Cooling fan

Abstract

The utility model discloses a cooling fan, which relates to the field of fans and comprises a shell, a motor and fan blades are arranged in the shell, and the motor is used for driving the fan blades to rotate; the semiconductor chilling plate is located at the edge of the shell; the heat conduction net is located at the air outlet end of the shell, and the heat conduction net is connected with the refrigeration face of the semiconductor refrigeration sheet; and the air guide part is located at the air outlet of the shell, can guide air to the semiconductor chilling plate and is used for dissipating heat of the semiconductor chilling plate. The semiconductor chilling plate is arranged on the side face of the shell, the air guide portion is designed, under the action of the air guide portion, airflow blown by the fan can dissipate heat of the semiconductor chilling plate, the heat conduction net is directly in contact with the refrigeration face of the semiconductor chilling plate, and when air flows out of the shell, the temperature of the air is reduced only through the heat conduction net. The refrigerating and heating parts of the semiconductor are separated from the airflow path of the fan, so that the airflow is prevented from being heated by the semiconductor refrigerating sheet, and the cooling effect on the airflow is better.

Description

Technical Field

[0001] The utility model relates to the field of fans, in particular to a cooling fan. Background Art

[0002] As one of the fans used on a cooling suit, a cooling fan mostly uses a semiconductor refrigeration sheet to cool the air flow. Since it is used on a cooling suit, the volume of the fan is relatively small, and using a semiconductor refrigeration sheet can fully meet the cooling requirements. However, for the cooling fans currently on the market, most of the semiconductor refrigeration sheets are placed at the center of the air outlet, and a heat conduction net made of aluminum alloy is installed at the air outlet of the fan with bolts. The heat conduction net is connected to the cooling surface of the semiconductor refrigeration sheet. As shown in Figure 1 However, this setting method has the following defects: Since the semiconductor refrigeration sheet is placed at the air outlet, when the air passes through the heat conduction net, although the temperature of the air flow can be reduced, the heating surface of the semiconductor refrigeration sheet is also at the air outlet and faces the motor. Part of the air will also flow through the heating surface of the semiconductor refrigeration sheet, which will cause the air flow to heat up. The air flow will experience a process of first heating up and then cooling down, resulting in a poor cooling effect on the air flow. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a cooling fan to solve the problems raised in the above background art.

[0004] To solve the above technical problems, the utility model provides the following technical solutions: A cooling fan, comprising:

[0005] A housing, inside which a motor and a fan blade are placed, and the motor is used to drive the fan blade to rotate;

[0006] A semiconductor refrigeration sheet, located at the edge of the housing;

[0007] A heat conduction net, located at the air outlet end of the housing, and the heat conduction net is connected to the cooling surface of the semiconductor refrigeration sheet;

[0008] A wind guiding part, located at the air outlet of the housing, capable of guiding the wind to the semiconductor refrigeration sheet for dissipating heat from the semiconductor refrigeration sheet.

[0009] Preferably, a heat dissipation shell is fixedly installed on the housing. The wind guiding part is communicated with the heat dissipation shell, and the semiconductor refrigeration sheet is fixedly installed inside the heat dissipation shell.

[0010] Preferably, an air outlet is opened at the bottom of the heat dissipation shell.

[0011] Preferably, a heat dissipation plate is fixedly installed on one side of the heating surface of the semiconductor refrigeration sheet, and there is an air duct between the heat dissipation plate and the heat dissipation shell.

[0012] Preferably, the air guiding part is a T-shaped plate structure, and an air inlet communicating with the heat dissipation shell is formed at the edge of the air guiding part.

[0013] Preferably, a circular support frame is fixedly installed at the air outlet of the outer shell, the heat conduction net is fixed on the support frame, and the motor is fixedly installed at the center of the support frame.

[0014] Preferably, a wire groove is formed on the support frame close to the heat dissipation shell, and the wire of the motor is placed in the wire groove.

[0015] Preferably, an opening is formed on one side of the heat dissipation shell close to the air outlet end of the outer shell, and a cover plate is covered at the opening.

[0016] Preferably, the semiconductor refrigeration sheet and the heat dissipation plate are arranged parallel to the axis line of the outer shell.

[0017] Preferably, the semiconductor refrigeration sheet and the heat dissipation plate are arranged perpendicular to the axis line of the outer shell.

[0018] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0019] In the utility model, the semiconductor refrigeration sheet is placed on the side of the outer shell, and the air guiding part is designed. Under the action of the air guiding part, the air flow blown by the fan can dissipate heat from the semiconductor refrigeration sheet. The heat conduction net is directly in contact with the refrigerating surface of the semiconductor refrigeration sheet. When the air flows out of the outer shell, it only passes through the heat conduction net to reduce the temperature, separating the refrigerating and heating parts of the semiconductor from the air flow path of the fan, avoiding the heating of the air flow by the semiconductor refrigeration sheet, and achieving a better air flow cooling effect. Description of the Drawings

[0020] Figure 1 It is a structural diagram of the prior art of the utility model;

[0021] Figure 2 It is an exploded view of the utility model;

[0022] Figure 3 It is an overall structural diagram of the utility model;

[0023] Figure 4 It is a structural diagram of the support frame and the outer shell of the utility model;

[0024] Figure 5 It is a structural diagram of the heat dissipation plate and the heat dissipation shell of the utility model;

[0025] Figure 6 It is an air flow diagram of the utility model;

[0026] Figure 7 It is a half-sectional view of the utility model.

[0027] In the figure: 1. Outer shell; 2. Heat conduction net; 3. Air guiding part; 4. Heat dissipation shell; 5. Support frame; 6. Motor; 7. Wire groove; 8. Heat dissipation plate; 9. Semiconductor refrigeration sheet; 10. Air inlet; 11. Air outlet; 12. Cover plate. Detailed implementation mode

[0028] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0029] As shown in the figure, this embodiment provides a cooling fan, including an outer shell 1. Both ends of the outer shell 1 are open structures, one side is the air inlet end, and the other side is the air outlet end. A protective net is installed at the air inlet end of the outer shell 1 by means of threads. A motor 6 and a fan blade are installed inside the outer shell 1. A support frame 5 is fixedly installed at the air outlet end of the outer shell 1 by means of bolts. The support frame 5 is a circular structure. The motor 6 is fixedly installed at the center of the support frame 5. A fan blade is fixedly installed on the output shaft of the motor 6. The motor 6 is used to drive the fan blade to rotate.

[0030] As Figure 4 shown, a wire groove 7 is opened in the part of the support frame 5 close to the heat dissipation shell 4. Wires are placed in the wire groove 7 to supply power to the motor 6.

[0031] As Figure 3 shown, a heat conduction net 2 is also fixedly installed at the air outlet end of the outer shell 1. The heat conduction net 2 is made of aluminum alloy. A heat dissipation shell 4 is fixedly installed at the edge of the outer shell 1. A semiconductor refrigeration sheet 9 is installed inside the heat dissipation shell 4. The heat conduction net 2 is in contact with the refrigerating surface of the semiconductor refrigeration sheet 9. The low temperature of the refrigerating surface of the semiconductor refrigeration sheet 9 will be transmitted along the heat conduction net 2. When the flowing air passes through the heat conduction net 2, it can cool the air passing through the heat conduction net 2.

[0032] An air guiding part 3 is also fixedly installed on the heat conduction net 2. As Figure 2 shown, the air guiding part 3 is located at the air outlet end of the outer shell 1. The structure of the air guiding part 3 is as follows: The air guiding part 3 is a plate-like structure similar to a T shape. An air inlet 10 communicating with the heat dissipation shell 4 is opened at the edge of the air guiding part 3, and an air outlet 11 is opened at the bottom of the heat dissipation shell 4. As Figure 2 shown. The air outlet 11 is threadedly arranged towards the protective net, and a wind blocking plate with a diameter larger than the diameter of the outer shell 1 is integrally arranged at the edge of the protective net. When the hot air flowing out from the inside of the heat dissipation shell 4 flows out from the air outlet 11, it diffuses outwards under the shielding of the side wall of the protective net and the wind blocking plate, and will not enter the inside of the outer shell 1.

[0033] When the fan blade is working, the flowing air passes through the air guiding part 3. Under the guiding action of the air guiding part 3, the air enters the interior of the heat dissipation shell 4 from the air inlet 10, and after flowing through the semiconductor refrigeration sheet 9, it is discharged from the air outlet 11, realizing the heat dissipation of the semiconductor refrigeration sheet 9.

[0034] In a further embodiment, in order to better realize the heat dissipation of the semiconductor refrigeration sheet 9, a heat dissipation plate 8 is fixedly installed on the heating surface of the semiconductor refrigeration sheet 9. The heat dissipation plate 8 is made of aluminum alloy. The surface of the heat dissipation plate 8 that fits with the semiconductor refrigeration sheet 9 is a flat structure, and the other surface is provided with a plurality of uniformly distributed protrusions. An air duct is formed between the protrusions and the side wall of the heat dissipation shell 4. When the air flow enters from the heat dissipation shell 4, the air flow will pass through the heat dissipation plate 8, and more heat can be taken away, and the heat dissipation effect of the semiconductor refrigeration sheet 9 is better.

[0035] There are two ways to place the semiconductor refrigeration sheet 9 and the heat dissipation plate 8. As Figure 6 shown, the semiconductor refrigeration sheet 9 and the heat dissipation plate 8 are arranged parallel to the axis of the outer shell 1. The air entering from the air inlet 10 can blow onto the heat dissipation plate 8, realizing the heat dissipation of the heat dissipation plate 8 and the semiconductor refrigeration sheet 9.

[0036] As Figure 7 shown, the semiconductor refrigeration sheet 9 and the heat dissipation plate 8 are arranged perpendicular to the axis of the outer shell 1. The air entering from the air inlet 10 can blow onto the heat dissipation plate 8, realizing the heat dissipation of the heat dissipation plate 8 and the semiconductor refrigeration sheet 9. The above two methods can both realize the heat dissipation of the semiconductor refrigeration sheet 9 and the heat dissipation plate 8.

[0037] In this embodiment, as Figure 5 shown, an opening is provided on one side of the heat dissipation shell 4 close to the air outlet end of the outer shell 1. A cover plate 12 is covered at the opening. The cover plate 12 can be directly snapped onto the opening, and the cover plate 12 can be removed from the opening, which is convenient for the installation of the heat dissipation plate 8 and the semiconductor refrigeration sheet 9.

[0038] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cooling fan, characterized in that: including a housing (1) with a motor (6) and a fan blade placed inside, the motor (6) being used to drive the fan blade to rotate; a semiconductor refrigeration sheet (9) located at the edge of the housing (1); a heat conduction net (2) located at the air outlet end of the housing (1), and the heat conduction net (2) is connected to the refrigerating surface of the semiconductor refrigeration sheet (9); a wind guiding part (3) located at the air outlet of the housing (1), capable of guiding the wind to the semiconductor refrigeration sheet (9) for dissipating heat from the semiconductor refrigeration sheet (9).

2. The cooling fan according to claim 1, wherein: A heat dissipation housing (4) is fixedly installed on the housing (1), the wind guiding part (3) is communicated with the heat dissipation housing (4), and the semiconductor refrigeration sheet (9) is fixedly installed inside the heat dissipation housing (4).

3. The cooling fan according to claim 2, characterized in that: An air outlet (11) is opened at the bottom of the heat dissipation housing (4).

4. A cooling fan according to claim 1 or 2 or 3, characterized in that: A heat dissipation plate (8) is fixedly installed on one side of the heating surface of the semiconductor refrigeration sheet (9), and there is an air duct left between the heat dissipation plate (8) and the heat dissipation housing (4).

5. The cooling fan according to claim 4, characterized in that: The wind guiding part (3) is of a T-shaped plate structure, and an air inlet communicated with the heat dissipation housing (4) is opened at the edge of the wind guiding part (3).

6. The cooling fan according to claim 5, characterized in that: A circular support frame (5) is fixedly installed at the air outlet of the housing (1), the heat conduction net (2) is fixed on the support frame (5), and the motor (6) is fixedly installed at the center of the support frame (5).

7. The cooling fan according to claim 6, characterized in that: A wire groove (7) is opened on the support frame (5) close to the heat dissipation housing (4), and the wire of the motor (6) is placed in the wire groove (7).

8. The cooling fan according to claim 7, characterized in that: An opening is provided on one side of the heat dissipation housing (4) close to the air outlet end of the housing (1), and a cover plate (12) is covered at the opening.

9. The cooling fan according to claim 4, wherein: The semiconductor refrigeration sheet (9) and the heat dissipation plate (8) are arranged parallel to the axis of the housing (1).

10. A cooling fan according to claim 4, characterized in that: The semiconductor refrigeration sheet (9) and the heat dissipation plate (8) are arranged perpendicular to the axis of the housing (1).

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