Heat dissipation type circuit board and production and processing equipment thereof

Abstract

The utility model relates to the field of circuit boards, and discloses a heat dissipation type circuit board and a production and processing device thereof, the heat dissipation type circuit board comprises a circuit board body on which an electronic component is installed; the heat conducting patch is fixedly connected to the circuit board body and is positioned between the circuit board body and the electronic element; wherein the projection range of the circuit board body comprises a first area in which pins are distributed and a second area in which no pins are distributed along a projection area perpendicular to the board surface direction of the circuit board body, and the electronic element is connected with the pins in the first area. The heat conduction patch is fixed in the second area, a plurality of first through holes penetrating in the direction perpendicular to the board face of the circuit board body are formed in the second area, second through holes right facing the first through holes are formed in the heat conduction patch, and the heat conduction and heat dissipation effects in a gap between the electronic element and the circuit board body are improved.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, and particularly to a heat dissipation type circuit board and its production and processing equipment. Background Art

[0002] A circuit board, also known as a printed circuit board or PCB, is widely used in electronic products. Electronic components such as CPUs (Central Processing Units) are installed on the circuit board. During use, the problem of heat generation of electronic components is common. In the prior art, silicone grease is coated on the outer surface of the electronic components to improve the heat dissipation performance. However, there are several pins distributed on the electronic components and the circuit board, which makes it inconvenient to coat the silicone grease on the surface of the electronic components close to the circuit board body, so that the heat in the gap between the electronic components and the circuit board body is still difficult to dissipate quickly. Summary of the Utility Model

[0003] In view of the above deficiencies or defects in the prior art, the utility model provides a heat dissipation type circuit board and its production and processing equipment. A heat conduction patch is arranged between the electronic component and the circuit board body, and a first through hole and a second through hole are respectively opened on the circuit board body and the heat conduction patch, so as to improve the heat conduction and heat dissipation effects in the gap between the electronic component and the circuit board body.

[0004] To achieve the above object, the utility model provides a heat dissipation type circuit board, including:

[0005] A circuit board body, on which an electronic component is installed;

[0006] A heat conduction patch, fixedly connected to the circuit board body and located between the circuit board body and the electronic component;

[0007] Wherein, along the projection area in the direction perpendicular to the board surface of the circuit board body, the projection range of the circuit board body includes a first area with pin distribution and a second area without pin distribution. The electronic component is connected to the pins in the first area, the heat conduction patch is fixed in the second area, and a plurality of first through holes penetrating in the direction perpendicular to the board surface of the circuit board body are opened in the second area, and second through holes are opened on the heat conduction patch opposite to the first through holes.

[0008] In some embodiments, a groove for accommodating the heat conduction patch is opened in the second area.

[0009] In some embodiments, the heat conduction patch has a protruding portion extending into the first through hole.

[0010] In some embodiments, the heat conduction patch has a first side ear, and a limiting groove for clamping the first side ear and restricting the freedom degree of the first side ear on the board surface of the circuit board body is opened on the circuit board body.

[0011] In some embodiments, the heat-dissipating circuit board further includes a connecting member, and the connecting member includes:

[0012] a connecting post;

[0013] a compression cap fixed to one end of the connecting post;

[0014] a connecting hole for interference-fitting with the connecting post is formed at the bottom of the limiting groove, a first through hole for the connecting post to pass through is formed through the first side ear, and the diameter of the first through hole is smaller than the diameter of the compression cap and larger than the diameter of the connecting post.

[0015] In some embodiments, the heat-dissipating circuit board further includes an outer frame for mounting the electronic component, and the outer frame is tightly connected to the connecting member or the circuit board body.

[0016] In some embodiments, there is a sealant layer between the heat-conducting patch and the electronic component.

[0017] The present utility model further provides a production and processing device for producing and processing and assembling the heat-dissipating circuit board as described above, including a base and a horizontal turntable mounted on the base. A plurality of tooling positions are annularly and arrayedly distributed on the horizontal turntable with the rotation center of the horizontal turntable as the symmetric center. A loading table is provided on the tooling position, and the loading table has a loading surface and a fixture for clamping the circuit board body is mounted on the loading surface.

[0018] In some embodiments, positioning posts for passing through the first through hole and the second through hole are fixedly provided on the loading table.

[0019] In some embodiments, the loading table is horizontally flipably mounted on the tooling position, and a glue injection pump is fixedly provided on the other side of the loading table opposite to the loading surface. A glue injection pipeline is formed through the positioning post, and the glue injection pipeline communicates with the glue injection pump.

[0020] Applying the above technical solution of the present utility model to a heat-dissipating circuit board has the following effects: A heat-conducting patch is provided between the electronic component and the circuit board body, and a first through hole and a second through hole that are directly opposite and communicate with each other are respectively formed on the circuit board body and the heat-conducting patch, improving the heat conduction and heat dissipation effect in the gap between the electronic component and the circuit board body. In addition, the heat-conducting patch is arranged in the area without pin distribution between the electronic component and the circuit board body, avoiding affecting the pin contact between the electronic component and the circuit board body.

[0021] Other features and advantages of the present utility model will be described in detail in the subsequent specific implementation part. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1It is a three-dimensional structural schematic diagram of a heat-dissipating circuit board according to an embodiment of the present utility model;

[0023] Figure 2 It is Figure 1 an explosion schematic diagram of;

[0024] Figure 3 It is a distribution schematic diagram of the first area and the second area of the first type;

[0025] Figure 4 It is a distribution schematic diagram of the first area and the second area of the second type;

[0026] Figure 5 It is a distribution schematic diagram of the first area and the second area of the third type;

[0027] Figure 6 It is a three-dimensional structural schematic diagram of a heat-conducting patch;

[0028] Figure 7 It is a three-dimensional structural schematic diagram of a connecting member;

[0029] Figure 8 It is Figure 1 a side view sectional schematic diagram of;

[0030] Figure 9 It is a three-dimensional structural schematic diagram of a production and processing device according to an embodiment of the present utility model;

[0031] Figure 10 It is a top view schematic diagram of a horizontal turntable.

[0032] Explanation of reference numerals

[0033] 1. Circuit board body; 12. First area; 13. Second area; 14. First through hole; 15. Groove; 16. Limit groove; 17. Connection hole; 2. Electronic component; 3. Heat-conducting patch; 31. Second through hole; 32. Protruding portion; 33. First side ear; 34. First via hole; 4. Connecting member; 41. Connecting column; 42. Pressing cap; 43. Internal thread hole; 5. Outer frame; 52. Second via hole; 6. Sealing glue layer; 7. Pin; 10. Horizontal turntable; 20. Base; 30. Tooling position; 40. Loading table; 50. Loading surface; 60. Fixture; 70. Positioning column; 80. Glue injection pump; 90. Glue injection pipeline; A. Tooling position for performing step a; B. Tooling position for performing step b; C. Tooling position for performing step c; D. Tooling position for performing step d; E. Tooling position for performing step e; F. Tooling position for performing step f; G. Tooling position for performing step g; H. Tooling position for performing step h. Detailed implementation manners

[0034] The following is a detailed description of the specific embodiments of the present utility model. It should be understood that the specific embodiments described herein are only for the purpose of illustrating and explaining the present utility model, and are not intended to limit the present utility model.

[0035] In the present utility model, unless otherwise stated, the orientation terms such as "upper" and "lower" generally refer to the orientation in the assembled and used state. "Inner" and "outer" refer to the inner and outer of the contour of each component itself.

[0036] As shown in the attached Figure 1 and the attached Figure 2 , the present utility model provides a heat-dissipating circuit board, which includes a circuit board body 1 and a heat-conducting patch 3. Electronic components 2 are installed on the circuit board body 1, and the heat-conducting patch 3 is fixedly connected to the circuit board body 1 and is located between the circuit board body 1 and the electronic components 2. Projected along the direction perpendicular to the board surface of the circuit board body 1, the projected range of the circuit board body 1 includes a first area 12 where pins 7 are distributed and a second area 13 where no pins 7 are distributed. The electronic components 2 are connected to the pins 7 in the first area 12, and the heat-conducting patch 3 is fixed in the second area 13, and a plurality of first through holes 14 penetrating along the direction perpendicular to the board surface of the circuit board body 1 are opened in the second area 13, and second through holes 31 facing the first through holes 14 are opened on the heat-conducting patch 3.

[0037] The heat dissipation effect is directly proportional to the thermal conductivity. The setting of the heat-conducting patch 3 is used to increase the thermal conductivity of the gap between the electronic components 2 and the circuit board body 1, thereby improving the heat transfer and heat dissipation effect of the gap between the electronic components 2 and the circuit board body 1. In addition, the first through holes 14 and the second through holes 31 are respectively opened on the circuit board body 1 and the heat-conducting patch 3, so that the heat in the gap can be transferred and dissipated downward of the circuit board body 1, further improving the heat dissipation effect. The heat-conducting patch 3 does not need to completely cover the second area 13, and only needs to be specifically set in the second area 13 around the first area 12. Of course, the heat-conducting patch 3 can also completely cover the second area 13. In comparison, the material consumption of completely covering the second area 13 with the heat-conducting patch 3 is higher.

[0038] Generally, there are several types and quantities of electronic components 2 installed on the circuit board body 1, and the number of pins 7 required to be connected by different electronic components 2 and the positions where the pins 7 are distributed are different. Correspondingly, the shape and number of the heat-conducting patches 3 also need to be set according to the types and quantities of the actual connected electronic components 2 on the circuit board body 1. In this embodiment, three distribution types of the first area 12 and the second area 13 are provided, as shown in the attached Figure 3 and the attached Figure 4 and the attached Figure 5 . Among them, the first type corresponds to the heat-dissipating circuit board in the attached Figure 1 and the attached Figure 2 .

[0039] In some embodiments, a groove 15 for accommodating the heat-conducting patch 3 is formed in the second region 13. The provision of the groove 15 enables the heat-conducting patch 3 to be installed in an embedded manner with respect to the circuit board body 1, preventing the heat-conducting patch 3 from protruding from the surface of the circuit board body 1 and interfering with the installation of the electronic component 2. Generally, the groove 15 in the circuit board body 1 is formed by laser processing.

[0040] In some embodiments, in combination with the attached Figure 6 , the heat-conducting patch 3 has a protruding portion 32 extending into the first through hole 14. On the one hand, the provision of the protruding portion 32 can serve as a heat transfer path at the first through hole 14 and the second through hole 31, facilitating the transfer of heat from the first through hole 14 and the second through hole 31 to the lower part of the circuit board body 1. On the other hand, the provision of the protruding portion 32 also facilitates the connection and positioning of the heat-conducting patch 3 and the circuit board body 1.

[0041] In some embodiments, in combination with the attached Figure 6 , a first side ear 33 is fixedly provided on the heat-conducting patch 3, and a limiting groove 16 for clamping the first side ear 33 and restricting the degree of freedom of the first side ear 33 on the board surface of the circuit board body 1 is formed in the circuit board body 1. The first side ear 33 is also installed on the circuit board body 1 in an embedded manner to avoid interfering with the installation of the electronic component 2. Additionally, the provision of the first side ear 33 also facilitates the manual or mechanical grasping of the heat-conducting patch 3. The limiting groove 16 in the circuit board body 1 is used to improve the positioning effect of the heat-conducting patch 3.

[0042] In a further arrangement, the heat-dissipating circuit board further includes a connecting member 4. In combination with the attached Figure 7 , the connecting member 4 includes a connecting post 41 and a pressing cap 42, and the pressing cap 42 is fixed to one end of the connecting post 41. The entire connecting member 4 can be integrally formed. A connecting hole 17 for an interference fit with the connecting post 41 is formed at the bottom of the limiting groove 16, and a first through hole 34 for the connecting post 41 to pass through is formed through the first side ear 33. The diameter of the first through hole 34 is smaller than the diameter of the pressing cap 42 and larger than the diameter of the connecting post 41. The first side ear 33 is pressed into the limiting groove 16 by the connecting member 4, and the connection strength is ensured by the interference fit connection between the connecting post 41 and the connecting hole 17.

[0043] In a further arrangement, the heat-dissipating circuit board further includes an outer frame 5 for installing the electronic component 2, and the outer frame 5 is tightly connected to the connecting member 4 or the circuit board body 1. Generally, the electronic component 2 is installed on the outer frame 5, and then the outer frame 5 is tightly connected to the connecting member 4 or the circuit board body 1 to achieve the connection between the electronic component 2 and the circuit board body 1. Specifically, internal threaded holes 43 are formed in the connecting member 4 or the circuit board body 1, and second through holes 52 are formed in the outer frame 5 for bolt fasteners to pass through, and the outer frame 5 is fixed to the connecting member 4 or the circuit board body 1 by bolt fasteners.

[0044] When the outer frame 5 is firmly connected to the circuit board body 1, the outer frame 5 is independent of the heat-conducting patch 3. When disassembling, the outer frame 5 and the electronic component 2 need to be removed first, and then the heat-conducting patch 3 can be removed from the circuit board body 1, with a safe and reliable structure. When the outer frame 5 is firmly connected to the connecting member 4, only by separating the connecting member 4 from the connecting hole 17 can the outer frame 5 and the heat-conducting patch 3 be removed simultaneously, which is more convenient and fast when maintaining the circuit board and replacing the heat-conducting patch 3.

[0045] Whether the outer frame 5 is fixed to the connecting member 4 or to the circuit board body 1 needs to be selected according to actual safety requirements.

[0046] In some embodiments, in combination with the attached Figure 8 , there is a sealant layer 6 between the heat-conducting patch 3 and the circuit board body 1. When setting the sealant layer 6, sealant is injected from the first through-hole 14 and the second through-hole 31 between the heat-conducting patch 3 and the electronic component 2. The sealant layer 6 can prevent dust and other impurities from entering between the electronic component 2 and the circuit board body 1 through the first through-hole 14 and the second through-hole 31.

[0047] The present utility model also provides a production and processing device for producing and assembling the above-mentioned heat-dissipating circuit board. The installation steps of the above-mentioned heat-dissipating circuit board are as follows:

[0048] a. Select a circuit board body 1 to be installed;

[0049] b. The heat-conducting patch 3 is snapped into the groove 15 and the first side ear 33 is snapped into the limiting groove 16;

[0050] c. The connecting member 4 presses the heat-conducting patch 3 onto the circuit board body 1;

[0051] d. The outer frame 5 with the electronic component 2 installed is fastened to the connecting member 4 by bolts;

[0052] e. Inject sealant from the first through-hole 14 and the second through-hole 31 between the heat-conducting patch 3 and the electronic component 2.

[0053] For this production and processing device, as shown in the attached Figure 9 and the attached Figure 10 , it includes a base 20 and a horizontal turntable 10 installed on the base 20. The rotational power of the horizontal turntable 10 can be provided by a motor (not shown). A plurality of tooling positions 30 are annularly and arrayedly distributed on the horizontal turntable 10 with the rotation center of the horizontal turntable 10 as the symmetry center. A loading platform 40 is provided on the tooling position 30, and the loading platform 40 has a loading surface 50 and a fixture 60 for clamping the circuit board body 1 is installed on the loading surface 50. Specifically, only one installation step is performed at each tooling position 30, simplifying the installation difficulty at each tooling position 30.

[0054] In some embodiments, a positioning post 70 for passing through the first through hole 14 and the second through hole 31 is fixedly provided on the material loading table 40. In this embodiment, the number of the positioning posts 70 is set to one, and when the circuit board body 1 is placed on the material loading table 40, the positioning post 70 passes through the first through hole 14 and the second through hole 31 at the center. In addition, the material loading table 40 is horizontally and rotatably mounted on the tooling position 30, and the turning power of the material loading table 40 can be provided by a motor (not shown). A glue injection pump 80 is fixedly provided on the other side of the material loading table 40 opposite to the material loading surface 50. A glue injection pipeline 90 is provided through the positioning post 70, and the glue injection pipeline 90 is communicated with the glue injection pump 80. For the function of the positioning post 70, on the one hand, the positioning post 70 passes through the first through hole 14 and the second through hole 31 to position the circuit board body 1, and on the other hand, the positioning post 70 provides support for the glue injection pipeline 90.

[0055] The purpose of the material loading table 40 being horizontally rotatable is to enable the material loading table 40 to be turned 180° before the glue injection step, so that when the glue injection step is carried out, the glue injection pump 80 injects the sealing glue from top to bottom between the heat-conducting patch 3 and the electronic component 2. If the glue injection pump 80 injects glue from bottom to top, the sealing glue is likely to overflow from the first through hole 14 and the second through hole 31 outside the positioning post 70 under the action of gravity.

[0056] In this embodiment, the number of the tooling positions 30 is set to eight. Referring to the attached Figure 10 , five of the tooling positions 30 are used for carrying out the above steps a to e. The remaining three tooling positions 30 can be provided with corresponding toolings according to the requirements of the assembly production, such as toolings for carrying out the reset step f of the material loading table 40, toolings for the circuit board performance detection step g, and toolings for the cleaning step h of the material loading table 40, etc.

[0057] The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the specific details in the above embodiments. Within the scope of the technical concept of the present invention, various simple modifications can be made to the technical solutions of the present invention, and these simple modifications all fall within the protection scope of the present invention.

[0058] In addition, it should be noted that, in the above specific embodiments, the various specific technical features described can be combined in any appropriate manner without contradiction. To avoid unnecessary repetition, the present invention will not separately describe various possible combination methods.

[0059] In addition, any combination can be made between different embodiments of the present invention as long as it does not violate the idea of the present invention, and it should also be regarded as the content disclosed by the present invention.

Claims

1. A heat-dissipating circuit board, characterized in that, Comprising: A circuit board body (1) on which electronic components (2) are mounted; A heat-conducting patch (3) fixedly connected to the circuit board body (1) and located between the circuit board body (1) and the electronic components (2); Wherein, when projected along the direction perpendicular to the board surface of the circuit board body (1), the projection range of the circuit board body (1) includes a first area (12) where pins (7) are distributed and a second area (13) where there are no pins (7) distributed. The electronic components (2) are connected to the pins (7) in the first area (12). The heat-conducting patch (3) is fixed in the second area (13), and a number of first through holes (14) penetrating along the direction perpendicular to the board surface of the circuit board body (1) are provided in the second area (13). Second through holes (31) are provided on the heat-conducting patch (3) opposite to the first through holes (14).

2. The heat-dissipating circuit board according to claim 1, wherein A groove (15) for accommodating the heat-conducting patch (3) is provided in the second area (13).

3. The heat-dissipating circuit board according to claim 1, wherein The heat-conducting patch (3) has a protruding portion (32) extending into the first through hole (14).

4. The heat dissipation type circuit board according to claim 1, characterized in that, The heat-conducting patch (3) has a first side ear (33), and a limiting groove (16) for clamping the first side ear (33) and restricting the freedom of the first side ear (33) on the board surface of the circuit board body (1) is provided on the circuit board body (1).

5. The heat-dissipating circuit board according to claim 4, wherein This heat-dissipating circuit board further includes a connecting member (4), and the connecting member (4) includes: A connecting column (41); A pressing cap (42) fixed at one end of the connecting column (41); A connecting hole (17) for interference-fitting with the connecting column (41) is provided at the bottom of the limiting groove (16). A first through hole (34) for the connecting column (41) to pass through is provided through the first side ear (33). The diameter of the first through hole (34) is smaller than the diameter of the pressing cap (42) and larger than the diameter of the connecting column (41).

6. The heat-dissipating circuit board according to claim 5, wherein, This heat-dissipating circuit board further includes an outer frame (5) for mounting the electronic components (2), and the outer frame (5) is tightly connected to the connecting member (4) or the circuit board body (1).

7. The heat dissipation type circuit board according to any one of claims 1 to 6, characterized in that, A sealant layer (6) is provided between the heat-conducting patch (3) and the electronic components (2).

8. A production and processing device for producing and processing and assembling the heat dissipation type circuit board according to any one of claims 1 to 7, characterized in that, Including a base (20) and a horizontal turntable (10) mounted on the base (20). A number of tooling positions (30) are annularly and arrayedly distributed on the horizontal turntable (10) with the rotation center of the horizontal turntable (10) as the symmetry center. A loading platform (40) is provided on the tooling position (30). The loading platform (40) has a loading surface (50), and a fixture (60) for clamping the circuit board body (1) is mounted on the loading surface (50).

9. The production and processing equipment according to claim 8, characterized in that, A positioning column (70) for passing through the first through hole (14) and the second through hole (31) is fixedly provided on the loading platform (40).

10. The production and processing equipment according to claim 9, characterized in that, The material loading table (40) is horizontally rotatably mounted on the tooling position (30), and a glue injection pump (80) is fixedly provided on the other side of the material loading table (40) relative to the material loading surface (50). A glue injection pipeline (90) is provided through the positioning column (70), and the glue injection pipeline (90) communicates with the glue injection pump (80).

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