Electrical device and energy storage device

Abstract

The utility model provides an electric device and an energy storage device, the electric device is used for the energy storage device, and the electric device comprises a box body which is provided with an accommodating cavity; the circuit board is arranged in the accommodating cavity; the power module is arranged on the circuit board and is electrically connected with the circuit board; the heat dissipation layer is arranged on the side, away from the circuit board, of the power module and located between the power module and the cavity wall of the containing cavity, at least one part of the heat dissipation layer comprises a graphene film layer, and when heat generated by the power module is transmitted to the graphene film layer, the heat is rapidly transmitted in the direction perpendicular to the thickness direction of the graphene film layer; and the heat is transmitted to the outer side of the box body through the cavity wall of the accommodating cavity and exchanges heat with the external environment, so that heat dissipation is realized, the situation that the power module fails due to over-high temperature rise caused by the fact that the heat is concentrated in the area where the power module is located and cannot be effectively dissipated is avoided, and the reliability of the electric device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of household energy storage electrical appliances, in particular to an electrical component and an energy storage device. Background Art

[0002] At present, the inverter in the related art generally uses a ceramic gasket to transfer the heat generated by an IGBT (Insulated Gate Bipolar Transistor) to a heat sink for heat dissipation.

[0003] Since the IGBT itself is relatively small, that is, a small area of heat source on a single side is in contact with the heat sink for heat dissipation, the heat dissipation effect is poor. Under certain operating conditions, the power and heat loss of the IGBT are high, which can easily cause the temperature rise of the IGBT to exceed the junction temperature and cause failure, thereby causing the inverter and the entire energy storage system to fail. Utility Model Content

[0004] The embodiments of the utility model are intended to solve at least one of the technical problems existing in the prior art.

[0005] To this end, a first aspect of an embodiment of the present utility model provides an electric device.

[0006] A second aspect of the embodiments of the present utility model provides an energy storage device.

[0007] In view of this, according to the first aspect of an embodiment of the utility model, an electrical device is provided, which is used for an energy storage device, and the electrical device includes: a box body, the box body is provided with a accommodating cavity; a circuit board is arranged in the accommodating cavity; a power module is arranged on the circuit board and electrically connected to the circuit board; a heat dissipation layer is arranged on the side of the power module away from the circuit board and is located between the power module and the cavity wall of the accommodating cavity, and at least a part of the heat dissipation layer includes a graphene film layer.

[0008] The electric device provided by the embodiment of the utility model comprises a box, a circuit board, a power module and a heat dissipation layer. Specifically, the power module is arranged on the circuit board, and the power module is electrically connected to the circuit board. Optionally, the power module comprises a transistor.

[0009] It is understandable that during the operation of electrical devices, power modules will generate heat. Under certain working conditions, the power and heat consumption of the power module will be very high, causing the heat in a single area of the power module to increase rapidly and the temperature of the power module to rise rapidly. If the heat dissipation is not timely or the heat dissipation effect is poor, it will easily lead to failure of the power module, and then cause failure of the electrical device and the entire energy storage device.

[0010] The heat dissipation layer is arranged on the side of the power module facing away from the circuit board, and at least part of the heat dissipation layer includes a graphene film layer. It can be understood that the graphene film layer has characteristics such as high thermal conductivity, low temperature rise, good flexibility, high fitting degree, and not easy to break. Among them, the lateral thermal conductivity of the graphene film layer can reach 1900 W / (m·k), that is, the graphene film layer has a high thermal conductivity in the direction perpendicular to the thickness of the graphene film layer.

[0011] When the heat generated by the power module is transferred to the graphene film layer, the heat is quickly transferred in the direction perpendicular to the thickness of the graphene film layer and dispersed to the surrounding of the graphene film layer, and then transferred to the outside of the box body through the cavity wall of the accommodation cavity for heat exchange with the external environment to achieve heat dissipation, avoiding heat concentration in the area where the power module is located and unable to be effectively dissipated, which may lead to the situation that the temperature rise of the power module is too high and fails. This makes the overall temperature of the graphene film layer roughly the same, achieving the purpose of quickly balancing the heat generated by the power module, meeting the heat dissipation requirements of high-power and high-heat-consumption electrical components, being beneficial to extending the service life of the electrical components, and improving the reliability of the electrical components.

[0012] Moreover, the heat dissipation layer is in direct contact with the power module, which can significantly improve the efficiency of heat transfer, avoid too high temperature rise of the power module, and improve the heat dissipation effect.

[0013] In addition, it can be understood that during the use of the electrical components of the energy storage device, they are generally installed and fixed by hanging on the wall or stacking. For example, for an inverter, by using the heat dissipation layer with at least part being a graphene film layer for heat dissipation of the power module, compared with the related technology of meeting the heat dissipation requirements by increasing the size of the radiator, it is beneficial to reduce the overall weight of the electrical components, make the product lightweight while meeting the heat dissipation requirements, and further improve the reliability of the electrical components.

[0014] Optionally, the entire heat dissipation layer is a graphene film layer. Or, the heat dissipation layer includes a heat-conducting film layer and a graphene film layer, and the heat-conducting film layer is located between the power module and the graphene film layer, or the graphene film layer is located between the heat-conducting film layer and the power module. It can be specifically set according to actual needs.

[0015] Optionally, the density of the graphene film layer is 0.7 g / cm 3 ~2.1 g / cm 3 。

[0016] Optionally, the density of the graphene film layer is 1.7 g / cm 3 ~2.0 g / cm 3 。

[0017] Optionally, the in-plane thermal conductivity of the graphene film layer is less than or equal to 1900 W / (m·K). Optionally, the in-plane thermal conductivity of the graphene film layer ranges from 1100 W / (m·K) to 1600 W / (m·K), the through-plane thermal conductivity is 10 W / (m·K), it can withstand high temperatures up to 400 °C, the flame retardancy rating is V0, it has high flexibility, and the number of bending times is greater than 10000 times without breaking.

[0018] In addition, the electrical device provided by the above technical solution of the present invention further has the following additional technical features:

[0019] In some technical solutions, optionally, the cross-sectional area of the heat dissipation layer in the direction perpendicular to its thickness is greater than or equal to the area of the side of the circuit board facing the heat dissipation layer.

[0020] In this technical solution, it is defined that the cross-sectional area of the heat dissipation layer in the direction perpendicular to its thickness is greater than or equal to the area of the side of the circuit board facing the heat dissipation layer, that is, the cross-sectional area of the heat dissipation layer is increased, so as to increase the contact area between the heat dissipation layer and the power module, enabling the heat generated by the power module to be transferred to the heat dissipation layer as much as possible, and improving the heat exchange efficiency.

[0021] Moreover, the heat quickly spreads in the direction perpendicular to the thickness of the graphene film layer and disperses to the surrounding of the graphene film layer, avoiding the heat being concentrated in the area where the power module is located and unable to be effectively dissipated, which may lead to the situation that the temperature of the power module rises too high and fails, meeting the heat dissipation requirements of high-power and high-heat-consumption electrical devices.

[0022] In some technical solutions, optionally, the side of the power module facing away from the circuit board is attached to the heat dissipation layer; and / or the heat dissipation layer is attached to the cavity wall of the accommodation cavity.

[0023] In this technical solution, it is defined that the side of the power module facing away from the circuit board is attached to the heat dissipation layer, so that the heat generated by the power module can be transferred to the graphene film layer as much as possible, significantly improving the heat exchange efficiency.

[0024] The heat dissipation layer is attached to the cavity wall of the accommodation cavity. It can be understood that after the heat generated by the power module is transferred to the heat dissipation layer, it quickly spreads laterally in the heat dissipation layer and then transfers the heat to the box body, and heat exchange is carried out with the external environment through the box body to achieve heat dissipation. By attaching the heat dissipation layer to the inner wall of the box body, it is beneficial to improve the heat exchange efficiency and thus improve the heat dissipation effect.

[0025] In addition, when the heat generated by the power module is transferred to the graphene film layer, the heat is rapidly transferred in the thickness direction perpendicular to the graphene film layer and dispersed to the periphery of the graphene film layer, avoiding the concentration of heat in the area where the power module is located and unable to be effectively dissipated, which may lead to the overheating of the power module and failure. This makes the temperature of the entire graphene film layer roughly the same, achieving the purpose of quickly balancing the heat generated by the power module and meeting the heat dissipation requirements of high-power and high-heat-consumption electrical components.

[0026] In some technical solutions, optionally, the electrical component further includes a radiator, which is disposed in the box body and located outside the accommodation cavity, and at least a part of the radiator faces the heat dissipation layer.

[0027] In this technical solution, it is defined that the electrical component further includes a radiator. Specifically, the radiator is arranged outside the accommodation cavity, and at least a part of the radiator faces the heat dissipation layer.

[0028] Specifically, when the heat generated by the power module is transferred to the graphene film layer, the heat is rapidly transferred in the thickness direction perpendicular to the graphene film layer and dispersed to the periphery of the graphene film layer, and then transferred from the graphene film layer to the radiator. The heat rise of the radiator exchanges heat with the external environment to achieve heat dissipation. While avoiding the concentration of heat in the area where the power module is located and unable to be effectively dissipated, which may lead to the overheating of the power module and failure, it improves the heat dissipation efficiency, and further achieves the purpose of quickly balancing the heat generated by the power module, meets the heat dissipation requirements of high-power and high-heat-consumption electrical components, and improves the stability and reliability of the electrical component.

[0029] In some technical solutions, optionally, the box body is further provided with an avoidance opening, which is communicated with the accommodation cavity, and at least a part of the heat dissipation layer and at least a part of the radiator are respectively located on both sides of the avoidance opening.

[0030] In this technical solution, it is defined that the box body is further provided with an avoidance opening. Specifically, the avoidance opening is communicated with the accommodation cavity, and at least a part of the heat dissipation layer and at least a part of the radiator are respectively located on both sides of the avoidance opening. That is to say, when the heat generated by the power module is transferred to the heat dissipation layer, the heat is directly transferred to the radiator through the avoidance opening, which is beneficial to further improving the heat transfer efficiency and the heat dissipation effect.

[0031] In some technical solutions, optionally, at least a part of the heat dissipation layer is attached to the radiator through the avoidance opening.

[0032] In this technical solution, it is defined that at least a part of the heat dissipation layer is attached to the radiator through the avoidance opening, so that the heat transferred to the heat dissipation layer can be transferred to the radiator as much as possible. The heat is dissipated quickly through the heat exchange between the radiator and the external environment, which is beneficial to further improving the heat exchange efficiency, and then improving the heat dissipation effect, meeting the heat dissipation requirements of high-power and high-heat-consumption electrical components, and enhancing the product competitiveness.

[0033] In some technical solutions, optionally, the radiator includes a heat dissipation substrate and a plurality of heat dissipation fins. Among them, the heat dissipation substrate is arranged on the box body and is located outside the accommodation cavity. The first end of each heat dissipation fin is connected to the side of the heat dissipation substrate facing away from the box body, and the second end of each heat dissipation fin extends in a direction away from the heat dissipation substrate; the extension length L of at least one heat dissipation fin satisfies 40 mm ≤ L ≤ 50 mm.

[0034] In this technical solution, it is defined that the radiator further includes a heat dissipation substrate and a plurality of heat dissipation fins. Specifically, the heat dissipation substrate is connected to the outer wall of the box body, and the plurality of heat dissipation fins are arranged at intervals on the side of the heat dissipation substrate facing away from the box body, and the second end of each heat dissipation fin extends in a direction away from the heat dissipation substrate, so as to be able to increase the heat exchange area between the radiator and the external environment, which is beneficial to further improving the heat exchange effect, quickly balancing the heat generated by the power module, meeting the heat dissipation requirements of high-power and high-heat-consumption electrical components, and enhancing the stability and reliability of the electrical components.

[0035] In the related art, for the inverter to meet the heat dissipation requirements, the fin height of the radiator is generally about 70 mm. Using a heat dissipation layer with at least part being a graphene film layer for heat transfer between the power module and the radiator can, while meeting the heat dissipation requirements of high-power and high-heat-consumption electrical components, correspondingly reduce the extension length of the heat dissipation fins, that is, the extension length of at least one heat dissipation fin is between 40 mm and 50 mm, which is beneficial to reducing the production cost of the electrical components. At the same time, it can also reduce the overall weight of the electrical components, make the product lightweight, and further enhance the reliability and product competitiveness of the electrical components.

[0036] Optionally, the thickness of the heat dissipation substrate is about 10 mm.

[0037] In some technical solutions, optionally, the heat dissipation substrate includes an aluminum substrate; and / or at least one heat dissipation fin includes an aluminum heat dissipation fin.

[0038] In this technical solution, the heat dissipation substrate includes an aluminum substrate, that is to say, the heat dissipation substrate is made of metal aluminum, so as to be able to ensure the heat dissipation effect while being beneficial to further reducing the weight of the whole machine and enhancing the stability and reliability of the electrical components.

[0039] At least one heat sink includes an aluminum heat sink, that is to say, at least one heat sink is made of aluminum metal, so that while ensuring the heat dissipation effect, it is beneficial to further reduce the weight of the whole machine and improve the stability and reliability of electrical components.

[0040] In some technical solutions, optionally, the power module includes a transistor and a fixing part. Among them, the heat dissipation layer is arranged on the side of the transistor facing away from the circuit board, and the transistor is connected to the circuit board through the fixing part.

[0041] In this technical solution, it is defined that the power module includes a transistor and a fixing part. Specifically, the heat dissipation layer is arranged on the side of the transistor facing away from the circuit board. That is to say, when the heat generated by the transistor is transferred to the heat dissipation layer, the heat is quickly transferred in the thickness direction perpendicular to the heat dissipation layer and dispersed to the periphery of the heat dissipation layer, and then transferred to the outside of the box body through the cavity wall of the accommodating cavity for heat exchange with the external environment to achieve heat dissipation.

[0042] The transistor is fixed on the circuit board through the fixing part. Optionally, the fixing part includes a fixing tooling, and the transistor is welded on the circuit board through the fixing tooling.

[0043] In some technical solutions, optionally, the thickness d of the graphene film layer satisfies 12μm ≤ d ≤ 100μm.

[0044] In this technical solution, the value range of the thickness of the graphene film layer is defined. Specifically, the thickness of the graphene film layer is between 12μm and 100μm to ensure the heat dissipation effect and meet the heat dissipation requirements of high-power and high-heat-consumption electrical components.

[0045] Moreover, by using the heat dissipation layer at least partially made of the graphene film layer for heat dissipation of the power module, it is beneficial to reduce the overall weight of the electrical components. While meeting the heat dissipation requirements, the product is made lightweight, further improving the stability and reliability of the electrical components, and thus being beneficial to enhancing the product competitiveness.

[0046] In some technical solutions, optionally, the electrical component includes an inverter, a high-voltage box or a battery module.

[0047] According to the second aspect of the present invention, there is provided an energy storage device including the electrical component provided in any of the above technical solutions, and thus having all the beneficial technical effects of the electrical component, which will not be elaborated herein.

[0048] The additional aspects and advantages of the present invention will be given in the following description part, some of which will become obvious from the following description, or can be understood through the practice of the present invention. Description of the Drawings

[0049] The above and / or additional aspects and advantages of the present utility model will become apparent and readily understood from the following description of embodiments in conjunction with the accompanying drawings, wherein:

[0050] Figure 1 FIG. 1 shows one of the partial structural schematic diagrams of an electrical device according to an embodiment of the present utility model;

[0051] Figure 2 FIG. 2 shows one of the partial exploded views of an electrical device according to an embodiment of the present utility model;

[0052] Figure 3 FIG. 3 shows another partial structural schematic diagram of an electrical device according to an embodiment of the present utility model;

[0053] Figure 4 FIG. 4 shows another partial exploded view of an electrical device according to an embodiment of the present utility model;

[0054] Figure 5 FIG. 5 shows one of the thermal simulation result diagrams of an electrical device according to an embodiment of the present utility model;

[0055] Figure 6 FIG. 6 shows another thermal simulation result diagram of an electrical device according to an embodiment of the present utility model.

[0056] Wherein, Figures 1 to 4 The corresponding relationship between the reference numerals and the component names in the drawings is as follows:

[0057] 100 Electrical device, 110 Box body, 111 Accommodating cavity, 112 Avoidance opening, 120 Circuit board, 130 Power module, 131 Transistor, 132 Fixing part, 140 Heat dissipation layer, 141 Graphene film layer, 150 Heat sink, 151 Heat dissipation substrate, 152 Heat dissipation fin. Detailed embodiments

[0058] In order to more clearly understand the above objects, features and advantages of the present utility model, the present utility model will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, without conflict, the embodiments of the present application and the features in the embodiments may be combined with each other.

[0059] In the following description, many specific details are set forth in order to fully understand the present utility model. However, the present utility model may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present utility model is not limited by the specific embodiments disclosed below.

[0060] The following refers to Figures 1 to 6 to describe the electrical device 100 and the energy storage device provided according to some embodiments of the present utility model.

[0061] In one embodiment according to the present application, as Figure 1 and Figure 2 shown, an electrical component 100 is proposed. The electrical component 100 is used for an energy storage device. The electrical component 100 includes: a box body 110, and the box body 110 is provided with a receiving cavity 111; a circuit board 120, which is arranged in the receiving cavity 111; a power module 130, which is arranged on the circuit board 120 and is electrically connected to the circuit board 120; a heat dissipation layer 140, which is arranged on the side of the power module 130 facing away from the circuit board 120 and is located between the power module 130 and the cavity wall of the receiving cavity 111. At least a part of the heat dissipation layer 140 includes a graphene film layer 141.

[0062] The electrical component 100 provided by the embodiment of the present utility model includes a box body 110, a circuit board 120, a power module 130 and a heat dissipation layer 140. Specifically, the power module 130 is arranged on the circuit board 120, and the power module 130 is electrically connected to the circuit board 120. Optionally, the power module 130 includes a transistor 131.

[0063] It can be understood that during the operation of the electrical component 100, the power module 130 will generate heat. Under individual working conditions, the power and heat consumption of the power module 130 will be very high, causing the heat in a single area of the power module 130 to increase rapidly, and the temperature of the power module 130 to rise rapidly. If the heat dissipation is not timely or the heat dissipation effect is poor, it is easy to cause the power module 130 to fail, and then cause the electrical component 100 and the entire energy storage device to fail.

[0064] The heat dissipation layer 140 is arranged on the side of the power module 130 facing away from the circuit board 120, and at least part of the heat dissipation layer 140 includes a graphene film layer 141. It can be understood that the graphene film layer 141 has the characteristics of high thermal conductivity, low temperature rise, good flexibility, high fitting degree and not easy to break. Among them, the transverse thermal conductivity of the graphene film layer 141 can reach 1900 W / (m·k), that is, the thermal conductivity of the graphene film layer 141 in the direction perpendicular to the thickness of the graphene film layer 141 is relatively high.

[0065] When the heat generated by the power module 130 is transferred to the graphene film layer 141, the heat is quickly transferred in the direction perpendicular to the thickness of the graphene film layer 141 and dispersed to the surrounding of the graphene film layer 141, and then transferred to the outside of the box body 110 through the cavity wall of the receiving cavity 111 for heat exchange with the external environment, realizing heat dissipation, avoiding the heat being concentrated in the area where the power module 130 is located and unable to be effectively dissipated, and then causing the temperature rise of the power module 130 to be too high and resulting in failure, making the overall temperature of the graphene film layer 141 roughly the same, achieving the purpose of quickly balancing the heat generated by the power module 130, meeting the heat dissipation requirements of high-power and high-heat-consumption electrical components 100, being beneficial to extending the service life of the electrical component 100 and improving the reliability of the electrical component 100.

[0066] Moreover, the heat dissipation layer 140 is in direct contact with the power module 130, which can significantly improve the efficiency of heat transfer, prevent the temperature of the power module 130 from rising too high, and enhance the heat dissipation effect.

[0067] In addition, it can be understood that during the use of the electrical components 100 of the energy storage device, they are generally installed and fixed by hanging on the wall or stacking. For example, for an inverter, by using the heat dissipation layer 140 with at least part being the graphene film layer 141 to dissipate heat from the power module 130, compared with the related art where the size of the radiator is increased to meet the heat dissipation requirements, it is beneficial to reduce the overall weight of the electrical components 100, make the product lightweight while meeting the heat dissipation requirements, and further improve the reliability of the electrical components 100.

[0068] Optionally, the entire heat dissipation layer 140 is the graphene film layer 141. Alternatively, the heat dissipation layer 140 includes a heat conductive film layer and the graphene film layer 141, where the heat conductive film layer is located between the power module 130 and the graphene film layer 141, or the graphene film layer 141 is located between the heat conductive film layer and the power module 130. It can be specifically set according to actual needs.

[0069] Optionally, the density of the graphene film layer 141 is 0.7 g / cm 3 ~2.1 g / cm 3 。

[0070] Optionally, the density of the graphene film layer 141 is 1.7 g / cm 3 ~2.0 g / cm 3 。

[0071] Optionally, the lateral thermal conductivity of the graphene film layer 141 is less than or equal to 1900 W / (m·k). Optionally, the lateral thermal conductivity of the graphene film layer 141 is between 1100 W / (m·k) and 1600 W / (m·k), the longitudinal thermal conductivity is 10 W / (m·k), and it can withstand high temperatures up to 400 °C, the flame retardant grade is V0, it has high flexibility, the number of bending times is greater than 10000 times and it does not break, as shown in the following table:

[0072]

[0073]

[0074] In some embodiments, optionally, the cross-sectional area of the heat dissipation layer 140 in the direction perpendicular to the thickness direction is greater than or equal to the area of the side of the circuit board 120 facing the heat dissipation layer 140.

[0075] In this embodiment, it is defined that the cross-sectional area of the heat dissipation layer 140 in the direction perpendicular to its thickness is greater than or equal to the area of the side of the circuit board 120 facing the heat dissipation layer 140, that is, the cross-sectional area of the heat dissipation layer 140 is increased, so as to increase the contact area between the heat dissipation layer 140 and the power module 130, enabling the heat generated by the power module 130 to be transferred to the heat dissipation layer 140 as much as possible and improving the heat exchange efficiency.

[0076] Moreover, the heat rapidly spreads in the direction perpendicular to the thickness of the graphene film layer 141 and is dispersed to the periphery of the graphene film layer 141, preventing the heat from concentrating in the area where the power module 130 is located and being unable to dissipate effectively, which may lead to the situation that the temperature of the power module 130 rises too high and fails, meeting the heat dissipation requirements of high-power and high-heat-consumption electrical components 100.

[0077] In some embodiments, optionally, the side of the power module 130 facing away from the circuit board 120 is attached to the heat dissipation layer 140; and / or the heat dissipation layer 140 is attached to the cavity wall of the accommodation cavity 111.

[0078] In this embodiment, it is defined that the side of the power module 130 facing away from the circuit board 120 is attached to the heat dissipation layer 140, so that the heat generated by the power module 130 can be transferred to the graphene film layer 141 as much as possible, significantly improving the heat exchange efficiency.

[0079] The heat dissipation layer 140 is attached to the cavity wall of the accommodation cavity 111. It can be understood that after the heat generated by the power module 130 is transferred to the heat dissipation layer 140, it rapidly spreads in the transverse direction of the heat dissipation layer 140 and then transfers the heat to the box body 110, and heat exchange is carried out with the external environment through the box body 110 to achieve heat dissipation. By attaching the heat dissipation layer 140 to the inner wall of the box body 110, it is beneficial to improve the heat exchange efficiency and further improve the heat dissipation effect.

[0080] In addition, when the heat generated by the power module 130 is transferred to the graphene film layer 141, the heat rapidly transfers in the direction perpendicular to the thickness of the graphene film layer 141 and is dispersed to the periphery of the graphene film layer 141, preventing the heat from concentrating in the area where the power module 130 is located and being unable to dissipate effectively, which may lead to the situation that the temperature of the power module 130 rises too high and fails, making the temperature of the entire graphene film layer 141 roughly the same, achieving the purpose of quickly balancing the heat generated by the power module 130 and meeting the heat dissipation requirements of high-power and high-heat-consumption electrical components 100.

[0081] As Figure 3 and Figure 4 shown, in some embodiments, optionally, the electrical component 100 further includes a radiator 150. The radiator 150 is disposed in the box body 110 and is located outside the accommodation cavity 111, and at least a part of the radiator 150 faces the heat dissipation layer 140.

[0082] In this embodiment, it is defined that the electrical component 100 further includes a radiator 150. Specifically, the radiator 150 is disposed outside the accommodation cavity 111, and at least a part of the radiator 150 faces the heat dissipation layer 140.

[0083] Specifically, when the heat generated by the power module 130 is transferred to the graphene film layer 141, the heat is rapidly transferred in the thickness direction perpendicular to the graphene film layer 141 and dispersed to the periphery of the graphene film layer 141, and then transferred from the graphene film layer 141 to the radiator 150. The heat rise of the radiator 150 exchanges heat with the external environment to achieve heat dissipation. While avoiding the heat being concentrated in the area where the power module 130 is located and unable to be effectively dissipated, which may lead to the failure of the power module 130 due to excessive temperature rise, the heat dissipation efficiency is improved, and the purpose of quickly balancing the heat generated by the power module 130 is achieved, meeting the heat dissipation requirements of high-power and high-heat-consumption electrical components 100, and improving the stability and reliability of the electrical component 100.

[0084] It can be understood that when the junction temperature of the power module 130 is 140 °C, that is, when the temperature of the power module 130 exceeds 140 °C, the power module 130 will fail, which will cause the failure of the entire energy storage device. In the related art, ceramic gaskets and thermal conductive greases are used to transfer the heat generated by the IGBT to the radiator. The transfer surface is small, and the horizontal thermal conductivity of the alumina ceramic gasket is 18 W / (m·k) to 35 W / (m·k). Even if the area of the ceramic gasket is increased, the heat cannot be effectively transferred to the entire surface.

[0085] As Figure 5 shown, the heat dissipation layer 140 with at least part being the graphene film layer 141 is used for heat transfer between the power module 130 and the radiator 150. The highest temperature is 120.2 °C, meeting the heat dissipation requirements and avoiding the failure of the power module 130.

[0086] As Figure 4 shown, in some embodiments, optionally, the box body 110 is further provided with an avoidance opening 112. The avoidance opening 112 communicates with the accommodation cavity 111, and at least part of the heat dissipation layer 140 and at least part of the radiator 150 are respectively located on both sides of the avoidance opening 112.

[0087] In this embodiment, it is defined that the box body 110 is further provided with an avoidance opening 112. Specifically, the avoidance opening 112 communicates with the accommodation cavity 111, and at least a part of the heat dissipation layer 140 and at least a part of the radiator 150 are respectively located on both sides of the avoidance opening 112. That is to say, when the heat generated by the power module 130 is transferred to the heat dissipation layer 140, the heat is directly transferred to the radiator 150 through the avoidance opening 112, which is beneficial to further improving the heat transfer efficiency and the heat dissipation effect.

[0088] In some embodiments, optionally, at least a part of the heat dissipation layer 140 is attached to the radiator 150 through the avoidance opening 112.

[0089] In this embodiment, it is defined that at least a part of the heat dissipation layer 140 is attached to the radiator 150 through the avoidance opening 112, so that the heat transferred to the heat dissipation layer 140 can be transferred to the radiator 150 as much as possible. Heat is quickly dissipated through the heat exchange between the radiator 150 and the external environment, which is beneficial to further improving the heat exchange efficiency, thereby enhancing the heat dissipation effect, meeting the heat dissipation requirements of high-power and high-heat-consumption electrical components 100, and enhancing the product competitiveness.

[0090] As Figure 3 shown, in some embodiments, optionally, the radiator 150 includes a heat dissipation substrate 151 and a plurality of heat dissipation fins 152. Among them, the heat dissipation substrate 151 is disposed on the box body 110 and is located outside the accommodation cavity 111. The first end of each heat dissipation fin 152 is connected to the side of the heat dissipation substrate 151 facing away from the box body 110, and the second end of each heat dissipation fin 152 extends in a direction away from the heat dissipation substrate 151; the extension length L of at least one heat dissipation fin 152 satisfies 40 mm ≤ L ≤ 50 mm.

[0091] In this embodiment, it is defined that the radiator 150 further includes a heat dissipation substrate 151 and a plurality of heat dissipation fins 152. Specifically, the heat dissipation substrate 151 is connected to the outer wall of the box body 110, and the plurality of heat dissipation fins 152 are arranged at intervals on the side of the heat dissipation substrate 151 facing away from the box body 110, and the second end of each heat dissipation fin 152 extends in a direction away from the heat dissipation substrate 151, so as to increase the heat exchange area between the radiator 150 and the external environment, which is beneficial to further improving the heat exchange effect, quickly balancing the heat generated by the power module 130, meeting the heat dissipation requirements of high-power and high-heat-consumption electrical components 100, and enhancing the stability and reliability of the electrical components 100.

[0092] For the inverter in the related art to meet the heat dissipation requirements, the fin height of the radiator is generally about 70 mm. Using the heat dissipation layer 140 with at least part being the graphene film layer 141 for heat transfer between the power module 130 and the radiator 150, while meeting the heat dissipation requirements of high-power and high-heat-consumption electrical components 100, the extension length of the heat dissipation fins 152 can be correspondingly reduced, that is, the extension length of at least one heat dissipation fin 152 is between 40 mm and 50 mm, which is beneficial to reducing the production cost of the electrical components 100. At the same time, it can also reduce the overall weight of the electrical components 100, make the product lightweight, and further enhance the reliability and product competitiveness of the electrical components 100.

[0093] Optionally, the thickness of the heat dissipation substrate 151 is about 10 mm.

[0094] As Figure 6As shown, a heat dissipation layer 140 that is at least partially a graphene film layer 141 is used for heat transfer between the power module 130 and the radiator 150. Among them, the extended length of the heat sink 152 is 70 mm, and the maximum temperature is 112.3 °C.

[0095] As Figure 5 shown, a heat dissipation layer 140 that is at least partially a graphene film layer 141 is used for heat transfer between the power module 130 and the radiator 150. Among them, the extended length of the heat sink 152 is 50 mm, that is, the extended length of the heat sink 152 is reduced by 20 mm, and the maximum temperature is 120.2 °C. While meeting the heat dissipation requirements, the production cost of the electrical component 100 is reduced, the weight of the whole machine is reduced, and the reliability of the electrical component 100 is improved.

[0096] In some embodiments, optionally, the heat dissipation substrate 151 includes an aluminum substrate; and / or at least one heat sink 152 includes an aluminum heat sink.

[0097] In this embodiment, the heat dissipation substrate 151 includes an aluminum substrate, that is to say, the heat dissipation substrate 151 is made of metallic aluminum, so that while ensuring the heat dissipation effect, it is beneficial to further reduce the weight of the whole machine and improve the stability and reliability of the electrical component 100.

[0098] At least one heat sink 152 includes an aluminum heat sink, that is to say, at least one heat sink 152 is made of metallic aluminum, so that while ensuring the heat dissipation effect, it is beneficial to further reduce the weight of the whole machine and improve the stability and reliability of the electrical component 100.

[0099] As Figure 1 and Figure 3 shown, in some embodiments, optionally, the power module 130 includes a transistor 131 and a fixing part 132. Among them, the heat dissipation layer 140 is disposed on the side of the transistor 131 facing away from the circuit board 120, and the transistor 131 is connected to the circuit board 120 through the fixing part 132.

[0100] In this embodiment, it is defined that the power module 130 includes a transistor 131 and a fixing part 132. Specifically, the heat dissipation layer 140 is disposed on the side of the transistor 131 facing away from the circuit board 120. That is to say, when the heat generated by the transistor 131 is transferred to the heat dissipation layer 140, the heat is quickly transferred in the thickness direction perpendicular to the heat dissipation layer 140 and dispersed to the periphery of the heat dissipation layer 140, and then transferred to the outside of the box body 110 through the cavity wall of the accommodation cavity 111 to perform heat exchange with the external environment to achieve heat dissipation.

[0101] The transistor 131 is fixed on the circuit board 120 through the fixing part 132. Optionally, the fixing part 132 includes a fixing tooling, and the transistor 131 is welded to the circuit board 120 through the fixing tooling.

[0102] In some embodiments, optionally, the thickness d of the graphene film layer 141 satisfies 12 μm ≤ d ≤ 100 μm.

[0103] In this embodiment, the value range of the thickness of the graphene film layer 141 is defined. Specifically, the thickness of the graphene film layer 141 is between 12 μm and 100 μm, ensuring the heat dissipation effect and meeting the heat dissipation requirements of the high-power and high-heat-consumption electrical device 100.

[0104] Moreover, by using the heat dissipation layer 140 which is at least partially the graphene film layer 141 to dissipate heat from the power module 130, it is beneficial to reduce the overall weight of the electrical device 100. While meeting the heat dissipation requirements, it makes the product lightweight, further improves the stability and reliability of the electrical device 100, and thus is beneficial to enhancing the product competitiveness.

[0105] In some embodiments, optionally, the electrical device 100 includes an inverter, a high-voltage box or a battery module.

[0106] According to the second aspect of the present utility model, there is provided an energy storage device, including the electrical device 100 provided in any of the above embodiments, and thus having all the beneficial technical effects of the electrical device 100, which will not be elaborated herein.

[0107] In the description of this specification, terms such as "connection", "installation", "fixation", etc. should all be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0108] In the description of this specification, the description of terms such as "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0109] The above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. For those skilled in the art, the present utility model can have various changes and modifications. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. An electrical component, characterized in that, The electrical device is used for an energy storage device, and the electrical device comprises: A box body, wherein the box body is provided with a containing cavity; A circuit board is arranged in the accommodating cavity; A power module, disposed on the circuit board and electrically connected to the circuit board; The heat dissipation layer is arranged on a side of the power module away from the circuit board and is located between the power module and the cavity wall of the accommodating cavity. At least a part of the heat dissipation layer includes a graphene film layer.

2. The electrical component according to claim 1, wherein The cross-sectional area of the heat dissipation layer in a direction perpendicular to the thickness is greater than or equal to the area of a side surface of the circuit board facing the heat dissipation layer.

3. The electrical device according to claim 1 or 2, characterized in that: The heat dissipation layer is in contact with the cavity wall of the accommodating cavity.

4. The electrical component according to claim 1 or 2, characterized in that, Also includes: The radiator is arranged in the box body and located outside the accommodating cavity, and at least a part of the radiator is opposite to the heat dissipation layer.

5. The electrical component according to claim 4, characterized in that, The box body is further provided with an escape opening, which is communicated with the accommodating cavity, and at least part of the heat dissipation layer and at least part of the radiator are respectively located on both sides of the escape opening.

6. The electrical component according to claim 5, wherein, At least a portion of the heat dissipation layer is in contact with the heat sink through the escape opening.

7. The electrical component according to claim 4, characterized in that, The radiator comprises: A heat dissipation substrate is provided in the box body and is located outside the accommodating cavity; A plurality of heat sinks, wherein a first end of each heat sink is connected to a side of the heat sink facing away from the box body, and a second end of each heat sink extends in a direction away from the heat sink; Wherein, an extension length L of at least one of the heat sinks satisfies 40 mm ≤ L ≤ 50 mm.

8. The electric device according to claim 7, characterized in that The heat dissipation substrate comprises an aluminum substrate; and / or At least one of the heat sinks comprises an aluminum heat sink.

9. The electrical component according to claim 1 or 2, characterized in that, The power module comprises: A transistor, wherein the heat dissipation layer is arranged on a side of the transistor away from the circuit board; A fixing portion, through which the transistor is connected to the circuit board.

10. The electrical component according to claim 1 or 2, characterized in that, The thickness d of the graphene film layer satisfies 12 μm≤d≤100 μm.

11. The electrical component according to claim 1 or 2, characterized in that, The electrical device includes an inverter, a high voltage box or a battery module.

12. An energy storage device, characterized in that, The invention comprises the electric device according to any one of claims 1 to 11.

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