Float glass tin bath cooling device

Abstract

The utility model discloses a float glass tin bath cooling device, and relates to the technical field of float glass production. The float glass tin bath cooling device comprises a tin bath table, a cooling mechanism and a positioning mechanism, a supporting frame is fixedly installed at the bottom of the tin bath table, the cooling mechanism is arranged at the bottom of the tin bath table, the cooling mechanism comprises a heat exchange plate, a water tank and a circulating pipeline, the heat exchange plate is arranged at the bottom of the tin bath table, and the water tank is fixedly installed at the bottom of the heat exchange plate. A water pump is fixedly installed at the bottom of the inner side of the water tank, a circulating pipeline is arranged in the heat exchange plate, and the positioning mechanism is arranged at the bottom of the tin bath table and used for assisting the cooling mechanism to be disassembled and assembled on the tin bath table. According to the float glass tin bath cooling device, through the cooling mechanism, cooling water can make contact with the heat exchange plate in the maximum area through the circulating pipeline, then heat exchange is conducted through the heat exchange plate and the tin bath table, cooling is achieved to the maximum degree, the cooling effect of the device is improved, and the practicability of the device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of float glass production, and particularly relates to a tin bath cooling device for float glass. Background Art

[0002] Chinese patent document CN217103568U discloses a glass ribbon cooling and temperature reducing device applicable to a float glass tin bath, which includes a tin bath table, a cooling unit and a lifting unit; a vertical plate is installed at the rear side of the lower end of the tin bath table; the cooling unit includes a table-attached cold pipe, a water pump, an outlet pump pipe, a copper water tank, an inlet tank pipe and a refrigerating sheet. A long S-shaped table-attached cold pipe is installed at the lower end of the tin bath table. The water pump is installed on the upper side of the front end of the vertical plate. The water outlet of the water pump is connected to one end of the table-attached cold pipe through the outlet pump pipe. The copper water tank is installed at the lower side of the front end of the vertical plate. The water inlet of the water pump is connected to the inside of the copper water tank through a connecting tank short pipe. It adopts the water cooling method and can cool the tin bath more comprehensively, and is more suitable for cooling the float glass ribbon, with higher cooling efficiency and more convenient use.

[0003] However, in the above device, the contact area between the tin bath table and the table-attached cold pipe is extremely small, and most of the surface of the table-attached cold pipe is in contact with air. It is difficult for the water in the table-attached cold pipe to exchange heat with the tin bath table, resulting in low heat exchange efficiency of the device and little cooling effect of the device. Therefore, we propose a tin bath cooling device for float glass. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a tin bath cooling device for float glass, which can solve the problem of poor cooling effect of some existing devices.

[0005] To achieve the above purpose, the utility model provides the following technical solution: a tin bath cooling device for float glass, including:

[0006] A tin bath table, and a support frame is fixedly installed at the bottom of the tin bath table;

[0007] A cooling mechanism, which is arranged at the bottom of the tin bath table. The cooling mechanism includes a heat exchange plate, a water tank and a circulation pipeline. A heat exchange plate is arranged at the bottom of the tin bath table. A water tank is fixedly installed at the bottom of the heat exchange plate. A water pump is fixedly installed at the inner bottom of the water tank. A circulation pipeline is arranged inside the heat exchange plate;

[0008] A positioning mechanism, which is arranged at the bottom of the tin bath table and is used to assist the disassembly and assembly of the cooling mechanism on the tin bath table.

[0009] Preferably, the cooling mechanism further includes a water inlet pipe and a return pipe. A water inlet pipe is fixedly connected between the front outer surface of the water tank and the front outer surface of the heat exchange plate. One end of the water inlet pipe communicates with one end of the circulation pipeline, and the other end of the water inlet pipe communicates with the output end of the water pump. A return pipe is fixedly connected between the rear outer surface of the water tank and the rear outer surface of the heat exchange plate. One end of the return pipe communicates with the other end of the circulation pipeline, and the other end of the return pipe communicates with the inside of the water tank. Under the action of the cooling mechanism, cooling water can contact the heat exchange plate over the largest area through the circulation pipeline, and then heat exchange is carried out between the heat exchange plate and the tin bath table to achieve maximum cooling, improving the cooling effect of the device and enhancing the practicality of the device.

[0010] Preferably, the positioning mechanism includes a fixing plate, a positioning rod, a pull handle and a spring. A fixing plate is fixedly installed at the bottom of the tin bath table. The positioning rod passes through the fixing plate movably. A positioning hole is formed on one side of the heat exchange plate. One end of the positioning rod is inserted into the positioning hole, and a pull handle is fixedly installed at the other end of the positioning rod. A spring is sleeved on the positioning rod. One end of the spring is fixedly connected with the fixing plate, and the other end of the spring is fixedly connected with the pull handle.

[0011] Preferably, a clamping plate is fixedly installed at the bottom of the tin bath table, and the heat exchange plate is clamped on the clamping plate.

[0012] Preferably, two groups of limiting plates are fixedly installed at the bottom of the tin bath table, and the two groups of limiting plates are respectively attached to the front and rear outer surfaces of the heat exchange plate.

[0013] Preferably, two groups of semiconductor refrigeration sheets are fixedly installed at the bottom of the water tank.

[0014] Preferably, at least two heat dissipation fins are fixedly installed at the bottom of the heat exchange plate.

[0015] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0016] (1) For this float glass tin bath cooling device, through the cooling mechanism, cooling water can contact the heat exchange plate over the largest area through the circulation pipeline, and then heat exchange is carried out between the heat exchange plate and the tin bath table to achieve maximum cooling, solving the problem that the heat exchange efficiency of some existing devices is low and the cooling effect of the devices is very poor, improving the cooling effect of the device and enhancing the practicality of the device.

[0017] (2) For this float glass tin bath cooling device, through the positioning mechanism, the cooling mechanism can be disassembled and assembled for use on other tin bath tables, reducing costs. At the same time, under the action of the semiconductor refrigeration sheets and the heat dissipation fins, the cooling water that has been heated after heat exchange can be further cooled to ensure the cooling effect of the cooling water and the use effect of the device, which is beneficial to the popularization and use of the device. Description of the Drawings

[0018] The present utility model will be further described below in conjunction with the accompanying drawings and embodiments:

[0019] Figure 1 is the front perspective view of the present utility model;

[0020] Figure 2 is the bottom perspective view of the tin bath table of the present utility model and some associated components thereon;

[0021] Figure 3 is the cross-sectional view of the heat exchange plate of the present utility model.

[0022] Reference numerals: 1, tin bath table; 2, cooling mechanism; 21, heat exchange plate; 22, water tank; 23, water inlet pipe; 24, circulation pipeline; 25, return pipe; 3, positioning mechanism; 31, fixing plate; 32, positioning rod; 33, pull handle; 34, spring; 4, clamping plate; 5, semiconductor refrigeration sheet; 6, heat dissipation fin; 7, support frame; 8, limiting plate. Specific embodiments

[0023] This part will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The role of the accompanying drawings is to supplement the description of the text part of the specification, enabling people to intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but it cannot be understood as a limitation on the protection scope of the present utility model.

[0024] Please refer to Figures 1-3 , the present utility model provides a technical solution: a float glass tin bath cooling device, including a tin bath table 1, a cooling mechanism 2 and a positioning mechanism 3. A support frame 7 is fixedly installed at the bottom of the tin bath table 1;

[0025] The cooling mechanism 2 is arranged at the bottom of the tin bath table 1. The cooling mechanism 2 includes a heat exchange plate 21, a water tank 22 and a circulation pipeline 24. A heat exchange plate 21 is arranged at the bottom of the tin bath table 1. A water tank 22 is fixedly installed at the bottom of the heat exchange plate 21. A water pump is fixedly installed at the inner bottom of the water tank 22. A circulation pipeline 24 is opened inside the heat exchange plate 21;

[0026] The positioning mechanism 3 is arranged at the bottom of the tin bath table 1. The positioning mechanism 3 is used to assist the disassembly and assembly of the cooling mechanism 2 on the tin bath table 1.

[0027] The cooling mechanism 2 also includes a water inlet pipe 23 and a return pipe 25. The water inlet pipe 23 is fixedly connected between the front outer surface of the water tank 22 and the front outer surface of the heat exchange plate 21. One end of the water inlet pipe 23 is communicated with one end of the circulation pipe 24, and the other end of the water inlet pipe 23 is communicated with the output end of the water pump. The return pipe 25 is fixedly connected between the rear outer surface of the water tank 22 and the rear outer surface of the heat exchange plate 21. One end of the return pipe 25 is communicated with the other end of the circulation pipe 24, and the other end of the return pipe 25 is communicated with the inside of the water tank 22. A clamping plate 4 is fixedly installed at the bottom of the tin bath table 1. The heat exchange plate 21 is clamped on the clamping plate 4. The tin bath Two groups of limit plates 8 are fixedly installed at the bottom of the platform 1, and the two groups of limit plates 8 are respectively fitted with the front and rear outer surfaces of the heat exchange plate 21. Two groups of semiconductor refrigeration plates 5 are fixedly installed at the bottom of the water tank 22. At least two groups of heat dissipation plates 6 are fixedly installed at the bottom of the heat exchange plate 21. Through the cooling mechanism 2, the cooling water can contact the heat exchange plate 21 with the maximum area through the circulation pipe 24, and then heat is exchanged with the tin bath platform 1 through the heat exchange plate 21 to achieve maximum cooling, thereby solving the problem of low heat exchange efficiency in some existing devices, resulting in little cooling effect of the device, improving the cooling effect of the device, and improving the practicability of the device.

[0028] The positioning mechanism 3 includes a fixing plate 31, a positioning rod 32, a handle 33 and a spring 34. The fixing plate 31 is fixedly installed at the bottom of the tin bath table 1, and the fixing plate 31 is movably penetrated by the positioning rod 32. A positioning hole is opened on one side of the heat exchange plate 21, one end of the positioning rod 32 is inserted into the positioning hole, and the other end of the positioning rod 32 is fixedly installed with the handle 33. A spring 34 is sleeved on the positioning rod 32, one end of the spring 34 is fixedly connected to the fixing plate 31, and the other end of the spring 34 is fixedly connected to the handle 33. Through the positioning mechanism 3, the cooling mechanism 2 can be disassembled and assembled so as to be used on other tin bath tables 1, thereby reducing costs. At the same time, under the action of the semiconductor refrigeration sheet 5 and the heat dissipation sheet 6, the cooling water that has heated up after heat exchange can be further cooled down, thereby ensuring the cooling effect of the cooling water, ensuring the use effect of the device, and being conducive to the promotion and use of the device.

[0029] Working principle: control the water pump in the water tank 22 to start, and draw the cooling water in the water tank 22 into the circulation pipe 24 through the water inlet pipe 23, and then flow back to the water tank 22 from the return pipe 25 to form a cycle. The cooling water exchanges heat with the tin bath table 1 through the heat exchange plate 21 to cool the tin bath table 1, and energizes the semiconductor refrigeration plate 5 to cool the cooling water. When the heat exchange plate 21 needs to be removed, pull the handle 33 to drive one end of the positioning rod 32 to disengage from the positioning hole on the heat exchange plate 21, and the heat exchange plate 21 can be removed together with the cooling mechanism 2.

[0030] The embodiments of the present utility model have been described in detail above in conjunction with the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those of ordinary skill in the art, various changes can be made without departing from the gist of the present utility model.

Claims

1. A tin bath cooling device for float glass, characterized in that, Including: A tin bath table (1), and a support frame (7) is fixedly installed at the bottom of the tin bath table (1); A cooling mechanism (2), which is arranged at the bottom of the tin bath table (1). The cooling mechanism (2) includes a heat exchange plate (21), a water tank (22) and a circulation pipeline (24). The heat exchange plate (21) is arranged at the bottom of the tin bath table (1), the water tank (22) is fixedly installed at the bottom of the heat exchange plate (21), a water pump is fixedly installed at the inner bottom of the water tank (22), and the circulation pipeline (24) is arranged inside the heat exchange plate (21); A positioning mechanism (3), which is arranged at the bottom of the tin bath table (1), and the positioning mechanism (3) is used to assist the disassembly and assembly of the cooling mechanism (2) on the tin bath table (1).

2. The float glass tin bath cooling device according to claim 1, characterized in that: The cooling mechanism (2) further includes a water inlet pipe (23) and a return pipe (25). A water inlet pipe (23) is fixedly connected between the front outer surface of the water tank (22) and the front outer surface of the heat exchange plate (21). One end of the water inlet pipe (23) communicates with one end of the circulation pipeline (24), and the other end of the water inlet pipe (23) communicates with the output end of the water pump. A return pipe (25) is fixedly connected between the rear outer surface of the water tank (22) and the rear outer surface of the heat exchange plate (21). One end of the return pipe (25) communicates with the other end of the circulation pipeline (24), and the other end of the return pipe (25) communicates with the inside of the water tank (22).

3. The float glass tin bath cooling device according to claim 2, characterized in that: The positioning mechanism (3) includes a fixing plate (31), a positioning rod (32), a pull handle (33) and a spring (34). The fixing plate (31) is fixedly installed at the bottom of the tin bath table (1). The positioning rod (32) movably penetrates through the fixing plate (31). A positioning hole is arranged on one side of the heat exchange plate (21). One end of the positioning rod (32) is inserted into the positioning hole. A pull handle (33) is fixedly installed at the other end of the positioning rod (32). A spring (34) is sleeved on the positioning rod (32). One end of the spring (34) is fixedly connected with the fixing plate (31), and the other end of the spring (34) is fixedly connected with the pull handle (33).

4. A float glass tin bath cooling device according to claim 3, characterized in that: A clamping plate (4) is fixedly installed at the bottom of the tin bath table (1), and the heat exchange plate (21) is clamped on the clamping plate (4).

5. The float glass tin bath cooling device according to claim 4, wherein: Two groups of limiting plates (8) are fixedly installed at the bottom of the tin bath table (1), and each of the two groups of limiting plates (8) is attached to the front and rear outer surfaces of the heat exchange plate (21).

6. The float glass tin bath cooling device according to claim 5, characterized in that: Two groups of semiconductor refrigeration sheets (5) are fixedly installed at the bottom of the water tank (22).

7. The float glass tin bath cooling device according to claim 6, characterized in that: At least two groups of heat dissipation fins (6) are fixedly installed at the bottom of the heat exchange plate (21).

Images