Silicon wafer packaging box transfer device and silicon wafer production line

Abstract

The utility model provides a silicon wafer packaging box transfer device and a silicon wafer production line, and relates to the technical field of silicon wafer manufacturing. The silicon wafer packaging box transferring device comprises a transferring module, the transferring module comprises a conveying assembly, a pushing assembly and a bearing assembly, and the bearing assembly is arranged on one side, in the first direction, of the conveying assembly; the bearing assembly comprises two bearing pieces, the two bearing pieces are arranged in a spaced mode in the second direction, and the two bearing pieces are used for bearing a silicon wafer packaging box; the pushing assembly can push the silicon wafer packaging box to move between the conveying assembly and the bearing assembly in the first direction, and the second direction is perpendicular to the first direction. According to the silicon wafer packaging box transferring equipment, the problem that labeling equipment and a belt integrally occupy a large space can be solved to a certain extent.

Description

Technical Field

[0001] The present application relates to the technical field of silicon wafer manufacturing, and in particular, to a transfer device for silicon wafer packaging boxes and a silicon wafer production line. Background Art

[0002] After the silicon wafers are produced, they need to be put into packaging boxes before they can be sold on the market. And a label paper needs to be pasted on the silicon wafer packaging box, which contains the serial number of the silicon wafer and the serial number of the packaging box, facilitating subsequent packaging and product tracking. The traditional labeling of silicon wafer packaging boxes is mainly divided into two types. The first is manual labeling, and the second is automatic labeling. The working efficiency of manual labeling is relatively low and has been gradually phased out. Automatic labeling is the current mainstream labeling method.

[0003] Automatic labeling is mainly achieved through a labeling device. Specifically, the silicon wafer packaging box is generally brought into the labeling station by a belt, the labeling device pastes the label paper on the silicon wafer packaging box, and then the belt takes the silicon wafer packaging box out of the labeling station. The labeling device is generally arranged on the side of the belt, which makes the overall space occupied by the labeling device and the belt for transporting the silicon wafer packaging box relatively large. Summary of the Utility Model

[0004] In view of this, the present application provides a transfer device for silicon wafer packaging boxes to solve, to a certain extent, the problem that the overall space occupied by the labeling device and the belt is relatively large.

[0005] According to one aspect of the present application, there is provided a transfer device for silicon wafer packaging boxes, the transfer device for silicon wafer packaging boxes includes a transfer module, the transfer module includes a conveying component, a pushing component and a bearing component, and the bearing component is arranged on one side of the conveying component in a first direction;

[0006] The bearing component includes two supporting members, the two supporting members are arranged at intervals in a second direction, and the two supporting members are used for supporting the silicon wafer packaging box;

[0007] The pushing component can push the silicon wafer packaging box to move between the conveying component and the bearing component along the first direction, and the second direction is perpendicular to the first direction.

[0008] Preferably, the transfer device for silicon wafer packaging boxes includes a mounting frame, the pushing component includes a pushing member, a driving mechanism and a first moving member, and the driving mechanism is arranged on the mounting frame;

[0009] The driving mechanism is connected to the first moving member to drive the first moving member to move along the first direction, and the first moving member is connected to the pushing member to drive the pushing member to move along a third direction, and the third direction is perpendicular to both the first direction and the second direction.

[0010] Preferably, the driving mechanism includes a second moving member and a third moving member. The third moving member is connected to the second moving member and can move along the first direction to drive the second moving member to move along the first direction.

[0011] The second moving member is connected to the first moving member to drive the first moving member to move along the first direction.

[0012] Preferably, the driving mechanism further includes a driving motor, a slide rail, and a fixing plate. The fixing plate is connected to the mounting frame, and the slide rail and the driving motor are both arranged on the fixing plate.

[0013] The slide rail extends along the first direction. The third moving member is arranged on the slide rail. The driving motor can drive the third moving member to move along the slide rail, and the second moving member is connected to the third moving member.

[0014] Preferably, the driving mechanism further includes a driving motor, a first runner, a second runner, and a belt. The first runner is connected to the output shaft of the driving motor. The first runner and the second runner are connected by the belt, and the third moving member is connected to the belt.

[0015] Preferably, the carrying assembly further includes two stoppers corresponding to the two supporting members respectively. The stoppers are arranged at one ends of the corresponding supporting members facing away from the conveying assembly in the first direction.

[0016] Preferably, each supporting member includes a supporting portion and a limiting portion. The limiting portion is fixed on the mounting frame, and the supporting portion protrudes from the limiting portion along the second direction. The protruding directions of the two limiting portions included in the two supporting members are opposite to each other.

[0017] Preferably, the silicon wafer packaging box transfer device includes two transfer modules which are arranged at intervals along the second direction, and the conveying directions of the two conveying assemblies included in the two transfer modules are opposite to each other.

[0018] Preferably, one transfer module includes an abutting block and a clamping mechanism. The abutting block and the clamping mechanism are respectively arranged on the two supporting members, and at least part of the clamping mechanism can move along the second direction so that the abutting block and the clamping mechanism respectively abut against two opposite sides of the silicon wafer packaging box in the second direction.

[0019] According to another aspect of the present application, there is provided a silicon wafer production line which includes the above-mentioned silicon wafer packaging box transfer device.

[0020] During the operation of the silicon wafer packaging box transfer device of the present application, the silicon wafer packaging box can be pushed onto the supporting component by the pushing component, and two spaced supporting members respectively support the two sides of the silicon wafer packaging box to facilitate labeling of the silicon wafer packaging box. The silicon wafer packaging box is no longer supported by the belt when labeling, so that the space under the supporting component can be used to set the labeling device, thereby reducing the space occupied by the silicon wafer packaging box transfer device and the labeling device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 A schematic structural diagram showing a silicon wafer packaging box transfer device according to an embodiment of the utility model;

[0023] Figure 2 A schematic diagram showing the structure of the transfer module;

[0024] Figure 3 Show Figure 2 A magnified view of part A;

[0025] Figure 4 A schematic diagram showing the three-dimensional structure of the push assembly;

[0026] Figure 5 A partial structural schematic diagram of a push assembly is shown;

[0027] Figure 6 A schematic diagram showing the use status of the silicon wafer packaging box transfer device according to an embodiment of the utility model.

[0028] Icons: 1-transmission assembly; 11-conveyor belt; 12-connecting plate; 2-pushing assembly; 21-first moving member; 22-second moving member; 23-third moving member; 24-pushing member; 25-driving motor; 261-first rotating wheel; 262-second rotating wheel; 263-rotating shaft; 264-belt; 265-adapter block; 27-slide rail; 28-fixed plate; 29-adapter plate; 3-bearing assembly; 31-supporting member; 311-supporting part; 312-limiting part; 32-abutment block; 33-clamping mechanism; 331-clamping block; 332-cylinder; 34-stopper; 4-installation frame; 5-silicon wafer packaging box; L1-first direction; L2-second direction; L3-third direction. DETAILED DESCRIPTION

[0029] The following specific embodiments are provided to assist the reader in obtaining a comprehensive understanding of the methods, apparatuses, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatuses, and / or systems described herein will be apparent after understanding the disclosure of this application. For example, the order of operations described herein is merely illustrative and is not limited to the order set forth herein. Rather, changes that will be apparent after understanding the disclosure of this application may be made, except for operations that must occur in a particular order. In addition, descriptions of features known in the art may be omitted for the sake of clarity and conciseness.

[0030] The features described herein may be implemented in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein are provided only to illustrate some of the many possible ways of implementing the methods, apparatuses, and / or systems described herein that will be apparent after understanding the disclosure of this application.

[0031] Throughout the specification, when an element (such as a layer, region, or substrate) is described as "on" another element, "connected to" another element, "coupled to" another element, "above" another element, or "covering" another element, it may be directly "on," "connected to," "coupled to," "above," or "covering" the other element, or there may be one or more other elements intervening therebetween. In contrast, when an element is described as "directly on" another element, "directly connected to" another element, "directly coupled to" another element, "directly above" another element, or "directly covering" another element, there may be no other elements intervening therebetween.

[0032] As used herein, the term "and / or" includes any one of the listed related items and any combination of any two or more of them.

[0033] Although terms such as "first," "second," and "third" may be used herein to describe various members, components, regions, layers, or parts, these members, components, regions, layers, or parts are not limited by these terms. Rather, these terms are only used to distinguish one member, component, region, layer, or part from another. Thus, the first member, component, region, layer, or part described in the examples herein may also be referred to as the second member, component, region, layer, or part without departing from the teachings of the examples.

[0034] For ease of description, spatial relationship terms such as "above", "upper", "below", and "lower" may be used herein to describe the relationship of one element to another as shown in the drawings. Such spatial relationship terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the drawings. For example, if the device in the drawings is flipped, an element described as "above" or "upper" relative to another element will then be "below" or "lower" relative to the other element. Thus, the term "above" includes both the orientation of "above" and "below" depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relationship terms used herein will be interpreted accordingly.

[0035] The terms used herein are for the purpose of describing various examples only and are not intended to limit the disclosure. Unless the context clearly dictates otherwise, the singular forms are also intended to include the plural forms. The terms "comprises", "comprising", and "having" list the stated features, quantities, operations, components, elements, and / or combinations thereof that exist, but do not preclude the existence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0036] Due to manufacturing techniques and / or tolerances, variations in the shapes shown in the drawings may occur. Accordingly, the examples described herein are not limited to the specific shapes shown in the drawings, but include changes in shape that occur during manufacturing.

[0037] The features of the examples described herein may be combined in various ways that will be apparent after understanding the disclosure of the present application. In addition, although the examples described herein have various configurations, other configurations will be apparent after understanding the disclosure of the present application.

[0038] The following will be combined with Figures 1 to 6 to describe the wafer cassette transfer device of the present application. In Figures 1 to 6 the first direction L1, the second direction L2, and the third direction L3 are perpendicular to each other pairwise.

[0039] According to one aspect of the present application, a wafer cassette transfer device is provided, as shown in Figure 1 and Figure 6As shown in the figure, the silicon wafer packaging box transfer device includes a transfer module. The transfer module includes a conveyor component 1, a pushing component 2, and a carrying component 3. The carrying component 3 is arranged on one side of the conveyor component 1 in the first direction L1. The carrying component 3 includes two supporting members 31. The two supporting members 31 are arranged at intervals in the second direction L2. The two supporting members 31 are used to support the silicon wafer packaging box 5. The pushing component 2 can push the silicon wafer packaging box 5 to move between the conveyor component 1 and the carrying component 3 in the first direction L1. During the operation of the silicon wafer packaging box 5 transfer device of the present application, the pushing component 2 can push the silicon wafer packaging box 5 onto the supporting component. The two spaced-apart supporting members 31 respectively support both sides of the silicon wafer packaging box 5, so as to facilitate labeling the silicon wafer packaging box 5. When the silicon wafer packaging box 5 is being labeled, it is no longer supported by the belt, which enables the space below the carrying component 3 to be used for arranging the labeling device, thereby reducing the space occupied by the silicon wafer packaging box transfer device and the labeling device.

[0040] In an embodiment of the present application, the silicon wafer packaging box transfer device includes two transfer modules. The two transfer modules are arranged at intervals in the second direction L2. The carrying component 3 included in one transfer module can be used as a pushing-in station, and the other carrying component 3 can be used as a pushing-out station. The conveying directions of the two conveyor components 1 included in the two transfer modules are opposite. The conveying direction of one conveyor belt 11 is towards the pushing-in station, and the conveying direction of the other conveyor belt 11 is away from the pushing-out station. In this way, the conveyor component 1 corresponding to the pushing-in station can drive the silicon wafer packaging box 5 to move towards the pushing-in station. Then, the pushing component 2 corresponding to the pushing-in station pushes the silicon wafer packaging box 5 into the pushing-in station. At this time, the labeling device can stick a label on the silicon wafer packaging box 5. Then, the labeled silicon wafer packaging box 5 can be moved to the pushing-out station through a transfer mechanism. The pushing component 2 corresponding to the pushing-out station can push the silicon wafer packaging box 5 out of the pushing-out station, so that the silicon wafer packaging box 5 enters the conveyor belt 11 corresponding to the pushing-out station, thereby conveying the silicon wafer packaging box 5 to the station for the next process.

[0041] Optionally, the transfer mechanism can be a structure such as a manipulator or a gripper that can grip the silicon wafer packaging box 5 and drive the silicon wafer packaging box 5 to move.

[0042] In addition, the silicon wafer packaging box transfer device of the present application includes two carrying components 3. The space below both carrying components 3 can be used for arranging the labeling device. The labeling device no longer needs to occupy extra space, reducing the space occupied by the silicon wafer packaging box transfer device and the labeling device.

[0043] In an embodiment of the present application, as Figure 1 and Figure 2 shown, the silicon wafer packaging box transfer device further includes a mounting frame 4. The conveyor component 1 can include a conveyor belt 11, a driving wheel, and a driven wheel (the driving wheel and the driven wheel are blocked by the conveyor belt 11,Figure 1 and Figure 2 (not shown in Figure 2 ), the driving wheel and the driven wheel are arranged at intervals along the first direction L1, and the conveyor belt 11 is wound around the driving wheel and the driven wheel. Connecting plates 12 are arranged on both sides of the conveyor belt 11 in the second direction L2. The driving wheel and the driven wheel both pass through the connecting plates 12 and can rotate relative to the connecting plates 12. The connecting plates 12 and the mounting frame 4 can be connected by bolts, so as to fix the conveying assembly 1.

[0044] In addition, by arranging the pushing assembly 2 to push the silicon wafer packaging box 5 to move, the risk of damage to the silicon wafer packaging box 5 caused by friction between the silicon wafer packaging box 5 and the conveyor belt 11 can be reduced. At the same time, compared with only driving the silicon wafer packaging box 5 to move by the conveyor belt 11, by the cooperation of the pushing assembly 2 and the conveying assembly 1, the moving speed of the silicon wafer packaging box 5 can be increased, the transfer time of the silicon wafer packaging box 5 is reduced, and the labeling efficiency of the silicon wafer packaging box 5 is improved.

[0045] Further, as shown in Figure 2 and Figure 4 , the pushing assembly 2 includes a pushing member 24, a driving mechanism, and a first moving member 21. The pushing member 24 can be in a block shape, and the driving mechanism is arranged on the mounting frame 4; the driving mechanism is connected to the first moving member 21 to drive the first moving member 21 to move along the first direction L1, and the first moving member 21 is connected to the pushing member 24 to drive the pushing member 24 to move along the third direction L3. By driving the pushing member 24 to move along the third direction L3 through the first moving member 21, the position of the pushing member 24 in the third direction L3 can be adjusted so that the pushing member 24 abuts against the silicon wafer packaging box 5. The driving mechanism can drive the first moving member 21 to move along the first direction L1, thereby driving the pushing member 24 to move along the first direction L1. When the pushing assembly 2 corresponding to the pushing-in station pushes the silicon wafer packaging box 5 into the pushing-in station, the pushing member 24 abuts against the side surface of the silicon wafer packaging box 5 facing the conveying assembly 1, and the driving mechanism drives the pushing member 24 to move along the first direction L1 towards the pushing-in station, so as to push the silicon wafer packaging box 5 into the pushing-in station; when the pushing assembly 2 corresponding to the pushing-out station pushes the silicon wafer packaging box 5 out of the pushing-out station, the pushing member 24 abuts against the side surface of the silicon wafer packaging box 5 facing away from the conveying assembly 1, and the driving mechanism drives the pushing member 24 to move along the first direction L1 towards the conveying assembly 1, so as to push the silicon wafer packaging box 5 out of the pushing-out station.

[0046] Preferably, the first moving member 21 can be a slide cylinder, and the pushing member 24 is in an "L" shape.

[0047] As shown in Figure 2 , Figure 4 and Figure 5 ​​​​​​​​​As shown, the driving mechanism includes a second moving member 22 and a third moving member 23. The third moving member 23 is connected to the second moving member 22 and can move along the first direction L1 to drive the second moving member 22 to move along the first direction L1. The second moving member 22 is connected to the first moving member 21 to drive the first moving member 21 to move along the first direction L1. Through the cooperation of the second moving member 22 and the third moving member 23, it can ensure that the pusher 24 has sufficient moving distance in the first direction L1 to meet the requirement of pushing the silicon wafer packaging box 5 into the pushing station or pushing the silicon wafer packaging box 5 out of the pushing station. Preferably, the second moving member 22 can be a slide cylinder.

[0048] As Figure 2 and Figure 4 shown, the driving mechanism further includes a driving motor 25, a slide rail 27, a fixing plate 28 and an adapter plate 29. The fixing plate 28 is connected to the mounting frame 4. The slide rail 27 and the driving motor 25 are both arranged on the fixing plate 28. The slide rail 27 extends along the first direction L1. The third moving member 23 is arranged on the slide rail 27 and can move along the slide rail 27. The adapter plate 29 is connected to the third moving member 23, and the second moving member 22 is fixed on the adapter plate 29. By the third moving member 23 moving along the slide rail 27, it can drive the second moving member 22 to move along the first direction L1, thereby driving the pusher 24 to move to push the silicon wafer packaging box 5 to move.

[0049] Furthermore, as Figure 5 shown, the driving mechanism further includes a first runner 261, a second runner 262 and a belt 264. The first runner 261 is connected to the output shaft of the driving motor 25, so that the driving motor 25 can drive the first runner 261 to rotate. The second runner 262 can be connected to the fixing plate 28 through a rotating shaft 263, and the second runner 262 can rotate around the rotating shaft 263. The first runner 261 and the second runner 262 are connected by the belt 264. The third moving member 23 is fixed on the adapter block 265, and the adapter block 265 is connected to the belt 264. In this way, driven by the belt 264, the third moving member 23 can move along the slide rail 27, thereby driving the pusher 24 to move along the first direction L1. In addition, by adjusting the rotation direction of the output shaft of the driving motor 25, the moving direction of the third moving member 23 on the slide rail 27 can be changed. Optionally, the third moving member 23 is a slider.

[0050] In the embodiment of the present application, as Figure 6As shown, the supporting member 31 includes a supporting portion 311 and a limiting portion 312. The supporting portion 311 is plate-shaped. The limiting portion 312 and the connecting plate 12 may be integrally formed. Both the supporting portion 311 and the limiting portion 312 extend along the first direction L1. The limiting portion 312 is fixed on the mounting frame 4. The supporting portion 311 protrudes from the limiting portion 312 along the second direction L2. The protruding directions of the two limiting portions 312 included in the two supporting members 31 are opposite. The two supporting portions 311 can support both sides of the silicon wafer packaging box 5. During the process of the pushing member 24 pushing the silicon wafer packaging box 5 to move, the limiting portions 312 on both sides can limit both sides of the silicon wafer packaging box 5 in the second direction L2 to ensure the stability of the movement of the silicon wafer packaging box 5.

[0051] In addition, the carrying assembly 3 further includes two stoppers 34. The two stoppers 34 correspond to the supporting members 31 respectively. The stopper 34 is arranged at one end of the corresponding supporting member 31 facing away from the conveying assembly 1 in the first direction L1, so as to limit the silicon wafer packaging box 5 to prevent the silicon wafer packaging box from falling off the supporting member 31.

[0052] In addition, the carrying assembly 3 as the pushing station includes an abutting block 32 and a clamping mechanism 33. The abutting block 32 and the clamping mechanism 33 are respectively arranged on the two supporting members 31. At least part of the clamping mechanism 33 can move along the second direction L2, so that the abutting block 32 and the clamping mechanism 33 respectively abut against the silicon wafer packaging box 5 in the second direction L2 in a back-to-back manner. When the silicon wafer packaging box 5 moves into place, at least part of the clamping mechanism 33 moves towards the abutting block 32, so as to realize the limitation of the silicon wafer packaging box 5, so as to facilitate the labeling device to label the silicon wafer packaging box 5.

[0053] Optionally, as Figure 3 shown, the clamping mechanism 33 may include a clamping block 331 and a cylinder 332. The cylinder 332 is fixed on the side of the supporting portion 311 facing away from the limiting portion 312. The clamping block 331 is connected to the cylinder 332 and thus moves under the drive of the cylinder 332. When the clamping block 331 moves towards the abutting block 32 until the clamping block 331 abuts against the silicon wafer packaging box 5, the abutting block 32 and the clamping block 331 cooperate to realize the limitation of the silicon wafer packaging box 5, so as to facilitate the labeling device to label the silicon wafer packaging box 5. Optionally, the cylinder 332 may be a guide rod type cylinder.

[0054] When the silicon wafer packaging box transfer device of the present application is in use, the silicon wafer packaging box 5 enters the transfer component 1 corresponding to the pushing station and moves along with the transfer component 1 corresponding to the pushing station. Then, the pushing component 2 corresponding to the pushing station pushes the silicon wafer packaging box 5 into the pushing station. At this time, the labeling device can label the silicon wafer packaging box 5. After the labeling is completed, the pushing component 2 corresponding to the pushing-out station pushes the silicon wafer packaging box 5 out of the pushing-out station, so that the silicon wafer packaging box 5 enters the conveyor belt 11 corresponding to the pushing-out station. The conveyor belt 11 corresponding to the pushing-out station drives the silicon wafer packaging box 5 to move, so as to convey the silicon wafer packaging box 5 to the station for the next process.

[0055] According to another aspect of the present application, a silicon wafer production line is provided. The silicon wafer production line includes the above-mentioned silicon wafer packaging box transfer device. The silicon wafer production line further includes a labeling device and a transfer mechanism. The labeling device can be arranged below the bearing component 3 to reduce the space occupied by the labeling device and the silicon wafer packaging box 5. The transfer mechanism can move the silicon wafer packaging box 5 after labeling on the bearing component 3 serving as the pushing station to the bearing component 3 serving as the pushing-out station, so as to facilitate the movement of the silicon wafer packaging box 5 to the station for the next process.

[0056] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A silicon wafer packaging box transfer device, characterized in that, The silicon wafer packaging box transfer device includes a transfer module, and the transfer module includes a conveying component, a pushing component, and a bearing component. The bearing component is arranged on one side of the conveying component in the first direction; The bearing component includes two supporting members, and the two supporting members are arranged at intervals in the second direction. The two supporting members are used for supporting the silicon wafer packaging box; The pushing component can push the silicon wafer packaging box to move between the conveying component and the bearing component in the first direction. The second direction is perpendicular to the first direction.

2. The silicon wafer packaging box transfer device according to claim 1, wherein The silicon wafer packaging box transfer device includes an installation frame. The pushing component includes a pushing member, a driving mechanism, and a first moving member. The driving mechanism is arranged on the installation frame; The driving mechanism is connected to the first moving member to drive the first moving member to move in the first direction. The first moving member is connected to the pushing member to drive the pushing member to move in the third direction. The third direction is perpendicular to the first direction and the second direction respectively.

3. The silicon wafer packaging box transfer device according to claim 2, characterized in that, The driving mechanism includes a second moving member and a third moving member. The third moving member is connected to the second moving member. The third moving member can move in the first direction to drive the second moving member to move in the first direction; The second moving member is connected to the first moving member to drive the first moving member to move in the first direction.

4. The silicon wafer packaging box transfer device according to claim 3, wherein The driving mechanism further includes a driving motor, a slide rail, and a fixing plate. The fixing plate is connected to the installation frame. The slide rail and the driving motor are both arranged on the fixing plate; The slide rail extends in the first direction. The third moving member is arranged on the slide rail. The driving motor can drive the third moving member to move along the slide rail. The second moving member is connected to the third moving member.

5. The silicon wafer packaging box transfer device according to claim 4, wherein, The driving mechanism further includes a driving motor, a first runner, a second runner, and a belt. The first runner is connected to the output shaft of the driving motor. The first runner and the second runner are connected by the belt. The third moving member is connected to the belt.

6. The silicon wafer packaging box transfer device according to claim 1, characterized in that, The bearing component further includes two stoppers, and the two stoppers correspond to the two supporting members respectively. The stoppers are arranged at one ends of the corresponding supporting members facing away from the conveying component in the first direction.

7. The silicon wafer packaging box transfer device according to claim 2, characterized in that, The supporting member includes a supporting portion and a limiting portion. The limiting portion is fixed on the installation frame. The supporting portion protrudes from the limiting portion in the second direction. The protruding directions of the two limiting portions included in the two supporting members are opposite.

8. The silicon wafer packaging box transfer device according to any one of claims 1-7, characterized in that, The silicon wafer packaging box transfer device includes two transfer modules, and the two transfer modules are arranged at intervals in the second direction. The conveying directions of the two conveying components included in the two transfer modules are opposite.

9. The silicon wafer packaging box transfer device according to claim 8, wherein, One of the transfer modules includes an abutting block and a clamping mechanism. The abutting block and the clamping mechanism are respectively arranged on the two supporting members. At least part of the clamping mechanism can move in the second direction so that the abutting block and the clamping mechanism respectively abut against the two sides of the silicon wafer packaging box facing away from each other in the second direction.

10. A silicon wafer production line, characterized in that, The silicon wafer production line includes the silicon wafer packaging box transfer device described in any one of claims 1-9.

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