Case, board card integrated assembly, quantum computing measurement and control system and quantum computer

Abstract

The utility model relates to a case, a board card integrated assembly, a quantum computing measurement and control system and a quantum computer. The case comprises a top plate, a bottom plate, a first side plate and a second side plate, wherein the first side plate and the second side plate are arranged between the top plate and the bottom plate and are oppositely arranged; the first side plate and the second side plate are respectively provided with a plurality of first slots and a plurality of second slots which are oppositely arranged, and the first slots and the second slots are respectively used for supporting two ends of a functional board card; the side walls of the first slot and the second slot are respectively provided with a first air inlet and a first air outlet which are oppositely arranged; the first side plate is provided with a first fan on the first surface away from the first slot, and the second side plate is provided with a second fan on the first surface away from the second slot. The first fan sucks in external air from the first air inlet and sends the external air into the case, the air passes through the function board card, the second fan discharges the air with heat out of the case through the first air outlet, and therefore the heat on the function board card is efficiently dissipated to the outside of the case to meet the requirement for efficient heat dissipation.

Description

Technical Field

[0001] The utility model relates to the technical field of quantum computers, in particular to a chassis, a board integrated component, a quantum computing measurement and control system and a quantum computer. Background Art

[0002] Quantum chips are the core components for running quantum computing. Multiple quantum bits are integrated on quantum chips. In order to ensure the normal operation of quantum bits, a special quantum computing measurement and control system needs to be built. The quantum computing measurement and control system includes several signal generation modules, which are used to provide various control signals (such as frequency control signals, quantum state control signals, and measurement control signals) for quantum chips; among them, each signal generation module is integrated on several functional boards, and several functional boards are integrated in the chassis.

[0003] The operating frequency of quantum chips is relatively high, and the frequencies of these control signals are also relatively high. Therefore, when the functional boards are working, they generate a lot of heat, and the existing chassis can hardly meet the heat dissipation requirements.

[0004] Therefore, there is an urgent need for a chassis with good heat dissipation effect to meet the heat dissipation requirements of functional boards when they are working.

[0005] It should be noted that the information disclosed in the background technology section of this application is only intended to deepen the understanding of the general background technology of this application, and should not be regarded as an admission or suggestion in any form that the information constitutes prior art already known to those skilled in the art. Utility Model Content

[0006] The utility model aims to provide a chassis, a board integrated component, a quantum computing measurement and control system and a quantum computer with good heat dissipation effect.

[0007] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0008] The first aspect of the utility model provides a chassis for integrating a plurality of functional boards, the chassis comprising a top plate, a bottom plate, and a first side plate and a second side plate disposed between the top plate and the bottom plate and arranged opposite to each other;

[0009] The first side panel and the second side panel are respectively provided with a plurality of first slots and a plurality of second slots arranged opposite to each other, and the first slots and the second slots are respectively used to support the two ends of the functional board; the side walls of the first slot and the second slot are respectively provided with a first air inlet and a first air outlet arranged opposite to each other;

[0010] A first fan is disposed on a first surface of the first side plate away from the first slot, and a second fan is disposed on a first surface of the second side plate away from the second slot.

[0011] For the chassis as described above, further, a first groove is provided on the side of the top plate opposite to the bottom plate; a second groove is provided on the side of the bottom plate opposite to the top plate.

[0012] For the chassis as described above, further, a plurality of the first slots are arranged in parallel, and a plurality of the second slots are arranged in parallel.

[0013] For the chassis as described above, further, a plurality of the first fan arrays are arranged, and a plurality of the first fans are arranged at different heights;

[0014] A plurality of the second fan arrays are arranged, and a plurality of the second fans are arranged at different heights.

[0015] For the chassis as described above, further, a first partition is provided on the first surface of the first side plate, and the first partition is used to separate the first fans at different heights;

[0016] A second partition is provided on the first surface of the second side plate, and the second partition is used to separate the second fans at different heights.

[0017] For the chassis as described above, further, it further includes a first outer cover plate covering the first surface of the first side plate and a second outer cover plate covering the first surface of the second side plate;

[0018] A second air inlet is provided on the first outer cover plate, and a second air outlet is provided on the first outer cover plate.

[0019] In a second aspect of the present invention, a board card integration component is provided, including the above-mentioned chassis and a plurality of functional board cards arranged in the chassis;

[0020] Heat dissipation plates are provided on the outer walls of each of the functional board cards, and a plurality of parallel heat dissipation channels are provided on the heat dissipation plates; the relatively arranged first air inlet and the first air outlet are respectively arranged at both ends of the heat dissipation channels.

[0021] For the board card integration component as described above, further, locking strips are provided on the outer walls at both ends of the functional board card, and the locking strips are in contact with the inner walls of the relatively arranged first slots or the second slots, and the locking strips are made of aluminum alloy.

[0022] In a third aspect of the present invention, a quantum computing measurement and control system is provided, including the above-mentioned board card integration component and a central control module, and the central control module controls the functional board cards in the board card integration component to output control signals for a quantum chip.

[0023] In a fourth aspect of the present utility model, a quantum computer is provided, which includes the above-mentioned quantum computing measurement and control system and a quantum chip, and the quantum chip operates based on the control signal output by the quantum computing measurement and control system.

[0024] The beneficial effects of the present utility model are as follows:

[0025] For the chassis of the present application, by respectively providing a plurality of first slots and a plurality of second slots arranged oppositely on the first side plate and the second side plate, the first slots and the second slots are respectively used to support both ends of the functional board; by respectively providing a first air inlet and a first air outlet arranged oppositely on the side walls of the first slot and the second slot, a first fan is provided on the first surface of the first side plate away from the first slot, and a second fan is provided on the first surface of the second side plate away from the second slot. In this way, the first fan inhales external air from the first air inlet and sends it into the chassis interior. The air passes through the functional board, and then the second fan discharges the hot air out of the chassis through the first air outlet, so as to efficiently dissipate the heat on the functional board to the outside of the chassis to meet the requirement of efficient heat dissipation.

[0026] The board card integration component, the quantum computing measurement and control system, and the quantum computer provided by the present utility model include the above-mentioned chassis, so they have the same beneficial effects, which will not be elaborated here. Description of the Drawings

[0027] Figure 1 It is a three-dimensional structure schematic diagram of the chassis provided by an embodiment of the present utility model;

[0028] Figure 2 It is an exploded structure schematic diagram of the chassis provided by an embodiment of the present utility model;

[0029] Figure 3 It is a front structure schematic diagram of the first side plate provided by an embodiment of the present utility model;

[0030] Figure 4 It is a reverse structure schematic diagram of the first side plate provided by an embodiment of the present utility model;

[0031] Figure 5 It is a front structure schematic diagram of the second side plate provided by an embodiment of the present utility model;

[0032] Figure 6 It is a reverse structure schematic diagram of the second side plate provided by an embodiment of the present utility model;

[0033] Figure 7 It is a structure schematic diagram of the functional board provided with heat sinks and locking bars in an embodiment of the present utility model.

[0034] In the attached drawing reference numerals: 10, chassis; 11, top plate; 12, bottom plate; 121, second groove; 13, first side plate; 131, first slot; 132, first air inlet; 133, first partition; 14, second side plate; 141, second slot; 142, first air outlet; 143, second partition; 15, first outer cover plate; 16, second outer cover plate; 17, second fan; 20, functional board; 30, heat dissipation plate; 40, locking strip. Detailed implementation manners

[0035] In order to enable those skilled in the art to better understand the technical solutions in this application, the following will clearly and completely describe the technical solutions in the embodiments of this application with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of this application. The embodiments described below with reference to the attached drawings are exemplary and are only used to explain this application, and cannot be construed as a limitation to this application.

[0036] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the attached drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present utility model.

[0037] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0038] Figure 1 It is a schematic three-dimensional structure diagram of the chassis 10 provided by the embodiment of the present utility model; Figure 2 It is an exploded structure diagram of the chassis 10 provided by the embodiment of the present utility model; Figure 3 It is a front structure diagram of the first side plate 13 provided by the embodiment of the present utility model; Figure 5 It is a front structure diagram of the second side plate 14 provided by the embodiment of the present utility model; as Figure 1 、 Figure 2 、 Figure 3 and Figure 5As shown: An embodiment of the present application discloses a chassis 10 for integrating several functional boards. The chassis 10 includes a top plate 11, a bottom plate 12, and a first side plate 13 and a second side plate 14 which are arranged opposite to each other between the top plate 11 and the bottom plate 12.

[0039] On the first side plate 13 and the second side plate 14, there are respectively arranged several first slots 131 and several second slots 141 which are arranged opposite to each other. The first slots 131 and the second slots 141 are respectively used to support both ends of the functional board; on the side walls of the first slots 131 and the second slots 141, there are respectively arranged a first air inlet 132 and a first air outlet 142 which are arranged opposite to each other.

[0040] On the first side of the first side plate 13 away from the first slots 131, there is a first fan, and on the first side of the second side plate 14 away from the second slots 141, there is a second fan.

[0041] In the chassis 10 of this embodiment, by respectively arranging several first slots 131 and several second slots 141 which are arranged opposite to each other on the first side plate 13 and the second side plate 14, the first slots 131 and the second slots 141 are respectively used to support both ends of the functional board; by respectively arranging a first air inlet 132 and a first air outlet 142 which are arranged opposite to each other on the side walls of the first slots 131 and the second slots 141, there is a first fan on the first side of the first side plate 13 away from the first slots 131, and there is a second fan on the first side of the second side plate 14 away from the second slots 141. In this way, the first fan inhales external air from the first air inlet 132 and sends it into the interior of the chassis 10. The air passes through the functional board, and then the second fan discharges the air with heat through the first air outlet 142 out of the chassis 10, so as to efficiently dissipate the heat on the functional board to the outside of the chassis 10 to meet the requirement of efficient heat dissipation.

[0042] In order to further improve the heat dissipation effect and reduce the weight of the chassis 10, in some embodiments of this embodiment, continue as Figure 1 As shown: On the side of the top plate 11 opposite to the bottom plate 12, there is a first groove; on the side of the bottom plate 12 opposite to the top plate 11, there is a second groove 121.

[0043] In this embodiment, the number of the first grooves is not specifically limited, and it can be 1 or multiple; the arrangement mode of multiple first grooves is not specifically limited either. Exemplarily, multiple first grooves are arranged in an array. The number of the second grooves 121 is not specifically limited, and it can be 1 or multiple; the arrangement mode of multiple second grooves 121 is not specifically limited either. Exemplarily, multiple second grooves 121 are arranged in an array.

[0044] In order to further improve the heat dissipation effect, in some embodiments of the present embodiment, continue as Figure 1 shown: A plurality of the first slots 131 are arranged in parallel, and a plurality of the second slots 141 are arranged in parallel. By arranging a plurality of the first slots 131 in parallel and a plurality of the second slots 141 in parallel, it is such that the heat dissipation channels of each functional board are arranged in parallel, reducing the mutual interference between the heat dissipation channels of each functional board and improving the heat dissipation effect.

[0045] In the present embodiment, the number of the first fans is not specifically limited. It can be 1 or multiple. In order to further improve the heat dissipation effect, in some embodiments of the present embodiment, a plurality of the first fans are arranged in an array, and a plurality of the first fans are arranged at different heights. Exemplarily, 6 first fans are arranged along 3 height directions, with 2 first fans arranged in each height direction; of course, a plurality of the first fans can also be arranged along the same height direction. Exemplarily, 2 first fans are arranged, and the 2 first fans are arranged at intervals along the same height direction.

[0046] In the present embodiment, the number of the second fans is not specifically limited. It can be 1 or multiple. In order to further improve the heat dissipation effect, in some embodiments of the present embodiment, a plurality of the second fans are arranged in an array, and a plurality of the second fans are arranged at different heights. Exemplarily, 6 second fans are arranged along 3 height directions, with 2 second fans arranged in each height direction (as Figure 2 shown); of course, a plurality of the second fans can also be arranged along the same height direction. Exemplarily, 2 second fans are arranged, and the 2 second fans are arranged at intervals along the same height direction.

[0047] In order to further improve the heat dissipation effect, in some embodiments of the present embodiment, Figure 4 is a schematic diagram of the reverse side structure of the first side plate 13 provided by the embodiment of the present utility model, Figure 6 is a schematic diagram of the reverse side structure of the second side plate 14 provided by the embodiment of the present utility model. As Figure 4 and Figure 6 shown: A first partition 133 is provided on the first surface of the first side plate 13, and the first partition 133 is used to separate the first fans at different heights; a second partition 143 is provided on the first surface of the second side plate 14, and the second partition 143 is used to separate the second fans at different heights. By providing the first partition 133 and the second partition 143, the mutual interference between different heat dissipation channels is reduced, and the heat dissipation effect is improved.

[0048] Furthermore, any two adjacent first fans can also be separated by partitions; this can further reduce the air flow interference between the first fans, improve the heat dissipation efficiency of each heat dissipation channel, and improve the heat dissipation effect.

[0049] Further, any two adjacent second fans can also be separated by a partition; this can further reduce the air flow interference between the second fans, improve the heat dissipation efficiency of each heat dissipation channel, and improve the heat dissipation effect.

[0050] Continue as Figure 1 and Figure 2 shown, in some embodiments of this embodiment, the chassis 10 further includes a first outer cover plate 15 covering the first surface of the first side plate 13 and a second outer cover plate 16 covering the first surface of the second side plate 14; a second air inlet is provided on the first outer cover plate 15, and a second air outlet is provided on the second outer cover plate 16. By providing the first outer cover plate 15 and the second outer cover plate 16, and at the same time, a second air inlet is provided on the first outer cover plate 15, and a second air outlet is provided on the second outer cover plate 16, in this way, while ensuring the heat dissipation effect, it also plays a role in dust prevention.

[0051] In this embodiment, the second air inlet can be a plurality of through holes arranged in an array; the second air outlet can be a plurality of through holes arranged in an array.

[0052] Based on the same inventive concept, an embodiment of the present application also proposes a board integration component, including the above-mentioned chassis 10 and several functional boards disposed in the chassis 10.

[0053] Figure 7 is a schematic structural diagram of the functional board 20 provided by the embodiment of the present invention after arranging the heat dissipation plate 30 and the locking strip 40; as Figure 7 shown, a heat dissipation plate 30 is provided on the outer wall of each functional board 20, and a plurality of parallel heat dissipation channels are provided on the heat dissipation plate 30; the relatively arranged first air inlet 132 and the first air outlet 142 are respectively arranged at both ends of the heat dissipation channel.

[0054] The board integration component of this embodiment includes the above-mentioned chassis 10, so it has the same beneficial effects as the above-mentioned chassis 10, which will not be elaborated here. In addition, in this embodiment, by providing a heat dissipation plate 30 on the outer wall of the functional board, a plurality of parallel heat dissipation channels are provided on the heat dissipation plate 30; the relatively arranged first air inlet 132 and the first air outlet 142 are respectively arranged at both ends of the heat dissipation channel; with this arrangement, the mutual interference between different heat dissipation channels is reduced, and the heat dissipation effect is improved.

[0055] In order to further improve the heat dissipation effect, in some embodiments of this embodiment, continue as Figure 7As shown in the figure: Locking strips 40 are provided on the outer walls at both ends of the functional board 20. The locking strips 40 are in contact with the inner walls of the relatively arranged first slots 131 or second slots 141. The locking strips 40 are made of aluminum alloy. By using the aluminum alloy locking strips 40, while ensuring locking, it also ensures efficient heat conduction between the functional board 20 and the first slots 131 and second slots 141, that is, it ensures efficient heat conduction between the functional board 20 and the chassis 10, thereby improving the heat dissipation effect.

[0056] Based on the same inventive concept, an embodiment of the present application further provides a quantum computing measurement and control system, including the above-mentioned board integration component and a central control module. The central control module controls the functional boards in the board integration component to output control signals for the quantum chip. Since the quantum computing measurement and control system of the present application includes the above-mentioned board integration component, it has the same beneficial effects as the above-mentioned board integration component, which will not be elaborated here.

[0057] Based on the same inventive concept, an embodiment of the present application further provides a quantum computer, including the above-mentioned quantum computing measurement and control system and a quantum chip. The quantum chip operates based on the control signals output by the quantum computing measurement and control system. Since the quantum computer of the present application includes the above-mentioned quantum computing measurement and control system, it has the same beneficial effects as the above-mentioned quantum computing measurement and control system, which will not be elaborated here.

[0058] In the description of this specification, the description with reference to terms such as "some embodiments" or "examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification.

[0059] The above are only the preferred embodiments of the present invention and do not impose any limitation on the present invention. Any person skilled in the art, without departing from the scope of the technical solution of the present invention, makes any form of equivalent replacement or modification and other changes to the technical solution and technical content disclosed in the present invention, which are all within the content of the technical solution of the present invention and still fall within the protection scope of the present invention.

Claims

1. A chassis for integrating several functional boards, characterized in that, The chassis includes a top plate, a bottom plate, and a first side plate and a second side plate that are arranged opposite to each other between the top plate and the bottom plate; A plurality of first slots and a plurality of second slots that are arranged opposite to each other are respectively provided on the first side plate and the second side plate. The first slots and the second slots are respectively used to support both ends of the functional board. First air inlets and first air outlets that are arranged opposite to each other are respectively provided on the side walls of the first slots and the second slots; A first fan is provided on a first surface of the first side plate away from the first slots, and a second fan is provided on a first surface of the second side plate away from the second slots.

2. The chassis according to claim 1, characterized in that, A first groove is provided on a surface of the top plate opposite to the bottom plate; A second groove is provided on a surface of the bottom plate opposite to the top plate.

3. The chassis according to claim 1, wherein, A plurality of the first slots are arranged in parallel, and a plurality of the second slots are arranged in parallel.

4. The chassis according to claim 1, characterized in that, The first fans are arranged in an array with multiple ones, and the multiple first fans are arranged at different heights; The second fans are arranged in an array with multiple ones, and the multiple second fans are arranged at different heights.

5. The chassis according to claim 4, characterized in that, A first partition is provided on the first surface of the first side plate, and the first partition is used to separate the first fans at different heights; A second partition is provided on the first surface of the second side plate, and the second partition is used to separate the second fans at different heights.

6. The chassis according to claim 1, characterized in that, It further includes a first outer cover plate covering the first surface of the first side plate and a second outer cover plate covering the first surface of the second side plate; A second air inlet is provided on the first outer cover plate, and a second air outlet is provided on the second outer cover plate.

7. A board card integrated component, characterized in that, It includes the chassis according to any one of claims 1-6 and a plurality of functional boards arranged in the chassis; Heat dissipation plates are provided on the outer walls of each of the functional boards, and a plurality of heat dissipation channels arranged in parallel are provided on the heat dissipation plates; The first air inlets and the first air outlets that are arranged opposite to each other are respectively arranged at both ends of the heat dissipation channels.

8. The board card integrated component according to claim 7, wherein Locking strips are provided on the outer walls at both ends of the functional board, and the locking strips are in contact with the groove walls of the first slots or the second slots that are arranged opposite to each other. The locking strips are made of aluminum alloy.

9. A quantum computing measurement and control system, characterized in that, It includes the board card integration component according to any one of claims 7-8, and a central control module. The central control module controls the functional boards in the board card integration component to output control signals for the quantum chip.

10. A quantum computer, characterized in that, It includes the quantum computing measurement and control system according to claim 9 and a quantum chip. The quantum chip operates based on the control signals output by the quantum computing measurement and control system.

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