Target board and any layer interconnection HDI board
The target board with asymmetric laser targets and honeycomb barriers addresses precision issues in high-density interconnect boards, enhancing alignment and reducing defects for improved production efficiency.
Patent Information
- Application Number
- CN202422053277.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-23
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-08-23
AI Technical Summary
During the multi-layer processing, existing any-layer interconnect HDI plates are prone to quality defects such as pattern deviation, blind hole deviation and collapse after etching due to shrinkage and compression deviation, which affects production efficiency and product quality.
A target plate is designed, using asymmetrical arrangement of laser targets and combined with a honeycomb-shaped plate edge block structure to improve the positioning accuracy of the laser machine, and reducing positioning point damage through the central hollow copper ring design of the laser target. At the same time, the plate edge block is adjusted to be honeycomb-shaped to enhance the tensile resistance.
Effectively improve the positioning accuracy of the laser machine, reduce the problems of shrinkage and collapse during processing, enhance the product's thermal stress and mechanical stress resistance, and ensure product quality and production efficiency.
Smart Images
Figure CN223110250U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit boards, in particular to a target board and an any-layer interconnect HDI board. Background Art
[0002] The printed circuit board (PCB) industry is facing the development trend of being light, thin, short, small, high-frequency, high-speed, low-pollution, low-energy consumption, multi-layer, and intelligent, as well as increasingly severe external situations. Among them, the any-layer interconnect HDI board is a high-density interconnect technology and a high-end new type of circuit board with micro-vias, high density, and low cost. It allows interconnection between any two layers in the PCB, without being restricted by the layer spacing. This technology greatly improves the flexibility of wiring design and can save about 30% of the PCB space. The any-layer interconnect HDI board can meet the development of electronic products towards being light, thin, short, small, multi-functional, high-frequency, high-speed digital, and compatible. Especially under the rapid development of high integration of semiconductor chips, it has excellent market application prospects.
[0003] The any-layer interconnect HDI board is named 1st-order HDI, 2nd-order HDI... 6th-order HDI according to different lamination times and interconnect layers. With the increase in the number of layers, the processing difficulty will increase linearly. Too many interconnect layers will cause quality defects such as pattern misalignment, blind via misalignment, and via collapse after etching due to different layer shrinkage and lamination offset, affecting production quality and production efficiency. Currently, the main processing methods in the industry are mechanical target hole processing for alignment, making X-Ray holes after lamination during inner layer production, or mechanical drilling for laser hole positioning. Such positioning adds the accuracy of X-Ray equipment and mechanical drilling equipment to the factors affecting the HDI hole stack accuracy.
[0004] Therefore, there is still a need to develop a high-quality target board and an any-layer interconnect HDI board containing the target board. Summary of the Utility Model
[0005] The purpose of the utility model is to provide a target board and an any-layer interconnect HDI board to obtain a high-quality target board and any-layer interconnect HDI board product.
[0006] The purpose of the utility model can be achieved by the following technical solutions:
[0007] The utility model provides a target board, including a board body, on which a plurality of laser targets and tool holes are provided, wherein the laser targets are asymmetrically arranged on the board body;
[0008] A plurality of board edge choke blocks are equidistantly arranged on the board body, and the board edge choke blocks are arranged to form a honeycomb structure.
[0009] Furthermore, the laser target is in the overall shape of a regular quadrilateral structure, and a target round hole is provided at the center of the regular quadrilateral structure.
[0010] Furthermore, the target round hole does not penetrate through the thickness direction of the plate body, and the target round hole penetrates to expose the resin layer of the plate body.
[0011] Furthermore, the distance between the laser target and the edge of the plate body is not less than 10 mm.
[0012] Furthermore, the distance between the laser target and the long side edge of the plate body is not less than 10 mm, and the distance between the laser target and the short side edge of the plate body is not less than 20 mm.
[0013] Even further, the laser targets are respectively arranged at the four corners of the plate body.
[0014] Even further, the distances between the laser targets at three corners and the edge of the plate body are equal, and the laser target at the other corner is arranged in a staggered manner, and the distance between it and the short side edge of the plate body is greater than the distances between the laser targets at the other three corners and the short side edge of the plate body.
[0015] Furthermore, the edge blocking block of the plate is in a regular hexagon structure, and the single-side width of the edge blocking block of the plate is 3 - 5 cm.
[0016] Furthermore, the spacing between the edge blocking blocks of the plate is 400 - 600 μm.
[0017] The present utility model also provides an arbitrary-layer interconnected HDI board including a target board. The arbitrary-layer interconnected HDI board includes at least two layers of spliced boards, and the middle two layers of spliced boards are the target boards.
[0018] Furthermore, the arbitrary-layer interconnected HDI board is a six-layer arbitrary-interconnected HDI board. The third layer and the fourth layer are both target boards, and the laser targets on the third layer and the fourth layer target boards correspond one by one.
[0019] Compared with the prior art, the present utility model has the following beneficial effects:
[0020] (1) By providing staggered laser targets on the target board, the present utility model improves the positioning accuracy of the laser machine, and cooperates with the honeycomb-shaped edge blocking blocks of the plate to effectively alleviate the problems of swelling and shrinkage and hole collapse.
[0021] (2) The edge blocking blocks of the plate of the present utility model are adjusted from the traditional cross-shaped structure design to a honeycomb-shaped design, which can ensure that the structural hardness is improved while the material and the glue flow effect of the product remain unchanged, and reduce the influence of swelling and shrinkage during the production process.
[0022] (3) The edge baffle block of the present utility model obtains better processing reliability by adjusting the honeycomb size and spacing, so as to increase the anti-tensile effect of the final product, improve the resistance of the product to thermal stress and mechanical stress generated during the processing, and effectively reduce the processing deformation.
[0023] (4) The laser target of the present utility model is designed as a central hollow copper ring, which can effectively reduce the positioning point damage caused by laser depth control. After laser depth control, a clear and reliable positioning target point is formed by the color difference between the bottom resin and the copper ring; while for traditional cross targets, origin targets, etc., due to the small copper layer of the target point, it is easy to be penetrated and damaged during laser depth control, resulting in product failure. Description of the Drawings
[0024] Figure 1 It is a schematic structural diagram of the target board of the present utility model.
[0025] Figure 2 It is a schematic structural diagram of the laser target of the present utility model.
[0026] Figure 3 It is a schematic structural diagram of the edge baffle block of the present utility model.
[0027] Figure 4 It is a schematic structural diagram of the any-layer interconnect HDI board of the present utility model.
[0028] Explanation of the Marks in the Figures:
[0029] 1 - board body, 2 - laser target, 21 - target round hole, 3 - tool hole, 4 - edge baffle block. Detailed Embodiment
[0030] The present utility model will be described in detail below with reference to the drawings and specific embodiments. This embodiment is implemented on the premise of the technical solution of the present utility model, and gives the detailed implementation method and specific operation process, but the protection scope of the present utility model is not limited to the following embodiments.
[0031] In the present utility model, it should be noted that the orientation or positional relationship indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model; the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance; in addition, unless otherwise clearly defined and limited, the terms "installation", "connection", "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0032] It should be noted that: Similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.
[0033] Embodiment 1:
[0034] A target board includes a board body 1, on which a plurality of laser targets 2 and tool holes 3 are provided. Among them, the laser targets 2 are asymmetrically arranged on the board body 1, that is, one of the laser targets 2 is misaligned.
[0035] A plurality of board-edge flow-blocking blocks 4 are equidistantly arranged on the board body 1. The board-edge flow-blocking blocks 4 are arranged to form a honeycomb structure, which increases the anti-tensile effect of the product and effectively reduces the processing deformation by improving the resistance of the product to the thermal stress and mechanical stress generated during the processing.
[0036] Embodiment 2:
[0037] A target board includes a board body 1, on which a plurality of laser targets 2 and tool holes 3 are provided.
[0038] Among them, the laser targets 2 are asymmetrically arranged on the plate body 1, that is, one of the laser targets 2 is misaligned. The laser target 2 is a regular quadrilateral structure as a whole, and a target circular hole 21 is opened at the center of the regular quadrilateral structure. The target circular hole 21 does not penetrate the thickness direction of the plate body 1, and the target circular hole 21 penetrates to expose the resin layer of the plate body 1. The distance between the laser target 2 and the long side edge of the plate body 1 is not less than 10 mm, and the distance from the short side edge of the plate body 1 is not less than 20 mm. The laser targets 2 are respectively arranged at three of the four corners of the plate body 1. The distances between the laser targets 2 at these three corners and the long side and short side edges of the plate body 1 are equal. The laser target 2 at the other corner is misaligned, and its distance from the short side edge of the plate body 1 is greater than the distances between the laser targets 2 at the other three corners and the short side edge of the plate body 1.
[0039] A plurality of plate edge flow blocking blocks 4 are arranged at equal intervals on the plate body 1, and the plate edge flow blocking blocks 4 are arranged to form a honeycomb structure. The plate edge flow blocking blocks 4 in this embodiment are regular hexagon structures, and the single-side width of the plate edge flow blocking blocks 4 is 3 - 5 cm. The spacing between the plate edge flow blocking blocks 4 is 400 - 600 μm.
[0040] Example 3:
[0041] An arbitrary layer interconnected HDI board includes at least two layers of panel boards, and the middle two layers of panel boards are the target boards described in the embodiment. In this embodiment, the arbitrary layer interconnected HDI board is a six-layer arbitrary interconnected HDI board, and the third layer and the fourth layer are both target boards, and the laser targets 2 on the third layer and the fourth layer target boards correspond one by one.
[0042] Example 4:
[0043] This embodiment provides an arbitrary layer interconnected HDI board and its specific manufacturing process. The main steps are as follows:
[0044] (1) Design an inner layer positioning pattern with a simple structure and strong anti-interference ability to ensure accurate device recognition.
[0045] (2) Lay honeycomb-shaped plate edge flow blocking blocks 4 on the copper-free area and the processing edge of the inner layer of the panel board to ensure that the structural hardness is improved under the condition that the material and the glue flow effect remain unchanged, and reduce the influence of expansion and shrinkage during the production process.
[0046] (3) During the processing, use a laser to break through the surface copper and resin layer to expose the inner layer design positioning pattern, and directly grab the positioning, which can cross the influence of other positioning schemes and improve the alignment accuracy to ±0.5 mil.
[0047] In this embodiment, the laser target 2 is designed as a square with a side length of 5 mm. A target round hole 21 with a diameter of 1 mm is etched at the center of the square to expose the resin for automatic positioning by the laser machine. The laser targets 2 on the same side or the other side of the production board cannot be symmetrical. The laser target 2 in the upper right corner needs to be offset by 5 mm to prevent errors during production. A ≥ 20 mm and B ≠ A to prevent errors. The laser target 2 in this embodiment is designed as a central hollow copper ring, which can effectively reduce the damage to the positioning points caused by laser depth control. After laser depth control, a clear and reliable positioning target point is formed by the color difference between the bottom resin and the copper ring. For traditional cross-shaped target points, origin target points, etc., due to the small copper layer of the target points, they are easily penetrated and damaged during laser depth control, resulting in failure. By arranging the target points in a staggered position, it is possible to effectively avoid using returned materials.
[0048] For the six-layer arbitrary interconnect HDI board, laser targets 2 are added simultaneously on L3 (the third layer) and L4 (the fourth layer), and three tool hole 3 targets are designed in the board. The tool hole 3 targets are designed according to the conventional method. There are three tool hole 3 coordinates in the drill tape format of L5 - L6 layers. During laser processing, pre-alignment is performed, and the hole depth exceeds the inner layer target. The laser machine grabs the inner layer target for processing. All laser targets 2 are designed as inner layer laser targets 2, that is, the pattern of the laser target 2 is made on the layer corresponding to the bottom PAD of the blind hole, and an empty window with a size of 5 mm × 5 mm is made on the layer where the blind hole is opened (the purpose of the empty window is to prevent interference from other layers), and the inner layer laser target is exposed. After each lamination, the laser depth control is used to clean the glue flowing out of the target positions on L3 and L4 layers to expose the targets. All layers share the targets on L3 and L4 layers to prevent layer-by-layer co-directional offset. The distance between the laser target 2 and the edge of the board body 1 is ≥ 10 mm from the board edge to prevent the laser target 2 from being too close to the board edge and being easily damaged and incomplete.
[0049] In this embodiment, the board edge flow block 4 is adjusted to a honeycomb shape, and the gap of the board edge flow block 4 is 500 μm, which can increase the anti-tensile effect of the product, improve the resistance of the product to thermal stress and mechanical stress generated during the processing, and effectively reduce the processing deformation. By adjusting the honeycomb size and spacing, better processing reliability can be obtained.
[0050] The above description of the embodiments is for the convenience of those of ordinary skill in the art to understand and use the utility model. Those skilled in the art can obviously make various modifications to these embodiments easily and apply the general principles described herein to other embodiments without creative labor. Therefore, the present utility model is not limited to the above embodiments, and all improvements and modifications made by those skilled in the art without departing from the scope of the present utility model according to the disclosure of the present utility model should be within the protection scope of the present utility model.
Claims
1. A target board, comprising a board body (1), characterized in that, A plurality of laser targets (2) and tool holes (3) are formed in the plate body (1), wherein the laser targets (2) are asymmetrically arranged on the plate body (1); A plurality of plate edge flow blocking blocks (4) are equidistantly arranged on the plate body (1), and the plate edge flow blocking blocks (4) are arranged to form a honeycomb structure.
2. A target board according to claim 1, characterized in that, The laser target (2) is an overall regular quadrilateral structure, and a target circular hole (21) is formed at the center of the regular quadrilateral structure.
3. A target board according to claim 2, characterized in that, The target circular hole (21) does not penetrate through the thickness direction of the plate body (1), and the target circular hole (21) penetrates to expose the resin layer of the plate body (1).
4. A target board according to claim 1, characterized in that, The distance between the laser target (2) and the edge of the plate body (1) is not less than 10 mm.
5. A target board according to claim 4, characterized in that, The distance between the laser target (2) and the long edge of the plate body (1) is not less than 10 mm, and the distance between the laser target (2) and the short edge of the plate body (1) is not less than 20 mm.
6. A target board according to claim 5, characterized in that, The laser targets (2) are respectively arranged at the four corners of the plate body (1); Among them, the distances between the triangular laser targets (2) and the edge of the plate body (1) are equal, and the laser target (2) at the other corner is arranged in a staggered manner, and the distance between it and the short edge of the plate body (1) is greater than the distances between the other triangular laser targets (2) and the short edge of the plate body (1).
7. A target board according to claim 1, characterized in that, The plate edge flow blocking block (4) is a regular hexagon structure, and the single-side width of the plate edge flow blocking block (4) is 3 - 5 cm.
8. A target board according to claim 1, characterized in that, The spacing of the plate edge flow blocking blocks (4) is 400 - 600 μm.
9. An arbitrary-layer interconnected HDI board comprising the target board according to any one of claims 1-8, characterized in that The arbitrary layer interconnected HDI board includes at least two layers of panel boards, and the middle two layers of panel boards are the target boards.
10. The any-layer interconnected HDI board according to claim 9, wherein, The arbitrary layer interconnected HDI board is a six-layer arbitrary interconnected HDI board, wherein the third layer and the fourth layer are both target boards, and the laser targets (2) on the third layer and the fourth layer target boards correspond one by one.