Semiconductor appearance detection device

Abstract

The utility model discloses a semiconductor appearance detection device, which comprises a detection platform, a detection window is arranged on the top surface of the detection platform, the detection window is used for placing a semiconductor product to be detected, a backlight plate assembly hole is further arranged on the side surface of the detection platform, and the backlight plate assembly hole is communicated with the detection window. The backlight plate assembly hole is used for placing a backlight plate, and the backlight plate can extend into the detection window from the backlight plate assembly hole and cover the detection window. The detection window can directly detect whether the peripheral size of the to-be-detected sample is qualified or not, the operation is simple, and the detection efficiency is high; a backlight plate can be placed in the backlight plate assembly hole, and the appearance of the sample to be detected can be clearly detected and judged through the optical principle of the backlight plate at the bottom, so that the detection efficiency is greatly improved; a supporting structure is arranged in the detection window, so that the conditions of scratching, smudginess and the like caused by frictional contact between the to-be-detected sample and an object can be avoided.

Description

Technical Field

[0001] The utility model relates to a semiconductor detection device, in particular to a semiconductor appearance detection device, belonging to the technical field of semiconductor manufacturing. Background Art

[0002] Semiconductor lasers have been widely used in the fields of optical communication, medical treatment, artificial intelligence, AR, etc. due to their excellent performance of being easy to realize the optoelectronic integration of semiconductor materials, the circular beam being easy to realize effective coupling with optical fibers, matching wavebands, realizing high-speed signal modulation, and the light source area having a very small size to achieve high packaging density and low threshold current.

[0003] The production technology control of new semiconductor quartz products has become one of the most important technological processes in product manufacturing. Generally, the entire process is inspected and judged to ensure external dimension inspection, appearance inspection, and clear appearance inspection, so as to meet the relevant technical standard requirements such as the inspection requirements of each process and the application requirements of the client. However, the existing detection devices are complex, the detection processes are numerous, and the detection efficiency is low. Summary of the Utility Model

[0004] Aiming at the deficiencies of the prior art, the purpose of the utility model is to provide a semiconductor appearance detection device with a simple device, low cost, simple detection process, and high detection efficiency.

[0005] To achieve the aforementioned utility model purpose, the technical solutions adopted by the utility model include:

[0006] A semiconductor appearance detection device, comprising: a detection table, a detection window is arranged on the top surface of the detection table, the detection window is used for placing the semiconductor product to be detected, a backlight board assembly hole is further arranged on the side surface of the detection table, the backlight board assembly hole is communicated with the detection window, the backlight board assembly hole is used for placing a backlight board, and the backlight board can extend into the detection window from the backlight board assembly hole and cover the detection window.

[0007] Furthermore: a support structure for supporting the semiconductor product to be detected is arranged on the side wall of the detection window.

[0008] Furthermore: the support structure protrudes radially along the side wall of the detection window.

[0009] Furthermore: the support structure includes a continuous annular protrusion arranged along the circumferential direction of the detection window, or the support structure includes a plurality of protrusions arranged at intervals in sequence along the circumferential direction of the detection window.

[0010] Furthermore, the backlight board assembly hole has a first port and a second port. The first port is located on the side of the inspection table, and the second port is located on the side wall of the inspection window. The second port is located on the side of the support structure facing away from the top surface of the inspection table.

[0011] Furthermore, a wafer picking groove is provided on the top surface of the inspection table. The wafer picking groove communicates with the inspection window, and a part of the side surface of the semiconductor product placed in the inspection window is exposed in the wafer picking groove.

[0012] Furthermore, the bottom of the wafer picking groove is flush with the top surface of the support structure or is located on the side of the top surface of the support structure facing away from the top surface of the inspection table.

[0013] The inspection window is a through window penetrating the inspection table.

[0014] Furthermore, the inspection table includes a first plate body and a second plate body. The first plate body has a first surface and a second surface facing away from each other along its thickness direction. The second plate body has a third surface and a fourth surface facing away from each other along its thickness direction. The first plate body has a first through window penetrating itself along its thickness direction. The second plate body has a second through window penetrating itself along its thickness direction. The first plate body and the second plate body are laminated and fixedly combined. The first through window and the second through window communicate with each other and form the inspection window. The backlight board assembly hole is provided between the first plate body and the second plate body.

[0015] Furthermore, a first assembly groove is provided on the second surface of the first plate body. The two ends of the first assembly groove are respectively communicated with the side surface of the first plate body and the first through window. The first assembly groove and the third surface of the second plate body enclose the backlight board assembly hole.

[0016] Furthermore, a second assembly groove is provided on the third surface of the second plate body. The two ends of the second assembly groove are respectively communicated with the side surface of the second plate body and the first through window. The second assembly groove and the second surface of the first plate body enclose the backlight board assembly hole.

[0017] Furthermore, a first assembly groove is provided on the second surface of the first plate body. The two ends of the first assembly groove are respectively communicated with the side surface of the first plate body and the first through window. A second assembly groove is provided on the third surface of the second plate body. The two ends of the second assembly groove are respectively communicated with the side surface of the second plate body and the first through window. The first assembly groove and the second assembly groove enclose the backlight board assembly hole.

[0018] Furthermore, the support structure is provided on the first plate body.

[0019] Furthermore, the support structure is disposed on the second plate body.

[0020] Furthermore, the support structure is disposed on the first plate body and the second plate body, with one end of the support structure disposed on the first plate body and the other end of the support structure disposed on the second plate body.

[0021] Furthermore, the sheet taking slot is disposed on the first plate body.

[0022] Furthermore, the sheet taking slot extends from the first plate body to the second plate body.

[0023] Furthermore, a backlight plate is disposed in the backlight plate assembly hole, and the backlight plate is detachably connected to the backlight plate assembly hole.

[0024] Furthermore, the detection device further includes a detection light source, and the detection light source is disposed on a side of the detection window away from the backlight plate placement hole.

[0025] Compared with the prior art, the advantages of the present utility model include:

[0026] 1) For the semiconductor appearance detection device provided by the present utility model, the detection window can directly detect whether the peripheral dimensions of the sample to be measured are qualified, with simple operation and high detection efficiency;

[0027] 2) For the semiconductor appearance detection device provided by the present utility model, a support structure is disposed in the detection window, which can avoid the situation of scratching and soiling caused by frictional contact between the sample to be measured and an object;

[0028] 3) For the semiconductor appearance detection device provided by the present utility model, a backlight plate can be placed in the backlight plate assembly hole, and through the optical principle of the backlight plate at the bottom, the appearance of the sample to be measured can be clearly inspected and determined, greatly improving the inspection efficiency. Description of the Drawings

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments recorded in the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0030] Figure 1 It is a schematic diagram of the overall structure of a semiconductor appearance detection device provided in a typical embodiment of the present utility model;

[0031] Figure 2 It is a schematic diagram of the structure of a detection table provided in a typical embodiment of the present utility model;

[0032] Description of the reference numerals: 1, inspection table; 2, inspection window; 3, support structure; 4, backlight board assembly hole; 5, wafer taking slot; 6, first plate body; 7, second plate body. Detailed implementation manners

[0033] In view of the deficiencies in the prior art, the inventors of this case have proposed the technical solution of the present utility model through long-term research and a large number of practices. The following will further explain the technical solution, its implementation process, principle, etc.

[0034] The present utility model discloses a semiconductor appearance inspection device.

[0035] A semiconductor appearance inspection device includes: an inspection table, on the top surface of the inspection table, there is an inspection window, and the inspection window is used to place the semiconductor product to be inspected and to inspect the appearance size of the semiconductor product. When inspecting, the semiconductor product is placed into the inspection window 2. If the semiconductor product cannot be placed into the inspection window 2, it means that the appearance size of the semiconductor product is too large and unqualified; if there is a large gap between the edge of the semiconductor product and the edge of the inspection window 2 after the semiconductor product is placed into the inspection window 2, it means that the shape size of the semiconductor product is too small and unqualified. The shape of the inspection window 2 should be set according to the shape of the semiconductor product to be inspected. In this embodiment, the cross-section of the inspection window 2 is circular. Preferably, the inspection window is a through window that penetrates the inspection table. The semiconductor product is a light-transmitting product, especially quartz products, etc.

[0036] In some embodiments, the inspection table includes a first plate body and a second plate body. The first plate body has a first surface and a second surface that are opposite to each other along the thickness direction of the first plate body. The second plate body has a third surface and a fourth surface that are opposite to each other along the thickness direction of the second plate body. The first plate body has a first through window that penetrates itself along the thickness direction of the first plate body. The second plate body has a second through window that penetrates itself along the thickness direction of the second plate body. The first plate body and the second plate body are stacked and fixedly combined. The first through window and the second through window are communicated to form the inspection window. The backlight board assembly hole is arranged between the first plate body and the second plate body.

[0037] The side of the inspection table is also provided with a backlight board assembly hole, and the backlight board assembly hole is communicated with the inspection window. The backlight board assembly hole is used to place a backlight board, and the backlight board can extend into the inspection window from the backlight board assembly hole and cover the inspection window, so that light can pass through the entire semiconductor product to inspect the entire appearance of the semiconductor product.

[0038] Specifically, a first assembly groove is provided on the second surface of the first plate body. Two ends of the first assembly groove are respectively communicated with the side surface of the first plate body and the first through window. The first assembly groove and the third surface of the second plate body enclose a backlight plate assembly hole.

[0039] Alternatively, a second assembly groove is provided on the third surface of the second plate body. Two ends of the second assembly groove are respectively communicated with the side surface of the second plate body and the first through window. The second assembly groove and the second surface of the first plate body enclose a backlight plate assembly hole.

[0040] Alternatively, a first assembly groove is provided on the second surface of the first plate body. Two ends of the first assembly groove are respectively communicated with the side surface of the first plate body and the first through window. A second assembly groove is provided on the third surface of the second plate body. Two ends of the second assembly groove are respectively communicated with the side surface of the second plate body and the first through window. The first assembly groove and the second assembly groove enclose a backlight plate assembly hole.

[0041] On the above basis, a support structure for supporting the semiconductor product to be detected is provided on the side wall of the detection window. The support structure 3 is higher than the bottom of the detection window 2. The semiconductor product is placed on the support structure 3 to protect the semiconductor product and prevent the semiconductor product from contacting and rubbing against other objects, resulting in scratches and dirt.

[0042] Specifically, the support structure protrudes radially from the side wall of the detection window along the detection window. More specifically, the support structure includes an annular protrusion continuously provided along the circumferential direction of the detection window, or the support structure includes a plurality of protrusions sequentially arranged at intervals along the circumferential direction of the detection window.

[0043] Specifically, the support structure can be provided on the first plate body, or can be provided on the second plate body; or it is provided on both the first plate body and the second plate body. One end of the support structure is provided on the first plate body, and the other end of the support structure is provided on the second plate body.

[0044] In some embodiments, the backlight plate assembly hole has a first port and a second port. The first port is located on the side surface of the detection table, and the second port is located on the side wall of the detection window. The second port is located on one side of the support structure facing away from the top surface of the detection table.

[0045] In some embodiments, a wafer picking groove is further provided on the top surface of the detection table. The wafer picking groove is communicated with the detection window, and a part of the side surface of the semiconductor product placed in the detection window is exposed in the wafer picking groove. Specifically, the bottom of the wafer picking groove is flush with the top surface of the support structure or is located on one side of the top surface of the support structure facing away from the top surface of the detection table.

[0046] Specifically, the chip-taking slot can be provided on the first plate body or extend from the first plate body to the second plate body.

[0047] In some embodiments, a backlight plate is disposed in the backlight plate assembly hole, and the backlight plate is detachably connected to the backlight plate assembly hole. Through the optical principle of the backlight plate, the semiconductor product is made clearer, enabling the inspector to clearly check the appearance of the semiconductor product, improving the detection efficiency and detection accuracy, and solving the problem of difficult appearance detection in the prior art. Different matching backlight plates are selected according to different types of semiconductor products to be detected, and the backlight plate can be black, red, blue, yellow, etc. By selecting the color of the bottom backlight plate, the outer diameter size and appearance of the semiconductor product can be clearly and accurately judged through the optical effect of the device, ensuring that the test results meet the standard requirements.

[0048] In some embodiments, the detection device further includes a detection light source, and the detection light source is disposed on a side of the detection window away from the backlight plate placement hole.

[0049] Embodiment 1:

[0050] As Figure 1 、 Figure 2 shown, a semiconductor appearance detection device includes a detection table 1, and the detection table 1 includes a first plate body 6 and a second plate body 7, and the first plate body 6 and the second plate body 7 are fixedly connected by screws. A circular detection window 2 is provided on the upper end surface of the first plate body 6, and a support structure 3 is provided in the detection window 2. The support structure 3 is higher than the bottom of the detection window 2, and the support structure 3 extends in the direction of the center of the detection window 2. The detection window 2 can support the edge of the semiconductor product. A backlight plate assembly hole 4 is provided on the lower end surface of the first plate body 6, and the backlight plate assembly hole 4 extends into the detection table 1 and communicates with the entire detection window 2. The axis of the detection window 2 is perpendicular to the plane where the backlight plate assembly hole 4 is located. A backlight plate is detachably connected in the backlight plate assembly hole 4.

[0051] A chip-taking slot 5 is provided on the upper end surface of the first plate body 6, the chip-taking slot 5 communicates with the detection window 2, and the bottom end of the chip-taking slot 5 is lower than the bottom end of the support structure 3.

[0052] The working process of this embodiment for the feeding detection of semiconductor products is as follows:

[0053] 1) First, open the semiconductor product chip box, take out the semiconductor product and place the semiconductor product into the detection device. Specifically, place the semiconductor product on the support structure provided in the detection window.

[0054] 2) After visually inspecting that the appearance dimensions of the semiconductor product are qualified, select a backlight board with a suitable matching color, insert the backlight board into the backlight board assembly hole, and move the detection device under the microscope for inspection;

[0055] 3) Clearly and intuitively judge the appearance morphology of the product through inspection. After passing the inspection, reach into the wafer picking slot with your hand to take out the semiconductor product and place the detected semiconductor product into the original cassette.

[0056] It should be understood that the above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly, and it cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims

1. A semiconductor appearance detection device, characterized in that, Comprising: A detection stage, on the top surface of the detection stage there is a detection window for placing a semiconductor product to be detected, on the side of the detection stage there is also a backlight plate assembly hole which is in communication with the detection window, the backlight plate assembly hole is used for placing a backlight plate, and the backlight plate can extend into the detection window from within the backlight plate assembly hole and cover the detection window.

2. The semiconductor appearance detection device according to claim 1, characterized in that, On the side wall of the detection window there is a support structure for supporting the semiconductor product to be detected; And / or, the support structure protrudes radially from the side wall of the detection window along the detection window; And / or, the support structure includes a continuous annular protrusion arranged along the circumferential direction of the detection window, or the support structure includes a plurality of protrusions arranged at intervals in sequence along the circumferential direction of the detection window.

3. The semiconductor appearance detection device according to claim 2, wherein, The backlight plate assembly hole has a first port and a second port, the first port is located on the side of the detection stage, the second port is located on the side wall of the detection window, and the second port is located on the side of the support structure facing away from the top surface of the detection stage.

4. A semiconductor appearance detection device according to claim 2, characterized in that, On the top surface of the detection stage there is also a chip taking slot which is in communication with the detection window, and a part of the side surface of the semiconductor product placed in the detection window is exposed in the chip taking slot; And / or, the bottom of the chip taking slot is flush with the top surface of the support structure or is located on the side of the top surface of the support structure facing away from the top surface of the detection stage; And / or, the detection window is a through window penetrating the detection stage.

5. A semiconductor appearance detection device according to claim 3, characterized in that, The detection stage includes a first plate body and a second plate body, the first plate body has a first surface and a second surface facing away from each other along its thickness direction, the second plate body has a third surface and a fourth surface facing away from each other along its thickness direction, the first plate body has a first through window penetrating itself along its thickness direction, the second plate body has a second through window penetrating itself along its thickness direction, the first plate body and the second plate body are laminated and fixedly combined, the first through window and the second through window are in communication and form the detection window, and the backlight plate assembly hole is arranged between the first plate body and the second plate body.

6. The semiconductor appearance detection device according to claim 5, wherein, On the second surface of the first plate body there is a first assembly groove, and both ends of the first assembly groove are respectively in communication with the side of the first plate body and the first through window, and the first assembly groove and the third surface of the second plate body enclose to form the backlight plate assembly hole; Or, on the third surface of the second plate body there is a second assembly groove, and both ends of the second assembly groove are respectively in communication with the side of the second plate body and the first through window; the second assembly groove and the second surface of the first plate body enclose to form the backlight plate assembly hole; Or, on the second surface of the first plate body there is a first assembly groove, and both ends of the first assembly groove are respectively in communication with the side of the first plate body and the first through window, on the third surface of the second plate body there is a second assembly groove, and both ends of the second assembly groove are respectively in communication with the side of the second plate body and the first through window; the first assembly groove and the second assembly groove enclose to form the backlight plate assembly hole.

7. A semiconductor appearance detection device according to claim 5, characterized in that The support structure is disposed on the first plate body; Alternatively, the support structure is disposed on the second plate body; Alternatively, the support structure is disposed on the first plate body and the second plate body, one end of the support structure is disposed on the first plate body, and the other end of the support structure is disposed on the second plate body.

8. A semiconductor appearance detection device according to claim 4, characterized in that, The chip taking groove is disposed on the first plate body; And / or, the chip taking groove extends from the first plate body to the second plate body.

9. A semiconductor appearance detection device according to claim 4, characterized in that, A backlight plate is disposed in the backlight plate assembly hole, and the backlight plate is detachably connected to the backlight plate assembly hole.

10. A semiconductor appearance detection device according to claim 1, characterized in that, The detection device further includes a detection light source, and the detection light source is disposed on a side of the detection window away from the backlight plate placement hole.

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