Parallel hybrid capacitor

Abstract

The utility model discloses a parallel hybrid capacitor, and belongs to the field of capacitors. Comprising a mould pressing packaging shell, an extraction electrode pole piece, a carrier tape, at least one chip tantalum capacitor and at least one multilayer ceramic capacitor. Wherein each chip tantalum capacitor and each multi-layer ceramic capacitor are arranged in parallel and packaged in the mould pressing packaging shell; the carrier tape is arranged at the end parts of the chip tantalum capacitors and the multi-layer ceramic capacitors which are arranged in parallel; an electrode of the chip tantalum capacitor and an electrode of the multi-layer ceramic capacitor are electrically connected with the carrier band, and are connected in parallel through the carrier band to form a hybrid capacitor inner core with a parallel structure; the two sides of the exterior of the mold pressing packaging shell are respectively provided with an extraction electrode pole piece, and the two extraction electrode pole pieces are electrically connected with a carrier band in the mold pressing packaging shell. The capacitor can improve the frequency characteristic of a product and improve the high-frequency filtering effect on the premise of ensuring the stable capacity, and has relatively stable filtering performance.

Description

Technical Field

[0001] The utility model relates to the field of capacitors, and particularly to a parallel hybrid capacitor. Background Art

[0002] Electronic components are components of electronic elements and small machines and instruments. They are often composed of several parts and can be used interchangeably in similar products. They usually refer to certain parts in industries such as electrical appliances, radio, and instruments, and are the general term for electronic devices such as capacitors, transistors, hairsprings, and mainsprings.

[0003] Capacitors are one of the three basic electronic components and are widely used in modern circuit applications, playing roles such as filtering, decoupling, and bypassing. With the continuous increase in the frequency of integrated circuits and the increasingly strict requirements for packaging area, the capacitor manufacturing technology needs to be further developed to meet the market needs. At present, there are many types of capacitors on the market, but different types of capacitors have different characteristics. For example, electrolytic capacitors, including tantalum electrolytic capacitors, are used in circuit applications that require a relatively large capacitance. With the rapid development of electronic information technology, the replacement speed of digital electronic products is getting faster and faster. The production and sales volume of consumer electronic products mainly including flat-panel TVs (LCD and PDP), notebook computers, digital cameras, etc. continue to grow, driving the growth of the capacitor industry.

[0004] However, the existing capacitors are of a single type and at least have the following problems:

[0005] (1) For a capacitor with a given capacitance, as the equivalent series resistance increases, both the ripple voltage and the power dissipation of the capacitor will increase accordingly.

[0006] (2) When a multilayer ceramic capacitor generates mechanical vibration, piezoelectric noise will be generated, resulting in system signal distortion.

[0007] In view of this, the present utility model is specifically proposed. Content of the Utility Model

[0008] The purpose of the present utility model is to provide a parallel hybrid capacitor, which can improve the frequency characteristics of the product, improve the high-frequency filtering effect, and have relatively stable filtering performance on the premise of ensuring the stable capacitance, thereby solving the above-mentioned technical problems existing in the prior art.

[0009] The purpose of the present utility model is achieved through the following technical solutions:

[0010] A parallel hybrid capacitor includes:

[0011] A molded encapsulation shell, lead-out electrode plates, a carrier tape, at least one chip tantalum capacitor, and at least one multilayer ceramic capacitor; wherein,

[0012] Each chip tantalum capacitor and each multilayer ceramic capacitor are arranged side by side and encapsulated in the molded encapsulation housing;

[0013] The carrier tape is arranged at the ends of the chip tantalum capacitors and the multilayer ceramic capacitors arranged side by side;

[0014] The electrodes of the chip tantalum capacitor and the electrodes of the multilayer ceramic capacitor are both electrically connected to the carrier tape, and are connected in parallel through the carrier tape to form the inner core of the hybrid capacitor with a parallel structure;

[0015] Lead-out electrode plates are respectively arranged on both sides of the outside of the molded encapsulation housing, and the two lead-out electrode plates are electrically connected to the carrier tape inside the molded encapsulation housing.

[0016] Compared with the prior art, the parallel hybrid capacitor provided by the present invention has the following beneficial effects:

[0017] After at least one chip tantalum capacitor and at least one multilayer ceramic capacitor are connected in parallel through a carrier tape to form a combined structure of a hybrid capacitor, and then encapsulated in a molded encapsulation housing, an overall capacitor simultaneously has the advantages of both chip tantalum capacitors and multilayer ceramic capacitors. Thus, on the premise of ensuring stable capacitance, the frequency characteristics of the product can be improved, the high-frequency filtering effect can be improved, and the filtering performance is relatively stable, and excellent performance is achieved throughout the frequency band. It has excellent performance in electrical performance parameters, electrical performance stability, product reliability, and actual filtering effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0019] Figure 1 It is a schematic diagram of the overall structure of the parallel hybrid capacitor provided by the embodiment of the present invention.

[0020] Figure 2 It is a schematic diagram of the internal structure of the parallel hybrid capacitor provided by the embodiment of the present invention.

[0021] In the figure: 1 - Molded encapsulation housing; 2 - Lead-out electrode plate; 3 - Carrier tape; 4 - Chip tantalum capacitor; 5 - Multilayer ceramic capacitor. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] The following clearly and completely describes the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings in the embodiments of the present utility model; obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments, which does not constitute a limitation to the present utility model. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0023] First, the terms that may be used in this article are described as follows:

[0024] The term "and / or" means that either one of the two or both can be achieved. For example, X and / or Y means that it includes both the case of "X" or "Y" and the three cases of "X and Y".

[0025] The description of terms such as "comprising", "including", "containing", "having" or other similar semantics should be interpreted as non-exclusive inclusion. For example: including a certain technical feature element (such as raw materials, components, ingredients, carriers, dosage forms, materials, dimensions, parts, components, mechanisms, devices, steps, processes, methods, reaction conditions, processing conditions, parameters, algorithms, signals, data, products or articles, etc.) should be interpreted as not only including the clearly listed certain technical feature element, but also including other technical feature elements well-known in the art that are not clearly listed.

[0026] The term "consisting of" means excluding any technical feature element that is not clearly listed. If this term is used in a claim, this term will make the claim a closed type, so that it does not include technical feature elements other than the clearly listed technical feature elements, except for related conventional impurities. If this term only appears in a sub-clause of a claim, then it only limits the elements clearly listed in that sub-clause, and the elements recorded in other sub-clauses are not excluded from the overall claim.

[0027] Unless otherwise clearly specified or limited, terms such as "installed", "connected", "joined", "fixed", etc. should be understood in a broad sense. For example: it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this article can be understood according to specific circumstances.

[0028] The terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of description and simplification of the description, rather than explicitly or implicitly indicating that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation to this article.

[0029] The following provides a detailed description of the solution provided by the present utility model. The content not described in detail in the embodiments of the present utility model belongs to the prior art well-known to those skilled in the art. For the conditions not specified in the embodiments of the present utility model, they are carried out according to the conventional conditions in the art or the conditions recommended by the manufacturer. For the reagents or instruments not specified in the embodiments of the present utility model for the manufacturer, they are all conventional products that can be obtained through commercial purchase.

[0030] As Figure 1 、 Figure 2 shown, an embodiment of the present invention provides a parallel hybrid capacitor, which is a parallel hybrid capacitor of a chip tantalum capacitor and a multilayer ceramic capacitor, including:

[0031] A molded encapsulation shell 1, lead-out electrode plates 2, a carrier tape 3, at least one chip tantalum capacitor 4 and at least one multilayer ceramic capacitor 5; wherein,

[0032] Each chip tantalum capacitor 4 and each multilayer ceramic capacitor 5 are arranged side by side and encapsulated in the molded encapsulation shell 1;

[0033] The carrier tape 3 is arranged at the ends of each chip tantalum capacitor 4 and each multilayer ceramic capacitor 5 arranged side by side;

[0034] The electrodes of the chip tantalum capacitor 4 and the electrodes of the multilayer ceramic capacitor 5 are both electrically connected to the carrier tape 3, and are connected in parallel through the carrier tape 3 to form the inner core of the hybrid capacitor with a parallel structure;

[0035] On both sides of the outside of the molded encapsulation shell 1, lead-out electrode plates 2 are respectively provided, and the two lead-out electrode plates 2 are electrically connected to the carrier tape 3 inside the molded encapsulation shell 1.

[0036] Preferably, in the above capacitor, the carrier tape 3 is connected in parallel to each chip tantalum capacitor 4 and each multilayer ceramic capacitor 5 by welding.

[0037] Preferably, in the above capacitor, the molded encapsulation shell 1 adopts an epoxy resin encapsulation shell.

[0038] Preferably, in the above capacitor, the size of the molded encapsulation housing 1 matches the sizes of the chip tantalum capacitor 4 and the multilayer ceramic capacitor 5.

[0039] The above parallel hybrid capacitor is manufactured in the following manner, including:

[0040] Step 1: Design the size of the molded encapsulation housing 1 according to the product's specification model;

[0041] Step 2: Determine the specifications and quantities of the chip tantalum capacitor 4 and the multilayer ceramic capacitor 5 selected according to the product's specification model;

[0042] Step 3: Solder the chip tantalum capacitor 4 and the multilayer ceramic capacitor 5 in parallel on the carrier tape 3 to form the inner core of the parallel hybrid capacitor;

[0043] Step 4: Solder the lead electrode tab 2;

[0044] Step 5: Perform molded encapsulation to encapsulate the inner core of the parallel hybrid capacitor in the molded encapsulation housing 1.

[0045] In summary, the parallel hybrid capacitor of the embodiment of the present invention combines the advantages of the chip tantalum capacitor and the multilayer ceramic capacitor. It can improve the frequency characteristics of the product while ensuring stable capacitance, improve the high-frequency filtering effect, has relatively stable filtering performance, and has excellent performance throughout the frequency band. It has excellent performance in electrical performance parameters, electrical performance stability, product reliability, and actual filtering effect.

[0046] In order to more clearly show the technical solution provided by the present invention and the technical effects produced, the following uses specific embodiments to describe in detail the solution provided by the embodiments of the present invention.

[0047] Embodiment 1

[0048] Please refer to Figure 1-2 , this embodiment provides a parallel hybrid capacitor of a chip tantalum capacitor and a multilayer ceramic capacitor, including: a molded encapsulation housing 1, the two ends of the molded encapsulation housing 1 are provided with lead electrode tabs 2, the lead electrode tabs 2 are connected to the internal carrier tape 3, and the internal carrier tape 3 is connected to the chip tantalum capacitor 4 and the multilayer ceramic capacitor 5 in parallel.

[0049] Further, the molded encapsulation housing 1 is made of epoxy resin material.

[0050] Further, electronic components are fixedly installed inside the molded encapsulation housing 1 and are connected in parallel.

[0051] Further, the lead electrode tabs 2 provided at both ends are connected to the internal carrier tape 3.

[0052] Further, the internal carrier tape 3 connects the chip tantalum capacitor 4 and the multilayer ceramic capacitor 5 by welding.

[0053] Based on the above-mentioned parallel hybrid capacitor of a chip tantalum capacitor and a multilayer ceramic capacitor, a manufacturing method of a parallel hybrid capacitor of a chip tantalum capacitor and a multilayer ceramic capacitor is proposed as follows:

[0054] Design the size of the molded package housing 1 according to the specifications and models of the product; determine the specifications and quantities of the chip tantalum capacitor 4 and the multilayer ceramic capacitor 5 selected according to the specifications and models of the product; weld the chip tantalum capacitor 4 and the multilayer ceramic capacitor 5 on the carrier tape 3 in parallel; weld the lead electrode tab 2; perform molded packaging to obtain the final parallel hybrid capacitor of the chip tantalum capacitor and the multilayer ceramic capacitor. This parallel hybrid capacitor combines the advantages of the chip tantalum capacitor and the multilayer ceramic capacitor. It can improve the frequency characteristics of the product while ensuring stable capacitance, improve the high-frequency filtering effect, has relatively stable filtering performance, and has excellent performance throughout the frequency band. It has excellent performance in terms of electrical performance parameters, electrical performance stability, product reliability, and actual filtering effect.

[0055] The above is only the preferred specific implementation manner of the present utility model, but the protection scope of the present utility model is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present utility model should be covered within the protection scope of the present utility model. Therefore, the protection scope of the present utility model should be subject to the protection scope of the claims. The information disclosed in the background art part of this article is only intended to deepen the understanding of the overall background technology of the present utility model, and should not be regarded as an admission or any form of suggestion that this information constitutes the prior art known to those skilled in the art.

Claims

1. A parallel hybrid capacitor, characterized in that, Comprising: A molded encapsulation housing (1), lead-out electrode plates (2), a carrier tape (3), at least one chip tantalum capacitor (4) and at least one multilayer ceramic capacitor (5); wherein, Each chip tantalum capacitor (4) and each multilayer ceramic capacitor (5) are arranged side by side and encapsulated in the molded encapsulation housing (1); The carrier tape (3) is arranged at the ends of the chip tantalum capacitors (4) and the multilayer ceramic capacitors (5) arranged side by side; The electrodes of the chip tantalum capacitor (4) and the electrodes of the multilayer ceramic capacitor (5) are both electrically connected to the carrier tape (3), and are combined in parallel through the carrier tape (3) to form a hybrid capacitor inner core with a parallel structure; Lead-out electrode plates (2) are respectively arranged on both outer sides of the molded encapsulation housing (1), and the two lead-out electrode plates (2) are electrically connected to the carrier tape (3) inside the molded encapsulation housing (1).

2. The parallel hybrid capacitor according to claim 1, wherein, The carrier tape (3) is connected in parallel to each chip tantalum capacitor (4) and each multilayer ceramic capacitor (5) by welding.

3. The parallel hybrid capacitor according to claim 1 or 2, characterized in that, The molded encapsulation housing (1) is an epoxy resin encapsulation housing.

4. The parallel hybrid capacitor according to claim 1 or 2, characterized in that, The size of the molded encapsulation housing (1) is matched with the sizes of the chip tantalum capacitor (4) and the multilayer ceramic capacitor (5).

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