Portable semiconductor laser

Abstract

The utility model discloses a portable semiconductor laser heat dissipation device which comprises a heat dissipation cylinder, a heat dissipation rotating rod, a heat absorption pipe and a driving assembly. The heat absorption pipe is arranged on the outer ring of the semiconductor laser body, is communicated with the heat dissipation cylinder and is filled with a cooling medium. The heat dissipation rotating rod is coaxially arranged in the heat dissipation cylinder, and the outer side wall of the heat dissipation rotating rod is provided with a spiral driving blade which is in clearance fit with the inner wall of the heat dissipation cylinder to form a liquid passing cavity. The driving assembly comprises a driving rod, a ratchet mechanism and an extension spring, the driving rod is meshed with an inner groove of the heat dissipation rotating rod through a sliding block in a through hole, and when the driving rod is manually stretched, the ratchet mechanism limits one-way rotation of the heat dissipation rotating rod and drives a driving blade to push a cooling medium to flow to the heat absorption pipe from the heat dissipation cylinder to absorb heat of the laser; after release, the extension spring automatically resets the driving rod, and continuous one-way circulation of the cooling medium is achieved. And fins are arranged on the outer side of the radiating cylinder to enhance the radiating efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of laser equipment, in particular to a portable semiconductor laser. Background Art

[0002] Semiconductor lasers, also known as laser diodes, are lasers that use semiconductor materials as working materials. Due to differences in material structure, the specific process of generating lasers of different types is relatively special. Common working materials include gallium arsenide (GaAs), cadmium sulfide (CdS), indium phosphide (InP), zinc sulfide (ZnS), etc. There are three types of excitation methods: electrical injection, electron beam excitation, and optical pumping. Semiconductor laser devices can be divided into homojunction, single heterojunction, double heterojunction, etc. Homojunction lasers and single heterojunction lasers are mostly pulse devices at room temperature, while double heterojunction lasers can achieve continuous operation at room temperature. Semiconductor lasers in the prior art need to be equipped with a larger heat dissipation structure to dissipate the heat of the laser, which results in the laser being too large to be carried. Utility Model Content

[0003] In order to solve the problem that the semiconductor laser needs to be equipped with a large heat dissipation structure to dissipate heat from the laser, the utility model provides a portable semiconductor laser, and the specific technical solution is as follows:

[0004] A portable semiconductor laser comprises a semiconductor laser body and a heat dissipation device arranged around the semiconductor laser body. The heat dissipation device comprises a heat dissipation tube, a heat dissipation rotating rod, a heat absorption tube and a driving assembly. The two ends of the heat absorption tube are respectively connected to the two sides of the heat dissipation tube. The heat absorption tube and the heat dissipation tube are filled with cooling medium. The heat absorption tube is arranged on the outer ring of the semiconductor laser body. The heat dissipation rotating rod is coaxially arranged on the inner side of the heat dissipation tube. The heat dissipation rotating rod and the heat dissipation tube are rotationally matched. The heat dissipation rotating rod is provided with a driving blade. The driving assembly is transmission-connected to the heat dissipation rotating rod. The driving assembly drives the heat dissipation rotating rod to rotate and drives the driving blade to rotate so as to transport the cooling medium in the heat dissipation tube to the heat absorption tube to absorb the heat on the semiconductor laser body.

[0005] Furthermore, the two ends of the heat dissipation rotating rod are rotatably connected to the two ends of the inner wall of the heat dissipation tube, a through hole is arranged along the axis of the heat dissipation rotating rod, a spiral inner groove is arranged on the inner side of the through hole of the heat dissipation rotating rod, the driving assembly includes a driving rod, a driving slider is arranged on the driving rod, the driving rod is inserted into the through hole, the driving slider is embedded in the inner groove in the through hole, the driving rod is stretched to move linearly, and the driving slider moves in the inner groove to drive the heat dissipation rotating rod to rotate.

[0006] Furthermore, the heat dissipation assembly also includes a tension spring, one end of which is fixedly connected to the heat dissipation cylinder, and the other end of which is fixedly connected to the driving rod, and the tension spring pulls the driving rod into the heat dissipation cylinder.

[0007] Furthermore, a ratchet mechanism is provided between the driving slider and the driving rod, and the ratchet mechanism limits the driving slider to rotate in one direction along the driving rod.

[0008] Furthermore, a handle is provided at one end of the driving rod extending from the heat dissipation rotating rod.

[0009] Furthermore, the heat absorption tube is arranged in an S shape on the semiconductor laser body.

[0010] Furthermore, the outer side of the heat dissipation rotating rod and the inner side of the heat dissipation tube form a liquid cavity, the driving blades are spirally wound around the outer wall of the heat dissipation rotating rod, the driving blades and the inner wall of the heat dissipation tube are gap-matched, and the cooling medium is in the liquid cavity.

[0011] Furthermore, the outer side wall of the heat dissipation tube is provided with heat dissipation fins.

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] First, a heat dissipation device is provided in this scheme, and the heat dissipation device includes a heat dissipation tube, a heat dissipation rotating rod, a heat absorption tube and a driving component. The two ends of the heat absorption tube are respectively connected to the two sides of the heat dissipation tube, and the heat absorption tube and the heat dissipation tube are filled with cooling medium. The heat absorption tube is arranged on the outer ring of the semiconductor laser body, and the heat dissipation rotating rod is coaxially arranged on the inner side of the heat dissipation tube. The heat dissipation rotating rod and the heat dissipation tube are rotated together. The heat dissipation rotating rod is provided with driving blades, and the driving component is connected to the heat dissipation rotating rod. The driving component drives the heat dissipation rotating rod to rotate and drives the driving blades to rotate to transport the cooling medium in the heat dissipation tube to the heat absorption tube to absorb the heat on the semiconductor laser body.

[0014] Secondly, the heat dissipation device in this scheme can be manual, and a ratchet mechanism is arranged between the driving slider and the driving rod. The ratchet mechanism limits the driving slider to rotate in a single direction along the driving rod, so that the reciprocating pulling and pulling of the driving rod can drive the heat dissipation rotating rod to rotate in a single direction, so that the cooling medium can continuously circulate in the heat absorption tube and the heat dissipation cylinder.

[0015] Third: In this solution, the outer side of the heat dissipation rod and the inner side of the heat dissipation tube form a liquid cavity, the driving blades are spirally wound around the outer wall of the heat dissipation rod, the driving blades and the inner wall of the heat dissipation tube are gap-matched, and the cooling medium is in the liquid cavity, thereby ensuring the sealing performance of the cooling medium and the heat dissipation stability.

[0016] Fourthly, the heat dissipation assembly also includes a tension spring, one end of which is fixedly connected to the heat dissipation tube, and the other end is fixedly connected to the driving rod. The tension spring pulls the driving rod into the heat dissipation tube and is naturally released after the driving rod is stretched. At this time, the driving rod is pulled back to its original position by the tension spring to facilitate subsequent stretching actions. Brief Description of the Drawings

[0017] Figure 1 is a schematic structural diagram of the present application;

[0018] Figure 2 is a schematic structural diagram of the heat dissipation device in the present application;

[0019] Figure 3 is a cross-section of the heat dissipation device in the present application Figure 1 ;

[0020] Figure 4 is a cross-section of the heat dissipation device in the present application Figure 2 ;

[0021] Figure 5 is a flow diagram of the cooling medium in the heat dissipation device of the present application.

[0022] Reference Numerals: Semiconductor laser body 1, heat dissipation cylinder 2, heat dissipation rotating rod 3, driving blade 31, heat absorption tube 4, driving assembly 5, driving rod 51, driving slider 52, pull handle 53, tension spring 6, liquid passing cavity 7. Detailed Description of the Invention

[0023] The present utility model will be further described below in conjunction with the accompanying drawings.

[0024] As Figures 1 to 5 shown, a portable semiconductor laser includes a semiconductor laser body 1, and a heat dissipation device disposed around the semiconductor laser body 1. The heat dissipation device includes a heat dissipation cylinder 2, a heat dissipation rotating rod 3, a heat absorption tube 4, and a driving assembly 5. Both ends of the heat absorption tube 4 are respectively communicated with both sides of the heat dissipation cylinder 2. The heat absorption tube 4 and the heat dissipation cylinder 2 are filled with a cooling medium. The heat absorption tube 4 is disposed on the outer circle of the semiconductor laser body 1. The heat dissipation rotating rod 3 is coaxially disposed inside the heat dissipation cylinder 2. The heat dissipation rotating rod 3 is rotationally matched with the heat dissipation cylinder 2. Driving blades 31 are provided on the heat dissipation rotating rod 3. The driving assembly 5 is drivingly connected to the heat dissipation rotating rod 3. The driving assembly 5 drives the heat dissipation rotating rod 3 to rotate, driving the driving blades 31 to rotate, and conveying the cooling medium in the heat dissipation cylinder 2 into the heat absorption tube 4 to absorb the heat on the semiconductor laser body 1.

[0025] In one embodiment, the driving assembly 5 in this solution can drive the heat dissipation rotating rod 3 to rotate through a driving motor. At this time, the driving blades 31 rotate, so that the cooling medium circulates in the heat absorption tube 4 and the heat dissipation cylinder 2, realizing heat dissipation of the semiconductor laser body 1.

[0026] In another embodiment, the driving component 5 in the present solution is manually operated. Both ends of the heat dissipation rotating rod 3 are rotatably connected to both ends of the inner side wall of the heat dissipation cylinder 2. A through hole is provided along the axis on the heat dissipation rotating rod 3, and a spiral inner groove is provided inside the through hole on the heat dissipation rotating rod 3. The driving component 5 includes a driving rod 51, and a driving slider 52 is provided on the driving rod 51. The driving rod 51 is inserted into the through hole, and the driving slider 52 is embedded in the inner groove in the through hole. By stretching the driving rod 51 to move linearly, the driving slider 52 moves in the inner groove to drive the heat dissipation rotating rod 3 to rotate. By reciprocally pulling the driving rod 51, the heat dissipation rotating rod 3 is driven to rotate reciprocally in both forward and reverse directions, thereby manually controlling the circulation of the cooling medium in the heat absorption tube 4 and the heat dissipation cylinder 2 to achieve heat dissipation of the semiconductor laser body 1.

[0027] Further on the basis of the previous embodiment, a ratchet mechanism is provided between the driving slider 52 and the driving rod 51. The ratchet mechanism limits the driving slider 52 to rotate in a single direction along the driving rod 51, so that the reciprocally pulling the driving rod 51 can drive the heat dissipation rotating rod 3 to rotate in a single direction, enabling the cooling medium to continuously circulate in the heat absorption tube 4 and the heat dissipation cylinder 2.

[0028] The ratchet mechanism in the present solution can adopt the ratchet mechanism in the prior art. The ratchet teeth usually use one-way teeth, and the ratchet pawl is hinged on the rocker. When the rocker swings counterclockwise, the driving ratchet pawl inserts into the ratchet teeth to push the ratchet to rotate in the same direction; when the rocker swings clockwise, the ratchet pawl slides over the ratchet, and the ratchet stops rotating.

[0029] In the setting of the above embodiment, a liquid passing cavity 7 is formed between the outer side of the heat dissipation rotating rod 3 and the inner side of the heat dissipation cylinder 2. The driving blades 31 are spirally wound around the outer side wall of the heat dissipation rotating rod 3, and the driving blades 31 are in clearance fit with the inner side wall of the heat dissipation cylinder 2. The cooling medium is in the liquid passing cavity 7, which can ensure the sealing performance and heat dissipation stability of the cooling medium setting.

[0030] Preferably, the heat dissipation component further includes a tension spring 6. One end of the tension spring 6 is fixedly connected to the heat dissipation cylinder 2, and the other end is fixedly connected to the driving rod 51. The tension spring 6 pulls the driving rod 51 into the heat dissipation cylinder 2 and naturally releases after the driving rod 51 is stretched. At this time, the driving rod 51 is pulled back by the tension spring 6 to facilitate subsequent stretching actions.

[0031] Preferably, a pull handle 53 is provided at the end of the driving rod 51 extending from the heat dissipation rotating rod 3. The user can pull the driving rod 51 through the provided pull handle 53 to improve the pulling stability of the driving handle.

[0032] Preferably, the heat absorption tube 4 is arranged in an S shape on the semiconductor laser body 1, which can achieve uniform heat dissipation of the semiconductor laser body 1.

[0033] Preferably, the outer side wall of the heat dissipation tube 2 is provided with heat dissipation fins to increase the heat dissipation area of the heat dissipation tube 2 and improve the heat dissipation efficiency.

[0034] When the temperature of the semiconductor laser body 1 is too high, the user can fix the semiconductor laser body 1, then hold the pull handle 53, and pull the pull handle 53 along the axial direction of the driving rod 51. At this time, the driving slider 52 cooperates with the inner groove in the through hole to make the heat dissipation rotating rod 3 rotate axially. The rotation of the heat dissipation rotating rod 3 drives the driving blade 31 to rotate, so that the cooling medium in the heat dissipation tube 2 is pressurized to enter the heat absorption tube 4 to dissipate heat for the semiconductor laser body 1. When the driving rod 51 moves to the maximum position, the pull handle 53 is released. At this time, the driving rod 51 is reset under the action of the tension spring 6. At the same time, due to the setting of the ratchet mechanism, the driving slider 52 rotates in the opposite direction along the inner groove in the through hole. At this time, the user pulls the pull handle 53 again to repeat the above steps to allow the cooling medium to continue to circulate and absorb heat in the heat absorption tube 4 and the heat dissipation tube 2.

[0035] The technical principle of the present invention is described above in combination with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the protection scope of the present invention in any way. Based on the explanations here, technicians in this field can think of other specific implementation methods of the present invention without creative work, and these methods will fall within the protection scope of the claims of the present invention.

Claims

1. A portable semiconductor laser, comprising a semiconductor laser body (1), characterized in that, The invention comprises a heat dissipation device arranged around a semiconductor laser body (1), the heat dissipation device comprising a heat dissipation tube (2), a heat dissipation rotating rod (3), a heat absorption tube (4) and a driving assembly (5), the two ends of the heat absorption tube (4) are respectively connected to the two sides of the heat dissipation tube (2), the heat absorption tube (4) and the heat dissipation tube (2) are filled with cooling medium, the heat absorption tube (4) is arranged on the outer ring of the semiconductor laser body (1), the heat dissipation rotating rod (3) is coaxially arranged on the inner side of the heat dissipation tube (2), the heat dissipation rotating rod (3) and the heat dissipation tube (2) are rotationally matched, the heat dissipation rotating rod (3) is provided with a driving blade (31), the driving assembly (5) is transmission-connected to the heat dissipation rotating rod (3), the driving assembly (5) drives the heat dissipation rotating rod (3) to rotate, drives the driving blade (31) to rotate, and transports the cooling medium in the heat dissipation tube (2) to the heat absorption tube (4) to absorb the heat on the semiconductor laser body (1).

2. The portable semiconductor laser according to claim 1, characterized in that, The two ends of the heat dissipation rotating rod (3) are rotatably connected to the two ends of the inner wall of the heat dissipation cylinder (2); a through hole is provided along the axis of the heat dissipation rotating rod (3); a spiral inner groove is provided inside the through hole of the heat dissipation rotating rod (3); the driving assembly (5) comprises a driving rod (51); a driving slider (52) is provided on the driving rod (51); the driving rod (51) is inserted into the through hole; the driving slider (52) is embedded in the inner groove in the through hole; the driving rod (51) is stretched to move linearly; the driving slider (52) moves in the inner groove to drive the heat dissipation rotating rod (3) to rotate.

3. The portable semiconductor laser according to claim 2, characterized in that, The heat dissipation assembly also includes a tension spring (6), one end of which is fixedly connected to the heat dissipation cylinder (2), and the other end of which is fixedly connected to the driving rod (51). The tension spring (6) pulls the driving rod (51) into the heat dissipation cylinder (2).

4. The portable semiconductor laser according to claim 2, wherein A ratchet mechanism is arranged between the driving slider (52) and the driving rod (51), and the ratchet mechanism limits the driving slider (52) to rotate in one direction along the driving rod (51).

5. The portable semiconductor laser according to claim 2, characterized in that, A pull handle (53) is provided at one end of the driving rod (51) extending from the heat dissipation rotating rod (3).

6. The portable semiconductor laser according to claim 1, wherein The heat absorption tube (4) is arranged in an S shape on the semiconductor laser body (1).

7. The portable semiconductor laser according to claim 1, characterized in that, The outer side of the heat dissipation rotating rod (3) and the inner side of the heat dissipation cylinder (2) form a liquid chamber (7); the driving blade (31) is spirally wound around the outer side wall of the heat dissipation rotating rod (3); the driving blade (31) and the inner side wall of the heat dissipation cylinder (2) are gap-matched; and the cooling medium is in the liquid chamber (7).

8. The portable semiconductor laser according to claim 1, wherein The outer side wall of the heat dissipation cylinder (2) is provided with heat dissipation fins.

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