Wafer supporting seat position detection structure and semiconductor production equipment

Abstract

The utility model discloses a wafer supporting seat position detection structure and semiconductor production equipment. The detection structure is matched with a motor shaft used for driving a wafer supporting seat to rotate, and the detection structure comprises a separation blade arranged on the motor shaft and a photoelectric detection assembly. The blocking piece synchronously rotates along with the motor shaft, and the photoelectric detection assembly adopts a light emitter and a light receiver. The optical transmitter and the optical receiver are arranged in a non-contact mode, a space between the optical transmitter and the optical receiver is used for allowing a blocking piece to pass through, when the blocking piece is located between the optical transmitter and the optical receiver, an optical path between the optical transmitter and the optical receiver is blocked, and it is judged that the wafer supporting base is located at the original point position. The utility model has double detection functions, and can conveniently and accurately control the wafer supporting seat to stop at the original position, so as to facilitate the proceeding of subsequent loading and unloading processes.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production, in particular to a wafer support position detection structure, and also relates to a semiconductor production device provided with the detection structure. Background Art

[0002] In the thin film deposition process of semiconductors, a wafer is placed in a reaction chamber through a wafer support. One side of the reaction chamber is a reaction gas inlet, and the other side is an exhaust port. The reaction gas reacts on the surface of the wafer to form a thin film. To ensure uniform reaction, the wafer needs to be driven to rotate to achieve uniform thickness of the deposition layer. Currently, it is common to use a motor to drive the rotation of the wafer support shaft to drive the wafer to rotate. The motor is usually a servo motor, and the servo motor is provided with an encoder disk for measuring the rotation speed and angle of the motor shaft. However, how to ensure that the servo motor returns to the origin position (for example, the set origin position is the position where the wafer positioning notch side is aligned with the extraction window, so that the manipulator can reach in to extract the wafer or the wafer support frame) when starting (such as restarting after power-off) is an important issue. Summary of the Utility Model

[0003] In view of the above-mentioned disadvantages of the prior art, the purpose of the present utility model is to provide a stop position control structure for a semiconductor production device to conveniently and accurately control the wafer support to stop at the origin position for subsequent operations such as loading and unloading processes.

[0004] A wafer support position detection structure is cooperatively arranged with a motor shaft for driving the rotation of the wafer support;

[0005] The detection structure includes:

[0006] A stop piece mounted on the motor shaft, which rotates synchronously with the motor shaft; and

[0007] An optoelectronic detection component, which is arranged non-contact with the stop piece;

[0008] Wherein, when the stop piece passes through the optoelectronic detection component, it is determined that the wafer support is at the origin position.

[0009] In one embodiment, the stop piece is fixedly installed at a corresponding position on the motor shaft, and the stop piece is perpendicular to the motor shaft.

[0010] In one embodiment, the optoelectronic detection component is located at a corresponding position on the motor shaft.

[0011] In one embodiment, the optoelectronic detection component adopts a light emitter and a light receiver.

[0012] Further, the optical transmitter and the optical receiver are arranged in a non-contact manner, and the space between the optical transmitter and the optical receiver is for the passing of the baffle.

[0013] Still further, when the baffle passes through the photoelectric detection component, the baffle, the optical transmitter and the optical receiver are vertically aligned, and the optical path between the optical transmitter and the optical receiver is blocked, determining that the wafer support is in the origin position.

[0014] In one embodiment, the detection component uses a magnetic switch.

[0015] In one embodiment, the detection component uses a proximity sensor.

[0016] A semiconductor production device includes a reaction chamber, a wafer support located in the reaction chamber, a driving mechanism for controlling the rotational movement of the wafer support, and the above-mentioned wafer support position detection structure.

[0017] Compared with the prior art, the beneficial effects of the present utility model are as follows: It can detect whether the wafer support stops at the origin position. In addition, in actual work, only when the motor shaft stops and the detection signal of the photoelectric detection component is received can it be determined that the wafer support has stopped at the origin position, so that the next process can be carried out. It has a dual detection function and can conveniently and accurately control the wafer support to stop at the origin position for subsequent processes such as loading and unloading. Description of the Drawings

[0018] In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only exemplary, and for those of ordinary skill in the art, without creative efforts, other implementation drawings can also be obtained according to the provided drawings.

[0019] The structures, ratios, sizes, etc. shown in this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the limited conditions for the implementation of the present utility model. Therefore, they do not have technical essence. Any modification of the structure, change of the ratio relationship or adjustment of the size, without affecting the effects that the present utility model can produce and the purposes that can be achieved, should still fall within the scope covered by the technical content disclosed by the present utility model.

[0020] Figure 1 Shown is a schematic diagram of a wafer support position detection structure provided by Embodiment 1 of the present utility model.

[0021] Figure 2 Shown as Figure 1Schematic diagram of the wafer support base located at the origin position.

[0022] Figure 3 The figure shows a schematic diagram of a wafer support base position detection structure provided by Embodiment 2 of the present utility model.

[0023] Figure 4 The figure shows a schematic diagram of a wafer support base position detection structure provided by Embodiment 3 of the present utility model.

[0024] Figure 5 The figure shows a schematic diagram of a semiconductor production device provided by Embodiment 4 of the present utility model.

[0025] Main element symbol description

[0026] 1. Motor shaft; 2. Retaining piece; 3. Photoelectric detection component; 4. Light emitter; 5. Light receiver; 6. Reaction chamber; 7. Magnetic switch; 8. Proximity sensor.

[0027] The above main element symbol description further elaborates on the present utility model in conjunction with the accompanying drawings and specific embodiments. Specific embodiments

[0028] The following specific embodiments illustrate the implementation manners of the present utility model. Those skilled in the art can easily understand other advantages and effects of the present utility model from the content disclosed in this specification. Obviously, the described embodiments are part of the embodiments of the present utility model, rather than all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0029] Embodiment 1

[0030] Please refer to Figure 1 , this embodiment provides a wafer support base position detection structure, which is cooperatively arranged with the motor shaft 1 for driving the rotation of the wafer support base. The detection structure includes a retaining piece 2 installed on the motor shaft 1 and a photoelectric detection component 3 arranged in a non-contact manner with the retaining piece 2.

[0031] The retaining piece 2 rotates synchronously with the motor shaft 1. The retaining piece 2 is fixedly installed at a corresponding position on one side of the motor shaft 1, and the retaining piece 2 is perpendicular to the motor shaft 1. Among them, when the retaining piece 2 passes through the photoelectric detection component 3, it is determined that the wafer support base is in the origin position.

[0032] The photoelectric detection component 3 uses a light emitter 4 and a light receiver 5. The light emitter 4 and the light receiver 5 are arranged in a non-contact manner, and the space between the light emitter 4 and the light receiver 5 is used for the retaining piece 2 to pass through.

[0033] When the baffle 2 passes through the photoelectric detection component 3, the baffle 2, the light emitter 4 and the light receiver 5 are vertically aligned, and the optical path between the light emitter 4 and the light receiver 5 is blocked, determining that the wafer support is at the origin position. In this embodiment, the origin position of the motor shaft 1 is set based on the photoelectric detection component 3, so as to ensure that the wafer support stops at the origin position when stopped for subsequent processes.

[0034] Please refer to Figure 2 , when the baffle 2 is located between the light emitter 4 and the light receiver 5, the optical path between the light emitter 4 and the light receiver 5 is blocked, determining that the wafer support is at the origin position. In this embodiment, the position where the wafer positioning notch side of the wafer support is aligned with the extraction window is taken as an example of the origin position. When the baffle 2 rotates through the photoelectric detection component 3, at the position where the optical path between the light emitter 4 and the light receiver 5 is blocked, since the light receiver 5 cannot receive the light emitted by the light emitter 4, the detection signal is not successfully measured, thereby determining that the motor shaft 1 has rotated to the origin position, that is, the wafer support stops at the position where the wafer positioning notch side is aligned with the extraction window.

[0035] Embodiment 2

[0036] Please refer to Figure 3 , this embodiment provides a wafer support position detection structure, and the difference from Embodiment 1 is that: in this embodiment, a magnetic switch 7 is used as the photoelectric detection component 3 to detect whether the motor shaft 1 is at the origin position. The magnetic switch 7 is in non-contact cooperation with the magnet, and a magnetic switch signal is formed through magnetic induction, so as to determine whether the baffle 2 is located between the magnetic switch 7 and the magnet, and thus indirectly determine whether the wafer support is at the origin position.

[0037] Embodiment 3

[0038] Please refer to Figure 4 , this embodiment provides a wafer support position detection structure, and the difference from Embodiment 1 is that: in this embodiment, a proximity sensor 8 is used as the photoelectric detection component 3 to detect whether the motor shaft 1 is at the origin position. The proximity sensor 8 is in non-contact cooperation with the magnet, and a magnetic switch signal is formed through magnetic induction, so as to determine whether the baffle 2 is located between the proximity sensor 8 and the magnet, and thus indirectly determine whether the wafer support is at the origin position.

[0039] In summary, the wafer support position detection structure of this embodiment has the following advantages: it can detect whether the wafer support stops at the origin position. In addition, in actual work, only when the motor shaft 1 stops and the detection signal of the photoelectric detection component 3 is received can it be determined that the wafer support has stopped at the origin position, so that the next process can be carried out. It has a dual detection function and can conveniently and accurately control the wafer support to stop at the origin position for subsequent processes such as loading and unloading operations.

[0040] Embodiment 4

[0041] Please continue to refer to Figure 5 , this embodiment provides a semiconductor manufacturing apparatus, which includes a reaction chamber 6, a wafer support located in the reaction chamber 6, a drive mechanism for controlling the rotational movement of the wafer support, and a wafer support position detection structure as described in Embodiment 1.

[0042] The semiconductor manufacturing apparatus of this embodiment can ensure that the servo motor returns to the origin position when restarted after a power failure. At this time, the wafer support stops at a position where the side of the wafer positioning notch is aligned with the extraction window, so that the manipulator can extend into the wafer support to extract the wafer or the wafer support frame.

[0043] For the naming of each component involved, the function described in the specification is used as the naming standard, and it is not limited by the specific nouns used in the present invention. Those skilled in the art can also choose other nouns to describe the names of the various components of the present invention.

Claims

1. A wafer support position detection structure, which is cooperatively arranged with a motor shaft (1) for driving the rotation of the wafer support; It is characterized in that The detection structure includes: A baffle (2) installed on the motor shaft (1), which rotates synchronously with the motor shaft (1); and An optoelectronic detection component (3), which is arranged in a non-contact manner with the baffle (2); Wherein, when the baffle (2) passes through the optoelectronic detection component (3), it is determined that the wafer support is in the origin position.

2. The position detection structure of a wafer support according to claim 1, wherein The baffle (2) is fixedly installed at a corresponding position on one side of the motor shaft (1), and the baffle (2) is perpendicular to the motor shaft (1).

3. The position detection structure of a wafer support according to claim 1, wherein The optoelectronic detection component (3) is located at a corresponding position on one side of the motor shaft (1).

4. A wafer support position detection structure according to claim 1, characterized in that, The optoelectronic detection component (3) uses a light emitter (4) and a light receiver (5).

5. The wafer support position detection structure according to claim 4, characterized in that The light emitter (4) and the light receiver (5) are arranged in a non-contact manner, and the space between the light emitter (4) and the light receiver (5) is used for the baffle (2) to pass through.

6. The position detection structure of a wafer support according to claim 5, characterized in that When the baffle (2) passes through the optoelectronic detection component (3), the baffle (2), the light emitter (4) and the light receiver (5) are vertically aligned, and the optical path between the light emitter (4) and the light receiver (5) is blocked, and it is determined that the wafer support is in the origin position.

7. A wafer support position detection structure according to claim 1, characterized in that, The detection component (3) uses a magnetic switch (7).

8. The position detection structure of a wafer support according to claim 1, characterized in that, The detection component (3) uses a proximity sensor (8).

9. A semiconductor manufacturing device, characterized in that, It includes a reaction chamber (6), a wafer support located in the reaction chamber (6), a driving mechanism for controlling the rotational movement of the wafer support, and a wafer support position detection structure according to any one of claims 1 to 8.

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