Wafer scrubbing machine
By designing a wafer brushing machine, using rotatable transfer assembly and multiple cleaning processes, the problems of low manual brushing efficiency and poor cleaning effect are solved, and efficient automatic cleaning and cleaning of silicon carbide wafers are achieved.
Patent Information
- Application Number
- CN202422353775.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-26
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2034-09-26
AI Technical Summary
Manual brushing of silicon carbide wafers is inefficient and easy to damage, with poor cleaning effect, which affects subsequent use.
A wafer brushing machine is designed, including a rotatable load transfer assembly, multiple cleaning mechanisms and drying mechanisms, and the wafer is grasped by synchronous rotary transfer arm to clean the wafers, and the cleaning mechanism of different medicines is used to improve the cleanliness.
It realizes automatic and efficient cleaning of the wafer, improves cleaning efficiency and cleanliness, and reduces the risk of damage caused by manual operation.
Smart Images
Figure CN223123875U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer cleaning, and more specifically, to a wafer scrubbing machine. Background Art
[0002] In the application of semiconductor devices, with the reduction of the production cost of silicon carbide, silicon carbide wafers may replace silicon wafers due to their excellent performance, breaking through the bottleneck of silicon wafers due to the performance of the material itself. Silicon carbide wafers are mainly used in the fields of LED solid lighting and high-frequency devices. They have excellent characteristics such as a bandgap, drift velocity, breakdown voltage, thermal conductivity, and high temperature resistance that are several times higher than those of traditional silicon. They have irreplaceable advantages in electronic application fields such as high temperature, high voltage, high frequency, high power, optoelectronics, radiation resistance, and microwave, as well as in extreme environment applications such as aerospace, military, and nuclear energy.
[0003] During the production process of silicon carbide wafers or after being used for a period of time, it is often necessary to scrub their surfaces. The most common scrubbing method is manual scrubbing, that is, the operator manually scrubs the silicon carbide wafers. The manual scrubbing method consumes a large amount of manpower, has low work efficiency, is easy to damage the surface of the silicon carbide wafers, and the cleaning effect of manual scrubbing is poor, which easily affects the subsequent use of the silicon carbide wafers. Summary of the Utility Model
[0004] In order to solve at least one of the above technical problems, the utility model proposes a wafer scrubbing machine.
[0005] In a first aspect of the utility model, a wafer scrubbing machine is provided, including: a scrubbing platform and a transfer assembly arranged on the scrubbing platform;
[0006] A first cleaning mechanism, a second cleaning mechanism, a scrubbing mechanism, and a drying mechanism are sequentially arranged on the top of the scrubbing platform and outside the transfer assembly;
[0007] A first chemical adding mechanism is arranged on one side of the first cleaning mechanism, and a second chemical adding mechanism is arranged on one side of the second cleaning mechanism;
[0008] The transfer assembly grabs the wafers and performs cleaning, scrubbing, and drying in sequence.
[0009] In a preferred embodiment of the utility model, the transfer assembly includes a fixed seat fixedly installed on the top of the scrubbing platform. A plurality of support columns are arranged on the top of the fixed seat, and an installation seat is arranged on the top of the support columns.
[0010] In a preferred embodiment of the utility model, a lifting cylinder is arranged at the bottom of the installation seat and inside the plurality of support columns. A rotating shaft is arranged on the top of the installation seat, and the rotating shaft is fitted and installed on the top of the lifting cylinder. The lifting cylinder drives the rotating shaft to move in the vertical direction.
[0011] In a preferred embodiment of the present utility model, a transfer motor is provided at the top of the rotating shaft. The transfer motor controls the rotation of the rotating shaft. A plurality of transfer arms are evenly distributed along the circumferential direction outside the rotating shaft. A transfer gripper is provided at the end of the transfer arm, and the transfer gripper is used for gripping the wafer.
[0012] In a preferred embodiment of the present utility model, a loading positioning mechanism and an unloading positioning mechanism are provided on the top of the brushing platform. The loading positioning mechanism and the unloading positioning mechanism are arranged side by side on one side of the transfer assembly.
[0013] In a preferred embodiment of the present utility model, a loading manipulator is provided on the top of the brushing platform. A loading chuck is provided on one side of the loading manipulator, and an unloading chuck is provided on the other side of the loading manipulator.
[0014] In a preferred embodiment of the present utility model, both the loading chuck and the unloading chuck are two. The two loading chucks and the two unloading chucks are all arranged along an arc trajectory outside the loading manipulator.
[0015] In a preferred embodiment of the present utility model, the liquid medicines in the first chemical adding mechanism and the second chemical adding mechanism are different.
[0016] The above technical solution of the present utility model has the following advantages compared with the prior art:
[0017] By providing a rotatable transfer assembly, the synchronous rotation of multiple outer transfer arms is realized, and multiple wafers can be grabbed at the same time, and the wafers in different processes can be transferred to the next process respectively, improving the wafer cleaning efficiency. In addition, by providing a first cleaning mechanism and a second cleaning mechanism to clean the wafers in two processes, the liquid medicines added in the two cleaning processes are different, improving the cleaning degree of the wafer cleaning. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the specific embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required to be used in the description of the specific embodiments or the prior art. Obviously, some of the following drawings are embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0019] Figure 1 is a three-dimensional structural schematic diagram of a wafer brushing machine according to an embodiment of the present utility model;
[0020] Figure 2 is a top view of a wafer brushing machine according to an embodiment of the present utility model;
[0021] Figure 3It is a side view of the wafer scrubbing machine according to the embodiment of the present utility model.
[0022] In the figure: 1, scrubbing platform; 2, loading chuck; 3, loading positioning mechanism; 4, unloading positioning mechanism; 5, first cleaning mechanism; 6, transfer motor; 7, second cleaning mechanism; 8, transfer arm; 9, transfer gripper; 10, wafer; 11, scrubbing mechanism; 12, drying mechanism; 13, fixed seat; 14, lifting cylinder; 15, unloading chuck; 16, loading manipulator; 17, first chemical adding mechanism; 18, second chemical adding mechanism; 19, rotating shaft; 20, mounting seat; 21, support column. Specific embodiments
[0023] In order to more clearly understand the above-mentioned objects, features and advantages of the present utility model, the present utility model will be further described in detail below in conjunction with specific embodiments. It should be noted that, without conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.
[0024] In the following description, many specific details are set forth in order to fully understand the present utility model. However, the present utility model can also be implemented in other ways different from those described herein. Therefore, the protection scope of the present utility model is not limited by the specific embodiments disclosed below.
[0025] Embodiment 1
[0026] See Figures 1 - 3 As shown, the present utility model provides a wafer scrubbing machine, including: a scrubbing platform 1 and a transfer assembly disposed on the scrubbing platform 1;
[0027] On the top of the scrubbing platform 1 and outside the transfer assembly, a first cleaning mechanism 5, a second cleaning mechanism 7, a scrubbing mechanism 11 and a drying mechanism 12 are sequentially arranged;
[0028] On one side of the first cleaning mechanism 5, a first chemical adding mechanism 17 is provided, and on one side of the second cleaning mechanism 7, a second chemical adding mechanism 18 is provided;
[0029] The transfer assembly grabs the wafer 10 and performs cleaning, scrubbing and drying in sequence.
[0030] It should be noted that by setting a rotatable transfer assembly and arranging cleaning devices corresponding to multiple cleaning processes outside the transfer assembly, the automatic cleaning of the wafer 10 is realized, and at the same time, the wafer 10 after cleaning is dried and stored, improving the storage safety of the wafer 10.
[0031] According to the embodiment of the present utility model, the transfer assembly includes a fixed seat 13 fixedly installed on the top of the scrubbing platform 1. On the top of the fixed seat 13, a plurality of support columns 21 are provided, and on the top of the support columns 21, a mounting seat 20 is provided.
[0032] Specifically, a jacking cylinder 14 is provided at the bottom of the mounting base 20 and inside multiple support columns 21. A rotating shaft 19 is provided at the top of the mounting base 20. The rotating shaft 19 is fitted and mounted on the top of the jacking cylinder 14, and the jacking cylinder 14 drives the rotating shaft 19 to move in the vertical direction.
[0033] Further, a transfer motor 6 is provided at the top of the rotating shaft 19. The transfer motor 6 controls the rotation of the rotating shaft 19. A plurality of transfer arms 8 are circumferentially distributed along the outer side of the rotating shaft 19. A transfer gripper 9 is provided at the end of the transfer arm 8, and the transfer gripper 9 is used for gripping the wafer 10.
[0034] According to an embodiment of the present invention, a loading positioning mechanism 3 and an unloading positioning mechanism 4 are provided on the top of the brushing platform 1. The loading positioning mechanism 3 and the unloading positioning mechanism 4 are arranged in parallel on one side of the transfer assembly.
[0035] Further, a loading manipulator 16 is provided on the top of the brushing platform 1. A loading chuck 2 is provided on one side of the loading manipulator 16, and an unloading chuck 15 is provided on the other side of the loading manipulator 16.
[0036] Specifically, both the loading chuck 2 and the unloading chuck 15 are two. The two loading chucks 2 and the two unloading chucks 15 are both arranged along an arc trajectory on the outer side of the loading manipulator 16.
[0037] According to an embodiment of the present invention, the liquid medicines in the first chemical adding mechanism 17 and the second chemical adding mechanism 18 are different.
[0038] It should be noted that by providing the first cleaning mechanism 5 and the second cleaning mechanism 7 to clean the wafer 10 in two processes, and the liquid medicines added in the two cleaning processes are different, the cleaning degree of the wafer 10 is improved.
[0039] In summary, by providing a rotatable transfer assembly, the synchronous rotation of multiple outer transfer arms is realized, and multiple wafers 10 can be grabbed simultaneously, and the wafers 10 in different processes can be transferred to the next process respectively, improving the cleaning efficiency of the wafers 10.
[0040] The technical features of the above embodiments can be combined arbitrarily. For the sake of concise description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.
[0041] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present utility model. Various modifications to the above embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present utility model. Therefore, the present utility model will not be limited to the above embodiments shown herein, but rather should be accorded the widest scope consistent with the principles and novel features disclosed herein.
[0042] The above are only specific embodiments of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model can easily conceive of changes or substitutions, which should all be covered within the protection scope of the present utility model. Therefore, the protection scope of the present utility model should be subject to the protection scope of the claimed rights.
Claims
1. A wafer scrubbing machine, comprising: A brushing platform and a transfer component arranged on the brushing platform; characterized in that, A first cleaning mechanism, a second cleaning mechanism, a brushing mechanism and a drying mechanism are sequentially arranged on the top of the brushing platform and outside the transfer component; A first chemical adding mechanism is arranged on one side of the first cleaning mechanism, and a second chemical adding mechanism is arranged on one side of the second cleaning mechanism; The transfer component grabs the wafers and performs cleaning, brushing and drying in sequence.
2. The wafer scrubber according to claim 1, wherein The transfer component includes a fixed seat fixedly installed on the top of the brushing platform, a plurality of support columns are arranged on the top of the fixed seat, and a mounting seat is arranged on the top of the support columns.
3. A wafer scrubber according to claim 2, wherein A lifting cylinder is arranged at the bottom of the mounting seat and inside the plurality of support columns. A rotating shaft is arranged on the top of the mounting seat. The rotating shaft is fitted and installed on the top of the lifting cylinder, and the lifting cylinder drives the rotating shaft to move in the vertical direction.
4. A wafer scrubbing machine according to claim 3, wherein, A transfer motor is arranged on the top of the rotating shaft. The transfer motor controls the rotation of the rotating shaft. A plurality of transfer arms are circumferentially and evenly distributed on the outer side of the rotating shaft. A transfer claw is arranged at the end of the transfer arm, and the transfer claw is used for clamping the wafers.
5. A wafer scrubbing machine according to claim 1, characterized in that, A loading positioning mechanism and an unloading positioning mechanism are arranged on the top of the brushing platform. The loading positioning mechanism and the unloading positioning mechanism are arranged side by side on one side of the transfer component.
6. A wafer scrubbing machine according to claim 1, characterized in that A loading manipulator is arranged on the top of the brushing platform. A loading plug is arranged on one side of the loading manipulator, and an unloading plug is arranged on the other side of the loading manipulator.
7. A wafer scrubbing machine according to claim 6, characterized in that, Both the loading plug and the unloading plug are two. The two loading plugs and the two unloading plugs are arranged on the outer side of the loading manipulator along an arc track.
8. A wafer scrubbing machine according to claim 1, wherein, The liquid medicines in the first chemical adding mechanism and the second chemical adding mechanism are different.