Polishing device for semiconductor processing
By introducing a rotating rod and limit block structure into the semiconductor polishing device, the problem of inconvenient disassembly of fixed arms in the prior art is solved, and the effects of rapid disassembly and efficient adjustment are achieved.
Patent Information
- Application Number
- CN202422351762.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-26
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2034-09-26
AI Technical Summary
When adjusting the polishing mode, existing semiconductor polishing devices need to frequently remove the bolted fixed arms, resulting in low convenience and affecting efficiency.
The rotating rod and limit block structure are adopted, and the fixing arm can be removed by rotating the rotating rod ninety degrees, simplifying the disassembly process.
It improves the convenience and efficiency of the polishing device, simplifies the disassembly time of the fixed arm, and has a simple structure and strong practicality.
Smart Images
Figure CN223114885U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor polishing, in particular to a polishing device for semiconductor processing. Background Technique
[0002] For the polishing of semiconductor wafers, the most popular polishing method at present is mechanical grinding, a polishing method that uses mechanical force to make the surface smooth. Mechanical polishing can effectively remove the materials on the wafer and easily make the irregular undulations of the wafer flat and stable, thereby making the surface quality of the wafer reach a higher level.
[0003] When adjusting the polishing mode of the polishing device in the prior art, the grinding disc needs to be disassembled. Before disassembling the grinding disc, the fixed arm needs to be removed. The connection between the fixed arm and the base is all fixed by bolts. When disassembling the fixed arm, the bolts need to be rotated frequently, and the convenience is low, resulting in low efficiency in adjusting the polishing mode. Summary of the Utility Model
[0004] The purpose of the utility model is to provide a polishing device for semiconductor processing to solve the problems raised in the above background technique.
[0005] To achieve the above purpose, the utility model provides the following technical solution: A polishing device for semiconductor processing, including a workbench and a fixed arm. A base is provided on the workbench. An installation groove is opened at the top end of the base. A connection groove is opened at the bottom end of the fixed arm. A rotating rod is rotatably connected to the fixed arm at a position corresponding to the connection groove. Symmetrically arranged sliding grooves are opened on the rotating rod. Springs are fixedly connected to the interiors of the two sliding grooves. Limiting blocks are slidably connected to the interiors of the two sliding grooves. Symmetrically arranged fixed blocks are fixedly connected to the installation groove at a position corresponding to the connection groove. Limiting grooves are opened on the two fixed blocks.
[0006] Preferably, a rotating ring is fixedly connected to the top end of the rotating rod. Symmetrically arranged indicating grooves are opened on the rotating ring.
[0007] Preferably, one ends of the limiting blocks are all arc-shaped, and the limiting blocks are fixedly connected to the springs.
[0008] Preferably, the tops of the limiting blocks are in contact with the top walls of the limiting grooves.
[0009] Preferably, the tail end of the fixed arm is connected to the interior of the installation groove, and the fixed blocks are all connected to the interior of the connection groove.
[0010] Compared with the prior art, the beneficial effects of the present utility model are as follows: The rotating rod can be directly rotated, and the rotation of the rotating rod will cause the components to be interlocked. At this time, only by rotating the rotating rod by 90 degrees can the fixation of the fixed arm be released, and then the fixed arm can be removed from the base, which shortens the time required for disassembling the fixed arm, has high convenience, and the overall structure is simple and the practicability is strong. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 is the front view structural schematic diagram of the present utility model;
[0012] Figure 2 is the structural schematic diagram of the separation of the fixed arm and the base of the present utility model;
[0013] Figure 3 is the cross-sectional structural schematic diagram of the fixed arm of the present utility model;
[0014] Figure 4 is the cross-sectional structural schematic diagram of the rotating rod of the present utility model.
[0015] In the figure: 1, workbench; 2, fixed arm; 3, base; 4, installation groove; 5, connection groove; 6, rotating rod; 7, sliding groove; 8, spring; 9, limiting block; 10, fixing block; 11, limiting groove; 12, rotating ring; 13, indicating groove. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0016] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0017] Please refer to Figures 1-4 , the present utility model provides a technical solution: a polishing device for semiconductor processing, including a workbench 1 and a fixed arm 2. An installation groove 4 is provided on the workbench 1, a connection groove 5 is opened at the top end of the base 3, a rotating rod 6 is rotatably connected to the fixed arm 2 at a position corresponding to the connection groove 5, symmetrically arranged sliding grooves 7 are opened on the rotating rod 6, springs 8 are fixedly connected to the interiors of the two sliding grooves 7, limiting blocks 9 are slidably connected to the interiors of the two sliding grooves 7, symmetrically arranged fixing blocks 10 are fixedly connected to the installation groove 4 at a position corresponding to the connection groove 5, and limiting grooves 11 are opened on the two fixing blocks 10.
[0018] The top end of the rotating rod 6 is fixedly connected with a rotating ring 12. Symmetrically arranged indicating grooves 13 are formed in the rotating ring 12. The rotating ring 12 facilitates the staff to directly rotate the rotating rod 6. The indicating grooves 13 facilitate prompting the staff whether the limiting block 9 is in the protruding state or the retracted state. One end of each limiting block 9 is arc-shaped. Each limiting block 9 is fixedly connected with a spring 8. The spring 8 facilitates driving the limiting block 9 to move for reset. The top ends of the limiting blocks 9 are in contact with the top wall of the limiting groove 11. The contact between the limiting block 9 and the limiting groove 11 facilitates fixing the fixed arm 2. The tail end of the fixed arm 2 is connected inside the installation groove 4. The fixed blocks 10 are all connected inside the connection groove 5.
[0019] Specifically, when using the present utility model, the rotating ring 12 can be directly held by hand, and the rotating rod 6 is rotated through the rotating ring 12. The rotation of the rotating rod 6 will drive the two limiting blocks 9 to rotate together. During the rotation of the two limiting blocks 9, the arc-shaped parts of both will abut against the inner wall of the connection groove 5. At this time, the continuously rotating rotating rod 6 will drive the limiting blocks 9 to continuously squeeze the inner wall of the connection groove 5. At this time, during the rotation, the limiting blocks 9 will retract into the sliding groove 7 and will also squeeze and contract the spring 8. When the rotating ring 12 drives the rotating rod 6 to rotate 90 degrees, the two limiting blocks 9 are completely retracted into the sliding groove 7, and the top ends of the limiting blocks 9 are no longer in contact with the top wall of the limiting groove 11. At this time, the fixed arm 2 can be directly lifted upwards. At this time, the fixed block 10 will be separated from the connection groove 5, completing the disassembly of the fixed arm 2. The installation of the fixed arm 2 is the same in principle, and then the grinding disc can be disassembled.
[0020] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.
Claims
1. A polishing device for semiconductor processing, characterized in that: It includes a workbench (1) and a fixed arm (2). A base (3) is provided on the workbench (1). An installation groove (4) is formed at the top of the base (3). A connection groove (5) is formed at the bottom end of the fixed arm (2). A rotating rod (6) is rotatably connected to the fixed arm (2) at a position corresponding to the connection groove (5). Symmetrically arranged sliding grooves (7) are formed on the rotating rod (6). Springs (8) are fixedly connected to the interiors of the two sliding grooves (7). Limit blocks (9) are slidably connected to the interiors of the two sliding grooves (7). Symmetrically arranged fixing blocks (10) are fixedly connected to the installation groove (4) at positions corresponding to the connection groove (5). Limit grooves (11) are formed on the two fixing blocks (10).
2. The polishing device for semiconductor processing according to claim 1, characterized in that: A rotating ring (12) is fixedly connected to the top end of the rotating rod (6). Symmetrically arranged indicating grooves (13) are formed on the rotating ring (12).
3. A polishing device for semiconductor processing according to claim 1, characterized in that: One ends of the limit blocks (9) are all arc-shaped. The limit blocks (9) are fixedly connected to the springs (8).
4. A polishing device for semiconductor processing according to claim 1, characterized in that: The top ends of the limit blocks (9) are all in contact with the top walls of the limit grooves (11).
5. A polishing device for semiconductor processing according to claim 1, characterized in that: The tail end of the fixed arm (2) is connected to the interior of the installation groove (4). The fixing blocks (10) are all connected to the interior of the connection groove (5).