Copper bar laminating and film covering jig

The copper bar stacking laminating fixture enables simultaneous processing of multiple copper bars with uniform pressure and heat distribution, enhancing production efficiency and reducing costs by allowing high-quality coating in a single operation.

CN223108583UActive Publication Date: 2025-07-15GUANGDONG SHENGLAN NEW ENERGY TECH CO LTD
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Patent Information

Application Number
CN202422036290.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-22
Publication Date
2025-07-15
Estimated Expiration
2034-08-22

AI Technical Summary

Technical Problem

In the prior art, the copper coating process is inefficient, resulting in increased production costs and time.

Method used

A copper row laminated film fixture is designed, including an upper formwork, a lower formwork and a copper row laminated film auxiliary device. The copper row is fixed by positioning needles, and the silicone layer and foam layer provide support and cushioning, the Teflon layer prevents adhesion, and the release paper prevents adhesion, so as to achieve simultaneous treatment of multiple layers of copper rows.

Benefits of technology

Significantly improves production efficiency, ensures coating quality, and reduces bubbles and gaps, reducing production costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a copper bar laminating and laminating jig which comprises an upper die plate, a lower die plate and copper bar laminating auxiliary devices, each copper bar laminating auxiliary device wraps a layer of copper bar and is positioned on the lower die plate through a positioning needle of the lower die plate, the upper die plate is used for pressing all layers of copper bars wrapped with the copper bar laminating auxiliary devices, and the copper bar laminating auxiliary devices are positioned on the lower die plate through a positioning needle of the lower die plate. The copper bar film coating auxiliary device comprises an upper silica gel layer, an upper foam layer, a lower silica gel layer and a lower foam layer, the upper silica gel layer and the upper foam layer are sequentially stacked on the upper surface of the upper insulating layer of each layer of copper bar, and the lower silica gel layer and the lower foam layer are sequentially stacked on the lower surface of the lower insulating layer of each layer of copper bar. According to the invention, through the stacking design, multiple layers of copper bars are allowed to be processed at the same time, and the production efficiency is remarkably improved; and (2) the upper silica gel layer, the upper foam layer, the lower silica gel layer and the lower foam layer in the copper bar film covering auxiliary device act together to provide good support and buffer for the copper bar and the insulating film, and uniform pressure and heat distribution in the film covering process are ensured.
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Description

Technical Field

[0001] This application relates to the field of copper bar film laminating fixtures, and particularly to a copper bar stacked film laminating fixture. Background Art

[0002] In the prior art for film laminating of copper bars, the basic principle is to cover the surface of the copper bar with an insulating film and make the insulating film closely combine with the copper bar under high temperature and high pressure conditions, so as to form a protective layer. This process generally includes the following steps:

[0003] Fixture Preparation: First, place a layer of insulating film as the bottom layer on the film laminating fixture, ensuring that the surface of the fixture is flat and clean.

[0004] Copper Bar Placement: Then, precisely place the copper bar to be film laminated on the insulating film, ensuring that there are no bubbles and gaps between the copper bar and the insulating film.

[0005] Insulating Film Coverage: Place another layer of insulating film above the copper bar to completely cover the surface of the copper bar, forming a "insulating film - copper bar - insulating film" sandwich structure.

[0006] High Temperature and High Pressure Film Laminating: Place the entire sandwich structure into the film laminating equipment and perform film laminating treatment under high temperature and high pressure conditions. During this process, the insulating film will soften and closely adhere to the surface of the copper bar, forming a firm protective layer.

[0007] The main disadvantages of the prior art are: Since the single film laminating method is adopted, only one layer of copper bar can be processed each time, resulting in low overall production efficiency. In large-scale production, this low efficiency will significantly increase production costs and time. Utility Model Content

[0008] The purpose of this application is to provide a copper bar stacked film laminating fixture that can improve production efficiency and film laminating quality.

[0009] To achieve the above purpose, this application provides the following technical solutions:

[0010] A copper bar stacked film laminating fixture includes an upper template, a lower template, and a copper bar film laminating auxiliary device. Each group of the copper bar film laminating auxiliary devices wraps one layer of copper bar and is positioned on the lower template through the positioning pins of the lower template. The upper template is used to press the copper bars after each layer is wrapped with the copper bar film laminating auxiliary device. The copper bar film laminating auxiliary device includes an upper silica gel layer, an upper foam layer, a lower silica gel layer, and a lower foam layer. The upper silica gel layer and the upper foam layer are sequentially stacked on the upper surface of the upper insulating layer of each layer of copper bar, and the lower silica gel layer and the lower foam layer are sequentially stacked on the lower surface of the lower insulating layer of each layer of copper bar.

[0011] Further, a Teflon layer is provided between each layer of copper bars, and the Teflon layer is provided on the upper foam layer.

[0012] Further, a first release paper is provided between the upper foam layer and the upper insulating layer, and a second release paper is provided between the lower foam layer and the lower insulating layer.

[0013] Further, the upper foam layer and the lower foam layer are low - viscosity foam layers.

[0014] Further, three guide posts are provided on the lower template, and each guide post is respectively arranged at three corners of the lower template.

[0015] Further, a guide sleeve is provided on the upper template corresponding to the guide post.

[0016] Further, a first handle is provided on the side of the upper template.

[0017] Further, a second handle is provided on the side of the lower template.

[0018] Further, cooling water channels are respectively provided inside the upper template and the lower template.

[0019] Further, guide rails are provided at the bottom of the lower template.

[0020] The beneficial effects of this application are as follows:

[0021] (1) Through the laminated design, this application allows multiple copper bars to be processed simultaneously, significantly improving production efficiency.

[0022] (2) In the copper bar film - covering auxiliary device of this application, the upper silica gel layer, the upper foam layer, the lower silica gel layer and the lower foam layer work together to provide good support and buffering for the copper bar and the insulating film, ensuring uniform pressure and heat distribution during the film - covering process. Description of the Drawings

[0023] Figure 1 It is a schematic structural diagram of the copper bar laminated film - covering fixture provided by an embodiment of this application after being installed on a hot press;

[0024] Figure 2 It is a schematic structural diagram of the copper bar laminated film - covering fixture provided by an embodiment of this application;

[0025] Figure 3 It is a schematic structural diagram of the copper bar laminated film - covering fixture provided by an embodiment of this application after being disassembled;

[0026] Figure 4 It is a schematic structural diagram of the copper bar, the upper insulating layer and the lower insulating layer provided by an embodiment of this application after being disassembled;

[0027] Explanation of the Reference Numerals:

[0028] a, hot press; b, copper bar laminated film - covering fixture; C, copper bar

[0029] 1. Upper template; 2. Lower template; 3. Copper busbar film laminating auxiliary device; 4. Upper insulating layer; 5. Lower insulating layer; 6. Teflon layer; 8. Guide post; 9. First handle; 10. Second handle; 11. Guide rail;

[0030] 31. Upper silicone layer; 32. Upper foam layer; 33. Lower silicone layer; 34. Lower foam layer; Detailed implementation manners

[0031] The terms used in the implementation manners part of this application are only used to explain the specific embodiments of this application, rather than aiming to limit this application. The implementation manners of the embodiments of this application will be described in detail below with reference to the drawings.

[0032] As Figure 1 and Figure 2 shown, the copper busbar C laminated film tool b is generally installed in the hot press a, and the hot press a drives the tool to complete the film laminating process through a series of mechanical and control systems. The following are the general steps and principles for the hot press a to drive the tool:

[0033] The hot press a mainly consists of a heating system, a hydraulic system, a control system, and a mechanical structure, etc. The heating system is used to provide the required temperature, the hydraulic system is responsible for generating pressure, and the control system precisely regulates the entire process.

[0034] The heating system of the hot press a is started to heat the upper and lower templates 2 to reach the temperature required for film lamination. The temperature control is usually achieved jointly by the temperature sensor and the heating element in the control system to ensure accurate and stable temperature.

[0035] The operator places the copper busbar C laminated film tool b on the lower template 2 of the hot press a, ensuring that the positioning pins accurately fix the copper busbar C and the film laminating auxiliary device.

[0036] The copper busbar C and materials such as insulating films are placed in the established order and positions.

[0037] When heated to the predetermined temperature, the hydraulic system starts to work. The hydraulic system generates pressure through the hydraulic cylinder to drive the upper template 1 to move downward, applying pressure to the copper busbar C and the insulating film in the tool. The magnitude and application time of the pressure are precisely controlled by the control system according to the preset parameters.

[0038] Under the combined action of pressure and temperature, the insulating film is closely attached to the copper busbar C to form a high-quality film laminating layer. The control system continuously monitors the temperature and pressure to ensure that they remain within the predetermined range. After the film lamination is completed, the hot press a stops heating and gradually cools down. After the operator waits for the tool and the copper busbar C to cool to a safe temperature, the operator takes out the tool and separates the copper busbar C.

[0039] AsFigure 3 and Figure 4 As shown in Figure 4 , in this embodiment, a copper busbar C laminated film covering fixture b includes an upper template 1, a lower template 2, and a copper busbar C film covering auxiliary device 3. The upper template 1 is made of high-temperature-resistant and high-strength alloy steel or cemented carbide to ensure no deformation under high-temperature and high-pressure environments. As the main pressing component during the hot pressing process, it is driven by a hydraulic system to move downward and apply uniform pressure to the copper busbar C and the film covering auxiliary device.

[0040] The lower template 2 is also made of high-temperature-resistant and high-strength materials and is matched with the upper template 1. As the base of the fixture, it supports the entire copper busbar C laminated structure. Precise positioning pins are provided on the lower template 2 to fix the copper busbar C film covering auxiliary device 3 and the copper busbar C, ensuring that they do not move or misalign during the hot pressing process.

[0041] The copper busbar C film covering auxiliary device 3 includes an upper silica gel layer 31, an upper foam layer 32, a lower silica gel layer 33, and a lower foam layer 34. Upper silica gel layer 31: Directly contacts the insulating layer 4 on the copper busbar C, providing a soft buffer layer to prevent damage to the copper busbar C.

[0042] Upper foam layer 32: Located above the upper silica gel layer 31, further enhancing the buffering effect and helping to evenly distribute the pressure.

[0043] Lower silica gel layer 33: Contacts the lower insulating layer 5 of the copper busbar C, with the same function as the upper silica gel layer 31.

[0044] Lower foam layer 34: Located below the lower silica gel layer 33, with the same function as the upper foam layer 32.

[0045] Provides comprehensive protection and support for the copper busbar C, ensuring that the insulating film is closely attached to the copper busbar C, while reducing the generation of bubbles and gaps.

[0046] The working principle is as follows: Place the copper busbar C on the lower template 2 in a predetermined order and position, ensuring an appropriate gap between each layer of the copper busbar C. Wrap the copper busbar C film covering auxiliary device 3 around each layer of the copper busbar C, ensuring that the silica gel layer and the foam layer are closely attached to the insulating layer of the copper busbar C. Use the positioning pins on the lower template 2 to fix the copper busbar C film covering auxiliary device 3 and the copper busbar C to prevent them from moving during the hot pressing process.

[0047] Start the hot press a, the heating system starts to work, heating the upper and lower templates 2 to a predetermined temperature. The control system monitors the temperature. After ensuring that the temperature required for film covering is reached, the hydraulic system starts to work. The hydraulic cylinder drives the upper template 1 to move downward, applying uniform pressure to the copper busbar C and the film covering auxiliary device in the fixture. Under high-temperature and high-pressure environments, the insulating film is closely attached to the copper busbar C, forming a high-quality film covering layer. The control system controls the hot pressing time and pressure magnitude according to preset parameters to ensure the best film covering effect.

[0048] After the hot pressing is completed, the hot press a stops heating and gradually cools down to a safe temperature. After the operator waits for the jig and the copper bar C to cool down, the operator takes out the jig and separates the copper bar C.

[0049] In this embodiment, a Teflon layer 6 is provided between each layer of the copper bar C, and the Teflon layer 6 is provided on the upper foam layer 32. The Teflon layer 6 has an extremely low coefficient of friction and surface energy, which makes it not easily adhere to other substances, including the foam layer. Even in a high-temperature environment, the Teflon layer 6 can maintain its non-stick property and effectively prevent the adhesion between the foam layers. During the hot pressing process under high temperature and high pressure, the foam layer may soften due to heat and is prone to adhesion. The presence of the Teflon layer 6 effectively isolates the direct contact between the foam layers and prevents them from sticking together due to high temperature, thus ensuring the clear stratification and easy separation of the copper bar C laminated structure.

[0050] In this embodiment, a first release paper is provided between the upper foam layer 32 and the upper insulating layer 4, and a second release paper is provided between the lower foam layer 34 and the lower insulating layer 5. The release paper has excellent release performance and can be easily separated from the foam layer without leaving residual glue or damaging the insulating layer. This effectively prevents the foam layer from adhering to the insulating layer after softening at high temperature and ensures the integrity and performance of the insulating layer.

[0051] In this embodiment, the upper foam layer 32 and the lower foam layer 34 are low-adhesion foam layers. The low-adhesion foam layers are not easily adhered to other materials (such as the insulating layer or the copper bar C) during the hot pressing process under high temperature and high pressure, thus ensuring the clear stratification of the copper bar C laminated structure.

[0052] As Figure 3 shown, in this embodiment, three guide posts 8 are provided on the lower template 2, and each guide post 8 is respectively provided at three corners of the lower template 2. The guide posts 8 are important components in the mold or jig, mainly playing the roles of positioning and guiding. They ensure that the upper template 1 and the lower template 2 can be accurately aligned during mold closing, preventing deviation or misalignment, and thus ensuring the processing accuracy of the product.

[0053] As Figure 3 shown, in this embodiment, the upper template 1 is provided with guide sleeves corresponding to the guide posts 8.

[0054] As Figure 3 shown, in this embodiment, a first handle 9 is provided on the side of the upper template 1. The setting of the first handle 9 enables the operator to easily grasp and move the upper template 1, especially when it is necessary to align or separate it from the lower template 2.

[0055] As Figure 3 shown, in this embodiment, a second handle 10 is provided on the side of the lower template 2. The setting of the second handle enables the operator to easily grasp and move the lower template 2.

[0056] In this embodiment, cooling water channels (not shown in the figure) are respectively arranged in the upper template 1 and the lower template 2 to accelerate the cooling process of the template after hot pressing. The cooled template is easier to separate because the material will shrink and reduce adhesion.

[0057] As Figure 2 shown, in this embodiment, a guide rail 11 is provided at the bottom of the lower template 2. In this way, after hot pressing is completed, the lower template 2 can be taken out of the fixture by sliding or pulling, without complex disassembly operations.

[0058] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, or an indirect connection through an intermediate medium, and can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.

[0059] The device or element referred to in the embodiments of the present application or implied must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "a plurality" is two or more, unless otherwise specifically and precisely defined.

[0060] The terms "first", "second", "third", "fourth", etc. (if any) in the description of the embodiments of the present application and the claims and the above drawings are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances, so that the embodiments of the present application described here, for example, can be implemented in an order other than those illustrated or described here. In addition, the terms "may include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units does not have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products, or devices.

[0061] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, and are not intended to limit them. Although the technical solutions described in the foregoing embodiments of the present application have been described in detail, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features. And these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A copper busbar laminated film fixture, characterized in that: It includes an upper template, a lower template and a copper bar film laminating auxiliary device. Each group of the copper bar film laminating auxiliary devices wraps a layer of copper bar and is positioned on the lower template by the positioning pins of the lower template. The upper template is used to press the copper bars wrapped with the copper bar film laminating auxiliary devices in each layer. The copper bar film laminating auxiliary device includes an upper silica gel layer, an upper foam layer, a lower silica gel layer and a lower foam layer. The upper silica gel layer and the upper foam layer are sequentially stacked on the upper surface of the upper insulating layer of each layer of copper bar, and the lower silica gel layer and the lower foam layer are sequentially stacked on the lower surface of the lower insulating layer of each layer of copper bar.

2. The copper row laminated film fixture according to claim 1, characterized in that: A Teflon layer is provided between each layer of copper bar, and the Teflon layer is provided on the upper foam layer.

3. The copper row laminated film fixture according to claim 1, characterized in that: A first release paper is provided between the upper foam layer and the upper insulating layer, and a second release paper is provided between the lower foam layer and the lower insulating layer.

4. A copper row stacking and laminating fixture according to claim 1, characterized in that: The upper foam layer and the lower foam layer are low-adhesion foam layers.

5. A copper row stacking and film laminating jig according to claim 1, characterized in that: Three guide posts are provided on the lower template, and each guide post is respectively provided at three corners of the lower template.

6. The copper bar stacking and film laminating fixture according to claim 1, wherein: The upper template is provided with guide sleeves corresponding to the guide posts.

7. A copper bar laminated film covering fixture according to claim 1, characterized in that: A first handle is provided on the side of the upper template.

8. A copper row laminated film tool according to claim 1, characterized in that: A second handle is provided on the side of the lower template.

9. A copper row stacking and film laminating jig according to claim 1, characterized in that: Cooling water channels are respectively provided in the upper template and the lower template.

10. A copper row stacking and film laminating fixture according to claim 1, characterized in that: A guide rail is provided at the bottom of the lower template.

Citation Information

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