Elastic pressing plate, bonding wire fixing tool and lead bonding system

Abstract

The utility model provides an elastic pressing plate, a bonding wire fixing tool and a lead bonding system. The elastic pressing plate comprises a pressing plate body; the at least one window is located on the pressing plate body; the at least one elastic pressing piece is arranged along the inner side of the window, an elastic antenna is arranged at a first preset position of the elastic pressing piece, and the thickness of the elastic antenna is larger than that of the middle of the pressing plate body. The plurality of elastic pressing sheets with elasticity are arranged on the inner side of the window of the pressing plate body, the elastic antennas are arranged at the first preset positions of the elastic pressing sheets, and the thickness of the elastic antennas is larger than that of the middle flat plate of the elastic pressing plate, so that the elastic pressing plate avoids the cover plate and directly and elastically presses the carrier plate placed on the carrier plate carrier; the risk of crushing the carrier plate is reduced, and the pressing effect of the elastic pressing plate on the carrier plate is improved.

Description

Technical Field

[0001] This application belongs to the technical field of wire bonding fixing tooling, and particularly relates to an elastic pressing plate, a wire bonding fixing tooling, and a wire bonding system. Background Art

[0002] The wire bonding process is a process that uses a thin metal wire and utilizes heat, pressure, and ultrasonic energy to tightly bond the metal lead to the substrate pad, achieving electrical interconnection between the chip and the substrate and information communication between chips. Among them, ultrasonic energy is high-frequency vibration, and the stability requirements for product fixation are very high. Therefore, the wire bonding fixing tooling is an important part of the wire bonding equipment. The wire bonding fixing tooling is used to fix the products carried by the transfer carrier. Therefore, how to improve the pressing effect of the wire bonding fixing tooling on the products carried by the transfer carrier has become one of the technical problems that need to be solved urgently by relevant technical personnel. Summary of the Utility Model

[0003] This application provides an elastic pressing plate, a wire bonding fixing tooling, and a wire bonding system, which are used to solve the technical problem that there is a lack of a mature pressing solution for the products carried by the transfer carrier in the existing wire bonding fixing tooling.

[0004] In a first aspect, an embodiment of this application provides an elastic pressing plate, including: a pressing plate body; at least one window located on the pressing plate body; at least one elastic pressing piece arranged along the inner side of the window, an elastic antenna is provided at a first preset position of the elastic pressing piece, and the thickness of the elastic antenna is greater than the middle thickness of the pressing plate body.

[0005] In one implementation manner of the first aspect, the shape of the elastic pressing piece is J-shaped, and the first preset position is the hooked end of the J-shaped elastic pressing piece.

[0006] In one implementation manner of the first aspect, a plurality of square electronic device avoidance openings are provided on the pressing plate body.

[0007] In one implementation manner of the first aspect, a triangular welding mechanism avoidance opening is provided on one side of the pressing plate body close to the wire bonding equipment.

[0008] In one implementation manner of the first aspect, installation positioning holes are respectively provided on the inner sides of the two sides of the pressing plate body perpendicular to the side where the triangular welding mechanism avoidance opening is located.

[0009] In one implementation manner of the first aspect, a carrier plate replacement hole is further provided on the pressing plate body.

[0010] In a second aspect, an embodiment of this application provides a wire bonding fixing tooling, which includes: a heating block; the elastic pressing plate according to any one of the first aspect of the embodiments of this application.

[0011] In a third aspect, an embodiment of the present application provides a wire bonding system, which includes: a wire bonding fixture, a wire bonding device, and a wire carrier. Among them: the wire bonding fixture includes: a heating block installed below the track of the wire bonding device; the elastic pressing plate according to any one of the first aspects of the embodiments of the present application, which is installed on the pressing plate arm of the wire bonding device and is used to press the carrier board carried by the wire carrier when the wire carrier is transferred to the second preset position of the wire bonding device.

[0012] In an implementation manner of the third aspect, the wire carrier includes: a carrier board carrier for carrying the carrier board; a cover plate installed on the carrier board carrier.

[0013] In an implementation manner of the third aspect, the cover plate is used to cover the first carrier board position of the carrier board, and the elastic pressing plate is used to directly press the second carrier board position of the carrier board, and the first carrier board position and the second carrier board position are different.

[0014] The elastic pressing plate provided by the embodiment of the present application includes: a pressing plate body; at least one window located on the pressing plate body; at least one elastic pressing piece arranged along the inner side of the window. An elastic antenna is provided at a first preset position of the elastic pressing piece, and the thickness of the elastic antenna is greater than the middle thickness of the pressing plate body, so that the elastic pressing plate directly presses the carrier board by using its own elastic antenna, reducing the risk of damaging the carrier board and improving the pressing effect of the elastic pressing plate on the carrier board. Description of the Drawings

[0015] Figure 1 Shown is a top view of a wire bonding fixture in some technical solutions.

[0016] Figure 2 Shown is a cross-sectional view of a wire bonding fixture in some technical solutions.

[0017] Figure 3 Shown is a schematic structural diagram of an elastic pressing plate in an embodiment of the present application.

[0018] Figure 4 Shown is a schematic diagram of an elastic pressing piece in an embodiment of the present application.

[0019] Figure 5A Shown is a cross-sectional view of a wire bonding fixture in an embodiment of the present application.

[0020] Figure 5B Shown is a top view of a wire bonding fixture in an embodiment of the present application.

[0021] Figure 6 Shown is a schematic structural diagram of a wire carrier in an embodiment of the present application.

[0022] Description of Component Labels

[0023] 100 First Wire Bonding Fixture

[0024] 110 First Heating Block

[0025] 120 Pressure Plate

[0026] 200 First Cover Plate

[0027] 300 Ceramic Plate

[0028] 400 Elastic Pressure Plate

[0029] 410 Pressure Plate Body

[0030] 420 Window

[0031] 430 Elastic Pressure Sheet

[0032] 431 Upper Hook-shaped End

[0033] 440 Square Electronic Device Avoidance Opening

[0034] 450 Triangular Welding Mechanism Avoidance Opening

[0035] 460 Mounting and Positioning Hole

[0036] 470 Carrier Plate Replacement Hole

[0037] 500 Wire Bonding Equipment

[0038] 600 Second Wire Bonding Fixture

[0039] 610 Second Heating Block

[0040] 700 Wire Flow Carrier

[0041] 710 Carrier Plate Carrier

[0042] 720 Second Cover Plate

[0043] 800 Carrier Plate Detailed Implementation Manner

[0044] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, rather than all of them. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of this application. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of this application to be protected, but merely represents the selected embodiments of this application. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of this application.

[0045] In the description of this application, it should be understood that the orientation or positional relationships indicated by the terms "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0046] In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of this application, the meaning of "at least one" and "a plurality" is two or more, unless otherwise specifically defined.

[0047] In this application, unless otherwise clearly specified and limited, the terms "install", "connect", "couple", "fix", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0048] In this application, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may include direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the horizontal height of the first feature is lower than that of the second feature.

[0049] In some technical solutions, during the process of the wire bonding fixing tooling pressing the carrier board carried by the fixed transfer carrier, due to the lack of mature pressing equipment, it is easy to cause damage to the carrier board.

[0050] Figure 1 and Figure 2 are respectively shown as the top view and sectional view of the first wire bonding fixing tooling in some technical solutions. In Figure 2 the example, the first wire bonding fixing tooling 100 includes a first heating block 110 and a pressing plate 120.

[0051] The first heating block 110 is installed under the track of the wire bonding equipment. When the wire bonding transfer carrier rotates to the designated position on the track, the first heating block 110 jacks up to support the ceramic plate 300; the pressing plate 120 is installed on the pressing plate arm of the wire bonding equipment, and the pressing plate arm drives the pressing plate 120 to move up and down. When the wire bonding transfer carrier rotates to the designated position on the track, the pressing plate arm drives the pressing plate 120 to press down. The pressing plate 120 presses on the first cover plate 200 of the wire bonding transfer carrier, and the first cover plate 200 presses on the ceramic plate 300, thereby playing a role in fixing the ceramic plate 300.

[0052] The working steps of the first wire bonding fixing tooling 100 are mainly: the pressing plate 120 acts on the first cover plate 200, and the first cover plate 200 then acts on the ceramic plate 300 to achieve the purpose of fixing the ceramic plate 300. However, affected by the installation of the first cover plate 200 and the material processing dimensions of the first cover plate 200 and the ceramic plate 300 itself, the pressing effect of the ceramic plate 300 is not good, and there is a risk of damaging the ceramic plate 300.

[0053] At least for the above problems, the embodiment of this application provides an elastic pressing plate. The elastic pressing plate directly presses the carrier board by using its own elastic tentacles, which can reduce the risk of damaging the carrier board and improve the pressing effect of the elastic pressing piece on the carrier board.

[0054] The following will elaborate on the elastic pressing plate of this embodiment in detail, so that those skilled in the art can understand an elastic pressing plate of this embodiment without creative labor.

[0055] Figure 3 It shows a schematic structural diagram of the elastic pressure plate in some embodiments of the present application. In some embodiments, the elastic pressure plate 400 at least includes a pressure plate body 410, at least one window 420 and an elastic pressing piece 430.

[0056] Among them, the window 420 is located on the pressure plate body 410, the elastic pressing piece 430 is arranged along the inner side of the window, an elastic antenna is provided at a first preset position of the elastic pressing piece 430, and the thickness of the elastic antenna is greater than the middle thickness of the pressure plate body.

[0057] Please refer to Figure 4 , in some embodiments, the shape of the elastic pressing piece 430 is J-shaped, and the first preset position is the hooked end 431 of the J-shaped elastic pressing piece 430.

[0058] Specifically, a plurality of the elastic pressing pieces 430 are arranged along the inner side of the window for pressing the carrier plate.

[0059] Exemplarily, to ensure that the carrier plate is pressed tightly, 4 of the elastic pressing pieces 430 can be arranged on the inner side of the window.

[0060] Among them, the J-shaped elastic pressing piece 430 can, based on its own elasticity, accommodate the tolerance of the carrier plate itself, greatly increasing the reliability of the fixation of the carrier plate.

[0061] Another exemplarily, the above-mentioned carrier plate can specifically be any suitable welding carrier such as a ceramic plate, a wooden board, etc., and the present application does not limit this.

[0062] It should be noted that the above-mentioned arrangement of 4 of the elastic pressing pieces 430 along the inner side of the window is only an exemplary illustration of this embodiment. In actual applications, the appropriate number of elastic pressing pieces can be selected according to the specific application scenario, and the present application does not limit this.

[0063] Specifically, the hooked end of the J-shaped elastic pressing piece 430 is provided with an antenna, and its thickness is greater than the thickness of the middle flat plate of the elastic pressure plate 400.

[0064] It should be noted that the shape of the elastic pressing piece 430 can also be L-shaped, H-shaped or other suitable shapes, as long as the pressing piece arranged along the inner side of the window meets the elasticity, and the present application does not limit the shape of the elastic pressing piece 430.

[0065] In some embodiments, a plurality of square electronic device avoidance openings 440 are provided on the pressure plate body 410 for avoiding the electronic devices on the carrier plate.

[0066] In some embodiments, a triangular welding mechanism avoidance opening 450 is provided on one side of the pressing plate body 410 close to the wire bonding device, for avoiding the welding mechanism of the wire bonding device 500 and preventing interference between the welding mechanism and the elastic pressing plate 400.

[0067] In some embodiments, mounting and positioning holes 460 are respectively provided on the inner sides of the two sides of the pressing plate body 410 perpendicular to the side where the triangular welding mechanism avoidance opening 450 is located.

[0068] Among them, the number of the mounting and positioning holes 460 is at least two, for fixing the carrier plate.

[0069] After the carrier plate is tooled for a long time, the carrier plate may become extremely hot. At this time, if the carrier plate needs to be replaced, it is easy for technicians to be scalded when directly replacing the carrier plate by hand. To address this problem, in some embodiments, a carrier plate replacement hole 470 is further provided on the pressing plate body 410. The carrier plate replacement hole 470 is used to conveniently replace the carrier plate. Specifically, when the carrier plate needs to be replaced, the connecting parts such as screws in the carrier plate replacement hole can be loosened, and the carrier plate can be removed by tools, avoiding technicians directly touching the carrier plate by hand.

[0070] The present application also provides a wire bonding fixing tooling. Figure 5A Shown is a sectional view of the wire bonding fixing tooling in some embodiments of the present application. As Figure 5A shown, in some embodiments, the second wire bonding fixing tooling 600 at least includes a second heating block 610 and an elastic pressing plate 400.

[0071] The present application also provides a wire bonding system. In some embodiments, the wire bonding system includes a second wire bonding fixing tooling 600, a wire bonding device 500, and a wire bonding transfer carrier 700. Among them: The second wire bonding fixing tooling 600 includes a second heating block 610 and an elastic pressing plate 400. The second heating block 610 is installed below the track of the wire bonding device 500. The elastic pressing plate 400 is installed on the pressing plate arm of the wire bonding device 500, for pressing the carrier plate carried by the wire bonding transfer carrier when the wire bonding transfer carrier is transferred to the second preset position of the wire bonding device.

[0072] Specifically, when the wire bonding transfer carrier 700 is transferred to the designated position on the track (i.e., the second preset position), after the second heating block 610 is lifted, it plays a role in supporting the carrier plate 800; the elastic pressing plate 400 is installed on the pressing plate arm of the wire bonding device 500, and the pressing plate arm drives the elastic pressing plate 400 to move up and down. When the wire bonding transfer carrier 700 is transferred to the designated position on the track, the pressing plate arm drives the elastic pressing plate 400 to press down, and the elastic pressing plate 400 directly presses on the carrier plate 800, thereby playing a role in fixing the carrier plate 800.

[0073] Exemplarily, an ultrasonic wave is a key factor in the wire bonding equipment. The ultrasonic wave of 120KHZ (vibrating 120,000 times in 1 second) acts on the carrier plate through the bonding tool. If the carrier plate shakes, it is extremely easy to occur various welding defects, such as poor soldering, wire breakage, spherical defects and other quality abnormalities. Therefore, the reliability of the carrier plate fixation has a very significant impact on the welding quality, and obvious shaking of the carrier plate is not allowed. When the existing wire bonding fixture fixes the carrier plate, there is shaking of the carrier plate. When using tweezers to touch 45 carrier plates, it is found that 15 products shake, and the shaking ratio reaches 33%. When using the improved wire bonding fixture of this application and using tweezers to touch 45 carrier plates, it is found that 0 products shake, and the shaking ratio is 0%. Thus, it can be seen that the improved wire bonding fixture based on the elastic pressing plate of this application greatly improves the reliability of the carrier plate fixation, can improve the quality of the carrier plate fixation, and reduce the risks of poor soldering and wire breakage.

[0074] To enable those skilled in the art to further understand the wire bonding fixture of this embodiment, Figure 5B It shows a top view of the wire bonding fixture in an embodiment of this application.

[0075] Figure 6 It shows a structural schematic diagram of the wire flow transfer tool in an embodiment of this application. In Figure 6 the example, in some embodiments, the wire flow transfer tool 700 at least includes a carrier plate carrier 710 and a second cover plate 720.

[0076] Among them, the carrier plate carrier 710 is used to carry the carrier plate 800; the second cover plate 720 is installed on the carrier plate carrier 710 to prevent the carrier plate from shaking and falling during the transfer process. The wire flow transfer tool 700 is transferred to the pressing position of the wire bonding equipment 500 and is fixed by the second wire bonding fixture 600.

[0077] In some embodiments, the cover plate is used to cover the first carrier plate position of the carrier plate, and the elastic pressing plate is used to directly press the second carrier plate position of the carrier plate, and the first carrier plate position and the second carrier plate position are different.

[0078] Among them, the second carrier plate position is the position where the elastic pressing plate 400 directly presses on the carrier plate, and the first carrier plate position is other positions that avoid the second carrier plate position on the carrier plate.

[0079] The elastic pressing plate 400 avoids the first carrier plate position and directly presses on the second carrier plate position of the carrier plate 800, which can avoid the influence of the second cover plate 720 part of the wire flow transfer tool.

[0080] In a traditional wire bonding fixture, the pressure plate acts on the cover plate, and the cover plate then acts on the ceramic plate. Since the pressure plate has strong rigidity, after pressing down, if the pressing force is set to be small, it is not easy to fix the ceramic plate; if the pressing force is set to be large, there is a risk of damaging the ceramic plate. Compared with the traditional wire bonding fixture, in this application, an elastic pressure plate is used to directly fix the carrier plate, avoiding the step of the elastic pressure plate acting on the cover plate first, and directly pressing the carrier plate by using the elasticity of the elastic pressure plate itself. Its pressing force is easier to control, the carrier plate is better fixed, the risk of damaging the carrier plate during pressing is reduced, and the pressing effect of the elastic pressure plate on the carrier plate is improved.

[0081] In summary, the elastic pressure plate, wire bonding fixture and wire bonding system provided in the embodiments of this application, by arranging a plurality of elastic pressure pieces with elasticity inside the window of the pressure plate body, and providing elastic tentacles with a thickness greater than the thickness of the middle flat plate of the elastic pressure plate at the first preset position of the elastic pressure piece, can directly press the carrier plate placed on the carrier plate elastically, reducing the risk of damaging the carrier plate and improving the pressing effect of the elastic pressure plate on the carrier plate.

[0082] The above embodiments are only illustrative of the principles and effects of this application, and are not used to limit this application. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or changes completed by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed in this application should still be covered by the claims of this application.

Claims

1. An elastic pressing plate, characterized in that Comprising: A pressing plate body; At least one window located on the pressing plate body; At least one elastic pressing piece arranged along the inner side of the window. An elastic antenna is provided at a first preset position of the elastic pressing piece, and the thickness of the elastic antenna is greater than the middle thickness of the pressing plate body.

2. The resilient pressing plate according to claim 1, wherein The elastic pressing piece is in a J shape, and the first preset position is the hooked end of the J-shaped elastic pressing piece.

3. The resilient pressing plate according to claim 1, wherein, A plurality of square electronic device avoidance openings are provided on the pressing plate body.

4. The elastic pressing plate according to claim 1, characterized in that A triangular welding mechanism avoidance opening is provided on one side of the pressing plate body close to the wire bonding equipment.

5. The resilient pressing plate according to claim 4, characterized in that Mounting positioning holes are respectively provided on the inner sides of the two side edges of the pressing plate body perpendicular to the side edge where the triangular welding mechanism avoidance opening is located.

6. The elastic pressing plate according to claim 1, characterized in that A carrier replacement hole is also provided on the pressing plate body.

7. A wire bonding fixing tooling, characterized in that, Comprising: A heating block; The elastic pressing plate according to any one of claims 1 to 6.

8. A wire bonding system, characterized in that, Comprising a wire bonding fixture, a wire bonding equipment, and a wire bonding transfer carrier, wherein: The wire bonding fixture comprises: A heating block installed under the track of the wire bonding equipment; The elastic pressing plate according to any one of claims 1 to 6, installed on the pressing plate arm of the wire bonding equipment, and used for pressing the carrier board carried by the wire bonding transfer carrier when the wire bonding transfer carrier is transferred to a second preset position of the wire bonding equipment.

9. The wire bonding system according to claim 8, wherein The wire bonding transfer carrier comprises: A carrier board carrier for carrying the carrier board; A cover plate installed on the carrier board carrier.

10. The wire bonding system according to claim 9, wherein, The cover plate is used to cover a first carrier board position of the carrier board, and the elastic pressing plate is used to directly press a second carrier board position of the carrier board. The first carrier board position and the second carrier board position are different.

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