Abnormality detection device for metalized vapor deposition plating layer on back surface of wafer

Abstract

The utility model relates to the technical field of wafer evaporation detection, in particular to an anomaly detection device for a metalized evaporation coating on the back surface of a wafer, which comprises a base plate and a detection bearing plate, a negative pressure air pump device is started under negative pressure, and a pipe orifice formed between the top of an annular cylinder and an annular gasket is used for carrying out negative pressure adsorption limit on the bottom of the wafer evaporation coating. And the screw rod is assembled and limited with threads in the wing plate and the bent plate, so that the bottom end of the rubber pad is tightly attached to the top end of the wafer, the stepping motor is started, the cavity pipe, the annular cylinder and the annular pad are driven to rotate through the second gear, and if a wafer evaporation plating layer is an abnormal product which is easy to peel off, the evaporation plating layer can be driven to twist and fall off. If the wafer evaporation plating layer is a qualified product which is not easy to peel off, the wafer and the evaporation plating layer are integrally rotated at a certain angle, the wafer product can be subjected to better non-destructive plating layer peeling detection, the good product can directly flow into the next working procedure, and the re-evaporation process on the detected good wafer product is not needed.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer evaporation plating detection, in particular to an abnormal detection device for the backside metallization evaporation plating coating of a wafer. Background Technique

[0002] The backside metallization process is a packaging technology developed to improve the heat dissipation problem of high-power ICs. BSM uses an electron beam evaporation plating or metal sputtering process to deposit a layer of metal and substrate for bonding on the backside of the wafer, so as to achieve better heat dissipation and electrical conductivity effects. After the backside metallization evaporation plating process of the wafer, the coating may have poor adhesion, peeling or particle phenomena due to various abnormal reasons during evaporation plating. Usually, a sampling detection method is adopted to perform peeling detection on the wafer evaporation plating products.

[0003] When some detection devices perform peeling detection on the wafer evaporation plating coating, they usually adopt a sampling detection method, and use structures such as a scraper controlled by an electric control device to perform a destructive detection method on the coating surface. Whether the sample is good or bad, it cannot directly flow into the next process, and the detected wafer products need to be re-evaporated. Therefore, an abnormal detection device for the backside metallization evaporation plating coating of a wafer is proposed to solve the above problems. Content of the Utility Model

[0004] The purpose of the utility model is to provide an abnormal detection device for the backside metallization evaporation plating coating of a wafer, so as to solve the problem that when some detection devices perform peeling detection on the wafer evaporation plating coating, they usually adopt a sampling detection method, and use structures such as a scraper controlled by an electric control device to perform a destructive detection method on the coating surface. Whether the sample is good or bad, it cannot directly flow into the next process, and the detected wafer products need to be re-evaporated, as mentioned in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solutions:

[0006] An abnormal detection device for a metalized evaporation coating on the back of a wafer, comprising a substrate and a detection carrier plate. The detection carrier plate is fixedly arranged on the top bracket of the substrate. Wing plates are fixedly arranged at the left end and the right end of the detection carrier plate. A cover plate is arranged on the top of the detection carrier plate. Bent plates are fixedly arranged at the left end and the right end of the cover plate. A pressing frame is fixedly arranged at the bottom end of the cover plate. A rubber pad is fixedly arranged at the bottom end of the pressing frame. Screws are threadedly arranged inside the wing plates and the bent plates. A column block is fixedly arranged at the top end of the screw. A limiting rod is fixedly arranged at the bottom end of the bent plate. A sleeve is fixedly arranged at the top end of the wing plate. A spring is fixedly arranged between the top end of the wing plate and the bottom end of the bent plate. A stepping motor and a negative pressure air pump device are fixedly arranged at the top end of the substrate. The top main shaft of the stepping motor is assembled with a first gear through a key block. The top air port of the negative pressure air pump device is fixedly communicated with a conduit. A cavity tube is arranged at the top of the conduit. A second gear is fixedly arranged on the outer side of the cavity tube. The top end of the cavity tube is fixedly communicated with an annular cylinder. An annular pad is fixedly arranged at the top end of the annular cylinder.

[0007] Preferably, the limiting rod is slidably arranged inside the sleeve, and the spring is spirally wound outside the limiting rod and the sleeve.

[0008] Preferably, a circular groove is formed on the top of the detection carrier plate. Both the annular cylinder and the annular pad are in fitting contact with the inside of the detection carrier plate, and the top surface of the annular pad is flush with the bottom of the circular groove provided on the detection carrier plate.

[0009] Preferably, a silica gel ring is fixedly arranged inside the bottom end of the cavity tube, and the inside of the silica gel ring is in fitting contact with the conduit.

[0010] Preferably, the outer side of the second gear is in meshing contact with the outer side of the first gear.

[0011] Compared with the prior art, the beneficial effects of the present utility model are:

[0012] In the present utility model, the personnel-controlled negative pressure air pump device starts under negative pressure. The conduit is a rigid pipe, and the conduit, the cavity pipe, and the annular cylinder form a communicating pipeline. The pipe orifice formed between the top of the annular cylinder and the annular gasket performs negative pressure adsorption and limitation on the bottom of the wafer evaporation coating. Through the threaded assembly limitation inside the screw and the wing plate and inside the bent plate, the bottom end of the rubber gasket is closely attached to the top end of the wafer. The personnel control the start of the stepping motor, and the rotation of the main shaft of the stepping motor drives the rotation of the first gear. The first gear meshes and rotates with the second gear, and the second gear drives the cavity pipe, the annular cylinder, and the annular gasket to rotate. Since the bottom of the wafer evaporation coating is limited by negative pressure adsorption through the pipe orifice between the top of the annular cylinder and the annular gasket, when the bottom end of the rubber gasket is closely attached to the top end of the wafer, if the wafer evaporation coating is an abnormal product that is easy to peel off, the evaporation coating can be driven to twist and fall off. If the wafer evaporation coating is a qualified product that is not easy to peel off, the wafer and the evaporation coating as a whole rotate by a certain angle, and a good non-destructive coating peeling detection can be performed on the wafer product. Good products can directly flow into the next process, and there is no need to re-evaporate the good wafer products after detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a schematic diagram of the overall installation structure of the present utility model;

[0014] Figure 2 is a schematic diagram of the cross-sectional structures of the detection support plate, the wing plate, the cover plate, the bent plate, and the sleeve of the present utility model;

[0015] Figure 3 For the present utility model Figure 2 schematic diagram of the structure at location A;

[0016] Figure 4 is a schematic diagram of the cross-sectional structures of the substrate, the detection support plate, and the wing plate of the present utility model;

[0017] Figure 5 For the present utility model Figure 4 schematic diagram of the structure at location B;

[0018] Figure 6 is a schematic diagram of the installation structure of the conduit of the present utility model.

[0019] In the figure: 1. Substrate; 2. Detection support plate; 3. Wing plate; 4. Cover plate; 5. Bent plate; 6. Pressure frame; 7. Rubber gasket; 8. Screw; 9. Column block; 10. Limit rod; 11. Sleeve; 12. Spring; 13. Stepping motor; 14. First gear; 15. Negative pressure air pump device; 16. Conduit; 17. Cavity pipe; 18. Second gear; 19. Annular cylinder; 20. Annular gasket; 21. Silicone ring. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0021] Please refer to Figures 1-6 , the present invention provides a technical solution:

[0022] An abnormal detection device for a metalized evaporation coating on the back of a wafer, including a substrate 1 and a detection carrier plate 2. The detection carrier plate 2 is fixedly arranged on the top bracket of the substrate 1. Wing plates 3 are fixedly arranged at the left end and the right end of the detection carrier plate 2. A cover plate 4 is arranged on the top of the detection carrier plate 2. Bent plates 5 are fixedly arranged at the left end and the right end of the cover plate 4. A pressing frame 6 is fixedly arranged at the bottom end of the cover plate 4. A rubber pad 7 is fixedly arranged at the bottom end of the pressing frame 6. Screws 8 are threadedly arranged inside the wing plates 3 and the bent plates 5. Column blocks 9 are fixedly arranged at the top ends of the screws 8. A limiting rod 10 is fixedly arranged at the bottom end of the bent plate 5. A sleeve 11 is fixedly arranged at the top end of the wing plate 3. A spring 12 is fixedly arranged between the top end of the wing plate 3 and the bottom end of the bent plate 5. A stepping motor 13 and a negative pressure air pump device 15 are fixedly arranged at the top end of the substrate 1. The top main shaft of the stepping motor 13 is assembled with a first gear 14 through a key block. The top air port of the negative pressure air pump device 15 is fixedly communicated with a conduit 16. A cavity tube 17 is arranged at the top of the conduit 16. A second gear 18 is fixedly arranged on the outer side of the cavity tube 17. The top end of the cavity tube 17 is fixedly communicated with an annular cylinder 19. An annular gasket 20 is fixedly arranged at the top end of the annular cylinder 19.

[0023] The limiting rod 10 is slidably arranged inside the sleeve 11. The spring 12 is spirally wound around the outer sides of the limiting rod 10 and the sleeve 11. A circular groove is formed on the top of the detection carrier plate 2. Both the annular cylinder 19 and the annular gasket 20 are in close contact with the inside of the detection carrier plate 2. The top surface of the annular gasket 20 is flush with the bottom of the circular groove provided on the detection carrier plate 2. A silica gel ring 21 is fixedly arranged inside the bottom end of the cavity tube 17. The inside of the silica gel ring 21 is in interference fit with the conduit 16. The outer side of the second gear 18 is in meshing contact with the outer side of the first gear 14. The above-mentioned cavity tube 17, second gear 18, annular cylinder 19, annular gasket 20 and silica gel ring 21 are of an integral structure. When installing the above integral structure, place it vertically by hand until the annular cylinder 19 and the annular gasket 20 are in close contact with the inside of the detection carrier plate 2. At this time, the silica gel ring 21 is in interference fit with the conduit 16, and the second gear 18 is placed in meshing with the first gear 14, which is convenient for regular replacement and disassembly of the above integral structure.

[0024] Workflow: The present utility model provides a peeling detection device for a wafer coating, which can detect the peeling between the evaporation coating on the back of the wafer and the wafer body, and is used to detect the stability of the wafer coating. The stepping motor 13 and the negative pressure air pump device 15 provided in this device are both electrically connected to an external power supply, and the operator manually controls the stepping motor 13 and the negative pressure air pump device 15 through an external PLC controller.

[0025] Among them, place the back of the sampled evaporation wafer facing downwards, so that the wafer evaporation coating is placed inside the circular groove of the detection carrier plate 2. At this time, the top of the ring gasket 20 is in contact with the wafer evaporation coating. The operator controls the negative pressure air pump device 15 to start under negative pressure. The conduit 16 is a rigid pipe, and the conduit 16, the cavity pipe 17 and the ring cylinder 19 form a communication pipeline, and a negative pressure adsorption limit is applied to the bottom of the wafer evaporation coating through the pipe orifice formed between the top of the ring cylinder 19 and the ring gasket 20.

[0026] Manually press down the cover plate 4 so that the rubber pad 7 provided at the bottom of the pressure frame 6 is in contact with the top of the wafer. At this time, the limiting rod 10 is slidably arranged on the inner wall of the sleeve 11, and the spring 12 is compressed. Manually rotate the column block 9, and the column block 9 drives the screw rod 8 to rotate. Through the threaded assembly limit between the screw rod 8 and the inside of the wing plate 3 and the inside of the bent plate 5, the bottom end of the rubber pad 7 is closely attached to the top of the wafer.

[0027] The operator controls the stepping motor 13 to start. The rotation of the main shaft of the stepping motor 13 drives the first gear 14 to rotate. The first gear 14 meshes with the second gear 18 to rotate, and the second gear 18 drives the cavity pipe 17, the ring cylinder 19 and the ring gasket 20 to rotate. Since the bottom of the wafer evaporation coating is limited by negative pressure adsorption through the pipe orifice between the top of the ring cylinder 19 and the ring gasket 20, when the bottom end of the rubber pad 7 is closely attached to the top of the wafer, if the wafer evaporation coating is an abnormal product that is easy to peel off, it can drive the evaporation coating to twist and fall. If the wafer evaporation coating is a qualified product that is not easy to peel off, the wafer and the evaporation coating as a whole will rotate by a certain angle. Then, the operator controls the stepping motor 13 to turn off and takes out the detected wafer product again.

[0028] Although the embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. An abnormal detection device for a metalized evaporation coating on the back of a wafer, comprising a substrate (1) and a detection carrier plate (2), characterized in that: A detection bearing plate (2) is fixedly arranged on the top bracket of the substrate (1). Wings (3) are fixedly arranged at the left and right ends of the detection bearing plate (2). A cover plate (4) is arranged on the top of the detection bearing plate (2). Bent plates (5) are fixedly arranged at the left and right ends of the cover plate (4). A pressing frame (6) is fixedly arranged at the bottom end of the cover plate (4). A rubber pad (7) is fixedly arranged at the bottom end of the pressing frame (6). Screws (8) are threadedly arranged inside the wings (3) and the bent plates (5). Column blocks (9) are fixedly arranged at the top ends of the screws (8). Limit rods (10) are fixedly arranged at the bottom ends of the bent plates (5). Sleeves (11) are fixedly arranged at the top ends of the wings (3). Springs (12) are fixedly arranged between the top ends of the wings (3) and the bottom ends of the bent plates (5). A stepping motor (13) and a negative pressure air pump device (15) are fixedly arranged at the top end of the substrate (1). The top main shaft of the stepping motor (13) is assembled with a first gear (14) through a key block. The top air port of the negative pressure air pump device (15) is fixedly communicated with a conduit (16). A cavity tube (17) is arranged at the top of the conduit (16). A second gear (18) is fixedly arranged on the outer side of the cavity tube (17). The top end of the cavity tube (17) is fixedly communicated with an annular cylinder (19). An annular pad (20) is fixedly arranged at the top end of the annular cylinder (19).

2. The abnormal detection device for the metalized evaporation coating on the back side of a wafer according to claim 1, wherein: The limit rod (10) is slidably arranged inside the sleeve (11). The spring (12) is spirally wound and distributed on the outer sides of the limit rod (10) and the sleeve (11).

3. The abnormal detection device for the metalized evaporation coating on the back of a wafer according to claim 1, characterized in that: A circular groove is formed on the top of the detection bearing plate (2). The annular cylinder (19) and the annular pad (20) are both in close contact with the inside of the detection bearing plate (2). The top surface of the annular pad (20) is flush with the bottom of the circular groove provided on the detection bearing plate (2).

4. The abnormal detection device for the metal evaporation coating on the back side of a wafer according to claim 1, characterized in that: A silica gel ring (21) is fixedly arranged inside the bottom end of the cavity tube (17). The inside of the silica gel ring (21) is in interference fit with the conduit (16).

5. The abnormal detection device for the metalized evaporation coating on the back side of a wafer according to claim 1, characterized in that: The outer side of the second gear (18) is in meshing contact with the outer side of the first gear (14).

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