Evaporation equipment

Abstract

An evaporation apparatus includes: a lower housing accommodating a deposition material; a nozzle emitting the deposition material; a first angle limiting member including a first angle limiting plate extending in a direction limiting an angle of the deposition material emitted from the nozzle; a plurality of first cooling fins connected to one side of the first angle limiting member; and a first heat exchanger having a plurality of first heat exchange fins located between the plurality of first cooling fins.

Description

[0001] Cross - Reference to Related Applications

[0002] This application claims the priority and benefit of Korean Patent Application No. 10-2023-0112263, filed with the Korean Intellectual Property Office on August 25, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to an evaporation apparatus including an angle limiting plate. Background Art

[0004] With the development of information technology, the importance of display devices as a medium connecting users and information has increased. Accordingly, display devices such as liquid crystal display devices, organic light emitting display devices, and inorganic light emitting display devices are increasingly used.

[0005] In a process of manufacturing a display device, a layer may be formed using a method of depositing a deposition material on a target substrate by using an evaporation apparatus. When several evaporation apparatuses are used to sequentially deposit several materials, there may be a portion where the deposited materials are mixed.

[0006] To reduce or prevent this, a structure called an angle limiting plate may be used. The angle limiting plate may be installed above a nozzle through which the deposition material is emitted, thereby limiting the emission path of the deposition material to a desired range.

[0007] In the process, a portion of the deposition material that is not deposited on the target substrate may accumulate in a solid state near the angle limiting plate and the nozzle. When the deposition material continuously accumulates near the angle limiting plate and the nozzle, the initially designed emission angle limit of the deposition material may be changed, or since the deposition material covers the nozzle, a layer may not be formed with a desired layer thickness.

[0008] The above information disclosed in this background art section is only for enhancing the understanding of the background art of the present disclosure, and thus, it may include information that does not constitute the prior art already known to those of ordinary skill in the art in the country. Summary of the Utility Model

[0009] An embodiment provides an evaporation apparatus in which the emission angle limit of a deposition material is not changed. For example, the heat dissipation effect of an angle limiting member is increased, so that it is possible to prevent the material not deposited on the target substrate from accumulating on the surface of the angle limiting member. Accordingly, it is possible to provide an evaporation apparatus in which the emission angle limit of a deposition material is not changed.

[0010] According to an embodiment of the present disclosure, an evaporation device may include: a lower housing that accommodates a deposition material; a nozzle that is mounted on the lower housing and emits the deposition material; a first angle limiting member that includes a first support member and a first angle limiting plate that is connected to the first support member and extends from the first support member in a direction that limits the angle of the deposition material emitted from the nozzle; a second angle limiting member that includes a second support member and a second angle limiting plate that is connected to the second support member and extends from the second support member in a direction that limits the angle of the deposition material emitted from the nozzle; a plurality of first cooling fins that are connected to a side surface of the first angle limiting member; and a first heat exchanger that has a plurality of first heat exchange fins, and each of the plurality of first heat exchange fins is located between adjacent first cooling fins among the plurality of first cooling fins.

[0011] The first angle limiting member may overlap the lower housing in one direction. The plurality of first cooling fins may extend from the first angle limiting member so as not to overlap the lower housing in this direction.

[0012] The plurality of first heat exchange fins may overlap the plurality of first cooling fins in this direction without directly contacting the plurality of first cooling fins.

[0013] The plurality of first cooling fins and the plurality of first heat exchange fins may be alternately arranged in this direction.

[0014] Each of the first angle limiting plate and the second angle limiting plate may extend in a first direction and a second direction that intersects the first direction. Each of the first support member and the second support member may be fixed to the lower housing, extend in a third direction that intersects the first direction and the second direction, and support the corresponding one of the first angle limiting plate and the second angle limiting plate. The first angle limiting member and the second angle limiting member may be spaced apart from each other in the first direction.

[0015] In the first direction, the length of one of the plurality of first cooling fins and the length of another one of the plurality of first cooling fins may be different.

[0016] The first angle limiting member and the second angle limiting member may include at least one of stainless steel, titanium, aluminum, and composite carbon.

[0017] The first heat exchanger may include a refrigerant material inlet for inputting a refrigerant material, a refrigerant material movement path connected to the refrigerant material inlet, and a refrigerant material outlet connected to the outside of the first heat exchanger. The refrigerant material movement path is located inside the first heat exchanger, the refrigerant material movement path transfers the refrigerant material, and the refrigerant material outlet discharges the refrigerant material that has been transferred through the refrigerant material movement path to the outside.

[0018] The evaporation device may further include: a plurality of second cooling fins connected to a side surface of the second angle limiting member; and a second heat exchanger having a plurality of second heat exchange fins, each of the plurality of second heat exchange fins being located between adjacent second cooling fins of the plurality of second cooling fins.

[0019] The second angle limiting member may overlap with the lower housing in one direction. The plurality of second cooling fins may extend from the second angle limiting member so as not to overlap with the lower housing in this direction.

[0020] The plurality of second heat exchange fins may overlap with the plurality of second cooling fins in this direction without directly contacting the plurality of second cooling fins.

[0021] According to another aspect of the present disclosure, an evaporation device may include: a lower housing for accommodating a deposition material; a nozzle mounted on the lower housing and emitting the deposition material; a first angle limiting member including a first support member and a first angle limiting plate connected to the first support member and extending from the first support member in a direction of limiting an angle of the deposition material emitted from the nozzle; a second angle limiting member including a second support member and a second angle limiting plate connected to the second support member and extending from the second support member in a direction of limiting an angle of the deposition material emitted from the nozzle; a plurality of first cooling fins connected to a side surface of the first angle limiting member; and a first heat exchanger in contact with at least one of the plurality of first cooling fins.

[0022] The evaporation device may further include: a plurality of second cooling fins connected to a side surface of the second angle limiting member; and a second heat exchanger in contact with at least one of the plurality of second cooling fins. Description of the Drawings

[0023] Embodiments will now be described more fully hereinafter with reference to the accompanying drawings; however, these embodiments may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of example embodiments to those skilled in the art.

[0024] In the drawings, for ease of explanation, dimensions may be exaggerated. It will be understood that when an element is referred to as being "between" two elements, it can be the only element between the two elements, or one or more intervening elements may also exist. The same reference numerals always refer to the same elements.

[0025] Figure 1 is a perspective view showing an evaporation device according to an embodiment of the present disclosure.

[0026] Figure 2 is Figure 1Schematic cross-sectional view taken along line I-I’ of the evaporation device shown in the figure.

[0027] Figure 3 is Figure 1 Schematic cross-sectional view taken along line II-II’ of the first heat exchanger shown in the figure.

[0028] Figure 4 shows Figure 1 Perspective view of the second angle limiting member shown in the figure.

[0029] Figure 5 shows according to Figure 4 Graph of the radiant heat radiated showing the number of the second cooling fins of the second angle limiting member shown in the figure.

[0030] Figure 6 Perspective view of the evaporation device according to another embodiment of the present disclosure. Detailed Description

[0031] Hereinafter, embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. In the following description, only the necessary parts for understanding the operation according to the present disclosure are described, and the description of other parts is omitted so as not to unnecessarily obscure the subject matter of the present disclosure. The present disclosure is not limited to the embodiments described herein, but can be embodied in various different forms. On the contrary, the embodiments described herein are provided to thoroughly and completely describe the disclosed content and to fully convey the idea of the present disclosure to those of ordinary skill in the art.

[0032] When an element or layer is referred to as "on", "connected to", or "coupled to" another element or layer, the element or layer may be directly on, connected to, or coupled to the other element or layer, or there may be intervening elements or intervening layers. However, when an element or layer is referred to as "directly on", "directly connected to", or "directly coupled to" another element or layer, there are no intervening elements or intervening layers. For this reason, the term "connection" may refer to physical connection, electrical connection, and / or fluid connection with or without intervening elements. In addition, when an element is referred to as "in contact with" or "contacting" another element, etc., the element may be "electrically in contact with" or "physically in contact with" the other element; or "indirectly in contact with" or "directly in contact with" the other element. The technical terms used herein are for the purpose of illustrating specific embodiments only and are not intended to limit the embodiments.

[0033] The terms used in this specification are for the purpose of describing particular embodiments and are not intended to be limiting. Unless the context clearly dictates otherwise, the singular forms "a," "an," and "the" as used herein are also intended to include the plural forms. Additionally, when used in this specification, the terms "comprises," "comprising," "has," and / or "having" specify the presence of the stated features, integers, steps, operations, elements, components, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof. It will be understood that, for the purposes of this disclosure, "at least one of X, Y, and Z" can be construed to mean only X, only Y, only Z, or any combination of two or more of X, Y, and Z (e.g., XYZ, XY, YZ, XZ). Similarly, for the purposes of this disclosure, "at least one selected from the group consisting of X, Y, and Z" can be construed to mean only X, only Y, only Z, or any combination of two or more of X, Y, and Z (e.g., XYZ, XY, YZ, XZ).

[0034] It will be understood that although the terms "first," "second," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. Thus, a "first" element discussed below could also be termed a "second" element without departing from the teachings of this disclosure.

[0035] For ease of description, spatial relative terms such as "below" and "above" may be used herein to describe the relationship of one element to another as shown in the figures. It will be understood that, in addition to the orientations described herein and depicted in the figures, the spatial relative terms and the configurations shown are also intended to encompass different orientations of the device during use or operation. For example, if the device is flipped in the figures, an element described as "below" or "beneath" other elements or features will then be oriented "above" the other elements or features. Thus, the exemplary term "above" can encompass both an orientation above and below. The device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and the spatial relative descriptors used herein will be interpreted accordingly.

[0036] Furthermore, embodiments of the present disclosure are described herein with reference to schematic illustrations of embodiments (and intermediate structures) of the present disclosure, such that variations in the shapes shown due to, for example, manufacturing techniques and / or tolerances are to be expected. Thus, embodiments of the present disclosure should not be construed as limited to the specific shapes of regions shown herein, but rather include shape deviations resulting from, for example, manufacturing techniques. The regions shown in the figures are actually schematic, and their shapes do not represent the actual shapes of regions of the device and do not limit the scope of the present disclosure.

[0037] Unless otherwise defined or implied herein, all terms used (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will be further understood that terms, such as those defined in a general dictionary, should be interpreted as having a meaning consistent with their meaning in the relevant technical context, and should not be interpreted in an idealized or overly formal sense, unless expressly defined in the specification.

[0038] Figure 1 is a perspective view showing an evaporation device according to an embodiment of the present disclosure.

[0039] Reference Figure 1 , the evaporation device 100 may include a lower housing 110, a first angle limiting member 120, a second angle limiting member 130, cooling fins 140, a first heat exchanger 150, and a second heat exchanger 160.

[0040] The lower housing 110 may have a three-dimensional shape extending in a first direction DR1, a second direction DR2 intersecting the first direction DR1, and a third direction DR3 intersecting the first direction DR1 and the second direction DR2. For example, the lower housing 110 may have a shape such as a hexahedron (e.g., a cuboid or a regular hexahedron).

[0041] The lower housing 110 may be configured to evaporate a deposition material DM (see Figure 2 ) accommodated inside the lower housing 110 for emission through a nozzle 111. The deposition material emitted through the nozzle 111 may form a thin film on a substrate overlapping the evaporation device 100. The internal structure of the lower housing 110 will be described in detail later with reference to Figure 2 .

[0042] The first angle limiting member 120 and the second angle limiting member 130 may be disposed on a heat insulating plate ( Figure 1 not shown in the figure), facing each other in the first direction DR1. In addition, the first angle limiting member 120 and the second angle limiting member 130 may be coupled to the lower housing 110. In a plan view, the first angle limiting member 120 and the second angle limiting member 130 may overlap the lower housing 110.

[0043] The first angle limiting member 120 may include at least one of stainless steel, titanium, aluminum, and composite carbon. The second angle limiting member 130 may include at least one of stainless steel, titanium, aluminum, and composite carbon.

[0044] The first angle limiting member 120 and the second angle limiting member 130 can limit the emission area of the deposition material emitted in a radiation form from the evaporation device 100. When the evaporation device 100 emits the deposition material in a radiation form toward the substrate, the deposition material DM may not be deposited in the area blocked by the first angle limiting member 120 and the second angle limiting member 130. Therefore, the emission area of the deposition material emitted in a radiation form from the evaporation device 100 can be controlled.

[0045] The first angle limiting member 120 may include a first angle limiting plate 121 and a first support member 122.

[0046] The first angle limiting plate 121 may have a three-dimensional shape configured to have sides extending in a first direction DR1, a second direction DR2, and a third direction DR3, respectively. For example, the first angle limiting plate 121 may have a rectangular parallelepiped plate shape. The first angle limiting plate 121 may be coupled to the first support member 122.

[0047] The first angle limiting plate 121 may extend in a direction (e.g., the nozzle direction) that can limit the angle at which the deposition material is emitted from the nozzle 111. The first angle limiting plate 121 can limit the emission area of the deposition material emitted in a radiation form from the evaporation device 100.

[0048] The first support member 122 may have a three-dimensional shape configured to have sides extending in a first direction DR1, a second direction DR2, and a third direction DR3, respectively. For example, the first support member 122 may have a rectangular parallelepiped column shape.

[0049] The first support member 122 can serve to fully support the first angle limiting plate 121. For example, the shape of the first angle limiting plate 121 may be partially deformed due to the heat radiated from the lower housing 110. The first support member 122 can serve to fully support the first angle limiting plate 121, thereby reducing (e.g., preventing) the deformation of the shape of the first angle limiting plate 121 due to heat.

[0050] The second angle limiting member 130 may include a second angle limiting plate 131 and a second support member 132.

[0051] The second angle limiting plate 131 may have a three-dimensional shape configured to have sides extending in a first direction DR1, a second direction DR2, and a third direction DR3, respectively. For example, the second angle limiting plate 131 may have a rectangular parallelepiped plate shape. The second angle limiting plate 131 may be coupled to the second support member 132.

[0052] The second angle limiting plate 131 may extend in a direction that can limit the angle of the deposition material emitted from the nozzle 111. The second angle limiting plate 131 may limit the emission area of the deposition material DM emitted from the evaporation device 100 in the form of radiation.

[0053] The second support member 132 may have a three-dimensional shape configured to have sides extending in a first direction DR1, a second direction DR2, and a third direction DR3, respectively. For example, the second support member 132 may have a rectangular parallelepiped column shape.

[0054] The second support member 132 may serve to fully support the second angle limiting plate 131. For example, the shape of the second angle limiting plate 131 may be partially deformed due to the heat radiated from the lower housing 110. The second support member 132 may serve to fully support the second angle limiting plate 131, thereby reducing (e.g., preventing) the deformation of the shape of the second angle limiting plate 131 due to heat.

[0055] The cooling fins 140 may include a first cooling fin 141 and a second cooling fin 142. The cooling fins 140, as well as the first heat exchanger 150 and the second heat exchanger 160, may be formed of the same material. For example, the cooling fins 140, as well as the first heat exchanger 150 and the second heat exchanger 160, may be formed of a material having the same thermal conductivity.

[0056] The first cooling fin 141 may include at least one of stainless steel, titanium, aluminum, and composite carbon.

[0057] The first cooling fin 141 may be coupled to the first angle limiting member 120. The first cooling fin 141 may have a three-dimensional shape configured to have sides extending in a first direction DR1, a second direction DR2, and a third direction DR3, respectively. For example, the first cooling fin 141 may have a rectangular parallelepiped plate shape.

[0058] The second cooling fin 142 may be coupled to the second angle limiting member 130. The second cooling fin 142 may have a three-dimensional shape configured to have sides extending in a first direction DR1, a second direction DR2, and a third direction DR3, respectively. For example, the second cooling fin 142 may have a rectangular parallelepiped plate shape.

[0059] In an embodiment of the present disclosure, the process of heat transfer can be as follows. First, the first angle limiting member 120 and the second angle limiting member 130 can receive heat transferred from the lower housing 110. The heat transferred to the first angle limiting member 120 and the second angle limiting member 130 can be transferred to the cooling fins 140. The cooling fins 140 can have a wide surface area where the heat transferred from the first angle limiting member 120 and the second angle limiting member 130 can be radiated into the air, and can accelerate the cooling of the first angle limiting member 120 and the second angle limiting member 130.

[0060] The density of the deposition material according to an embodiment of the present disclosure can increase as the temperature decreases. Accordingly, the density of the deposition material accumulated on the surfaces of the first angle limiting member 120 and the second angle limiting member 130 can increase as the temperature decreases. Accordingly, for the same mass, a smaller volume of deposition material can be accumulated on the surfaces of the first angle limiting member 120 and the second angle limiting member 130, and the covering of the nozzle 111 due to the deposition material can be reduced (e.g., prevented).

[0061] The evaporation device 100 may include a first heat exchanger 150 and a second heat exchanger 160.

[0062] The first heat exchanger 150 and the second heat exchanger 160 can be spaced apart from each other in the first direction DR1, and the lower housing 110 is interposed between the first heat exchanger 150 and the second heat exchanger 160.

[0063] The first heat exchanger 150 and the second heat exchanger 160 can include a material having a high thermal conductivity. For example, the first heat exchanger 150 and the second heat exchanger 160 can include a metal (e.g., iron (Fe), etc.).

[0064] The first heat exchanger 150 may include a first heat exchanger body 151, first heat exchange fins 152, a first refrigerant material inlet 153, a first refrigerant material outlet 154, etc.

[0065] The first heat exchanger body 151 can have a three-dimensional shape configured to have sides extending in the first direction DR1, the second direction DR2, and the third direction DR3, respectively. For example, the first heat exchanger body 151 can have a rectangular parallelepiped shape configured to have sides extending in the first direction DR1, the second direction DR2, and the third direction DR3, respectively.

[0066] The first heat exchange fins 152 can be coupled to the first heat exchanger body 151 and have a three-dimensional shape extending in the first direction DR1 to the third direction DR3. For example, the first heat exchange fins 152 can have a rectangular parallelepiped plate shape.

[0067] In a plan view, the first heat exchange fin 152 may overlap with the first cooling fin 141 (e.g., overlap without direct contact). The first heat exchange fin 152 and the first cooling fin 141 may be alternately arranged.

[0068] The first refrigerant material inlet 153 and the first refrigerant material outlet 154 may be coupled to the first heat exchanger body 151 and have various shapes. For example, each of the first refrigerant material inlet 153 and the first refrigerant material outlet 154 may have a circular column shape, but the present disclosure is not limited to Figure 1 the shapes shown therein.

[0069] The refrigerant material may be a liquid. For example, water (H2O) may be used as the refrigerant material, but the present disclosure is not limited thereto. The refrigerant material may be input into the interior of the first heat exchanger 150 through the first refrigerant material inlet 153. In addition, the refrigerant material may be discharged to the outside of the first heat exchanger 150 through the first refrigerant material outlet 154.

[0070] Through the input and discharge of the refrigerant material, the heat of the first heat exchanger 150 may be radiated to the outside of the first heat exchanger 150. As this process is repeated, the temperature of the first heat exchanger 150 may be maintained equal (or substantially equal) to the temperature of the refrigerant material. For example, the temperature of the first heat exchange fin 152 coupled to the first heat exchanger 150 may also be maintained equal (or substantially equal) to the temperature of the refrigerant material.

[0071] The second heat exchanger 160 may include a second heat exchanger body 161, a second heat exchange fin 162, a second refrigerant material inlet 163, and a second refrigerant material outlet (not shown), etc.

[0072] The second heat exchanger body 161 may have a three-dimensional shape configured to have sides extending in a first direction DR1, a second direction DR2, and a third direction DR3, respectively. For example, the second heat exchanger body 161 may have a rectangular parallelepiped shape configured to have sides extending in the first direction DR1, the second direction DR2, and the third direction DR3.

[0073] The second heat exchange fin 162 may be coupled to the second heat exchanger body 161 and have a three-dimensional shape extending in the first direction DR1 to the third direction DR3. For example, the second heat exchange fin 162 may have a rectangular parallelepiped plate shape.

[0074] In some embodiments, in a plan view, the second heat exchange fin 162 may overlap with the second cooling fin 142 without directly contacting the second cooling fin 142. In some embodiments, the second heat exchange fin 162 and the second cooling fin 142 may be alternately arranged.

[0075] The second refrigerant material inlet 163 and the second refrigerant material outlet may be coupled to the second heat exchanger body 161. The second refrigerant material inlet 163 and the second refrigerant material outlet may have various shapes. For example, as Figure 1 shown, each of the first refrigerant material inlet 153 and the first refrigerant material outlet 154 may have a circular column shape. However, the present disclosure is not limited thereto.

[0076] The refrigerant material may be input into the interior of the second heat exchanger 160 through the second refrigerant material inlet 163. The input refrigerant material may be discharged to the outside of the second heat exchanger 160 through the second refrigerant material outlet.

[0077] Through the input and discharge of the refrigerant material, the heat of the second heat exchanger 160 may be radiated to the outside of the second heat exchanger 160. As such a process is repeated, the temperature of the second heat exchanger 160 may be maintained equal (or substantially equal) to the temperature of the refrigerant material. For example, the temperature of the second heat exchange fin 162 coupled to the second heat exchanger 160 may also be maintained equal (or substantially equal) to the temperature of the refrigerant material.

[0078] According to an embodiment of the present disclosure, the first heat exchange fin 152, the second heat exchange fin 162, and the cooling fin 140 may be alternately arranged in the evaporation device 100. Each of the cooling fins 140 may overlap with the first heat exchange fin 152 and the second heat exchange fin 162 having a large surface temperature difference from each of the cooling fins 140 in the third direction DR3. The amount of radiant heat radiated from each of the cooling fins 140 having a high surface temperature toward each of the first heat exchange fin 152 and the second heat exchange fin 162 having a low surface temperature may increase. Accordingly, the radiant heat of the first cooling fin 141 may be easily radiated into the air through the first heat exchange fin 152.

[0079] Figure 2 is Figure 1 a schematic cross-sectional view of the evaporation device shown taken along line I-I'.

[0080] Refer to Figure 1 and Figure 2, in the sectional view, the lower housing 110, the first angle limiting member 120, the second angle limiting member 130, the first heat exchanger 150, and the second heat exchanger 160 are shown.

[0081] Hereinafter, the description of the parts of the first angle limiting member 120 and the second angle limiting member 130, and the first heat exchanger 150 and the second heat exchanger 160 that overlap with the parts described in Figure 1 will be omitted.

[0082] The lower housing 110 may include a nozzle 111, a crucible 112, a heating member 113, a first inner plate 114 and a second inner plate 115, a first cover 116, a frame 117, and a heat insulating plate 118.

[0083] The lower housing 110 may include an empty space for exposing the nozzle 111. In an embodiment, the lower housing 110 may include an empty space having a shape extending in one direction (e.g., the second direction DR2) to expose (e.g., fully expose) a plurality of nozzles 111. In an embodiment, the empty space of the lower housing 110 may be covered by the heat insulating plate 118. In the region covered by the heat insulating plate 118, the region corresponding to the nozzle 111 may be opened such that an opening is located therein.

[0084] The crucible 112 may be configured to accommodate a deposition material DM in the crucible 112. An internal space IS may be defined inside the crucible 112, and the deposition material DM may be accommodated in the internal space IS. The internal space IS may include a first internal space IS1, a second internal space IS2, and a third internal space IS3. The crucible 112 may be connected to the nozzle 111. The deposition material DM may be evaporated inside the crucible 112 to be emitted through the nozzle 111.

[0085] The heating member 113 may be located in the lateral direction (e.g., the first direction DR1) of the crucible 112. The heating member 113 may extend in one direction (e.g., the third direction DR3).

[0086] The heating member 113 may provide heat, and the heat provided by the heating member 113 may increase the temperature of the crucible 112. For example, the heat provided by the heating member 113 may increase the temperature of the internal space IS of the crucible 112.

[0087] The heating member 113 may evaporate the deposition material DM accommodated in the crucible 112 to form a thin film on a target substrate.

[0088] The heating member 113 may include, for example, a plurality of heating plates. In an embodiment, the heating member 113 may include a heating coil. In an embodiment, the heating member 113 may extend not only in one direction (e.g., the third direction DR3), but also in another direction (e.g., the second direction DR2 which is perpendicular to the third direction DR3). In an embodiment, the heating member 113 may have a form in which the heating member 113 is separated in the third direction DR3 perpendicular to the first direction DR1. In an embodiment, the heating member 113 may be integrally formed along the third direction DR3.

[0089] The evaporation device 100 may include a first inner plate 114 and a second inner plate 115. The first inner plate 114 may divide the internal space IS into a first internal space IS1 and a second internal space IS2. The second inner plate 115 may divide the internal space IS into a second internal space IS2 and a third internal space IS3.

[0090] The deposition material DM may be accommodated in the first internal space IS1. Hereinafter, although an embodiment in which the evaporation device 100 includes the first inner plate 114 and the second inner plate 115 is described, the present disclosure is not limited thereto. For example, the functions of the first inner plate 114 and the second inner plate 115 described below may be performed by one inner plate. In addition, in addition to the first inner plate 114 and the second inner plate 115, the evaporation device 100 may further include additional inner plates.

[0091] The first inner plate 114 may be disposed above the deposition material DM inside the crucible 112. The first inner plate 114 may include a plurality of through holes.

[0092] The first inner plate 114 may increase the internal pressure of the crucible 112 (or the atmospheric pressure of the first internal space IS1). The first inner plate 114 may improve the deposition efficiency of the deposition material DM heated and evaporated in the crucible 112 on the target substrate. The first inner plate 114 may prevent the deposition material in terms of mass from being discharged in the third direction DR3 of the crucible 112.

[0093] The second inner plate 115 may overlap the first inner plate 114 in the third direction DR3 inside the crucible 112. The second inner plate 115 may include a plurality of through holes.

[0094] The second inner plate 115 may extend the movement path through which the deposition material DM emitted from being heated and evaporated in the crucible 112 passes. Therefore, it is possible to effectively prevent the deposition material DM from being deposited on the first lid 116, or it is possible to effectively prevent the deposition material DM in terms of mass from being discharged.

[0095] In an embodiment, the size of the through hole of the second inner plate 115 may be smaller than the size of the through hole of the first inner plate 114. Accordingly, a large amount of deposition material DM heated and evaporated in the crucible 112 may mainly pass through the through hole of the first inner plate 114.

[0096] The first cover 116 may be coupled to the upper side of the crucible 112. The first cover 116 and the crucible 112 may extend in the same direction (e.g., the first direction DR1).

[0097] The first cover 116 may have a plate shape (e.g., a flat plate shape). The first cover 116 and the crucible 112 may be formed of, for example, the same material, but the present disclosure is not limited thereto. Figure 2 The first cover 116 is shown separated from the crucible 112. However, the present disclosure is not limited thereto, and in another embodiment, the first cover 116 and the crucible 112 may be integral with each other. In an embodiment, the first cover 116 may be omitted.

[0098] The nozzle 111 may protrude in the upward direction (e.g., the third direction DR3) of the first cover 116. The nozzle 111 may have a plate shape including an opening through which the deposition material DM may be emitted.

[0099] The frame 117 may accommodate the crucible 112 and the heating member 113 therein. For example, the frame 117 may be formed in a box shape in which at least a part of the upper side thereof is opened. The frame 117 may be coupled to the heat insulating plate 118. The frame 117 may protect the components accommodated therein from external influences.

[0100] The frame 117 may include a heat insulating material. The frame 117 may prevent the heat of the internal space IS from leaking to the outside. A pipe (not shown) for providing a path through which the deposition material DM flows may be provided inside the frame 117.

[0101] The heat insulating plate 118 may be disposed on top of the first cover 116 and expose the nozzle 111. The heat insulating plate 118 may be coupled to the frame 117. The heat insulating plate 118 may prevent the heat radiated from the heating member 113 and / or the heat radiated from the crucible 112 from leaking to the outside.

[0102] The heat insulating plate 118 may include an opening formed in a region corresponding to the nozzle 111. The width of the opening of the heat insulating plate 118 may gradually increase as it approaches the region away from the nozzle 111 from the region close to the nozzle 111. Accordingly, the deposition material DM emitted from the nozzle 111 may be radiated in a wider region while preventing the heat generated at the lower part of the heat insulating plate 118 (e.g., the heat radiated from the heating member 113 and / or the crucible 112) from radiating to the upper part of the heat insulating plate 118.

[0103] Figure 3 is Figure 1 a schematic cross-sectional view taken along line II-II’ of the first heat exchanger shown in

[0104] Referring to Figure 1 and Figure 3 ,the first heat exchanger 150 may include a first heat exchanger body 151, a first refrigerant material inlet 153, a first refrigerant material outlet 154, and a first refrigerant material movement path 155. Hereinafter, the parts of the first heat exchanger body 151, the first refrigerant material inlet 153, and the first refrigerant material outlet 154 that are repetitive of the parts described in Figure 1 will be omitted from the description.

[0105] The first refrigerant material movement path 155 may extend from the first refrigerant material inlet 153 and be located inside the first heat exchanger body 151. The shape of the first refrigerant material movement path 155 is not limited to Figure 3 the shape shown in

[0106] For example, the first refrigerant material movement path 155 may have various shapes including a curved shape and the like.

[0107] Figure 4 is a perspective view showing Figure 1 the second angle limiting member shown in

[0108] Referring to Figure 4 the parts described in Figure 1 may be equally applied to

[0109] Referring to Figure 1 and Figure 4 ,the second angle limiting member 130 may include a second angle limiting plate 131, a second support member 132, and a second cooling fin 142.

[0110] At least one of the second cooling fins 142 may extend a first length D1 from the second support member 132 in a first direction DR1. At least another one of the second cooling fins 142 may extend a second length D2 from the second support member 132 in the first direction DR1. In an embodiment, the first length D1 and the second length D2 may be different from each other. For example, the first length D1 may be greater than the second length D2. In an embodiment, the first length D1 and the second length D2 may be the same (or substantially the same).

[0111] Two cooling fins adjacent to each other among the second cooling fins 142 may be spaced apart from each other. For example, two cooling fins adjacent to each other in a third direction DR3 among the second cooling fins 142 may be spaced apart a third length D3 in the third direction DR3.

[0112] The second cooling fins 142 may have a thickness (e.g., a predetermined thickness). For example, a thickness of at least one of the second cooling fins 142 in the third direction DR3 may be a fourth length D4.

[0113] The cooling fin disposed at the uppermost end among the second cooling fins 142 may be spaced apart a fifth length D5 from the cooling fin disposed at the lowermost end among the second cooling fins 142.

[0114] In Figure 4 it is shown that the number of the second cooling fins 142 is 10. However, the number of the second cooling fins 142 is not limited thereto. For example, the number of the second cooling fins 142 may be less than or greater than 10.

[0115] The second cooling fins 142 may radiate heat. According to the location where the heat is radiated, the heat radiated by the second cooling fins 142 may be separated into a first heat H1, a second heat H2, a third heat H3, a fourth heat H4, a fifth heat H5, etc.

[0116] The first heat H1 may correspond to the heat radiated in a direction (e.g., the third direction DR3) through the upper surface of the second cooling fin disposed at the uppermost end among the second cooling fins 142.

[0117] The second cooling fin disposed at the lowermost end among the second cooling fins 142 that extends a first length D1 from the second support member 132 in the first direction DR1 may include a surface that does not overlap with the cooling fin adjacent to the second cooling fin in the opposite direction of the third direction DR3, and radiate a second heat H2 in the opposite direction of the third direction DR3 through the surface.

[0118] The third heat quantity H3 may correspond to the heat radiated in the opposite direction of the third direction DR3 through the lower surface of the second cooling fin disposed at the lowermost end among the second cooling fins 142.

[0119] The fourth heat quantity H4 may correspond to the heat radiated from the side surface of the second cooling fin 142 in the first direction DR1.

[0120] The fifth heat quantity H5 may correspond to the heat radiated between two adjacent cooling fins among the second cooling fins 142.

[0121] The heat radiated through the second cooling fins 142 may have the following relationship with the number of the second cooling fins 142. As the number of the second cooling fins 142 increases, the surface area on which the second angle limiting member 130 radiates heat into the air may increase, and thus, a relatively large amount of the first heat quantity H1 to the third heat quantity H3 can be radiated into the air.

[0122] The heat radiated through the second cooling fins 142 may have the following relationship with the length of the second cooling fins 142. As the length of the second cooling fins 142 in the first direction DR1 increases, the surface area on which the second angle limiting member 130 radiates heat into the air may increase, and thus, a relatively large amount of the first heat quantity H1 to the fourth heat quantity H4 can be radiated into the air.

[0123] On the other hand, the fifth heat quantity H5 among the heat radiated through the second cooling fins 142 may have the following relationship with the number of the second cooling fins 142. When the fifth length D5 is constant, as the number of the second cooling fins 142 increases, the distance between the second cooling fins 142 may decrease. In other words, the distance in the third direction DR3 between adjacent second cooling fins 142 may decrease. Since the second cooling fins 142 with a smaller surface temperature difference are arranged at a closer distance, each of the second cooling fins 142 can radiate a smaller amount of radiant heat.

[0124] Figure 5 is a graph showing the radiant heat of the number of the second cooling fins of the second angle limiting member according to Figure 4 shown in.

[0125] Refer to Figure 4 and Figure 5 , Figure 5 The horizontal axis shown in may correspond to the number of the second cooling fins 142 coupled to the second angle limiting member 130. Figure 5 The vertical axis shown in represents the flux of the radiant heat (e.g., the first heat quantity H1, the second heat quantity H2, the third heat quantity H3, the fourth heat quantity H4, and the fifth heat quantity H5) radiated from the second angle limiting member 130 into the air.

[0126] When the number of the second cooling fins 142 increases, the surface area where the second angle limiting member 130 radiates heat into the air can increase. As the surface area of the second angle limiting member 130 increases, the flux of the radiant heat radiated from the second angle limiting member 130 into the air can gradually increase. For example, in Figure 5 the graph shown, as the number of the second cooling fins 142 increases until the number of the second cooling fins 142 becomes 12, the flux of the radiant heat radiated from the second angle limiting member 130 into the air can gradually increase. When the number of the second cooling fins 142 is 12, 0.595 W (watt) of radiant heat can be radiated, which corresponds to the maximum value among the radiant heat radiated from the second angle limiting member 130 into the air.

[0127] On the other hand, as the number of the second cooling fins 142 increases, the distance between the second cooling fins 142 can decrease. In other words, the distance between the second cooling fins 142 adjacent to each other in the third direction DR3 can decrease. Since the second cooling fins 142 with a smaller surface temperature difference are arranged at a closer distance, each of the second cooling fins 142 can radiate a smaller amount of radiant heat into the air. For example, in Figure 5 the graph, as the number of the second cooling fins 142 increases to be greater than 12, the flux of the radiant heat radiated from the second angle limiting member 130 into the air can gradually decrease.

[0128] Figure 6 is a perspective view showing an evaporation device according to another embodiment of the present disclosure.

[0129] Referring to Figure 6 , compared with Figure 1 , the evaporation device 200 may not include the first heat exchange fin 152 and the second heat exchange fin 162. The first cooling fin 141 may be coupled to (e.g., directly coupled to) the side surface of the first heat exchanger 150, and the second cooling fin 142 may be coupled to (e.g., directly coupled to) the side surface of the second heat exchanger 160.

[0130] The temperatures of the first angle limiting member 120 and the second angle limiting member 130 can increase as the first angle limiting member 120 and the second angle limiting member 130 receive the heat radiated from the lower housing 110. The first angle limiting member 120 can transfer (e.g., directly transfer) the heat received from the lower housing 110 to the first heat exchanger 150 through the first cooling fin 141. The second angle limiting member 130 can transfer (e.g., directly transfer) the heat received from the lower housing 110 to the second heat exchanger 160 through the second cooling fin 142.

[0131] In a state where the temperature of the first heat exchanger 150 is increased due to the heat received from the lower housing 110, the refrigerant material input to the first refrigerant material inlet 153 may be discharged to the outside of the first heat exchanger 150 through the first refrigerant material outlet 154. As this process is repeated, the heat received by the first angle limiting member 120 from the lower housing 110 may be radiated into the air.

[0132] Similarly, in a state where the temperature of the second heat exchanger 160 is increased due to the heat received from the lower housing 110, the refrigerant material input to the second refrigerant material inlet 163 may be discharged to the outside of the second heat exchanger 160 through the second refrigerant material outlet. As this process is repeated, the heat received by the second angle limiting member 130 from the lower housing 110 may be radiated into the air.

[0133] According to the present disclosure, an evaporation device can be provided in which the emission angle limitation of the deposition material is not changed.

[0134] The above description is an example of the technical features of the present disclosure, and those skilled in the art to which the present disclosure pertains will be able to make various modifications and changes. Therefore, the embodiments disclosed above may be implemented individually or may be implemented in combination with each other.

[0135] Therefore, the embodiments disclosed in the present disclosure are not intended to limit the technical spirit of the present disclosure, but are used to describe the technical spirit of the present disclosure, and the scope of the technical spirit of the present disclosure is not limited by these embodiments. The protection scope of the present disclosure should be interpreted by the appended claims and should be interpreted as including all technical spirits within the equivalent scope in the scope of the present disclosure.

Claims

1. An evaporation device, characterized in that, The evaporation device includes: A lower housing that accommodates a deposition material; A nozzle that is mounted on the lower housing and emits the deposition material; A first angle limiting member that includes a first support member and a first angle limiting plate that is connected to the first support member and extends from the first support member in a direction that limits the angle of the deposition material emitted from the nozzle; A second angle limiting member that includes a second support member and a second angle limiting plate that is connected to the second support member and extends from the second support member in the direction that limits the angle of the deposition material emitted from the nozzle; A plurality of first cooling fins that are connected to a side surface of the first angle limiting member; and A first heat exchanger that has a plurality of first heat exchange fins, and each of the plurality of first heat exchange fins is located between adjacent first cooling fins among the plurality of first cooling fins.

2. The evaporation device according to claim 1, wherein: The first angle limiting member overlaps with the lower housing in one direction, and The plurality of first cooling fins extend from the first angle limiting member so as not to overlap with the lower housing in the direction.

3. The evaporation device according to claim 2, characterized in that, The plurality of first heat exchange fins overlap with the plurality of first cooling fins in the direction without directly contacting the plurality of first cooling fins.

4. The evaporation device according to claim 1, characterized in that, The plurality of first cooling fins and the plurality of first heat exchange fins are alternately arranged in the direction.

5. The evaporation device according to claim 1, wherein: Each of the first angle limiting plate and the second angle limiting plate extends in a first direction and a second direction intersecting the first direction, Each of the first support member and the second support member is fixed to the lower housing, extends in a third direction intersecting the first direction and the second direction, and supports the corresponding one of the first angle limiting plate and the second angle limiting plate, and The first angle limiting member and the second angle limiting member are spaced apart from each other in the first direction.

6. The evaporation device according to claim 1, characterized in that, The evaporation device further includes: A plurality of second cooling fins that are connected to a side surface of the second angle limiting member; and A second heat exchanger that has a plurality of second heat exchange fins, and each of the plurality of second heat exchange fins is located between adjacent second cooling fins among the plurality of second cooling fins.

7. An evaporation device, characterized in that, The evaporation device includes: A lower housing that accommodates a deposition material; A nozzle that is mounted on the lower housing and emits the deposition material; A first angle limiting member that includes a first support member and a first angle limiting plate that is connected to the first support member and extends from the first support member in a direction that limits the angle of the deposition material emitted from the nozzle; A second angle limiting member that includes a second support member and a second angle limiting plate that is connected to the second support member and extends from the second support member in the direction that limits the angle of the deposition material emitted from the nozzle; A plurality of first cooling fins that are connected to a side surface of the first angle limiting member; and The first heat exchanger is in contact with at least one of the plurality of first cooling fins.

8. The evaporation device according to claim 7, wherein the first angle limiting member overlaps with the lower housing in one direction, and the plurality of first cooling fins extend from the first angle limiting member so as not to overlap with the lower housing in the direction.

9. The evaporation device according to claim 7, wherein each of the first angle limiting plate and the second angle limiting plate extends in a first direction and a second direction intersecting the first direction, each of the first support member and the second support member is fixed to the lower housing, extends in a third direction intersecting the first direction and the second direction, and supports the corresponding one of the first angle limiting plate and the second angle limiting plate, and the first angle limiting member and the second angle limiting member are spaced apart from each other in the first direction.

10. The evaporation device according to claim 7, characterized in that, The evaporation device further includes: a plurality of second cooling fins connected to a side surface of the second angle limiting member; and a second heat exchanger in contact with at least one of the plurality of second cooling fins.

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