasonic fingerprint recognition function, and any one of the above screen protection films, or the above two-liquid mixed hardening adhesive layer and the glass layer attached through the above two-liquid mixed hardening adhesive layer.

[0076] The following further describes the specific implementation of the embodiments of the present invention in conjunction with the accompanying drawings of the embodiments of the present invention.

[0077] The electronic device of the embodiments of the present application includes, but is not limited to:

[0078] (1) Mobile communication devices: These devices are characterized by having mobile communication functions and mainly aim to provide voice and data communication. Such terminals include: smart phones (such as iPhone), multimedia phones, functional phones, and low-end phones, etc.

[0079] (2) Ultra-mobile personal computer devices: These devices belong to the category of personal computers, have computing and processing functions, and generally also have the characteristic of mobile Internet access. Such terminals include: PDA, MID, and UMPC devices, etc., such as iPad.

[0080] (3) Portable entertainment devices: These devices can display and play multimedia content. Such devices include: audio and video players (such as iPod), handheld game consoles, e-books, and smart toys and portable vehicle navigation devices.

[0081] (4) Other electronic devices with data interaction functions, such as door locks and car locks.

[0082] Thus far, specific embodiments of the present subject matter have been described. Other embodiments are within the scope of the appended claims. In some cases, the acts recited in the claims can be performed in a different order and still achieve the desired results. Additionally, the processes depicted in the figures do not necessarily require the particular order or sequential order shown to achieve the desired results. In certain embodiments, multitasking and parallel processing may be advantageous.

[0083] It should also be noted that the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, such that a process, method, commodity or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, commodity or device. Without further limitation, an element defined by the statement "comprising one..." does not exclude the presence of additional identical elements in the process, method, commodity or device comprising the element.

[0084] Each embodiment in this specification is described in a progressive manner, and the same or similar parts among the embodiments can be referred to each other. Each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the description of the method embodiment.

[0085] The above are only the embodiments of the present application and are not intended to limit the present application. For those skilled in the art, various modifications and changes can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the scope of the claims of the present application.

Claims

1. A screen protector is applied to a screen with an in-screen ultrasonic fingerprint recognition function, characterized in that The screen protector includes: a glass layer and a two-component mixed curing adhesive layer, and the glass layer is attached to the surface of the screen through the two-component mixed curing adhesive layer. The two-component mixed curing adhesive layer includes a semi-cured photosensitive adhesive layer, a substrate layer, and a silica gel layer arranged in sequence.

2. The screen protector according to claim 1, wherein The propagation time of the ultrasonic wave in the two-liquid mixed hardening glue layer is equal to Or; the sum of the propagation times of the ultrasonic wave in the semi-cured photosensitive glue layer and the substrate layer is equal to Or; the propagation time of the ultrasonic wave in the semi-cured photosensitive glue layer is equal to Wherein, N is a positive integer, and T0 is the period of the ultrasonic wave.

3. The screen protection film according to claim 1 or 2, characterized in that, If the sum of the propagation times of the ultrasonic waves in the semi-cured photosensitive adhesive layer and the substrate layer is equal to then the thickness of the silicone layer is equal to λ1 / 2*M, or less than λ1 / 8; or If the propagation time of the ultrasonic wave in the semi-cured photosensitive adhesive layer is equal to then the thickness of the silica gel layer is equal to λ1 / 2*M, or less than λ1 / 8 and the thickness of the substrate layer is equal to λ4 / 2*M, or less than λ4 / 8; Wherein, M is a positive integer, λ1 is the wavelength of the longitudinal wave of the ultrasonic wave propagating in the silica gel layer, and λ4 is the wavelength of the longitudinal wave of the ultrasonic wave propagating in the substrate layer.

4. The screen protection film according to claim 1 or 2, characterized in that If the frequency of the ultrasonic wave is 11 MHz; the substrate layer is a PET film; The thickness of the semi-cured photosensitive adhesive layer is 260 um; the thickness of the substrate layer is 50 um; and the thickness of the silica gel layer is 50 um; Or, The thickness of the semi-cured photosensitive adhesive layer is 130 um; the thickness of the substrate layer is 50 um; and the thickness of the silica gel layer is 50 um or 20 um; Or, The thickness of the semi-cured photosensitive adhesive layer is 60 um; the thickness of the substrate layer is 50 um; and the thickness of the silica gel layer is 20 um.

5. The screen protector according to claim 1 or 2, characterized in that, The thickness of the silica gel layer is less than the thickness of the semi-cured photosensitive adhesive layer; the thickness of the silica gel layer is less than the thickness of the substrate layer.

6. The screen protection film according to claim 1 or 2, characterized in that The thickness of the semi-cured photosensitive adhesive layer is equal to λ2 / 2*O, or less than λ2 / 8, the thickness of the substrate layer is equal to λ4 / 2*P, or less than λ4 / 8, the thickness of the silica gel layer is equal to λ1 / 2*Q, or less than λ1 / 8, wherein, O, P, Q are positive integers, λ1 is the wavelength of the longitudinal wave of the ultrasonic wave propagating in the silica gel layer, λ2 is the wavelength of the longitudinal wave of the ultrasonic wave propagating in the cured semi-cured photosensitive adhesive layer, and λ4 is the wavelength of the longitudinal wave of the ultrasonic wave propagating in the substrate layer.

7. The screen protection film according to claim 1 or 2, characterized in that, If the frequency of the ultrasonic wave is 11 MHz; the substrate layer is a PET film; The thickness of the semi-cured photosensitive adhesive layer is 130 um; the thickness of the substrate layer is 50 um; and, the thickness of the silica gel layer is 50 um.

8. The screen protection film according to claim 1, wherein The two-component mixed curing adhesive layer further includes an optical adhesive layer disposed between the semi-cured photosensitive adhesive layer and the substrate layer.

9. The screen protection film according to claim 8, characterized in that, The thickness of the optical adhesive layer is equal to λ5 / 2*R, and the thickness of the semi-cured photosensitive adhesive layer is λ2 / 4 or 3λ2 / 4; or, The sum of the propagation times of the ultrasonic wave in the semi-cured photosensitive adhesive layer and the optical adhesive layer is equal to Wherein, R, S are positive integers, T0 is the period of the ultrasonic wave, λ2 is the wavelength of the longitudinal wave of the ultrasonic wave propagating in the cured semi-cured photosensitive adhesive layer, and λ5 is the wavelength of the longitudinal wave of the ultrasonic wave propagating in the optical adhesive layer.

10. The screen protection film according to claim 8 or 9, characterized in that The propagation time of the ultrasonic wave in the two-liquid mixed and hardened adhesive layer is equal to Or; the sum of the propagation times of the ultrasonic wave in the optical adhesive layer and the substrate layer is equal to Wherein, T, N are positive integers, and T0 is the period of the ultrasonic wave.

11. The screen protection film according to claim 8 or 9, characterized in that, The sum of the propagation times of the ultrasonic waves in the silica gel layer and the substrate layer is equal to Wherein, W is a positive integer, and T0 is the period of the ultrasonic wave.

12. The screen protection film according to claim 8 or 9, characterized in that, If the frequency of the ultrasonic wave is 11 MHz; the substrate layer is a PET film; The thickness of the semi-cured photosensitive adhesive layer is 60 um; the thickness of the optical adhesive layer is 120 um; the thickness of the substrate layer is 50 um; and, the thickness of the silica gel layer is 50 um; Or, The thickness of the semi-cured photosensitive adhesive layer is 100 um; the thickness of the optical adhesive layer is 80 um; the thickness of the substrate layer is 50 um; and the thickness of the silica gel layer is 50 um; Or, The thickness of the semi-cured photosensitive adhesive layer is 60 um; the thickness of the optical adhesive layer is 180 um; the thickness of the substrate layer is 75 um; and the thickness of the silica gel layer is 50 um; Or, The thickness of the semi-cured photosensitive adhesive layer is 180 um; the thickness of the optical adhesive layer is 120 um; the thickness of the substrate layer is 50 um; and the thickness of the silica gel layer is 50 um; Or, The thickness of the semi-cured photosensitive adhesive layer is 60 um; the thickness of the optical adhesive layer is 120 um; the thickness of the substrate layer is 20 um; and the thickness of the silica gel layer is 50 um; or The thickness of the semi-cured photosensitive adhesive layer is 200 um; the thickness of the optical adhesive layer is 80 um or 160 um or 240 um; the thickness of the substrate layer is 20 um; and the thickness of the silica gel layer is 50 um; or The thickness of the semi-cured photosensitive adhesive layer is 60 um; the thickness of the optical adhesive layer is 160 um or 240 um; the thickness of the substrate layer is 20 um; and the thickness of the silica gel layer is 50 um.

13. The screen protection film according to any one of claims 2 and 9, characterized in that The floating range of the propagation time is plus or minus 20%.

14. The screen protection film according to claim 4, wherein The floating range of the thickness of the semi-cured photosensitive adhesive layer, the substrate layer and the silica gel layer is plus or minus 20%.

15. The screen protection film according to any one of claims 2 and 9, characterized in that, The floating range of the propagation time is plus or minus 10%.

16. The screen protection film according to claim 1, wherein, Upper and lower release films are respectively arranged on both sides of the two-component mixed-curing adhesive layer.

17. The screen protection film according to claim 9, characterized in that The floating range of the thickness is plus or minus 20%.

18. The screen protection film according to claim 9, characterized in that, The floating range of the thickness is plus or minus 10%.

19. A two - liquid mixed and hardened adhesive layer is applied to bond a glass layer to the surface of a screen with an in - screen ultrasonic fingerprint recognition function, and is characterized in that, The two-component mixed-curing adhesive layer includes an optical adhesive layer, a substrate layer and a silica gel layer which are arranged in sequence, and upper and lower release films are respectively arranged on both sides of the two-component mixed-curing adhesive layer.

20. An electronic device, characterized in that, Including: A screen with an in-screen ultrasonic fingerprint recognition function, the screen protector according to any one of claims 1-18, or the two-component mixed-curing adhesive layer according to claim 19, and a glass layer attached through the two-component mixed-curing adhesive layer.

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