Cavity module and semiconductor device

Abstract

The embodiment of the utility model provides a cavity module and semiconductor equipment. The cavity module comprises a cavity cold plate and a switching part, the switching part is arranged on the outer surface of the cavity cold plate, the switching part is connected with the cavity cold plate to circulate a liquid cooling working medium, the switching part is provided with a first switching end, and a port of the first switching end is arranged towards a first direction; the first switching end is used for being matched with a joint part in an accommodating cavity of the semiconductor equipment in an inserted mode, and an opening of the accommodating cavity faces the first direction. The first switching end can be directly pulled out of or inserted into the joint part from the joint part in the first direction, unlocking or locking between the cavity module and the machine body is achieved, operation is simple and rapid, and the disassembly and assembly efficiency between the cavity module and the machine body is improved.

Description

Technical Field

[0001] The present application relates to the field of equipment technology, and in particular to a cavity module and semiconductor equipment. Background Art

[0002] Some semiconductor equipment, such as remote plasma sources (RPS) equipment, or remote plasma cleaning (RPC) equipment, etc., semiconductor equipment usually includes a cavity module and other functional modules arranged around the cavity module. The cavity module usually needs to be equipped with a liquid cooling plate for cooling and heat dissipation. In order to save installation space, the pipelines of the liquid cooling plate usually pass through some functional modules of the cavity module to connect with the whole machine pipelines of the semiconductor equipment to circulate the liquid cooling medium. In this way, when disassembling and assembling the cavity module, it is necessary to dismantle the structure surrounding the cavity module first, and then disassemble and assemble the pipelines of the liquid cooling plate and the whole machine pipelines, which affects the disassembly and assembly efficiency. Utility Model Content

[0003] The present application provides a cavity module and semiconductor equipment that are conducive to improving disassembly and assembly efficiency.

[0004] In a first aspect, an embodiment of the present application provides a cavity module for semiconductor equipment. The cavity module includes a cavity cold plate and a transfer component, the transfer component is arranged on the outer surface of the cavity cold plate, the transfer component is connected to the cavity cold plate to circulate liquid cooling medium, the transfer component is provided with a first transfer end, the port of the first transfer end is arranged in a first direction, the first transfer end is used to plug and match with a joint component in a receiving cavity of the semiconductor equipment, and the opening of the receiving cavity is oriented in the first direction.

[0005] The cavity module provided by the present application can enter or exit the receiving cavity through the opening of the receiving cavity in the first direction. The first adapter end of the adapter component is plugged and matched with the coupling component in the first direction. When the cavity module needs to be disassembled from the body of the semiconductor device, the first adapter end can be directly pulled out from the coupling component along the first direction. When the cavity module needs to be assembled to the body, the adapter component can be directly plugged with the coupling component along the first direction through the first adapter end to achieve unlocking or locking between the cavity module and the body of the semiconductor device. The operation is simple and fast, and the disassembly and assembly efficiency between the cavity module and the body is improved. In addition, the plug-in and pull-out direction of the first adapter end of the adapter component and the coupling component is the same as the direction of the receiving cavity that the cavity module enters or exits. It is not necessary to disassemble some components on the body first, such as the bracket component, the circuit board component, the body cold plate component, etc., which reduces the number of parts that need to be disassembled and assembled, thereby reducing the disassembly and assembly steps, and further improving the disassembly and assembly maintenance efficiency.

[0006] According to the first aspect, in a possible implementation, the adapter component further includes a first adapter unit, and the first adapter unit includes an adapter block and a connection structure. The adapter block protrudes from the outer surface of the cavity cold plate, one end of the connection structure is connected to the adapter block, and the first adapter end is provided at the other end of the connection structure.

[0007] In this possible implementation, the first adapter unit includes an adapter block and a connection structure. The first adapter end is provided on the connection structure. The adapter block and the connection structure can change the flow direction of the liquid cooling working medium. The positions of the adapter block and the connection structure on the cavity cold plate can be flexibly set according to the conditions of other devices on the outer surface of the cavity cold plate or the devices arranged around the cavity cold plate. In this way, the layout flexibility of the adapter component on the outer surface of the cavity cold plate is improved.

[0008] According to the first aspect, in a possible implementation, it includes a second adapter end and an intermediate part. The intermediate part is connected between the first adapter end and the second adapter end. The outer diameter of the second adapter end is smaller than that of the intermediate part. The second adapter end is inserted into the adapter block. One end of the intermediate part facing the second adapter end is used to abut against the adapter block. The outer diameter of the first adapter end is smaller than that of the intermediate part. One end of the intermediate part facing the first adapter end is used to abut against the joint component.

[0009] In this possible implementation, the outer diameter of the second adapter end is smaller than that of the intermediate part. During the process of inserting the second adapter end into the adapter block along the first direction, if one end of the intermediate part facing the second adapter end abuts against the adapter block, it means that the assembly between the connection structure and the adapter block is in place, which facilitates the assembly between the connection structure and the adapter block.

[0010] The outer diameter of the first adapter end is smaller than that of the intermediate part. During the process of inserting and mating the first adapter end with the joint component in the first direction, if one end of the first adapter end facing the second adapter end abuts against the joint component, it means that the assembly between the connection structure and the joint component is in place, which facilitates the assembly between the connection structure and the joint component.

[0011] According to the first aspect, in a possible implementation, the second adapter end is provided with a sealing ring, and the sealing ring of the second adapter end is located between the outer walls of the adapter block and the second adapter end.

[0012] In this possible implementation, the sealing ring of the second adapter end is used to achieve a sealed connection between the second adapter end and the adapter block.

[0013] According to the first aspect, in a possible implementation, the first adapter end is provided with a sealing ring, and the sealing ring of the first adapter end is used to be arranged between the joint component and the outer wall of the first adapter end.

[0014] In a possible implementation of this type, the sealing ring of the first adapter end is used to achieve a sealed connection between the first adapter end and the engaging component.

[0015] According to the first aspect, in a possible implementation, the adapter component further includes a second adapter unit. The first adapter end of the first adapter unit is used to connect to the first engaging block of the engaging component, and the second adapter unit is used to connect to the second engaging block of the engaging component.

[0016] In a possible implementation of this type, the adapter component includes a separately arranged first adapter unit and a second adapter unit, which is beneficial to simplify the flow channel design of the adapter component and facilitate the manufacturing of the adapter component.

[0017] According to the first aspect, in a possible implementation, the cavity module further includes a cavity and a mounting component. The cavity cold plate is provided in the cavity, and the mounting component is connected between the cavity and the cavity cold plate.

[0018] In a possible implementation of this type, the flow between the cavity and the cavity cold plate is achieved through the mounting component, which facilitates the connection between the mounting component and the cold plate.

[0019] According to the first aspect, in a possible implementation, the cavity cold plate is provided with through holes penetrating the thickness direction of the cavity. The mounting component includes a cavity adapter block and a cavity adapter structure. The cavity adapter block is fixed to the cavity and passes through the through holes, and the cavity adapter structure is connected between the cavity adapter block and the cavity cold plate.

[0020] In a possible implementation of this type, the cavity adapter block passes through the through holes of the cavity, which is beneficial to reduce the volume of the cavity module.

[0021] In a second aspect, an embodiment of the present application provides a semiconductor device. The semiconductor device includes a body, a body pipeline, and a cavity module according to the first aspect. The body includes a receiving cavity and an engaging component. The engaging component is received in the receiving cavity and is connected to the body pipeline, and the cavity module is received in the receiving cavity.

[0022] In the semiconductor device provided by the present application, since the first adapter end cooperates with the engaging component in the first direction, it is convenient for the disassembly and assembly between the cavity module and the body.

[0023] According to the second aspect, in a possible implementation, the body includes a housing, a body cold plate component, a bracket component, and a circuit board component. The bracket component is provided in the housing, the body cold plate component and the circuit board component are provided on the bracket component, the bracket component and the body cold plate component jointly enclose the receiving cavity, and the body pipeline is connected between the body cold plate component and the engaging component. Description of the Drawings

[0024] In order to more clearly illustrate the implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 is a three-dimensional schematic diagram of a semiconductor device provided by one embodiment of the present application;

[0026] Figure 2 yes Figure 1 The three-dimensional schematic diagram of the semiconductor device shown is shown with the cover removed;

[0027] Figure 3 It is a three-dimensional schematic diagram of a partial structure of a semiconductor device;

[0028] Figure 4 yes Figure 3 A schematic diagram of another perspective of the semiconductor device shown;

[0029] Figure 5 is a schematic diagram of the connection structure;

[0030] Figure 6 It is a cross-sectional schematic diagram of a connection structure, a joining component, and a transition component connected together provided in one embodiment of the present application.

[0031] Description of reference numerals:

[0032] 100-semiconductor device; 10-machine body; 11-housing; 112-bottom plate; 114-side plate; 13-bracket component; 131-first support plate; 132-second support plate; 133-third support plate; 14-machine body cold plate component; 141-first machine body cold plate; 142-second machine body cold plate; 145-accommodating chamber; 15-circuit board component; 151-first circuit board; 152-second circuit board; 153-third circuit board; 16-machine body pipeline; 17-joining component; 171-first A connecting block; 173-a second connecting block; 30-a cover body; 50-a cavity module; 51-a cavity; 53-an installation component; 531-a cavity transfer block; 533-a cavity transfer structure; 55-a cavity cold plate; 551-a through hole; 56-a pipe; 57-a transfer component; 571-a first transfer unit; 573-a second transfer unit; 5711-a transfer block; 5713-a connection structure; 5716-a second transfer end; 5717-a middle part; 5715-a first transfer end; 5719-a sealing ring. DETAILED DESCRIPTION

[0033] The following will describe the technical solutions in the embodiments of the present application in conjunction with the accompanying drawings in the embodiments of the present application.

[0034] It should be noted that when a component is referred to as being "fixed to" another component, it can be directly on the other component or there may also be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component at the same time.

[0035] Unless otherwise defined, all technical and scientific terms used in the present application have the same meaning as commonly understood by those skilled in the technical field to which the present application belongs. The terms used in the present application in the specification are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used in the present application includes any and all combinations of one or more of the related listed items.

[0036] The following will describe in detail some embodiments of the present application in conjunction with the accompanying drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0037] Please refer to Figure 1 and Figure 2 , some embodiments of the present application provide a semiconductor device 100. The semiconductor device 100 may be an RPS device. The RPS device is a core component supporting thin film deposition devices (CVD, ALD, PVD) in the semiconductor and chip manufacturing processes. The RPS device is used to output high-concentration radicals such as fluorine (F) / oxygen (O) / hydrogen (H) / nitrogen (N), etc., so as to support various process application scenarios such as atomic layer deposition (ALD), metal oxide cleaning, and etching (Etch) in the semiconductor manufacturing process.

[0038] For example, the RPS device can use a compound containing F as the raw material gas for F to enter the chamber. Under the action of an alternating electric field and a magnetic field, the raw materials will be dissociated and release F radicals. The active ions F- enter the process chamber and react with the contaminated materials in the process chamber, such as silicon oxide and silicon nitride, etc., and the generated vaporized new substances are pumped out of the process chamber by a vacuum pump, thereby ensuring the cleanliness of the process chamber.

[0039] The semiconductor device 100 includes a body 10, a cover 30 (as Figure 1 shown) and a cavity module 50. The cavity module 50 is provided in the body 10. The cover 30 is detachably covered or covered on the body 10 and the cavity module 50 for protecting the body 10, the cavity module 50 and for dust prevention. The cavity module 50 is the place where plasma reactions occur.

[0040] The semiconductor device 100 may further include necessary or non-necessary components such as a plasma driving power supply, an impedance matching circuit, a high-frequency coupling magnetic core, and a gas supply system. The structure of the semiconductor device 100 is not limited in this application. It can be understood that this application does not limit the semiconductor device 100 to be an RPS device. The semiconductor device 100 may also be other semiconductor devices with a detachable cavity module 50, such as an RPC device, a plasma source device, and so on. The body 10 includes a housing 11, a support member 13, a body cold plate member 14, a circuit board member 15, and a body pipeline 16. The body cold plate member 14 is connected to the body pipeline 16, and the body pipeline 16 is connected to the cavity module 50. The body cold plate member 14, the body pipeline 16, and the cavity module 50 are connected to form a flow path through which a liquid cooling working medium can flow to perform liquid cooling and heat dissipation on the cavity module 50.

[0041] The liquid cooling working medium can be a coolant, such as water, ethylene glycol solution, propylene glycol solution, or fluorinated liquid, etc. The liquid cooling working medium can also include gas. The liquid cooling working medium can be a single component or can be composed of at least two liquid cooling working media mixed together (for example, a mixed liquid composed of at least two coolants). The liquid cooling working medium can remain single-phase (i.e., no phase change occurs) during the flowing process, or can be two-phase (i.e., convert between the liquid phase and the gas phase). In some embodiments of this application, the liquid cooling working medium is water. It can be understood that the type of the liquid cooling working medium can be selected as needed.

[0042] Please refer to Figure 1 、 Figure 2 and Figure 3 , the housing 11 includes a bottom plate 112 and side plates 114 connected to the bottom plate 112. The cover body 30, the bottom plate 112, and the side plates 114 can jointly enclose a closed space. The closed space is used to accommodate the support member 13, the body cold plate member 14, the circuit board member 15, and the cavity module 50.

[0043] In some embodiments of this application, the cavity module 50 is disposed on the bottom plate 112 and is detachably connected to the bottom plate 112 to fix the cavity module 50 on the housing 11 and prevent the cavity module 50 from moving relative to the housing 11. The cavity module 50 and the bottom plate 112 can be connected by screws. The screw connection can improve the connection strength and connection stability between the cavity module 50 and the bottom plate 112. When it is necessary to disassemble the cavity module 50 from the housing 11, loosen the screws between the cavity module 50 and the housing 11. It can be understood that the cavity module 50 can be directly placed on the bottom plate 112, the cavity module 50 is in contact with the housing 11, and there is no connection between the cavity module 50 and the housing 11 through other devices.

[0044] Please refer to again Figure 2The bracket component 13 includes a first support plate 131, a second support plate 132 and a third support plate 133 connected to each other. The first support plate 131, the second support plate 132 and the third support plate 133 are all erected on the bottom plate 112 and connected to the bottom plate 112. The first support plate 131, the second support plate 132 and the third support plate 133 are used to support the body cold plate component 14 and the circuit board component 15. The heights of the first support plate 131, the second support plate 132 and the third support plate 133 all extend along the first direction Z. The first support plate 131 is connected between the second support plate 132 and the third support plate 133 in the second direction X. The third support plate 133 is arranged opposite to the second support plate 132 along the second direction X. The first direction Z is perpendicular to the second direction X, the second direction X is perpendicular to the third direction Y, and the third direction Y is perpendicular to the first direction Z. The first support plate 131 and the second support plate 132 can be made in one piece to facilitate assembly. It can be understood that the first support plate 131 and the second support plate 132 can be provided separately, or the first support plate 131, the second support plate 132 and the third support plate 133 can be provided integrally, and the present application does not limit the structure of the bracket component 13.

[0045] The body cold plate component 14 includes a first body cold plate 141 and a second body cold plate 142. The first body cold plate 141 and the first support plate 131 are stacked along the third direction Y, and the first body cold plate 141 is supported by the first support plate 131. The second body cold plate 142 is connected to the second support plate 132 at one end in the second direction X, and the second body cold plate 142 is connected to the third support plate 133 at the other end in the second direction X. The second body cold plate 142 can be supported by the second support plate 132 and the third support plate 133. In the third direction Y, the first support plate 131 is located between the first body cold plate 141 and the second body cold plate 142. The first body cold plate 141 and the second body cold plate 142 are both used to connect to the body pipeline 16. The first support plate 131, the second support plate 132, the third support plate 133 and the second body cold plate 142 surround a receiving cavity 145. The receiving cavity 145 is used to receive the cavity module 50. The first body cold plate 141 is disposed on a side of the first support plate 131 away from the receiving cavity 145. The receiving cavity 145 has an opening at one end away from the bottom plate 112, and the opening of the receiving cavity 145 is disposed toward the positive direction of the first direction Z to facilitate the cavity module 50 to enter or exit the receiving cavity 145.

[0046] It is understandable that the present application does not limit the first support plate 131 , the second support plate 132 , the third support plate 133 and the second body cold plate 142 to form the receiving cavity 145 . The body 10 can form the receiving cavity 145 through other structures or devices, and the body 10 only needs to be provided with the receiving cavity 145 .

[0047] In some embodiments of the present application, the circuit board component 15 includes a first circuit board 151, a second circuit board 152, and a third circuit board 153. The first circuit board 151 is fixed on the side of the second support plate 132 away from the third support plate 133, the second circuit board 152 is arranged on the side of the second body cold plate 142 away from the first support plate 131, and the third circuit board 153 is arranged on the side of the third support plate 133 away from the second support plate 132.

[0048] In some implementations of this application, please refer to Figure 2 and Figure 4 The machine body 10 further includes a joint component 17 disposed on the shell 11, and the joint component 17 is used to connect between the cavity module 50 and the machine body pipeline 16. The joint component 17 includes a first joint block 171 and a second joint block 173. The first joint block 171 is used to connect with the cavity module 50 to input liquid cooling medium into the cavity module 50. The second joint block 173 is used to connect with the cavity module 50 to output the liquid cooling medium in the cavity module 50. The machine body cold plate component 14, the first joint block 171, the cavity module 50 and the second joint block 173 can communicate with each other to deliver liquid cooling medium to the cavity module 50.

[0049] The present application does not limit the number of joining blocks in the joining component 17. For example, the number of joining blocks in the joining component 17 can be one, and an input flow channel and an output flow channel are set in the same joining block. The input flow channel is used to input liquid-cooling medium into the cavity module 50, and the output flow channel is used to output the liquid-cooling medium in the cavity module 50.

[0050] The cavity module 50 can enter or exit the receiving cavity 145 through the opening of the receiving cavity 145 in the first direction Z. The cavity module 50 includes a cavity 51, a mounting component 53, a cavity cold plate 55 and a transition component 57. The cavity 51 is used to generate plasma based on ionized gas.

[0051] The mounting member 53 is connected between the cavity 51 and the cavity cold plate 55 to connect the flow passages of the cavity 51 and the cavity cold plate 55. The mounting member 53 enables the flow between the cavity 51 and the cavity cold plate 55, facilitating the connection between the cavity 51 and the cavity cold plate 55.

[0052] The cavity cold plate 55 is provided with a through hole 551 penetrating in the thickness direction of the cavity cold plate 55. In this embodiment, the thickness direction of the cavity cold plate 55 is substantially parallel to the third direction Y. The mounting component 53 includes a cavity adapter block 531 and a cavity adapter structure 533. The cavity adapter block 531 is fixed to the cavity 51 and passes through the through hole 551, and the cavity adapter structure 533 is connected between the cavity adapter block 531 and the cavity cold plate 55. A flow channel is provided in the cavity 51 to circulate the liquid cooling working medium. The cavity adapter block 531 passing through the through hole 551 of the cavity cold plate 55 is beneficial to reducing the volume of the cavity module 50. The cavity adapter structure 533 may include a quick connector or a ferrule.

[0053] The adapter component 57 is provided on the outer surface of the cavity cold plate 55. The adapter component 57 is connected to the cavity cold plate 55 to circulate the liquid cooling working medium, and the adapter component 57 is used for plugging and matching with the engaging component 17 in the receiving cavity 145 in the first direction Z.

[0054] The adapter component 57 is plugging and matching with the engaging component 17 in the first direction Z. When it is necessary to disassemble the cavity module 50 from the machine body 10, the adapter component 57 can be directly pulled out from the engaging component 17 in the first direction Z. When it is necessary to assemble the cavity module 50 from the machine body 10 onto the machine body 10, the adapter component 57 can be directly plugged together with the engaging component 17 in the first direction Z to realize unlocking or locking between the cavity module 50 and the machine body 10. The operation is simple and fast, improving the disassembly and assembly efficiency between the cavity module 50 and the machine body 10. In addition, the plugging and unplugging direction of the adapter component 57 and the engaging component 17 is the same as the direction in which the cavity module 50 enters or exits the receiving cavity 145, without first disassembling the bracket component 13, the circuit board component 15, the machine body cold plate component 14, etc. on the machine body 10, reducing the number of parts to be disassembled and assembled, and further reducing the disassembly and assembly steps, improving the disassembly, assembly and maintenance efficiency.

[0055] The adapter component 57 includes a separately arranged first adapter unit 571 and a second adapter unit 573. The first adapter unit 571 and the second adapter unit 573 are arranged in the first direction Z. The second adapter unit 573 is used for plugging and matching with the second engaging block 173 in the receiving cavity 145 in the first direction Z. The adapter component 57 including the separately arranged first adapter unit 571 and the second adapter unit 573 is beneficial to simplifying the flow channel design on the cavity adapter block 531 and facilitating the manufacture of the cavity adapter block 531.

[0056] The first adapter unit 571 and the second adapter unit 573 each include an adapter block 5711 and a connection structure 5713. When the cavity module 50 is accommodated in the accommodating cavity 145, the adapter block 5711 of the first adapter unit 571 and the first joint block 171 are arranged along the first direction Z, and the adapter block 5711 of the second adapter unit 573 and the second joint block 173 are arranged along the first direction Z. One end of the connection structure 5713 of the first adapter unit 571 is connected to the adapter block 5711 of the first adapter unit 571. One end of the connection structure 5713 of the second adapter unit 573 is connected to the adapter block 5711 of the second adapter unit 573. The adapter block 5711 and the cavity cold plate 55 can be connected through a pipe 56.

[0057] In some embodiments of this application, please refer to Figure 5 and Figure 6 The connection structure 5713 includes a first transfer end 5715 , a second transfer end 5716 , and a middle portion 5717 . The middle portion 5717 is connected between the first transfer end 5715 and the second transfer end 5716 .

[0058] The first transfer end 5715 is disposed toward the negative direction of the first direction Z. The first transfer end 5715 is used to connect with the joint component 17 (such as Figure 4 Plug-in fit as shown.

[0059] The outer diameter of the first adapter end 5715 is smaller than the outer diameter of the middle part 5717. The end of the middle part 5717 facing the first adapter end 5715 is used to abut against the coupling component 17 to position the assembly between the coupling component 17 and the connecting structure 5713. The first adapter end 5715 of the first adapter unit 571 is used to be plugged and matched with the first connecting block 171 in the first direction Z. During the process of inserting the first adapter end 5715 of the first adapter unit 571 into the first connecting block 171, if the end of the first adapter unit 571 facing the first adapter end 5715 abuts against the first connecting block 171, it means that the assembly between the connecting structure 5713 of the first adapter unit 571 and the first connecting block 171 is in place, which facilitates the assembly between the first adapter unit 571 and the first connecting block 171. During the process of inserting the first adapter end 5715 of the second adapter unit 573 into the second connecting block 173, if the end of the second adapter unit 573 facing the first adapter end 5715 abuts against the second connecting block 173, it means that the assembly between the connecting structure 5713 of the second adapter unit 573 and the second connecting block 173 is in place, which facilitates the assembly between the second adapter unit 573 and the second connecting block 173.

[0060] The outer diameter of the second adapter end 5716 is smaller than that of the middle portion 5717. The second adapter end 5716 is used to be inserted into the adapter block 5711. One end of the middle portion 5717 facing the second adapter end 5716 is used to abut against the adapter block 5711 to position the assembly between the adapter block 5711 and the connection structure 5713. During the process of inserting the second adapter end 5716 into the adapter block 5711 along the first direction Z, if one end of the middle portion 5717 facing the second adapter end 5716 abuts against the adapter block 5711, it means that the assembly between the connection structure 5713 and the adapter block 5711 is in place, facilitating the assembly between the connection structure 5713 and the cavity adapter block 531.

[0061] The connection structure 5713 further includes a sealing ring 5719. Sealing rings 5719 are provided on the outer walls of the second adapter end 5716 and the first adapter end 5715. The sealing ring 5719 on the second adapter end 5716 is used to achieve a sealed connection between the second adapter end 5716 and the adapter block 5711. The sealing ring 5719 on the first adapter end 5715 is used to achieve a sealed connection between the first adapter end 5715 and the corresponding engaging block. The number of sealing rings 5719 on the second adapter end 5716 and the first adapter end 5715 can be two or more to form a multi-stage seal, thereby improving the sealing effect. The number of sealing rings 5719 on each of the second adapter end 5716 and the first adapter end 5715 can be one.

[0062] It can be understood that the structure and form of the connection structure 5713 are not limited in this application. For example, in some embodiments, the connection structure 5713 can include a quick connector or a ferrule, and the first adapter end 5715 for plugging and mating with the engaging component 17 is provided on the quick connector or the ferrule.

[0063] It can be understood that the structure and form of the adapter component 57 are not limited in this application. For example, the connection structure 5713 can be omitted from the adapter component 57, and the first adapter end 5715 for plugging and mating with the engaging component 17 is provided on the adapter block 5711; or, the adapter block 5711 can be omitted from the adapter component 57, and the first adapter end 5715 is provided on the adapter component 57, and the port of the first adapter end 5715 faces the first direction Z.

[0064] Please refer to Figure 1 、 Figure 2 、 Figure 4 、 Figure 5 and Figure 6, when the cavity module 50 needs to be disassembled from the body 10, remove the cover 30, remove the screws between the cavity module 50 and the bottom plate 112, and directly pull out the connection structure 5713 of the first adapter unit 571 from the first engaging block 171 along the first direction Z and away from the bottom plate 112. The connection structure 5713 of the second adapter unit 573 is directly pulled out from the second engaging block 173 along the first direction Z and away from the bottom plate 112, then the cavity module 50 can be taken out from the body 10 without first disassembling the cavity module 50 from the support components 13, the body cold plate component 14, etc. surrounding the cavity module 50. In this way, the steps of disassembling the cavity module 50 from the body are simplified.

[0065] When the cavity module 50 needs to be installed on the body 10, the cavity module 50 enters the receiving cavity 145 from the opening of the receiving cavity 145. The connection structure 5713 of the first adapter unit 571 is directly inserted into the first engaging block 171 along the first direction Z and towards the bottom plate 112. The connection structure 5713 of the second adapter unit 573 is directly inserted into the second engaging block 173 along the first direction Z and towards the bottom plate 112, without first disassembling the cavity module 50 from the support components 13, the body cold plate component 14, etc. surrounding the cavity module 50. In this way, the steps of installing the cavity module 50 into the body are simplified.

[0066] It can be understood that the connection structure and the second connection structure of the first adapter unit and the second adapter unit can be omitted. The adapter block of the first adapter unit is directly connected to the cold plate, and a connection structure is provided on the first engaging block. The adapter block of the second adapter unit is directly connected to the cold plate, and a connection structure is provided on the second engaging block.

[0067] In the description of the embodiments of the present application, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0068] The above-disclosed is only a preferred embodiment of the present application, and of course, it cannot be used to limit the scope of the rights of the present application. Those of ordinary skill in the art can understand all or part of the processes of implementing the above embodiments, and the equivalent changes made according to the claims of the present application still fall within the scope covered by the present application.

Claims

1. A cavity module, characterized in that For semiconductor equipment, The cavity module includes a cavity cold plate and a transfer component, wherein the transfer component is disposed on the outer surface of the cavity cold plate, and the transfer component is connected to the cavity cold plate to circulate liquid cooling medium, and the transfer component is provided with a first transfer end, and the port of the first transfer end is arranged toward a first direction, and the first transfer end is used for plugging and cooperating with a coupling component in a receiving cavity of the semiconductor device, and the opening of the receiving cavity is toward the first direction.

2. The cavity module according to claim 1, wherein The adapter component also includes a first adapter unit, which includes an adapter block and a connecting structure. The adapter block is protruding from the outer surface of the cavity cold plate, one end of the connecting structure is connected to the adapter block, and the first adapter end is arranged at the other end of the connecting structure.

3. The cavity module according to claim 2, wherein The connecting structure also includes a second adapter end and a middle part, the middle part is connected between the first adapter end and the second adapter end, the outer diameter of the second adapter end is smaller than the outer diameter of the middle part, the second adapter end is inserted into the adapter block, and one end of the middle part facing the second adapter end is used to abut against the adapter block, the outer diameter of the first adapter end is smaller than the outer diameter of the middle part, and one end of the middle part facing the first adapter end is used to abut against the coupling component.

4. The cavity module according to claim 3, wherein The second adapter end is provided with a sealing ring, and the sealing ring of the second adapter end is located between the adapter block and the outer wall of the second adapter end.

5. The cavity module according to claim 3 or 4, characterized in that, The first adapter end is provided with a sealing ring, and the sealing ring of the first adapter end is used to be arranged between the joint component and the outer wall of the first adapter end.

6. The cavity module according to claim 2, wherein The adapter component further includes a second adapter unit, wherein the first adapter end of the first adapter unit is used to connect to the first joining block of the joining component, and the second adapter unit is used to connect to the second joining block of the joining component.

7. The cavity module according to claim 1, wherein It also includes a cavity and a mounting component, the cavity cold plate is arranged in the cavity, and the mounting component is connected between the cavity and the cavity cold plate.

8. The cavity module according to claim 7, wherein The cavity cold plate is provided with a through hole penetrating the thickness direction of the cavity, and the mounting component comprises a cavity transfer block and a cavity transfer structure, the cavity transfer block is fixed to the cavity and penetrates the through hole, and the cavity transfer structure connects the cavity transfer block and the cavity cold plate.

9. A semiconductor device, characterized in that, It comprises a machine body, a machine body pipeline and a cavity module according to any one of claims 1 to 8, wherein the machine body comprises a receiving cavity and a joining component, the joining component is received in the receiving cavity and connected to the machine body pipeline, and the cavity module is received in the receiving cavity.

10. The semiconductor device according to claim 9, wherein, The machine body includes a shell, a machine body cold plate component, a bracket component and a circuit board component, the bracket component is arranged on the shell, the machine body cold plate component and the circuit board component are arranged on the bracket component, the bracket component and the machine body cold plate component jointly form the accommodating cavity, and the machine body pipeline is connected between the machine body cold plate component and the joining component.

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