Annealing device for oxygen-free copper wire production

Abstract

The utility model discloses an annealing device for oxygen-free copper wire production, which relates to the technical field of annealing equipment, and comprises a box body with a supporting rod at the bottom, and further comprises a partition plate integrally formed in the box body, a heat dissipation chamber and a cooling chamber are respectively formed in the box body through the partition plate, and the heat dissipation chamber is communicated with the cooling chamber through the partition plate. Strip-shaped cavity grooves are formed in the two sides of the box body and the partition plate. And the number of the wire arranging mechanisms is two, and the two wire arranging mechanisms are installed in the heat dissipation chamber and the cooling chamber of the box body correspondingly. The partition plate is arranged in the box body, the internal environment of the box body is divided into the heat dissipation chamber and the cooling chamber, then graded cooling annealing of the oxygen-free copper wires is achieved, the wire arranging mechanisms are installed in the heat dissipation chamber and the cooling chamber, the annealing treatment storage amount of the oxygen-free copper wires can be increased through the wire arranging mechanisms, then the annealing efficiency is improved, and the service life of the oxygen-free copper wires is prolonged. The problems that an existing device is not good enough in annealing treatment effect, low in efficiency and inconvenient to feed are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of annealing equipment, in particular to an annealing device for producing oxygen-free copper wire. Background Technique

[0002] Oxygen-free copper wire is pure copper without any deoxidizer residues, and its products are widely used in fields such as power cables, communication cables, charging piles, automotive control panels, industrial robots, drones, and monitoring systems; during the production and processing of oxygen-free copper wire, in the later stage, the internal stress and related defects of the copper wire need to be eliminated through an annealing process to restore the performance of the oxygen-free copper wire, and then the oxygen-free copper wire needs to be annealed and cooled.

[0003] At present, the annealing equipment generally consists of a box body and a cooling device. The oxygen-free copper wire penetrates into the inner side of the box body, and then the oxygen-free copper wire is annealed and cooled by the cooling device. This method can directly anneal the oxygen-free copper wire, but there are still certain deficiencies. First, after the oxygen-free copper wire penetrates into the box body, it is directly discharged, resulting in a small amount of copper wire staying and cooling in the box body and a short residence time, and it is not possible to anneal and cool the oxygen-free copper wire well. Moreover, the device generally only anneals and cools the copper wire through a single cooling process and cannot perform graded annealing treatment on the copper wire, affecting the annealing treatment effect. Therefore, improvement is needed. Content of the Utility Model

[0004] The utility model provides an annealing device for producing oxygen-free copper wire, which has the advantages of good annealing treatment effect and small occupied space, etc., to solve the related problems mentioned in the above background technique.

[0005] To achieve the purpose of high annealing efficiency and small occupied space, the utility model provides the following technical solution: an annealing device for producing oxygen-free copper wire, including a box body with support rods at the bottom, and further including: a partition, integrally formed inside the box body, the box body forms a heat dissipation chamber and a cooling chamber through the partition respectively, and strip-shaped cavity grooves are opened on both sides of the box body and on the partition; a wire discharging mechanism, provided with two, the two wire discharging mechanisms are respectively installed in the heat dissipation chamber and the cooling chamber of the box body, the wire discharging mechanism includes a bidirectional lead screw rotatably connected to the box body, and two sliders symmetrically threadedly connected to the bidirectional lead screw, both of the two sliders are fixedly connected with telescopic plates, and equidistantly distributed L-shaped plates are fixed on the telescopic plates through bolts, a roller is installed on one side of the L-shaped plate, the L-shaped plates and rollers on the two telescopic plates are staggered with each other, and the copper wire body is inserted into the strip-shaped cavity grooves and the rollers, thereby realizing the batch annealing and cooling of the copper wire body.

[0006] As a preferred technical solution of the utility model, the wire discharging mechanism further includes a limiting rod fixed to the box body, and the slider is provided with a limiting hole adapted to the limiting rod at the corresponding position of the limiting rod.

[0007] As a preferred technical solution of the present utility model, one of the bidirectional lead screws extends to the outside of the box body and is fixed with a handwheel, and synchronous wheels are fixed on both bidirectional lead screws, and a synchronous belt is arranged between the two synchronous wheels.

[0008] As a preferred technical solution of the present utility model, two symmetrically distributed cover plates are fixedly connected to the top of the box body, and fans are installed at the positions corresponding to the heat dissipation chambers on both cover plates, and a hollow cavity is formed between the two cover plates.

[0009] As a preferred technical solution of the present utility model, a sealing member is further included, and the sealing member includes: a horizontal plate adapted to the hollow cavity between the two cover plates; three vertical plates integrally formed on the lower surface of the horizontal plate, the vertical plates are adapted to the corresponding strip-shaped cavity grooves, and an arc-shaped groove is provided at the lower end of the vertical plate, a round hole is formed between the arc-shaped groove and the strip-shaped cavity groove, and the copper wire body is inserted through the round hole; a positioning protrusion integrally formed on the lower surface of the horizontal plate, and a positioning groove adapted to the positioning protrusion is provided on the box body corresponding to the positioning protrusion.

[0010] As a preferred technical solution of the present utility model, a stop block is rotatably connected to the upper surface of the cover plate, and one side of the stop block abuts against the upper surface of the horizontal plate.

[0011] As a preferred technical solution of the present utility model, a plurality of array-distributed semiconductor refrigeration sheets are embedded at the bottom of the box body in the cooling chamber, and heat sinks are fixedly connected to the hot ends of the lower surfaces of the semiconductor refrigeration sheets at equal intervals, and heat dissipation grooves are formed between adjacent two heat sinks. A plurality of equally spaced exhaust grooves are provided at the bottom of the box body in the heat dissipation chamber, and a wind cover is fixedly connected to one side of the exhaust groove on the lower surface of the box body, and the air outlet of the wind cover corresponds to the heat dissipation groove.

[0012] Compared with the prior art, the present utility model provides an annealing device for producing oxygen-free copper wire, which has the following beneficial effects:

[0013] 1. For the annealing device for producing oxygen-free copper wire, by arranging a partition in the box body, the internal space of the box body is divided into a heat dissipation chamber and a cooling chamber. The heat dissipation chamber can realize the pretreatment of oxygen-free copper wire, and the cooling chamber can realize the thorough cooling treatment of oxygen-free copper wire. The hierarchical cooling has a good treatment effect. The present utility model refrigerates the cooling chamber by means of semiconductor refrigeration sheets, and heat sinks are arranged at equal intervals at the hot ends of the semiconductor refrigeration sheets. At the same time, a wind cover is arranged at the bottom of the heat dissipation chamber, and the air outlet of the wind cover corresponds to one side of the heat sink. Then, the heat formed at the hot end of the semiconductor refrigeration sheet can be dissipated by the wind discharged from the heat dissipation chamber, ensuring the heat dissipation effect at the hot end of the semiconductor refrigeration sheet and ensuring the cooling performance of the cooling chamber.

[0014] 2. The annealing device for producing oxygen-free copper wire installs wire arranging mechanisms in both the heat dissipation chamber and the cooling chamber of the box body. The wire arranging mechanisms can realize the wire arranging process of the oxygen-free copper wire, making the oxygen-free copper wire penetrate through the round holes and the rollers of the wire arranging mechanisms. The setting of the wire arranging mechanisms can make more oxygen-free copper wire stay in the box body and increase its cooling and annealing time. Therefore, the annealing treatment effect is good, which can ensure the annealing treatment efficiency of the oxygen-free copper wire, meet the annealing and cooling of a large number of oxygen-free copper wires, with high efficiency and good use effect.

[0015] 3. The annealing device for producing oxygen-free copper wire sets detachable sealing components on the box body and the cover plate. The setting of the sealing components is convenient for the feeding of copper wire. When copper wire needs to be fed, it can be removed, which has good convenience. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is the structural schematic diagram when the present utility model is disassembled;

[0017] Figure 2 is the structural schematic diagram of the sealing component in the present utility model;

[0018] Figure 3 is the structural schematic diagram when the wire arranging mechanism of the present utility model is in use;

[0019] Figure 4 is the structural schematic diagram when the wire arranging mechanism of the present utility model is feeding the copper wire body;

[0020] Figure 5 is the front perspective view of the present utility model;

[0021] Figure 6 is the bottom perspective view of the present utility model.

[0022] In the figure: 1. Box body; 2. Copper wire body; 3. Strip-shaped cavity groove; 4. Positioning groove; 5. Heat dissipation chamber; 6. Partition board; 7. Cooling chamber; 8. Wire arranging mechanism; 801. Bidirectional lead screw; 802. Limiting rod; 803. Slide block; 804. L-shaped plate; 805. Roller; 806. Telescopic plate; 9. Semiconductor refrigeration sheet; 10. Synchronous pulley; 11. Synchronous belt; 12. Hand wheel; 13. Support rod; 14. Cover plate; 15. Fan; 16. Stopper; 17. Sealing component; 1701. Horizontal plate; 1702. Positioning protrusion; 1703. Vertical plate; 1704. Arc-shaped groove; 18. Round hole; 19. Exhaust slot; 20. Air hood; 21. Heat sink. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0023] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0024] Please refer to Figure 1 a Figure 6 , the present utility model discloses an annealing device for producing oxygen-free copper wire, which includes a box body 1 with support rods 13 at the bottom, and further includes: a partition plate 6 integrally formed inside the box body 1. The box body 1 forms a heat dissipation chamber 5 and a cooling chamber 7 through the partition plate 6 respectively, and strip-shaped cavity grooves 3 are opened on both sides of the box body 1 and on the partition plate 6; two wire arranging mechanisms 8 are provided, and the two wire arranging mechanisms 8 are respectively installed in the heat dissipation chamber 5 and the cooling chamber 7 of the box body 1. The wire arranging mechanism 8 includes a bidirectional lead screw 801 rotatably connected to the box body 1, and two sliders 803 symmetrically threadedly connected to the bidirectional lead screw 801. Telescopic plates 806 are fixedly connected to both sliders 803, and equidistantly distributed L-shaped plates 804 are fixed to the telescopic plates 806 by bolts. A roller 805 is installed on one side of the L-shaped plate 804. The L-shaped plates 804 and rollers 805 on the two telescopic plates 806 are staggered with each other. The copper wire body 2 is inserted through the strip-shaped cavity grooves 3 and the rollers 805, thereby realizing the batch annealing and cooling of the copper wire body 2.

[0025] In this implementation scheme, the support rods 13 are used for the support and fixation of the box body 1. By arranging the partition plate 6 inside the box body 1, the internal space of the box body 1 can be formed into a heat dissipation chamber 5 and a cooling chamber 7, and then the hierarchical annealing and cooling of the copper wire body 2 are realized through the heat dissipation chamber 5 and the cooling chamber 7. By arranging the strip-shaped cavity grooves 3 on both sides of the box body 1 and on the partition plate 6, it is convenient for the feeding and wire arranging of the copper wire body 2. By installing the wire arranging mechanism 8 at the heat dissipation chamber 5 and the cooling chamber 7 of the box body 1, the wire arranging mechanism 8 can form the wire arrangement of the copper wire body 2, increase the storage amount of the copper wire body 2 in the box body 1, and then increase the annealing treatment effect. The wire arranging mechanism 8 is mainly composed of a bidirectional lead screw 801, sliders 803, L-shaped plates 804, rollers 805 and telescopic plates 806. The copper wire body 2 is inserted through the strip-shaped cavity grooves 3 and the rollers 805 to realize the wire arrangement of the copper wire body 2. When the bidirectional lead screw 801 rotates, the two sliders 803 can move towards each other, and then drive the corresponding sliders 803 and telescopic plates 806 to move towards each other, realizing the moving function of the rollers 805, thereby expanding the storage amount of the copper wire body 2 and increasing the annealing treatment effect of the copper wire body 2.

[0026] Specifically, the wire arranging mechanism 8 further includes a limiting rod 802 fixed to the box body 1, and the slider 803 is provided with a limiting hole adapted to the limiting rod 802 at the corresponding position of the limiting rod 802.

[0027] In this embodiment, it should be noted that the setting of the limiting rod 802 can realize the limiting and guiding functions of the slider 803, so that the slider 803 and the telescopic plate 806 move stably.

[0028] Specifically, one of the bidirectional lead screws 801 extends to the outside of the box body 1 and is fixed with a hand wheel 12, and synchronous wheels 10 are fixed on both of the bidirectional lead screws 801, and a synchronous belt 11 is arranged between the two synchronous wheels 10.

[0029] In this embodiment, the hand wheel 12 can control the rotation of the bidirectional lead screw 801, and the settings of the synchronous wheels 10 and the synchronous belt 11 can make the bidirectional lead screws 801 in the two wire arranging mechanisms 8 rotate synchronously and in the same direction, so that the copper wires in the heat dissipation chamber 5 and the cooling chamber 7 expand simultaneously.

[0030] Specifically, two symmetrically distributed cover plates 14 are fixedly connected to the top of the box body 1, and fans 15 are installed at the positions corresponding to the heat dissipation chamber 5 on the two cover plates 14, and a hollow cavity is formed between the two cover plates 14.

[0031] In this embodiment, the setting of the cover plate 14 can realize the protection function of the upper part of the box body 1. By installing the fans 15 on the cover plate 14, the air-cooling effect can be formed by the fans 15, and the heat dissipation and cooling of the copper wire body 2 in the heat dissipation chamber 5 can be initially realized. A hollow cavity is arranged between the two cover plates 14, which is convenient for the feeding of the copper wire body 2.

[0032] Specifically, it further includes a sealing member 17. The sealing member 17 includes: a horizontal plate 1701, and the horizontal plate 1701 is adapted to the hollow cavity between the two cover plates 14; three vertical plates 1703, and the three vertical plates 1703 are integrally formed on the lower surface of the horizontal plate 1701. The vertical plates 1703 are adapted to the corresponding strip-shaped cavity grooves 3, and an arc-shaped groove 1704 is arranged at the lower end of the vertical plate 1703. A round hole 18 is formed between the arc-shaped groove 1704 and the strip-shaped cavity groove 3, and the copper wire body 2 is inserted through the round hole 18; a positioning protrusion 1702, which is integrally formed on the lower surface of the horizontal plate 1701, and a positioning groove 4 adapted to the positioning protrusion 1702 is opened on the box body 1 corresponding to the positioning protrusion 1702.

[0033] In this embodiment, the sealing member 17 can achieve the sealing and protection function at the hollowed cavity. The sealing member 17 is detachably assembled on the box body 1 and the cover plate 14, which facilitates the feeding of the copper wire body 2. The sealing member 17 is composed of a transverse plate 1701, a positioning protrusion 1702 and a vertical plate 1703. During assembly, the transverse plate 1701 is adapted to the hollowed cavity, and the positioning protrusion 1702 is inserted into the positioning groove 4 to achieve the positioning of the sealing member 17. The vertical plate 1703 extends to the strip-shaped cavity groove 3 to achieve the protection at the strip-shaped cavity groove 3. A round hole 18 is formed between the arc-shaped groove 1704 and the strip-shaped cavity groove 3, thereby realizing the wiring of the copper wire body 2.

[0034] Specifically, a stop block 16 is rotatably connected to the upper surface of the cover plate 14, and one side of the stop block 16 abuts against the upper surface of the transverse plate 1701.

[0035] In this embodiment, after the sealing member 17 is assembled to the box body 1 and the cover plate 14, the stop block 16 is rotated to lock and position the sealing member 17.

[0036] Specifically, a plurality of semiconductor refrigeration chips 9 are embedded in an array distribution at the bottom of the box body 1 in the cooling chamber 7, and heat sinks 21 are fixedly connected to the hot ends of the lower surfaces of the semiconductor refrigeration chips 9 at equal intervals. Heat dissipation grooves are formed between adjacent two heat sinks 21. Exhaust grooves 19 are formed at equal intervals at the bottom of the box body 1 in the heat dissipation chamber 5, and a wind hood 20 is fixedly connected to one side of the exhaust groove 19 on the lower surface of the box body 1. The air outlet of the wind hood 20 corresponds to the heat dissipation groove.

[0037] In this embodiment, when the fan 15 works, it realizes the preliminary cooling of the copper wire body 2, and the generated wind is discharged through the exhaust groove 19. Due to the existence of the wind hood 20, the wind force can blow towards the heat dissipation grooves on the heat sinks 21, thereby realizing the heat dissipation of the hot ends of the semiconductor refrigeration chips 9. It should be noted that a water-cooling plate is arranged inside the wind hood 20, and cooling water flows through the water-cooling plate. The installation direction of the water-cooling plate is the same as the exhaust direction of the wind hood 20, thereby cooling the gas through the water-cooling plate to avoid the heat in the gas affecting the heat dissipation effect of the heat sinks 21, and then ensuring the normal and effective heat dissipation of the heat sinks 21. It should also be noted that both the water inlet end and the water outlet end of the water-cooling plate are located on one side of the wind hood 20 to realize the normal circulation of the cooling water.

[0038] Working principle and usage process of the present utility model: First, take out the sealing member 17 to expose the strip-shaped cavity 3, then extend the copper wire body 2 along the strip-shaped cavity 3 into the box body 1, and then assemble the sealing member 17 onto the box body 1 and the cover plate 14. During assembly, fit the cross plate 1701 to the hollow cavity on one side of the cover plate 14, and insert the positioning protrusion 1702 into the positioning groove 4 to achieve the preliminary positioning of the sealing member 17. Then, make the copper wire body 2 located within the round hole 18, and then rotate the stop block 16 to achieve the positioning effect on the upper part of the sealing member 17 through the stop block 16. At this time, the copper wire body 2 is located between the rollers 805. Then, rotate the hand wheel 12 to rotate the bidirectional lead screw 801, so that the two sliders 803 move towards each other along the limiting rod 802, and then drive the corresponding telescopic plate 806, L-shaped plate 804 and roller 805 to move. The roller 805 contacts the copper wire body 2, and the wiring of the copper wire body 2 is achieved through the roller 805, which can increase the amount of the copper wire body 2 in the box body 1 and improve the annealing treatment effect. During operation, drive the fan 15 and the semiconductor refrigeration sheet 9 to work. The fan 15 generates wind to dissipate heat from the copper wire body 2, and the cold end of the semiconductor refrigeration sheet 9 performs refrigeration to reduce the temperature at the cooling chamber 7. The annealing and cooling of the copper wire body 2 are carried out step by step, and the wind in the heat dissipation chamber 5 is discharged through the exhaust slot 19 and then discharged through the air outlet of the air hood 20 to take away the heat on the heat sink 21, realizing the rapid cooling of the hot end of the semiconductor refrigeration sheet 9.

[0039] In summary, this annealing device for producing oxygen-free copper wire has the advantages of good annealing treatment effect, high efficiency and convenient feeding.

[0040] It should be noted that in this article, terms such as "including", "comprising" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of another identical element in the process, method, article or device including the said element.

[0041] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. An annealing device for producing oxygen-free copper wire, comprising a box body (1) with support rods (13) at the bottom, characterized in that, It further includes: A partition board (6), integrally formed inside the box body (1). The box body (1) forms a heat dissipation chamber (5) and a cooling chamber (7) respectively through the partition board (6), and strip-shaped cavity grooves (3) are provided on both sides of the box body (1) and the partition board (6); Wire arranging mechanisms (8), there are two of them. The two wire arranging mechanisms (8) are respectively installed in the heat dissipation chamber (5) and the cooling chamber (7) of the box body (1). The wire arranging mechanism (8) includes a bidirectional lead screw (801) rotatably connected to the box body (1), and two sliders (803) symmetrically threadedly connected to the bidirectional lead screw (801). Telescopic plates (806) are fixedly connected to both of the two sliders (803), and equidistantly distributed L-shaped plates (804) are fixed to the telescopic plates (806) by bolts. A roller (805) is installed on one side of the L-shaped plate (804). The L-shaped plates (804) and rollers (805) on the two telescopic plates (806) are staggered with each other. The copper wire body (2) is inserted through the strip-shaped cavity grooves (3) and the rollers (805), thereby realizing batch annealing and cooling of the copper wire body (2).

2. The annealing device for producing oxygen-free copper wire according to claim 1, characterized in that: The wire arranging mechanism (8) further includes a limiting rod (802) fixed to the box body (1), and the slider (803) is provided with a limiting hole adapted to the limiting rod (802) at the position corresponding to the limiting rod (802).

3. An annealing device for producing oxygen-free copper wires according to claim 1, characterized in that: One of the bidirectional lead screws (801) extends to the outside of the box body (1) and is fixed with a hand wheel (12), and synchronous wheels (10) are fixed on both of the two bidirectional lead screws (801), and a synchronous belt (11) is arranged between the two synchronous wheels (10).

4. An annealing device for producing oxygen-free copper wire according to claim 1, characterized in that: Two symmetrically distributed cover plates (14) are fixedly connected to the top of the box body (1), and fans (15) are installed at the positions corresponding to the heat dissipation chamber (5) on both of the two cover plates (14), and a hollow cavity is formed between the two cover plates (14).

5. An annealing device for producing oxygen-free copper wire according to claim 4, characterized in that: It further includes a sealing member (17), and the sealing member (17) includes: A horizontal plate (1701), which is adapted to the hollow cavity between the two cover plates (14); Vertical plates (1703), there are three of them. The three vertical plates (1703) are all integrally formed on the lower surface of the horizontal plate (1701). The vertical plates (1703) are adapted to the corresponding strip-shaped cavity grooves (3), and an arc-shaped groove (1704) is provided at the lower end of the vertical plate (1703). A round hole (18) is formed between the arc-shaped groove (1704) and the strip-shaped cavity groove (3), and the copper wire body (2) is inserted through the round hole (18); Positioning protrusions (1702), integrally formed on the lower surface of the horizontal plate (1701), and the box body (1) is provided with a positioning groove (4) adapted to the positioning protrusions (1702) at the position corresponding to the positioning protrusions (1702).

6. An annealing device for producing oxygen-free copper wire according to claim 5, characterized in that: A stop block (16) is rotatably connected to the upper surface of the cover plate (14), and one side of the stop block (16) abuts against the upper surface of the horizontal plate (1701).

7. An annealing device for producing oxygen-free copper wire according to claim 1, characterized in that: The box body (1) is embedded with an array of thermoelectric coolers (9) at the bottom of the cooling chamber (7), and heat sinks (21) are fixedly connected to the hot ends of the lower surfaces of the thermoelectric coolers (9) at equal intervals. Heat dissipation grooves are formed between adjacent heat sinks (21). The box body (1) is provided with equal-interval exhaust grooves (19) at the bottom of the heat dissipation chamber (5), and a wind hood (20) is fixedly connected to one side of the box body (1) where the exhaust grooves (19) are located on the lower surface. The air outlet of the wind hood (20) corresponds to the heat dissipation grooves.

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