Ultralow-temperature proportional valve with protection function

Abstract

The utility model discloses an ultralow-temperature proportional valve with a protection function, and relates to the technical field of valves. The proportional valve comprises a proportional valve body, a first flow guide pipe and a second flow guide pipe which are used for medium circulation are arranged on the surface of the proportional valve body, a distance adjusting assembly is installed on the top face of the proportional valve body, and a semiconductor heating ceramic piece is attached to the surface of the proportional valve body. The surface of the distance adjusting assembly is provided with a positioning mechanism used for limiting the semiconductor heating ceramic chip, the distance adjusting assembly comprises a mounting box, the mounting box is fixedly connected with the proportional valve body, and the inner wall of the mounting box is rotationally connected with a double-thread screw; the effect of conveniently heating the pipeline surface of the ultralow-temperature proportional valve is achieved in the using process, so that a proportional valve control element and an ultralow-temperature refrigerant are blocked, the proportional valve is prevented from being damaged due to ultralow temperature, a heating part can be rapidly replaced, and the proportional valve is more convenient to maintain and use.

Description

Technical Field

[0001] The utility model relates to the technical field of valves, and particularly relates to an ultra-low temperature proportional valve with protection. Background Technique

[0002] In the fields of vacuum coating and composite current collectors, precisely controlling the fluid flow rate in a specific environment is a key technology. The application of ultra-low temperature fluid refrigerants is particularly important for these two technologies. The operating temperature of ultra-low temperature fluid refrigerants can be as low as -120 degrees Celsius, which poses great requirements and challenges to various equipment involved.

[0003] In an ultra-low temperature environment, the material and performance of conventional proportional valves are severely affected, resulting in a significant shortening of their service life. Low temperature can cause physical deformation of the metal parts inside the proportional valve, and even increase the brittleness of the material, thus accelerating the wear of the valve components. Local mechanical stress will also be aggravated due to temperature changes, ultimately reducing the reliability and stability of the overall equipment. In addition, traditional proportional valves rely on precise sealing components to ensure leak-free fluid transmission. However, in the extreme low temperature of -120 degrees Celsius, the sealing material will undergo significant cold shrinkage, thus changing the size and shape of the seal, directly affecting the sealing effect. This will not only cause fluid leakage, but also further increase the frequency of failures and maintenance.

[0004] Therefore, an ultra-low temperature proportional valve with protection is proposed. Content of the Utility Model

[0005] The purpose of the utility model is: to solve the problems mentioned in the above background technique, the utility model provides an ultra-low temperature proportional valve with protection.

[0006] The utility model specifically adopts the following technical solutions to achieve the above purpose:

[0007] An ultra-low temperature proportional valve with protection, including a proportional valve body, a first diversion pipe and a second diversion pipe for the medium to flow through are arranged on the surface of the proportional valve body, an adjustment component is installed on the top surface of the proportional valve body, a semiconductor heating ceramic sheet is attached to the surface of the proportional valve body, and a positioning mechanism for limiting the semiconductor heating ceramic sheet is arranged on the surface of the adjustment component.

[0008] Further, the adjustment component includes an installation box, and the installation box is fixedly connected with the proportional valve body. A double-headed screw is rotatably connected to the inner wall of the installation box. One end of the double-headed screw is fixedly connected with a knob. An installation rod is threadedly connected to the surface of the double-headed screw. A chute is penetrated and opened on the front surface of the installation box, and the inner wall of the chute is slidably connected with the surface of the installation rod.

[0009] Further, the positioning mechanism includes a mounting base, and the mounting base is fixedly connected to the end of the mounting rod. A bracket is fixedly connected to the bottom of the mounting base. An L-shaped plug is movably inserted into the top surface of the mounting base. Slots are formed in both the top and bottom surfaces of the semiconductor heating ceramic sheet, and the ends of the bracket and the L-shaped plug are both movably inserted into the inner wall of the slot. The positioning mechanism further includes a locking assembly for limiting the L-shaped plug.

[0010] Further, the locking assembly includes a connecting piece, and the connecting piece is movably inserted into the mounting base. A pin shaft is fixedly connected to one end of the connecting piece. Shaft holes are formed in both the front and back surfaces of the L-shaped plug, and the inner wall of the shaft hole is movably inserted into the end of the pin shaft. A spring is fixedly connected to the surface of the mounting base, and the free end of the spring is fixedly connected to the connecting piece.

[0011] Further, the number of both the semiconductor heating ceramic sheets and the positioning mechanisms is two, and the semiconductor heating ceramic sheets are in an arc structure.

[0012] Further, the starting time of the semiconductor heating ceramic sheet is earlier than that of the proportional valve body.

[0013] The beneficial effects of the present utility model are as follows:

[0014] The ultra-low temperature refrigerant medium is transmitted through the first diversion pipe and the second diversion pipe. The flow rate can be controlled by the proportional valve body. The surface of the proportional valve body pipeline can be heated by using the semiconductor heating ceramic sheet to avoid damage to the proportional valve body caused by too low temperature. The positioning mechanism and the semiconductor heating ceramic sheet can be controlled to move through the distance adjustment assembly, so that the semiconductor heating ceramic sheet is separated from the surface of the proportional valve body pipeline. By removing the limit on the semiconductor heating ceramic sheet through the positioning mechanism, the disassembly and replacement of the semiconductor heating ceramic sheet can be realized. The effect of facilitating the heating of the surface of the pipeline of the ultra-low temperature proportional valve is achieved during use, thereby blocking between the proportional valve control element and the ultra-low temperature refrigerant, avoiding damage to the proportional valve caused by ultra-low temperature, and being able to quickly replace the heating component, making the maintenance and use of the proportional valve more convenient. Description of the Drawings

[0015] Figure 1 is a three-dimensional structural schematic diagram of the present utility model;

[0016] Figure 2 is a top cross-sectional view of the distance adjustment assembly structure of the present utility model;

[0017] Figure 3 is a partial structural schematic diagram of the present utility model;

[0018] Figure 4 is a structural schematic diagram of the semiconductor heating ceramic sheet of the present utility model;

[0019] Reference numerals: 1, proportional valve body; 2, first diversion pipe; 3, second diversion pipe; 4, distance adjustment assembly; 401, mounting box; 402, double-headed screw; 403, knob; 404, chute; 405, mounting rod; 5, positioning mechanism; 501, mounting seat; 502, bracket; 503, L-shaped insert block; 504, slot; 505, connecting piece; 506, pin shaft; 507, spring; 6, semiconductor heating ceramic sheet. Detailed implementation mode

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. Usually, the components of the embodiments of the present utility model described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the present utility model claimed, but merely represents selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts fall within the scope of protection of the present utility model.

[0022] It should be noted that similar reference numerals and letters indicate similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. In addition, the terms "first", "second", etc. are only used for descriptive distinction and cannot be understood as indicating or implying relative importance.

[0023] All the electrical components appearing in this article are electrically connected to the external main controller and 220V mains power, and the main controller can be a conventional known device such as a computer for control.

[0024] In the description of the embodiments of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "inner", "outer", "upper", etc. is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the present utility model is usually placed during use. It is only for the convenience of describing the present utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present utility model.

[0025] Such as Figures 1 to 4As shown in the figure, a cryogenic proportional valve with protection includes a proportional valve body 1. On the surface of the proportional valve body 1, there are a first diversion pipe 2 and a second diversion pipe 3 for the medium to flow through. A distance adjustment component 4 is installed on the top surface of the proportional valve body 1. A semiconductor heating ceramic sheet 6 is attached to the surface of the proportional valve body 1. A positioning mechanism 5 for limiting the semiconductor heating ceramic sheet 6 is arranged on the surface of the distance adjustment component 4. More specifically, the cryogenic refrigerant medium is transmitted through the first diversion pipe 2 and the second diversion pipe 3. The flow rate can be controlled by the proportional valve body 1. The surface of the pipeline of the proportional valve body 1 can be heated by using the semiconductor heating ceramic sheet 6 to avoid damage to the proportional valve body 1 caused by too low temperature. The distance adjustment component 4 can control the movement of the positioning mechanism 5 and the semiconductor heating ceramic sheet 6, so that the semiconductor heating ceramic sheet 6 is separated from the surface of the pipeline of the proportional valve body 1. By releasing the limit on the semiconductor heating ceramic sheet 6 through the positioning mechanism 5, the disassembly and replacement of the semiconductor heating ceramic sheet 6 can be realized.

[0026] The distance adjustment component 4 includes an installation box 401, and the installation box 401 is fixedly connected to the proportional valve body 1. A double-headed screw rod 402 is rotatably connected to the inner wall of the installation box 401. One end of the double-headed screw rod 402 is fixedly connected to a knob 403. An installation rod 405 is threadedly connected to the surface of the double-headed screw rod 402. A chute 404 is penetratingly opened on the front surface of the installation box 401, and the inner wall of the chute 404 is slidably connected to the surface of the installation rod 405. It should be noted that by rotating the knob 403, the double-headed screw rod 402 is driven to rotate. Under the action of the thread, the installation rod 405 will be controlled to slide along the inner wall of the chute 404, so as to drive the positioning mechanism 5 and the semiconductor heating ceramic sheet 6 to approach the surface of the proportional valve body 1, and the semiconductor heating ceramic sheet 6 and the surface of the pipeline of the proportional valve body 1 are made to fit.

[0027] The positioning mechanism 5 includes an installation seat 501, and the installation seat 501 is fixedly connected to the end of the installation rod 405. A bracket 502 is fixedly connected to the bottom of the installation seat 501. An L-shaped insertion block 503 is movably inserted into the top surface of the installation seat 501. Slots 504 are opened on both the top surface and the bottom surface of the semiconductor heating ceramic sheet 6, and the ends of the bracket 502 and the L-shaped insertion block 503 are both movably inserted into the inner wall of the slot 504. The positioning mechanism 5 further includes a locking component for limiting the L-shaped insertion block 503. More specifically, by inserting the bracket 502 and the L-shaped insertion block 503 into the inner wall of the slot 504, the semiconductor heating ceramic sheet 6 is limited. By releasing the limit on the L-shaped insertion block 503 through the locking component and pulling up the L-shaped insertion block 503, it can be pulled out of the inner wall of the slot 504, so as to release the limit on the semiconductor heating ceramic sheet 6, and thus the semiconductor heating ceramic sheet 6 can be disassembled and replaced.

[0028] The locking assembly includes a connecting piece 505, and the connecting piece 505 is movably inserted into the mounting seat 501. One end of the connecting piece 505 is fixedly connected with a pin shaft 506. Shaft holes are formed on the front and back surfaces of the L-shaped insertion block 503, and the inner wall of the shaft hole is movably inserted with the end of the pin shaft 506. A spring 507 is fixedly connected to the surface of the mounting seat 501, and the free end of the spring 507 is fixedly connected with the connecting piece 505. It should be noted that by pressing the connecting piece 505, the spring 507 is compressed, and the connecting piece 505 will drive the pin shaft 506 to move, so that the end of the pin shaft 506 is separated from the inner wall of the shaft hole, thereby releasing the limit on the L-shaped insertion block 503.

[0029] The number of the semiconductor heating ceramic sheets 6 and the positioning mechanism 5 is two groups, and the semiconductor heating ceramic sheets 6 are in an arc structure. More specifically, by providing two groups of arc-shaped semiconductor heating ceramic sheets 6, the surface of the pipeline of the proportional valve body 1 can be better fitted, and the surface of the pipeline of the proportional valve body 1 can be effectively heated, so as to protect the proportional valve body 1.

[0030] The starting time of the semiconductor heating ceramic sheet 6 is earlier than that of the proportional valve body 1. More specifically, before transporting the ultra-low temperature refrigerant, the controller first controls the semiconductor heating ceramic sheet 6 to operate to preheat the pipeline of the proportional valve body 1, and then transports the refrigerant, so as to improve the protection effect on the proportional valve body 1.

[0031] In summary: The ultra-low temperature refrigerant medium is transmitted through the first diversion pipe 2 and the second diversion pipe 3. The flow rate can be controlled by the proportional valve body 1. The semiconductor heating ceramic sheet 6 can be used to heat the surface of the pipeline of the proportional valve body 1 to avoid damage to the proportional valve body 1 caused by too low temperature. The positioning mechanism 5 and the semiconductor heating ceramic sheet 6 can be controlled to move through the distance adjustment component 4, so that the semiconductor heating ceramic sheet 6 is separated from the surface of the pipeline of the proportional valve body 1. The limit on the semiconductor heating ceramic sheet 6 can be released through the positioning mechanism 5, and the disassembly and replacement of the semiconductor heating ceramic sheet 6 can be realized. The effect of facilitating the heating of the surface of the pipeline of the ultra-low temperature proportional valve is realized during use, so as to block between the proportional valve control element and the ultra-low temperature refrigerant, avoid damage to the proportional valve caused by ultra-low temperature, and can quickly replace the heating component, making the maintenance and use of the proportional valve more convenient.

[0032] The foregoing has shown and described the basic principles, main features and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above-mentioned embodiments, and what is described in the above-mentioned embodiments and the specification is only the principle of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed. The scope of protection required by the present utility model is defined by the appended claims and their equivalents.

Claims

1. A cryogenic proportional valve with protection, characterized in that, It includes a proportional valve body (1). A first diversion pipe (2) and a second diversion pipe (3) for the medium to flow through are arranged on the surface of the proportional valve body (1). An adjustment distance component (4) is installed on the top surface of the proportional valve body (1). A semiconductor heating ceramic sheet (6) is attached to the surface of the proportional valve body (1). A positioning mechanism (5) for limiting the semiconductor heating ceramic sheet (6) is arranged on the surface of the adjustment distance component (4).

2. The cryogenic proportional valve with protection according to claim 1, characterized in that, The adjustment distance component (4) includes an installation box (401), and the installation box (401) is fixedly connected to the proportional valve body (1). A double-headed screw rod (402) is rotatably connected to the inner wall of the installation box (401). One end of the double-headed screw rod (402) is fixedly connected to a knob (403). An installation rod (405) is threadedly connected to the surface of the double-headed screw rod (402). A chute (404) is penetrated and opened on the front surface of the installation box (401), and the inner wall of the chute (404) is slidably connected to the surface of the installation rod (405).

3. The cryogenic proportional valve with protection according to claim 2, characterized in that, The positioning mechanism (5) includes an installation seat (501), and the installation seat (501) is fixedly connected to the end of the installation rod (405). A bracket (502) is fixedly connected to the bottom of the installation seat (501). An L-shaped insertion block (503) is movably inserted into the top surface of the installation seat (501). Slots (504) are opened on both the top surface and the bottom surface of the semiconductor heating ceramic sheet (6), and the ends of the bracket (502) and the L-shaped insertion block (503) are both movably inserted into the inner wall of the slot (504). The positioning mechanism (5) further includes a locking component for limiting the L-shaped insertion block (503).

4. The cryogenic proportional valve with protection according to claim 3, characterized in that, The locking component includes a connecting piece (505), and the connecting piece (505) is movably inserted into the installation seat (501). A pin shaft (506) is fixedly connected to one end of the connecting piece (505). Shaft holes are opened on both the front surface and the back surface of the L-shaped insertion block (503), and the inner wall of the shaft hole is movably inserted into the end of the pin shaft (506). A spring (507) is fixedly connected to the surface of the installation seat (501), and the free end of the spring (507) is fixedly connected to the connecting piece (505).

5. A cryogenic proportional valve with protection according to claim 1, wherein The number of both the semiconductor heating ceramic sheets (6) and the positioning mechanisms (5) is two groups, and the semiconductor heating ceramic sheets (6) are in an arc structure.

6. The cryogenic proportional valve with protection according to claim 1, wherein The starting time of the semiconductor heating ceramic sheet (6) is earlier than that of the proportional valve body (1).

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