Electronic module conduction and heat dissipation structure
The modular heat dissipation structure with a screw mechanism simplifies heat sink installation and removal, addressing thermal inefficiencies in high-power electronic devices by enhancing thermal conductivity and reliability.
Patent Information
- Application Number
- CN202422346815.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-26
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-09-26
AI Technical Summary
In existing electronic equipment, the heat sink is fixedly installed on the circuit board, which is inconvenient for disassembly and replacement, resulting in a decrease in the heat dissipation effect and affecting the reliability and service life of the equipment.
The combined structure of screw, nut and limit rod is adopted to facilitate disassembly and installation of the heat sink through the screwing of the nut. The contact area between the electronic module and the heat sink is increased through the design of the limit plate and the filling block, and the air gap is reduced to improve the heat conduction efficiency.
It realizes convenient disassembly and replacement of heat sinks, improves heat dissipation efficiency, and extends the service life and reliability of the equipment.
Smart Images
Figure CN223110394U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of electronic devices, and particularly relates to a conduction heat dissipation structure for an electronic module. Background Art
[0002] With the development of electronic devices towards miniaturization and high performance, the power consumption inside the electronic module also increases accordingly. Excessive temperature will cause the performance of electronic devices to decline, the service life to be shortened, and even the devices to fail, seriously affecting the reliability and service life of electronic devices.
[0003] When the existing electronic devices are in use, the heat sinks inside them are fixedly installed on the circuit board, which is not convenient for the disassembly and installation of the heat sinks. If the heat sinks are not replaced for a long time, the heat dissipation effect is likely to decline, affecting the service life of the electronic devices. Summary of the Utility Model
[0004] Aiming at the problems in the prior art that the heat sink is fixedly installed on the circuit board, which is not convenient for the disassembly and installation of the heat sink, and the heat dissipation effect is likely to decline if the heat sink is not replaced for a long time, the utility model proposes the following technical solutions:
[0005] A conduction heat dissipation structure for an electronic module, comprising: a circuit board, a heat sink is arranged at the top end of the circuit board, a screw is slidably installed inside the heat sink, a nut is threadedly connected to the outer surface of the screw, a gasket is arranged at the bottom end of the nut on the outer surface of the screw, a ring block is fixedly connected to the end of the screw away from the heat sink, a limiting rod is rotatably connected inside the ring block, and a limiting hole is opened at the corresponding position of one end of the limiting rod at the bottom end of the circuit board.
[0006] Preferably, the heat sink is made of aluminum alloy material.
[0007] Preferably, a convex block is fixedly installed at the bottom end of the heat sink, and a groove is opened inside the circuit board at the corresponding position of the convex block.
[0008] Preferably, limiting plates are symmetrically and fixedly installed on one side of the heat sink, and an electronic module body is arranged between the two limiting plates.
[0009] Preferably, a heat dissipation paste is filled at the contact surface between the electronic module body and the heat sink.
[0010] Preferably, a filling block is arranged on the side of the electronic module body away from the heat dissipation paste.
[0011] The beneficial effects of the utility model are as follows:
[0012] (1) The utility model fixes and installs the heat sink on the circuit board through the action of the limit posts and nuts, and disassembles and replaces the heat sink by turning the nuts. The structure is simple and easy to operate;
[0013] (2) Through the arranged filling blocks, the utility model squeezes the main body of the electronic component to move it towards the direction close to the heat paste under the action of the limit plate, thereby squeezing and discharging the air gap between the electronic module and the heat sink, and improving the heat conduction efficiency of the heat sink. Description of the Drawings
[0014] Figure 1 The figure shows an overall structure diagram of an electronic module conduction heat dissipation structure;
[0015] Figure 2 The figure shows Figure 1 a schematic diagram of the structure of area A in
[0016] Figure 3 The figure shows Figure 1 a schematic diagram of the structure of area B in
[0017] Figure 4 The figure shows a schematic diagram of the heat sink structure of an electronic module conduction heat dissipation structure;
[0018] Figure 5 The figure shows a schematic diagram of the structure of the ring block part of an electronic module conduction heat dissipation structure.
[0019] In the figure: 1. Circuit board; 2. Heat sink; 21. Protrusion; 22. Groove; 3. Screw; 31. Nut; 32. Gasket; 33. Ring block; 34. Limit rod; 35. Limit hole; 36. Limit plate; 4. Main body of electronic module; 5. Heat paste; 6. Filling block. Detailed Embodiment
[0020] To make the purpose, technical solutions and advantages of the embodiments of the utility model clearer, the technical solutions of the utility model will be clearly and completely described below in conjunction with the embodiments.
[0021] Embodiment 1
[0022] The utility model provides an electronic module conduction heat dissipation structure, as shown in Figures 1 to 5As shown in the figure, it includes a circuit board 1. A heat sink 2 is provided at the top of the circuit board 1. The heat sink 2 is made of aluminum alloy material. A convex block 21 is fixedly installed at the bottom end of the heat sink 2. A groove 22 is opened inside the circuit board 1 at the position corresponding to the convex block 21. A screw rod 3 is slidably installed inside the heat sink 2. A nut 31 is threadedly connected to the outer surface of the screw rod 3. A gasket 32 is provided on the outer surface of the screw rod 3 on one side of the nut 31. One end of the screw rod 3 away from the heat sink 2 is fixedly connected with a ring block 33. A limiting rod 34 is rotatably connected inside the ring block 33. A limiting hole 35 is opened at the bottom end of the circuit board 1 at the position corresponding to one end of the limiting rod 34. The screw rod 3 is penetrated upward along the bottom end of the circuit board 1 into the inside of the heat sink 2. Through the action of the limiting hole 35, one end of the limiting rod 34 is clamped into the limiting hole 35. Then the nut 31 is rotated to move it in the direction close to the heat sink 2, thereby fixing the heat sink 2 on the top of the circuit board 1. Through the action of the gasket 32, it is convenient to increase the contact area between the nut 31 and the heat sink 2, thereby increasing the friction force between the two, so that the nut 31 will not loosen, ensuring the stability of the heat sink 2.
[0023] As Figure 3 shown, two limiting plates 36 are symmetrically and fixedly installed on one side of the heat sink 2. An electronic module body 4 is arranged between the two limiting plates 36. A heat-conducting paste 5 is filled on the contact surface between the electronic module body 4 and the heat sink 2. A filling block 6 is arranged on the side of the electronic module body 4 away from the heat-conducting paste 5. By filling the filling block 6 into one side of the electronic module body 4, the electronic module body 4 is squeezed to move in the direction close to the heat sink 2, thereby squeezing out the air between the contact surfaces of the heat sink 2 and the electronic module body 4, improving the heat conduction efficiency of the heat sink 2, and effectively dissipating the heat generated by the electronic module body 4 to the surrounding air through the action of the heat sink 2.
[0024] Working principle: When using the device, the heat sink 2 is clamped on the top of the circuit board 1 along the groove 22 opened inside the circuit board 1. Then the staff penetrates the screw rod 3 upward along the bottom end of the circuit board 1 into the inside of the heat sink 2, inserts the limiting rod 34 rotatably connected inside the ring block 33 into the limiting hole 35, and then passes the gasket 32 through the screw rod 3 and places it on the outer surface of the heat sink 2. The nut 31 is rotated to move it in the direction close to the heat sink 2. With the cooperation of the limiting rod 34, the heat sink 2 is fixed on the top of the circuit board 1. Then the filling block 6 is inserted on one side of the electronic module body 4. Under the action of the limiting plate 36, the filling block 6 squeezes the electronic module body 4 to move in the direction close to the heat sink 2, thereby squeezing out the air gap between the contact surfaces of the heat sink 2 and the electronic module body 4, increasing the tightness of the contact surface, enabling the heat generated by the electronic module body 4 to be efficiently transferred to the heat sink 2, and finally being dissipated to the surrounding air through the heat sink 2, increasing the efficiency of heat transfer.
[0025] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it.
Claims
1. An electronic module conduction heat dissipation structure, characterized in that Including: A circuit board (1), a heat sink (2) is provided at the top of the circuit board (1), a screw rod (3) is slidably installed inside the heat sink (2), a nut (31) is threadedly connected to the outer surface of the screw rod (3), a gasket (32) is provided at the bottom end of the screw rod (3) outside the nut (31), one end of the screw rod (3) away from the heat sink (2) is fixedly connected with a ring block (33), a limiting rod (34) is rotatably connected inside the ring block (33), and a limiting hole (35) is opened at the position corresponding to one end of the limiting rod (34) at the bottom end of the circuit board (1).
2. The conduction heat dissipation structure of the electronic module according to claim 1, wherein The heat sink (2) is made of aluminum alloy material.
3. The conduction heat dissipation structure of the electronic module according to claim 1, wherein, A convex block (21) is fixedly installed at the bottom end of the heat sink (2), and a groove (22) is opened inside the circuit board (1) at the position corresponding to the convex block (21).
4. The conduction heat dissipation structure of the electronic module according to claim 1, characterized in that, Limiting plates (36) are symmetrically and fixedly installed on one side of the heat sink (2), and an electronic module body (4) is arranged between the two limiting plates (36).
5. The conduction heat dissipation structure of the electronic module according to claim 1, wherein A heat-conducting paste (5) is filled on the contact surface between the electronic module body (4) and the heat sink (2).
6. The conduction heat dissipation structure of the electronic module according to claim 5, characterized in that A filling block (6) is arranged on the side of the electronic module body (4) away from the heat-conducting paste (5).