Temperature adjusting device and thin film deposition equipment

Abstract

The utility model provides a temperature adjusting device and thin film deposition equipment, the temperature adjusting device comprises a pipeline assembly and a temperature adjusting assembly, the pipeline assembly comprises a pipeline and a base, the pipeline is connected with a plasma generating device and a reaction chamber, the base is sleeved on the outer side of the pipeline, and a temperature adjusting chamber is formed between the base and the pipeline; the temperature adjusting assembly comprises a cold water device, the two ends of the cold water device communicate with the two sides of the temperature adjusting cavity correspondingly, and the cold water device and the temperature adjusting cavity form a cold water loop. Wherein when the cleaning work is executed, cold water flows along the cold water loop. According to the thin film deposition equipment, the temperature adjusting cavity is formed between the pipeline and the base, the two sides of the temperature adjusting cavity communicate with the cold water devices, so that the cold water devices and the temperature adjusting cavity form the cold water loop, and when the thin film deposition equipment starts cleaning work, cold water flows along the cold water loop, so that the pipeline and the base are cooled in the temperature adjusting cavity; the stability of thin film deposition is stabilized, so that the uniformity of the deposited thin film is ensured, and the product quality is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor production, in particular to a temperature regulating device and a thin film deposition apparatus. Background Art

[0002] With the development of intelligence, semiconductors are used more and more, and are applied in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion, etc. Most electronic products, such as the core units in computers, mobile phones or digital recorders, are extremely closely related to semiconductors. Among them, in semiconductor production technology, including thin film deposition technology, thin films are deposited on the surface of wafers to create micro-devices inside the chips.

[0003] In current thin film deposition apparatuses, since the time for executing the cleaning formula is too long, it is easy to cause the pipeline temperature to be too high. With the accumulation of the number of wafers, after a long time of in-depth cleaning, the uneven growth of aluminum fluoride built on the shower plate and the heating plate will occur, which will further cause the overall radio frequency impedance in the chamber to change, and finally cause the deposition rate of each part of the wafer to change. Technologically, it is manifested that the uniformity of the deposited thin film becomes worse as the number of wafers increases. Summary of the Utility Model

[0004] Embodiments of the utility model provide a temperature regulating device and a thin film deposition apparatus to reduce the pipeline temperature, ensure the uniformity of the deposited thin film during the cleaning process of the thin film deposition apparatus, and improve the product quality.

[0005] The utility model provides a temperature regulating device, which includes:

[0006] A pipeline assembly, including a pipeline and a base, the pipeline is connected to a plasma generating device and a reaction chamber, the base is sleeved outside the pipeline, and a temperature regulating chamber is formed between the base and the pipeline;

[0007] A temperature regulating assembly, including a cold water device, both ends of the cold water device are respectively communicated with both sides of the temperature regulating chamber, and a cold water circuit is formed by the cold water device and the temperature regulating chamber;

[0008] Wherein, when performing cleaning work, cold water flows along the cold water circuit.

[0009] In the temperature regulating device provided by the utility model, the temperature regulating assembly further includes a hot water device, both ends of the hot water device are respectively communicated with both sides of the temperature regulating chamber, and a hot water circuit is formed by the hot water device and the temperature regulating chamber;

[0010] Wherein, when performing deposition work, hot water flows along the hot water circuit.

[0011] In the temperature control device provided by the present utility model, the cold water device includes a cold water pipe, the hot water device includes a hot water pipe, the pipe assembly further includes two water delivery pipes, one ends of the two water delivery pipes are both connected to the cold water pipe and the hot water pipe, the other ends are connected to the base, and the two water delivery pipes are respectively communicated with two sides of the temperature control chamber.

[0012] In the temperature control device provided by the present utility model, the water delivery pipe includes a first connection section and a second connection section, the first connection section and the second connection section are vertically connected, one end of the first connection section is connected to the cold water pipe and the hot water pipe, and one end of the second connection section is connected to the base.

[0013] In the temperature control device provided by the present utility model, a reversing valve is fixedly provided at one end of the water delivery pipe away from the base, the cold water pipe and the hot water pipe are located on the side of the reversing valve away from the base, and the reversing valve is used to communicate the cold water pipe or the hot water pipe and the water delivery pipe.

[0014] In the temperature control device provided by the present utility model, both the cold water device and the hot water device further include a water delivery assembly, the water delivery assembly is connected to the cold water pipe or the hot water pipe, and is used to drive cold water or hot water to flow into the cold water pipe or the hot water pipe.

[0015] In the temperature control device provided by the present utility model, both the cold water pipe and the hot water pipe include a water inlet pipe and a water outlet pipe, one ends of the water inlet pipe and the water outlet pipe are respectively fixedly connected to the two water delivery pipes, and the other ends of the water inlet pipe and the water outlet pipe are respectively connected to two sides of the water delivery assembly.

[0016] In the temperature control device provided by the present utility model, the water delivery assembly includes a water collecting member, a first circulation pipe, a second circulation pipe and a three-way valve, one ends of the first circulation pipe and the second circulation pipe are respectively connected to two sides of the water collecting member, the other ends are respectively connected to two ends of the three-way valve, and the other end of the three-way valve is connected to the water inlet pipe.

[0017] In the temperature control device provided by the present utility model, the water inlet pipe and the water outlet pipe are flexible pipes; and / or, the water delivery pipe is a rigid pipe.

[0018] The present utility model further provides a thin film deposition device, which includes the temperature control device described in any one of the above.

[0019] The present utility model provides a temperature regulating device and a thin film deposition apparatus. The temperature regulating device includes a pipeline assembly and a temperature regulating assembly. The pipeline assembly includes a pipeline and a base. The pipeline is connected to a plasma generating device and a reaction chamber. The base is sleeved outside the pipeline, and a temperature regulating chamber is formed between the base and the pipeline. The temperature regulating assembly includes a cold water device. Two ends of the cold water device are respectively communicated with two sides of the temperature regulating chamber, and the cold water device and the temperature regulating chamber form a cold water loop. When cleaning work is performed, cold water flows along the cold water loop. In this application, the temperature regulating chamber is arranged between the pipeline and the base, and the cold water device is communicated with two sides of the temperature regulating chamber, so that the cold water device and the temperature regulating chamber form the cold water loop. When the thin film deposition apparatus starts cleaning work, cold water flows along the cold water loop, thereby cooling the pipeline and the base in the temperature regulating chamber to stabilize the stability of thin film deposition, ensuring the uniformity of the deposited thin film, and improving the product quality. Description of the Drawings

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0021] Figure 1 It is a top view of the temperature regulating device heating the pipeline in an embodiment of the present utility model;

[0022] Figure 2 It is a top view of the temperature regulating device cooling the pipeline in an embodiment of the present utility model;

[0023] Figure 3 It is a structural diagram of the temperature regulating device cooling the pipeline in an embodiment of the present utility model;

[0024] Figure 4 It is a structural diagram of the temperature regulating device heating the pipeline in an embodiment of the present utility model.

[0025] The reference numerals in the drawings are as follows:

[0026] 10. Pipeline assembly; 110. Pipeline; 120. Base; 130. Temperature regulating chamber; 140. Water delivery pipe; 141. Reversing valve; 20. Temperature regulating assembly; 210. Cold water device; 211. Cold water pipe; 220. Hot water device; 221. Hot water pipe; 231. Water collecting member; 232. First circulation pipe; 233. Second circulation pipe; 234. Three-way valve; 241. Water inlet pipe; 242. Water outlet pipe; 30. Plasma generating device. Detailed Embodiments

[0027] It should be noted that, without conflict, the embodiments in this application and the features in the embodiments can be combined with each other. Now, in conjunction with the accompanying drawings, the preferred embodiments of the present utility model will be described in detail.

[0028] Referring to Figures 1 to 4 As shown, it shows an embodiment of the temperature control device and the thin film deposition equipment of the present utility model. The temperature control device includes a pipeline 110 assembly 10 and a temperature control assembly 20. The pipeline 110 assembly 10 includes a pipeline 110 and a base 120. The pipeline 110 is connected to a plasma generating device 30 and a reaction chamber. The base 120 is sleeved outside the pipeline 110, and a temperature control chamber 130 is formed between the base 120 and the pipeline 110. The temperature control assembly 20 includes a cold water device 210. Both ends of the cold water device 210 are respectively communicated with both sides of the temperature control chamber 130, and the cold water device 210 and the temperature control chamber 130 form a cold water loop. Among them, when performing the cleaning work, cold water flows along the cold water loop.

[0029] Specifically, when the thick film process is running in the thin film deposition equipment, the wafer needs to be cleaned first and then deposited to form a thick film on the wafer surface. However, when the thin film deposition equipment performs the cleaning work, since the plasma runs in the pipeline 110 of the thin film deposition equipment for a long time, the temperature of the pipeline at the bottom of the plasma generating device is too high, resulting in uneven growth of aluminum fluoride built on the spray plate and the heating plate, and further resulting in a change in the overall radio frequency impedance in the chamber, making the quality of the wafer coating poor. Therefore, the temperature control device is fixedly arranged on the thin film deposition equipment to control the pipeline temperature of the thin film deposition equipment.

[0030] In this embodiment, the thin film deposition equipment includes a plasma generating device 30 for generating plasma. The plasma generating device 30 is arranged above the workbench. The thin film deposition equipment further includes two reaction chambers. The reaction chambers are arranged inside the workbench. One of the reaction chambers is used for cleaning the wafer, that is, the cleaning work of the thin film deposition equipment is mainly carried out in this reaction chamber, and the other reaction chamber is used for depositing the thin film, that is, the deposition work of the thin film deposition equipment is mainly carried out in the other reaction chamber. The plasma generating device 30 and the reaction chambers are communicated through the pipeline 110 assembly 10, that is, the plasma generating device generates plasma, and the plasma enters the reaction chambers along the pipeline 110 assembly 10.

[0031] More specifically, the pipeline 110 assembly 10 includes a pipeline 110 and a base 120. The pipeline 110 connects a plasma generating device 30 and a reaction chamber. The pipeline 110 is provided at the bottom of the plasma generating device 30 and is located inside the workbench. One end of the pipeline 110 is connected to the bottom end of the plasma generating device 30, and the other end extends downward and then extends toward the two reaction chambers respectively and is connected to the two reaction chambers respectively. Where the pipeline 110 extends toward the two reaction chambers respectively forms a bifurcation of the pipeline 110; the base 120 is sleeved outside the pipeline 110, and the base 120 is located at the bifurcation of the pipeline 110. A temperature control chamber 130 is formed between the base 120 and the pipeline 110. The temperature control chamber 130 is used to adjust the temperature of the pipeline 110. The base 120 and the pipeline 110 are of an integral structure.

[0032] The temperature control device further includes a temperature control component 20. The temperature control component 20 includes a cold water device 210. Two ends of the cold water device 210 are respectively communicated with two sides of the temperature control chamber 130, so that the cold water device 210 and the temperature control chamber 130 form a cold water loop. The cold water device 210 is used to divert cold water into the temperature control chamber 130 and make the cold water circulate in the cold water device 210 and the temperature control chamber 130.

[0033] Refer to Figure 2 and Figure 3 As shown, when the thin film deposition equipment performs a cleaning operation, cold water flows in the cold water device 210 and the temperature control chamber 130 along the cold water loop, thereby cooling the base 120 and the pipeline 110 inside the base 120 to reduce the temperature of the pipeline 110, and further reducing the temperature of the plasma inside the pipeline 110, so as to avoid the plasma having too high a temperature. When the thin film deposition equipment performs a cleaning operation, it plays a role in inhibiting the growth of aluminum fluoride, making the growth of aluminum fluoride uniform, so that the rate of wafer thin film deposition remains stable, and the uniformity of the deposited thin film is high, so as to improve the product quality; on the other hand, the cold water reduces the temperature of the pipeline 110 and the base 120, thereby avoiding the phenomenon of corrosion of the rubber ring inside the thin film deposition equipment and improving the service life of the rubber ring; at the same time, it avoids the problems that the process performance stability of the thin film deposition equipment is affected due to the too high temperature at the bottom of the plasma generating device 30, and the maintenance cycle of the thin film deposition equipment is shortened and the maintenance cost is high.

[0034] In this application, a temperature control chamber 130 is provided between the pipeline 110 and the base 120, and a cold water device 210 is communicated with both sides of the temperature control chamber 130, so that the cold water device 210 and the temperature control chamber 130 form a cold water circuit. When the thin film deposition equipment starts the cleaning work, cold water flows along the cold water circuit, thereby cooling the pipeline 110 and the base 120 in the temperature control chamber 130 to stabilize the stability of thin film deposition, so as to ensure the uniformity of the deposited thin film and improve the product quality.

[0035] In one embodiment, referring to Figures 1 to 4 As shown, the temperature control component 20 further includes a hot water device 220. Both ends of the hot water device 220 are communicated with both sides of the temperature control chamber 130, and the hot water device 220 and the temperature control chamber 130 form a hot water circuit. Among them, when performing the deposition work, hot water flows along the hot water circuit. Specifically, the temperature control component 20 further includes a hot water device 220, and the hot water device 220 is used to divert hot water to the temperature control chamber 130 to heat the pipeline 110; both ends of the hot water device 220 are communicated with both sides of the temperature control chamber 130 respectively, so that the hot water device 220 and the temperature control chamber 130 form a hot water circuit, and the hot water device 220 is used to divert hot water into the temperature control chamber 130 and make the hot water circulate in the hot water device 220 and the temperature control chamber 130.

[0036] Referring to Figure 1 and Figure 4 As shown, when the thin film deposition equipment performs the deposition work, hot water flows in the hot water device 220 and the temperature control chamber 130 along the hot water circuit, thereby heating the base 120 and the pipeline 110 inside the base 120 to increase the temperature of the pipeline 110, and further increase the temperature of the plasma inside the pipeline 110, so as to avoid the low temperature of the plasma. When the thin film deposition equipment performs the deposition work, during the thin film deposition process, the plasma generating device 30 is in a non-working state. Continuing to pass cold water will reduce the overall temperature of the pipeline 110 and affect the vaporization state of the liquid source. At this time, the thin film deposition equipment introduces a heat source at a certain temperature during the thin film deposition process, that is, the hot water circulates in the hot water circuit to heat the pipeline 110, ensure the stability of the overall temperature of the pipeline 110, make the deposition process stable, and improve the product quality.

[0037] In a specific embodiment, referring to Figures 1 to 4As shown, the cold water device 210 includes a cold water pipe 211, the hot water device 220 includes a hot water pipe 221, the pipe 110 assembly 10 further includes two water delivery pipes 140. One ends of the two water delivery pipes 140 are both connected to the cold water pipe 211 and the hot water pipe 221, and the other ends are connected to the base 120. And the two water delivery pipes 140 are respectively communicated with two sides of the temperature control chamber 130. Specifically, the cold water device 210 includes a cold water pipe 211, the hot water device 220 includes a hot water pipe 221. The cold water pipe 211 and the hot water pipe 221 are respectively used for guiding cold water or hot water, that is, the cold water pipe 211 and the hot water pipe 221 are respectively used for inputting cold water or hot water into the temperature control chamber 130 and outputting the cold water or hot water in the temperature control chamber 130. The pipe 110 assembly 10 further includes two water delivery pipes 140. One ends of the two water delivery pipes 140 are both fixedly connected to the cold water pipe 211 and the hot water pipe 221. The other ends of the two water delivery pipes 140 are both fixedly connected to two sides of the base 120. That is, the ends of the water delivery pipes 140 connected to the cold water pipe 211 and the hot water pipe 221 are located above the workbench, and the other ends of the water delivery pipes 140 connected to the base 120 are located inside the workbench. The water delivery pipes 140 are used for connecting the cold water pipe 211, the hot water pipe 221 and the base 120. And the cold water pipe 211 or the hot water pipe 221 is communicated with the temperature control chamber 130, so that the cold water or hot water in the cold water pipe 211 or the hot water pipe 221 flows to the temperature control chamber 130 through the water delivery pipes 140.

[0038] In this application, the cold water pipe 211, the hot water pipe 221 and the temperature control chamber 130 are communicated through the water delivery pipes 140, which improves the structural stability of the temperature control device. And the connection parts of the cold water pipe 211, the hot water pipe 221 and the water delivery pipes 140 are located above the workbench, and the other ends of the water delivery pipes 140 are fixedly connected to the base 120 inside the workbench. Therefore, when connecting the cold water pipe 211, the hot water pipe 221 and the base 120, it is only necessary to connect the cold water pipe 211 and the hot water pipe 221 to the water delivery pipes 140. The connection method is simple and fast, and the connection is stable.

[0039] In a specific embodiment, the water delivery pipe 140 includes a first connection section and a second connection section (not shown in the figure). The first connection section and the second connection section are perpendicularly connected. One end of the first connection section is connected to the cold water pipe 211 and the hot water pipe 221, and one end of the second connection section is connected to the base 120. Specifically, one end of the water delivery pipe 140 is fixedly connected to the cold water pipe 211 and the hot water pipe 221, and the other end of the water delivery pipe 140 is fixedly connected to the base 120. One end of the water delivery pipe 140 is located above the workbench, and the other end of the water delivery pipe 140 is located inside the workbench. The water delivery pipe 140 includes a first connection section and a second connection section. The first connection section and the second connection section are perpendicularly connected, and one end of the first connection section is fixedly connected to the cold water pipe 211 and the hot water pipe 221. One end of the second connection section is fixedly connected to the base 120, that is, the second connection section is fixedly connected to the base 120 parallel to the workbench, and the first connection section extends perpendicularly to the second connection section above the workbench to be fixedly connected to the cold water pipe 211 and the hot water pipe 221. Cold water or hot water flows from the cold water pipe 211 or the hot water pipe 221 to the first connection section and the second connection section and then into the temperature adjustment chamber 130. The water delivery pipe 140 has a 90° structure to connect the base 120, the cold water pipe 211, and the hot water pipe 221. The structure of the water delivery pipe 140 is stable, and it is convenient to arrange one end of the water delivery pipe 140 inside the workbench and the other end outside the workbench, so that the connection structure of the cold water pipe 211, the hot water pipe 221, the base 120, and the water delivery pipe 140 has high stability, thereby improving the structural stability of the temperature adjustment device.

[0040] In one embodiment, referring to Figures 1 to 4 as shown, a reversing valve 141 is fixedly provided at one end of the water delivery pipe 140 away from the base 120. The cold water pipe 211 and the hot water pipe 221 are located on the side of the reversing valve 141 away from the base 120. The reversing valve 141 is used to connect the cold water pipe 211 or the hot water pipe 221 and the water delivery pipe 140. Specifically, one end of the water delivery pipe 140 away from the base 120 is respectively connected to the cold water pipe 211 and the hot water pipe 221. Therefore, the cold water pipe 211 and the hot water pipe 221 are connected to the water delivery pipe 140. A reversing valve 141 is fixedly provided at one end of the water delivery pipe 140 away from the base 120. The cold water pipe 211 and the hot water pipe 221 are located on the side of the reversing valve 141 away from the base 120. Through the reversing valve 141, it is possible to control the connection between the cold water pipe 211 or the hot water pipe 221 and the water delivery pipe 140.

[0041] Referring toFigure 2 and Figure 3 As shown in Figure 3 , when the thin film deposition device performs cleaning work, the reversing valve 141 opens the communication port between the cold water pipe 211 and the water delivery pipe 140, and closes the communication port between the hot water pipe 221 and the water delivery pipe 140, so that cold water flows along the cold water pipe 211 to the water delivery pipe 140 and then to the temperature control chamber 130, thereby cooling the pipe 110; when the thin film deposition device performs deposition work, the reversing valve 141 opens the communication port between the hot water pipe 221 and the water delivery pipe 140, and closes the communication port between the cold water pipe 211 and the water delivery pipe 140, so that hot water flows along the hot water pipe 221 to the water delivery pipe 140 and then to the temperature control chamber 130, thereby heating the pipe 110.

[0042] In this embodiment, the reversing valve 141 is fixedly provided at one end of the water delivery pipe 140 away from the base 120. By controlling the connection between the cold water pipe 211 and the hot water pipe 221 and the water delivery pipe 140 through the reversing valve 141, one water delivery pipe 140 can guide cold water or hot water to the temperature control chamber 130, saving the production cost of the temperature control device and the occupied space of the temperature control device. The temperature control device has high integration and high structural stability.

[0043] In a specific embodiment, referring to Figures 1 to 4 As shown in Figures 1 to 4 , both the cold water device 210 and the hot water device 220 further include a water delivery component, and the water delivery component is connected to the cold water pipe 211 or the hot water pipe 221 for driving cold water or hot water to flow to the cold water pipe 211 or the hot water pipe 221. Specifically, both the cold water device 210 and the hot water device 220 further include a water delivery component. The water delivery component is connected to the cold water pipe 211, or the water delivery component is connected to the hot water pipe 221. That is, the water delivery component of the cold water device 210, the cold water pipe 211 and the base 120 form the cold water circuit, and the water delivery component of the hot water device 220, the hot water pipe 221 and the base 120 form the hot water circuit. The water delivery component is used to drive cold water or hot water to flow to the cold water pipe 211 or the hot water pipe 221, so that cold water or hot water can flow in the cold water circuit or the hot water circuit. The structures of the cold water device 210 and the hot water device 220 are simple, and cold water or hot water circulates in the cold water circuit or the hot water circuit to save resources.

[0044] More specifically, the water delivery component includes a water storage member and a water pump. The water storage member is used to store cold water or hot water, and the water pump pumps the water in the water storage member into the cold water pipe 211 or the hot water pipe 221.

[0045] In one embodiment, referring to Figures 1 to 4 As shown, both the cold water pipe 211 and the hot water pipe 221 include a water inlet pipe 241 and a water outlet pipe 242. One end of the water inlet pipe 241 and the water outlet pipe 242 are respectively fixedly connected to the two water delivery pipes 140, and the other ends of the water inlet pipe 241 and the water outlet pipe 242 are respectively connected to both sides of the water delivery assembly. Specifically, both the cold water pipe 211 and the hot water pipe 221 include a water inlet pipe 241 and a water outlet pipe 242. One end of the water inlet pipe 241 is connected to one end of the water delivery assembly, and the other end is connected to one of the water delivery pipes 140. One end of the water outlet pipe 242 is connected to the other water delivery pipe 140, and the other end is connected to the other end of the water delivery assembly. That is, one end of the water inlet pipe 241 and the water outlet pipe 242 are respectively fixedly connected to the two water delivery pipes 140, so that the water inlet pipe 241, the water outlet pipe 242 and the temperature adjustment chamber 130 are communicated. The other ends of the water inlet pipe 241 and the water outlet pipe 242 are respectively connected to both sides of the water delivery assembly, so that the water delivery assembly, the water inlet pipe 241, the water delivery pipe 140, the base 120 and the water outlet pipe 242 form the cold water circuit or the hot water circuit, so that cold water or hot water circulates along the cold water circuit or the hot water circuit. The cold water device 210 and the hot water device 220 have a simple structure, high stability and low production cost.

[0046] In a specific embodiment, referring to Figures 1 to 4 As shown, the water delivery assembly includes a water collection member 231, a first circulation pipe 232, a second circulation pipe 233 and a three-way valve 234. One end of the first circulation pipe 232 and the second circulation pipe 233 are respectively connected to both sides of the water collection member 231, and the other ends are respectively connected to both ends of the three-way valve 234. The other end of the three-way valve 234 is connected to the water inlet pipe 241. Specifically, the water delivery assembly is used to drive cold water or hot water to flow to the cold water pipe 211 or the hot water pipe 221; the water delivery assembly includes a water collection member 231, a first circulation pipe 232, a second circulation pipe 233 and a three-way valve 234. The water collection member 231 is used to store cold water or hot water and drive cold water or hot water to flow; one end of the first circulation pipe 232 and the second circulation pipe 233 are respectively fixedly connected to both sides of the water collection member 231, the other ends of the first circulation pipe 232 and the second circulation pipe 233 are respectively fixedly connected to both ends of the three-way valve 234, and the other end of the three-way valve 234 is fixedly connected to the water inlet pipe 241. The three-way valve 234 is used to control the communication of the first circulation pipe 232, the second circulation pipe 233 and the water inlet pipe 241.

[0047] Referring to Figure 2 andFigure 3 As shown, when the thin film deposition equipment performs cleaning work, the three-way valve 234 of the hot water device 220 closes the port connected to the water inlet pipe 241 and the three-way valve 234, opens the port connected to the second circulation pipe 233 and the three-way valve 234, and opens the port connected to the first circulation pipe 232 and the three-way valve 234, so that hot water circulates in the water collecting member 231, the first circulation pipe 232 and the second circulation pipe 233, that is, the hot water does not flow to the water delivery pipe 140; at the same time, the three-way valve 234 of the cold water device 210 closes the port connected to the first circulation pipe 232 and the three-way valve 234, opens the port connected to the second circulation pipe 233 and the three-way valve 234, and opens the port connected to the water inlet pipe 241 and the three-way valve 234, so that cold water circulates in the direction from the water collecting member 231 along the second circulation pipe 233, the water inlet pipe 241, the water delivery pipe 140 and the water outlet pipe 242 back to the water collecting member 231, so as to cool the pipeline 110 and the base 120, that is, at this time the hot water device 220 is in a closed state, the cold water device 210 is in an open state, and cold water flows from the water collecting member 231 into the second circulation pipe 233 to the water inlet pipe 241 and the water delivery pipe 140, and flows to the temperature control chamber 130, and finally flows from the temperature control chamber 130 to the water outlet pipe 242 and finally to the water collecting member 231, so as to circulate.

[0048] Refer to Figure 1 and Figure 4As shown, when the film deposition equipment performs deposition work, the three-way valve 234 of the cold water device 210 closes the port connected to the water inlet pipe 241 and the three-way valve 234, opens the port connected to the second circulation pipe 233 and the three-way valve 234, and opens the port connected to the first circulation pipe 232 and the three-way valve 234, so that cold water circulates in the water collecting member 231, the first circulation pipe 232 and the second circulation pipe 233, that is, the cold water does not flow to the water delivery pipe 140; at the same time, the three-way valve 234 of the hot water device 220 closes the port connected to the first circulation pipe 232 and the three-way valve 234, opens the port connected to the second circulation pipe 233 and the three-way valve 234, and opens the port connected to the water inlet pipe 241 and the three-way valve 234, so that hot water circulates in the direction from the water collecting member 231 along the second circulation pipe 233, the water inlet pipe 241, the water delivery pipe 140 and the water outlet pipe 242 and then back to the water collecting member 231, so as to heat up the pipeline 110 and the base 120 with hot water. That is, at this time, the cold water device 210 is in the closed state, the hot water device 220 is in the open state, and the hot water flows from the water collecting member 231 into the second circulation pipe 233 to the water inlet pipe 241 and the water delivery pipe 140, and flows to the temperature control chamber 130, and finally flows from the temperature control chamber 130 to the water outlet pipe 242 and finally to the water collecting member 231, so as to circulate.

[0049] In this application, by setting the first circulation pipe 232, the second circulation pipe 233 and the three-way valve 234, cold water or hot water can circulate in the water delivery assembly. Thus, when the cold water device 210 is controlled to be closed, the hot water device 220 circulates along the hot water circuit; when the hot water device 220 is controlled to be closed, the cold water device 210 circulates along the cold water circuit. The structures of the cold water device 210 and the hot water device 220 are simple, and the control accuracy is high, and the temperature control function of cooling or heating the base 120 can be realized.

[0050] In an embodiment, the water inlet pipe 241 and the water outlet pipe 242 are flexible hoses; and / or, the water delivery pipe 140 is a rigid pipe. Specifically, the water inlet pipe 241 and the water outlet pipe 242 are arranged above the workbench. A part of the water delivery pipe 140 is located inside the workbench, and the other part is located above the workbench. In this embodiment, the water inlet pipe 241 and the water outlet pipe 242 are made of flexible hose material, so that the positions of the water inlet pipe 241 and the water outlet pipe 242 are convenient to set and the applicability is higher; and / or, the water delivery pipe 140 is made of rigid pipe material. The water delivery pipe 140 has high hardness, so that the connection between the water inlet pipe 241 and the water outlet pipe 242 and the water delivery pipe 140 is more stable and the structure is more reliable.

[0051] This embodiment also provides a thin film deposition device (not shown in the figure). The thin film deposition device includes a temperature regulating device, and the temperature regulating device can adopt any one of the temperature regulating devices provided by the present utility model. Since the specific structure and working principle of the temperature regulating device have been introduced in detail in the previous description, for the sake of simplicity of the description, it will not be repeated here.

[0052] In the thin film deposition device of this embodiment, due to the adoption of the temperature regulating device provided by the present utility model, the temperature of the pipeline 110 can be adjusted to control the temperature of the plasma, so that when the thin film deposition device performs the cleaning work, the temperature of the pipeline 110 and the base 120 can be reduced, avoiding the problem that the growth of aluminum fluoride on the spray plate and the heating plate in the chamber affects the process repeatability due to the long-term operation of the thin film deposition device. Finally, the quality of the products produced by the thin film deposition device is improved. At the same time, the equipment maintenance cycle can be extended on the thin film deposition device, the production capacity can be increased, and the temperature can be reduced to protect the sealing rubber ring of the thin film deposition device, improving the service life of related hardware; and during the thin film deposition process, the plasma generating device 30 is in a non-working state, and continuously passing cold water will reduce the overall temperature of the pipeline 110, affecting the vaporization state of the liquid source. At this time, a heat source at a certain temperature is introduced during the film deposition process of the equipment to ensure the stability of the overall temperature of the pipeline 110.

[0053] As mentioned above, the above is only the specific implementation manner of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should be covered within the protection scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.

Claims

1. A temperature control device, characterized in that, Comprising: A pipeline component, including a pipeline and a base. The pipeline is connected to a plasma generating device and a reaction chamber. The base is sleeved outside the pipeline, and a temperature control chamber is formed between the base and the pipeline. A temperature control component, including a cold water device. Both ends of the cold water device are respectively communicated with both sides of the temperature control chamber, and a cold water circuit is formed by the cold water device and the temperature control chamber. Wherein, when performing cleaning work, cold water flows along the cold water circuit.

2. The temperature control device according to claim 1, wherein The temperature control component further includes a hot water device. Both ends of the hot water device are respectively communicated with both sides of the temperature control chamber, and a hot water circuit is formed by the hot water device and the temperature control chamber. Wherein, when performing deposition work, hot water flows along the hot water circuit.

3. The temperature regulating device according to claim 2, characterized in that, The cold water device includes a cold water pipeline, and the hot water device includes a hot water pipeline. The pipeline component further includes two water delivery pipes. One ends of the two water delivery pipes are both connected to the cold water pipeline and the hot water pipeline, and the other ends are connected to the base, and the two water delivery pipes are respectively communicated with both sides of the temperature control chamber.

4. The temperature regulating device according to claim 3, wherein The water delivery pipe includes a first connection section and a second connection section. The first connection section and the second connection section are perpendicularly connected. One end of the first connection section is connected to the cold water pipeline and the hot water pipeline, and one end of the second connection section is connected to the base.

5. The temperature control device according to claim 3, characterized in that, A reversing valve is fixedly provided at the end of the water delivery pipe away from the base. The cold water pipeline and the hot water pipeline are located on the side of the reversing valve away from the base. The reversing valve is used to connect the cold water pipeline or the hot water pipeline and the water delivery pipe.

6. The temperature regulating device according to claim 3, characterized in that, Both the cold water device and the hot water device further include a water delivery assembly. The water delivery assembly is connected to the cold water pipeline or the hot water pipeline and is used to drive cold water or hot water to flow into the cold water pipeline or the hot water pipeline.

7. The temperature control device according to claim 6, characterized in that, Both the cold water pipeline and the hot water pipeline include a water inlet pipe and a water outlet pipe. One ends of the water inlet pipe and the water outlet pipe are respectively fixedly connected to the two water delivery pipes, and the other ends of the water inlet pipe and the water outlet pipe are respectively connected to both sides of the water delivery assembly.

8. The temperature control device according to claim 7, characterized in that, The water delivery assembly includes a water collecting member, a first circulation pipe, a second circulation pipe and a three-way valve. One ends of the first circulation pipe and the second circulation pipe are respectively connected to both sides of the water collecting member, and the other ends are respectively connected to both ends of the three-way valve. The other end of the three-way valve is connected to the water inlet pipe.

9. The temperature regulating device according to any one of claims 7-8, characterized in that, The water inlet pipe and the water outlet pipe are flexible hoses; and / or, the water delivery pipe is a rigid pipe.

10. A thin film deposition device, characterized in that, Including the temperature control device according to any one of claims 1-9.

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