Wafer supporting and taking manipulator

Abstract

The utility model relates to the technical field of wafer supporting and taking, and discloses a wafer supporting and taking manipulator which comprises a fixing block, the top of the fixing block is fixedly connected with a second servo motor, an output shaft of the second servo motor is fixedly connected with a two-way threaded rod, one side of the fixing block is provided with a sliding groove, and the two-way threaded rod is fixedly connected with an output shaft of the second servo motor. The distance between the driving mechanical arm and the driven mechanical arm is adjusted, so that the two first clamping wheels and the two second clamping wheels are used for clamping a wafer capable of being supported, after supporting is completed, the first clamping wheels and the second clamping wheels on the driving mechanical arm rotate, the clamped wafer is conveniently conveyed, and the conveying efficiency is improved. And when the driving mechanical arm and the driven mechanical arm cannot support the wafer, the horizontal movement of the supporting piece can be utilized to carry out another wafer supporting mode.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer picking, and specifically relates to a wafer picking manipulator. Background Art

[0002] A wafer is a basic material used to produce integrated circuits in semiconductor manufacturing, and is usually made of silicon, germanium or other semiconductor materials. The surface of the wafer is finely processed and has the characteristics of high flatness and smoothness, so as to carry out subsequent processes such as lithography, etching and doping.

[0003] During the production process of the wafer, generally some manipulators are needed to pick and carry it. However, during the handling process of the existing manipulators, the wafer can only be stably placed on the rack after being picked up. Once the wafer is placed on the platform, the manipulator rack for picking cannot be withdrawn, and the wafer cannot be stably placed on the platform, so that the manipulator can only simply cooperate with the rack to work with the wafer.

[0004] Therefore, it is necessary to design a wafer picking manipulator to solve the above problems. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a wafer picking manipulator for solving the technical problems put forward in the above background art.

[0006] To achieve the above object, the present utility model provides the following technical solution: A wafer picking manipulator, including a fixed block, a second servo motor is fixedly connected to the top of the fixed block, and an output shaft of the second servo motor is fixedly connected to a bidirectional threaded rod. A chute is opened on one side of the fixed block. Threaded sleeve blocks are respectively threadedly sleeved at both ends inside the chute of the bidirectional threaded rod. One side of each of the two threaded sleeve blocks is fixedly connected to a main manipulator arm and a driven manipulator arm respectively. Grooves are opened on the adjacent sides of the driven manipulator arm and the main manipulator arm. A first rotating shaft and a second rotating shaft are respectively rotatably connected inside the two grooves. Second clamping wheels are fixedly sleeved on the outer surfaces of the two second rotating shafts. First clamping wheels are fixedly sleeved on the outer surfaces of the two first rotating shafts. One side of the main manipulator arm is fixedly connected to an equipment box. One ends of the first rotating shaft and the second rotating shaft on the main manipulator arm penetrate into the interior of the equipment box. A first servo motor is fixedly connected to one side of the equipment box. One end of the first rotating shaft on the main manipulator arm is fixedly connected to the output shaft of the equipment box. Synchronous wheels are fixedly sleeved on the outer surfaces of the first rotating shaft and the second rotating shaft on the main manipulator arm. A synchronous belt is commonly sleeved between the two synchronous wheels through a toothed groove. The fixed block is fixedly connected to a U-shaped connecting block on the side away from the main manipulator arm. A telescopic mechanism is arranged on the U-shaped connecting block. A connecting piece is slidably clamped on the telescopic mechanism. A picking piece is fixedly connected to one side of the connecting piece. An air pipe connecting pipe is fixedly inserted on the picking piece.

[0007] Preferably, the telescopic mechanism includes a third servo motor, and the third servo motor is fixedly connected to the top of the U-shaped connecting block. An output shaft of the third servo motor is fixedly connected to a third rotating shaft. Another third rotating shaft is rotatably connected inside the U-shaped connecting block. Gears are fixedly sleeved on the outer surfaces of the two third rotating shafts. The two gears are meshed with each other. Rotating blocks are fixedly sleeved on the outer surfaces of the two third rotating shafts. Clamping blocks are respectively rotatably connected to the tops of the two rotating blocks. Two symmetric T-shaped grooves are opened at the bottom of the connecting piece. The two clamping blocks are respectively slidably clamped inside the two T-shaped grooves.

[0008] Preferably, the threaded sleeve block is a square block. The outer surfaces of the two threaded sleeve blocks are respectively attached to both sides of the inner cavity of the chute. One side of each of the two main manipulator arms is attached to one side of the fixed block.

[0009] Preferably, the diameter of the first clamping wheel is larger than that of the second clamping wheel. The bottoms of the outer surfaces of the first clamping wheel and the second clamping wheel on the main manipulator arm and the tops of the outer surfaces of the first clamping wheel and the second clamping wheel on the driven manipulator arm are respectively located on the same horizontal plane.

[0010] Preferably, a connecting frame is fixedly connected to the top of the fixed block, a threaded connection hole is formed in the top of the connecting frame, and the second servo motor is arranged inside the connecting frame.

[0011] The technical solution provided by the present utility model has the following beneficial effects compared with the prior art:

[0012] By adjusting the distance between the active robotic arm and the driven robotic arm, the present utility model uses two first clamping wheels and two second clamping wheels to clamp the wafers that can be picked up. After the picking is completed, the rotation of the first clamping wheel and the second clamping wheel on the active robotic arm facilitates the conveying of the picked-up wafers, so as to conveniently place the wafers stably on the rack or platform. When the active robotic arm and the driven robotic arm cannot pick up, another way of picking up wafers can be carried out by the horizontal movement of the picking piece. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a schematic structural diagram of the present utility model;

[0014] Figure 2 is an exploded schematic diagram of the equipment box structure of the present utility model;

[0015] Figure 3 is an exploded schematic diagram of the fixed block structure of the present utility model;

[0016] Figure 4 is an exploded schematic diagram of the connecting piece and the clamping block structure of the present utility model;

[0017] In the figure: 1, fixed block; 2, active robotic arm; 3, driven robotic arm; 4, first clamping wheel; 5, second clamping wheel; 6, first rotating shaft; 7, second rotating shaft; 8, synchronous pulley; 9, synchronous belt; 10, equipment box; 11, first servo motor; 12, connecting frame; 13, second servo motor; 14, bidirectional threaded rod; 15, threaded sleeve block; 16, picking piece; 17, air pipe connecting pipe; 18, connecting piece; 20, rotating block; 21, clamping block; 22, U-shaped connecting block; 23, third servo motor; 24, third rotating shaft; 25, gear. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.

[0019] Obviously, many specific details are set forth in the following description in order to fully understand the present utility model. However, the present utility model can also be implemented in other ways different from those described herein. Therefore, the present utility model is not limited by the limitations of the specific embodiments disclosed below.

[0020] Please refer toFigures 1-4 , the present utility model provides a wafer picking and placing manipulator, including a fixed block 1. A second servo motor 13 is fixedly connected to the top of the fixed block 1, and an output shaft of the second servo motor 13 is fixedly connected to a bidirectional threaded rod 14. A chute is formed on one side of the fixed block 1. Threaded sleeve blocks 15 are threadedly sleeved at both ends inside the chute of the bidirectional threaded rod 14. A driving robotic arm 2 and a driven robotic arm 3 are respectively fixedly connected to one side of the two threaded sleeve blocks 15. Grooves are formed on adjacent sides of the driven robotic arm 3 and the driving robotic arm 2. A first rotating shaft 6 and a second rotating shaft 7 are rotatably connected inside the two grooves. Second clamping wheels 5 are fixedly sleeved on the outer surfaces of the two second rotating shafts 7. First clamping wheels 4 are fixedly sleeved on the outer surfaces of the two first rotating shafts 6. A device box 10 is fixedly connected to one side of the driving robotic arm 2. One ends of the first rotating shaft 6 and the second rotating shaft 7 on the driving robotic arm 2 penetrate into the interior of the device box 10. A first servo motor 11 is fixedly connected to one side of the device box 10. One end of the first rotating shaft 6 on the driving robotic arm 2 is fixedly connected to the output shaft of the device box 10. Synchronous wheels 8 are fixedly sleeved on the outer surfaces of the first rotating shaft 6 and the second rotating shaft 7 on the driving robotic arm 2. A synchronous belt 9 is commonly sleeved between the two synchronous wheels 8 through a toothed groove. A U-shaped connecting block 22 is fixedly connected to one side of the fixed block 1 away from the driving robotic arm 2. A telescopic mechanism is arranged on the U-shaped connecting block 22. A connecting piece 18 is slidably clamped on the telescopic mechanism. A picking piece 16 is fixedly connected to one side of the connecting piece 18. An air pipe connecting pipe 17 is fixedly inserted on the picking piece 16. By starting the second servo motor 13, the distance between the driving robotic arm 2 and the driven robotic arm 3 can be adjusted by using the approaching or separating movement of the two threaded sleeve blocks 15. Different sizes and thicknesses of wafers can be clamped by the two first clamping wheels 4 and the two second clamping wheels 5. When the wafer needs to be placed, by starting the first servo motor 11, the wafer can be translated by using the rotation of the first clamping wheel 4 and the second clamping wheel 5 on the driving robotic arm 2 to be sent to the platform and the rack where it needs to be placed. When the placement rack is not applicable to the driving robotic arm 2 and the driven robotic arm 3, the telescopic mechanism can also be used to drive the picking piece 16 to move horizontally to perform the picking work of the wafer. Connecting with the air pipe through the air pipe connecting pipe 17 also facilitates the stability of the wafer during picking. Thus, through the above operations, the device is more adaptable and easy to use.

[0021] It should be noted that the telescopic mechanism mentioned in the above description includes the third servo motor 23. When the third servo motor 23 is turned on, the two meshing gears 25 will drive the two third rotating shafts 24 to rotate in opposite directions, thereby using the reverse rotation of the two rotating blocks 20 to cause the two clamping blocks 21 rotatably clamped on the two T-shaped grooves at the bottom of the connecting piece 18 to slide inside the two T-shaped grooves, so as to adjust the horizontal positions of the air pipe connecting pipe 17 and the picking piece 16, and this is used when the active robotic arm 2 and the passive robotic arm 3 are unable to pick up the wafer.

[0022] To facilitate the adjustment of the distance between the active robotic arm 2 and the passive robotic arm 3 by the sliding of the two threaded sleeve blocks 15, the threaded sleeve blocks 15 are square blocks, and the outer surfaces of the two threaded sleeve blocks 15 are respectively fitted with both sides of the inner cavity of the sliding groove, and one side of the two active robotic arms 2 is fitted with one side of the fixed block 1.

[0023] To facilitate the stable picking and transporting of the wafer by the two first picking wheels 4 and the second picking wheels 5, the diameter of the first picking wheel 4 is larger than that of the second picking wheel 5, and the bottoms of the outer surfaces of the first picking wheel 4 and the second picking wheel 5 on the active robotic arm 2 and the tops of the outer surfaces of the first picking wheel 4 and the second picking wheel 5 on the passive robotic arm 3 are respectively located on the same horizontal plane.

[0024] To facilitate the connection of the device, a connecting frame 12 is fixedly connected to the top of the fixed block 1, a threaded connection hole is opened at the top of the connecting frame 12, and the second servo motor 13 is arranged inside the connecting frame 12.

[0025] The preferred embodiments of the present invention have been described in detail above in conjunction with the accompanying drawings. However, the present invention is not limited to the specific details in the above embodiments. Within the scope of the technical concept of the present invention, various simple modifications can be made to the technical solutions of the present invention, and these simple modifications all fall within the protection scope of the present invention.

[0026] In addition, it should be noted that, among the various specific technical features described in the above specific embodiments, they can be combined in any suitable manner without contradiction. To avoid unnecessary repetition, the present invention will not separately describe various possible combination methods.

[0027] In addition, any combination can be made between various different embodiments of the present invention as long as it does not violate the idea of the present invention, and it should also be regarded as the content disclosed by the present invention.

Claims

1. A wafer picking and placing manipulator, comprising a fixed block (1), characterized in that: A second servo motor (13) is fixedly connected to the top of the fixed block (1), and a bidirectional threaded rod (14) is fixedly connected to the output shaft of the second servo motor (13). A chute is formed on one side of the fixed block (1). Threaded sleeve blocks (15) are threadedly sleeved at both ends inside the chute on the bidirectional threaded rod (14). A driving robotic arm (2) and a driven robotic arm (3) are respectively fixedly connected to one side of the two threaded sleeve blocks (15). Grooves are formed on the adjacent sides of the driven robotic arm (3) and the driving robotic arm (2). A first rotating shaft (6) and a second rotating shaft (7) are rotatably connected inside the two grooves. Second clamping wheels (5) are fixedly sleeved on the outer surfaces of the two second rotating shafts (7). First clamping wheels (4) are fixedly sleeved on the outer surfaces of the two first rotating shafts (6). A device box (10) is fixedly connected to one side of the driving robotic arm (2). One ends of the first rotating shaft (6) and the second rotating shaft (7) on the driving robotic arm (2) penetrate into the inside of the device box (10). A first servo motor (11) is fixedly connected to one side of the device box (10). One end of the first rotating shaft (6) on the driving robotic arm (2) is fixedly connected to the output shaft of the device box (10). Synchronous wheels (8) are fixedly sleeved on the outer surfaces of the first rotating shaft (6) and the second rotating shaft (7) on the driving robotic arm (2). A synchronous belt (9) is commonly sleeved between the two synchronous wheels (8) through a toothed groove. A U-shaped connecting block (22) is fixedly connected to the side of the fixed block (1) away from the driving robotic arm (2). A telescopic mechanism is arranged on the U-shaped connecting block (22). A connecting piece (18) is slidably clamped on the telescopic mechanism. A picking piece (16) is fixedly connected to one side of the connecting piece (18). An air pipe connecting pipe (17) is fixedly inserted on the picking piece (16).

2. The wafer picking and placing manipulator according to claim 1, characterized in that: The telescopic mechanism includes a third servo motor (23). The third servo motor (23) is fixedly connected to the top of the U-shaped connecting block (22). A third rotating shaft (24) is fixedly connected to the output shaft of the third servo motor (23). Another third rotating shaft (24) is rotatably connected inside the U-shaped connecting block (22). Gears (25) are fixedly sleeved on the outer surfaces of the two third rotating shafts (24). The two gears (25) are meshed with each other. Rotating blocks (20) are fixedly sleeved on the outer surfaces of the two third rotating shafts (24). Clamping blocks (21) are rotatably connected to the tops of the two rotating blocks (20). Symmetrically arranged two T-shaped grooves are formed at the bottom of the connecting piece (18). The two clamping blocks (21) are respectively slidably clamped inside the two T-shaped grooves.

3. The wafer handling manipulator according to claim 1, wherein: The threaded sleeve block (15) is a square block. The outer surfaces of the two threaded sleeve blocks (15) are respectively attached to both sides of the inner cavity of the chute. One side of the two driving robotic arms (2) is attached to one side of the fixed block (1).

4. The wafer pick-up manipulator according to claim 1, wherein: The diameter of the first clamping wheel (4) is greater than that of the second clamping wheel (5), and the bottom of the outer surface of the first clamping wheel (4) and the second clamping wheel (5) on the active robotic arm (2) and the top of the outer surface of the first clamping wheel (4) and the second clamping wheel (5) on the driven robotic arm (3) are each located on the same horizontal plane.

5. The wafer pick-up manipulator according to claim 1, wherein: A connecting frame (12) is fixedly connected to the top of the fixed block (1), and a threaded connection hole is formed in the top of the connecting frame (12), and the second servo motor (13) is disposed inside the connecting frame (12).

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