Horizontal adjusting device for wafer transfer robot in semiconductor atomic layer deposition process

Abstract

The utility model discloses a horizontal adjusting device for a wafer transfer robot in a semiconductor atomic layer deposition process, and relates to the technical field of wafer transfer robots. Comprising four wafer supporting arms, horizontal adjusting tables are connected to the four wafer supporting arms, connecting sliding blocks are connected to the horizontal adjusting tables, guide rails, guide rail sliding blocks and bidirectional ball screws are connected to the connecting sliding blocks, guide rail supporting frames are connected to the guide rails and the guide rail sliding blocks, and the bidirectional ball screws are connected to the guide rail supporting frames. The bidirectional ball screw is connected with a bearing and a bearing fixing ring, the guide rail supporting frame and the bearing are connected with a bottom connecting piece and an upper connecting piece, and the upper connecting piece is connected with a motor. According to the utility model, the two bidirectional ball screws are synchronously controlled by the belt and the pulley device, and the four wafer supporting arms are ensured to be opened and closed at equal intervals through the cooperation of the guide rail, the guide rail sliding block, the connecting sliding block, the horizontal adjusting table and the wafer supporting arms.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer handling robots, and particularly relates to a horizontal adjustment device for a wafer handling robot in a semiconductor atomic layer deposition process. Background Technique

[0002] A wafer handling robot is a robot specifically used for handling wafers in a semiconductor atomic layer deposition process. The wafer robot uses a laser sensor to identify and position the wafers in the front-opening wafer cassette and the quartz boat slot, and then controls the output shaft through a motor. The pulley connected to the output shaft is connected to the pulleys on two bidirectional ball screws through a belt, so as to realize the equal-distance opening and closing of different degrees between the four support arms, and further realize the handling task between the wafer cassette and the quartz boat.

[0003] During actual use, ceramic wafer forks are installed on the wafer support arms, and the wafers are finally placed on the ceramic wafer forks. Since the lead screw nut is connected to the connecting slider, and the connecting slider is finally connected to the wafer support arm through a horizontal adjustment table, under the action of the gravity of the wafer support arm, the ceramic wafer fork, and the wafer, the elastic deformation caused by the increase in the axial distance between the lead screw nut and the lead screw, as well as the cumulative errors generated during the processing and assembly processes, will all cause the horizontal of each wafer to deviate to varying degrees relative to the front-opening wafer cassette and the quartz boat slot. In this case, when the wafer is repeatedly handled between the front-opening wafer cassette and the quartz boat, it may cause friction between the wafer and the front-opening wafer cassette and the quartz boat slot opening, and when the wafer is taken out from the front-opening wafer cassette and the quartz boat, it may cause friction between the wafer and the ceramic wafer fork, thereby generating particles and affecting the process quality. For this reason, a horizontal adjustment device for a wafer handling robot in a semiconductor atomic layer deposition process is proposed. Summary of the Utility Model

[0004] The purpose of the utility model is to solve the problem that the wafer support arm deviates horizontally to varying degrees relative to the front-opening wafer cassette and the quartz boat slot under the influence of the gravity of the ceramic wafer fork and the wafer, as well as the cumulative errors of the processing error and the assembly error. The utility model provides a horizontal adjustment device for a wafer handling robot in a semiconductor atomic layer deposition process.

[0005] The utility model specifically adopts the following technical solutions to achieve the above purpose:

[0006] A horizontal adjustment device for a wafer handling robot in a semiconductor atomic layer deposition process. It includes four wafer support arms, and the four wafer support arms are connected to a connecting slider through a horizontal adjustment table.

[0007] Further, a left double - lead ball screw and a right double - lead ball screw are connected to the connecting slider, and the connecting slider is also connected to a guide rail and a guide rail slider, and the guide rail and the guide rail slider are connected to a guide rail support frame.

[0008] Further, the left double - lead ball screw is connected to the second wafer support arm and the third wafer support arm through the connecting slider and the horizontal adjustment table, and the right double - lead ball screw is connected to the first wafer support arm and the fourth wafer support arm through the slider and the horizontal adjustment table.

[0009] Further, bearings and bearing fixing rings are connected to the left double - lead ball screw and the right double - lead ball screw. The guide rail support frame and the bearings are connected to a bottom connecting piece and an upper connecting piece. A motor is connected to the upper connecting piece. A pulley is connected to the upper parts of the output shaft of the motor, the left double - lead ball screw and the right double - lead ball screw, and the pulley rotates through a belt.

[0010] The beneficial effects of the present utility model are as follows:

[0011] The present utility model synchronously controls two double - lead ball screws through a belt and pulley device. The two double - lead ball screws are connected to four wafer support arms through connecting sliders, guide rails, guide rail sliders and horizontal adjustment tables. Through the cooperation adjustment of the top screws of the horizontal adjustment table and the top screws of the wafer support arms, the elastic deformation caused by the increase in the axial distance between the screw nut and the screw due to the gravity of the wafer support arm, the ceramic wafer fork and the wafer, and the cumulative error generated during the processing and assembly processes, which leads to the horizontal inclination of the wafer support arm, are offset. It ensures that when the four wafer support arms open and close to different degrees, the distances between the four wafer support arms remain equal. Description of the Drawings

[0012] Figure 1 is a three - dimensional structural schematic diagram of the present utility model;

[0013] Figure 2 is a front view of the present utility model;

[0014] Figure 3 is a right view of the present utility model;

[0015] Figure 4 is a sectional view of the front view of the present utility model;

[0016] Reference numerals: 1, the first wafer support arm; 2, the second wafer support arm; 3, the third wafer support arm; 4, the fourth wafer support arm; 5, the horizontal adjustment table; 6, the connecting slider; 7, the bottom connecting member; 8, the upper connecting member; 9, the left double lead screw; 10, the right double lead screw; 11, the guide rail support frame; 12, the guide rail and the guide rail slider; 13, the top screw hole of the wafer support arm; 14, the top screw hole of the horizontal adjustment table; 15, the pulley; 16, the belt; 17, the motor; 18, the bearing; 19, the bearing fixing ring; 20, the ball screw nut.

[0017] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Apparently, the described embodiments are some, but not all, of the embodiments of the present utility model. Usually, the components of the embodiments of the present utility model described and illustrated in the drawings here can be arranged and designed in various different configurations.

[0018] Therefore, the following detailed description of the embodiments of the present utility model provided in the drawings is not intended to limit the scope of the claimed present utility model, but merely represents the selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts fall within the scope of protection of the present utility model.

[0019] It should be noted that: similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. In addition, the terms "first", "second", etc. are only used for descriptive distinction and cannot be understood as indicating or implying relative importance.

[0020] All the electrical components appearing in this text are electrically connected to the external main controller and the 220V mains power supply, and the main controller can be a conventional known device such as a computer for control.

[0021] In the description of the embodiments of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "inner", "outer", "upper", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present utility model is usually placed when in use. It is only for the convenience of describing the present utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present utility model. Detailed implementation manners

[0022] Such as Figures 1-4As shown in the figure, a horizontal adjustment device for a wafer handling robot in a semiconductor atomic layer deposition process includes four wafer support arms, namely a first wafer support arm (1), a second wafer support arm (2), a third wafer support arm (3), and a fourth wafer support arm (4). Wafer support arm set screws holes (13) for adjusting the horizontality of the wafer support arms are provided on the four wafer support arms. A horizontal adjustment table (5) is connected to each of the four wafer support arms. Horizontal adjustment table set screws holes (14) for adjusting the horizontality of the horizontal adjustment table are provided on the horizontal adjustment tables (5). A connecting slider (6) is connected to the horizontal adjustment table. A guide rail and a guide rail slider (12), a left double lead screw (9), and a right double lead screw (10) are connected to the connecting slider (6). A guide rail support frame (11) is connected to the guide rail and the guide rail slider (12). Bearings (18) and bearing fixing rings (19) are connected to both the left double lead screw (9) and the right double lead screw (10). A bottom connecting member (7) and an upper connecting member (8) are connected to the guide rail support frame (11) and the bearing (18). A motor (17) is connected to the upper connecting member (8). Pulleys (15) are connected to the output shaft of the motor (17), the upper parts of the left double lead screw (9), and the right double lead screw (10). In this embodiment, during use, the pulley (15) on the output shaft of the motor (17) drives the other pulleys (15) to rotate synchronously, ensuring the up-and-down synchronous movement between the four wafer bearing arms.

[0023] As Figures 1-4As shown in the figure, the ball screw nut (20) of the left double - acting ball screw (9) is connected to the second wafer support arm (2) and the third wafer support arm (3) through the connecting slider (6) and the horizontal adjustment table (5), and the right double - acting ball screw (10) is connected to the first wafer support arm and the fourth wafer support arm through the connecting slider (6) and the horizontal adjustment table (3). Since the thread directions of the upper and lower parts of the double - acting ball screw are opposite and the pitches are the same, the moving directions of the first wafer support arm (1) and the second wafer support arm (2) are always opposite to the moving directions of the third wafer support arm (3) and the fourth wafer support arm (4), and the moving distances of the four wafer support arms are equal. In this embodiment, during use, by adjusting the tightness of the set screws in the horizontal adjustment table set - screw hole (14) and the wafer support arm set - screw hole (13), the elastic deformation caused by the increase in the axial distance between the ball screw nut (20) and the double - acting ball screw under the gravity of the wafer support arm, the ceramic wafer fork, and the wafer is compensated, as well as the cumulative errors generated during the processing and assembly processes, which result in different degrees of horizontal inclination of the wafer support arms. This ensures that when the four wafer support arms open and close to different degrees, the distances between the four wafer support arms remain equal, thus avoiding the problem that when the wafer handling robot repeatedly transports wafers between the front - opening wafer cassette and the quartz boat, the friction between the wafer and the front - opening wafer cassette and the notch of the quartz boat, and the friction between the wafer and the ceramic wafer fork when the wafer is taken out from the front - opening wafer cassette and the quartz boat generates microparticles, which ultimately affects the quality of the process. As Figure 1 , 2 shown, there are four wafer support arms, namely the first wafer support arm (1), the second wafer support arm (2), the third wafer support arm (3), and the fourth wafer support arm (4). Wafer support arm set - screw holes (13) for adjusting the horizontal level of the wafer support arms are provided on all four wafer support arms. A horizontal adjustment table (5) is connected to the four wafer support arms, and horizontal adjustment table set - screw holes (14) for adjusting the horizontal level of the horizontal adjustment table are provided on the horizontal adjustment table (5). The wafer support arm set - screw hole (13) and the horizontal adjustment table set - screw hole (14), in this embodiment, during use, ensure the horizontal adjustment of the four wafer support arms in the up - down, left - right directions by adjusting the tightness of the set screws.

[0024] As Figure 1 , 2As shown, bearings (18) and bearing fixing rings (19) that play a role in fixing the bearings (18) are provided at both the upper and lower ends of the left double - lead ball screw (9) and the right double - lead ball screw (10). The ball screw nuts (20) of the left double - lead ball screw (9) and the right double - lead ball screw (10) are connected to the connecting slider (6). The connecting slider (6) is connected to four wafer support arms through a horizontal adjustment table (6). When the first wafer support arm (1) and the second wafer support arm (2) or the third wafer support arm (3) and the fourth wafer support arm (4) move upward, under the influence of the upward axial tension of the left double - lead ball screw (9) and the right double - lead ball screw (10), the second wafer support arm (2) and the third wafer support arm (4) connected to the left double - lead ball screw (19), the first wafer support arm and the fourth wafer support arm connected to the right double - lead ball screw (19), and the bearings (18) as a whole will have different degrees of upward displacement, resulting in different moving spacings between the four wafer support arms. In this embodiment, during use, the bearing fixing ring (19) avoids the displacement in the above - mentioned situation, ensuring that when the four wafer support arms open and close, the spacings between the four wafer support arms are equal. In summary, during use, the pulley (15) on the output shaft of the motor (17) drives the pulleys (15) on the left double - lead ball screw (19) and the right double - lead ball screw (10) to rotate synchronously, ensuring the up - and - down synchronous movement between the four wafer bearing arms. During use, by adjusting the tightness of the set screws in the horizontal adjustment table set - screw holes (14) and the wafer support arm set - screw holes (13), the elastic deformation caused by the increase in the axial spacing between the ball screw nut (20) and the ball screw under the action of the gravity of the wafer support arm, the ceramic wafer fork, and the wafer, as well as the cumulative errors generated during the processing and assembly processes, which lead to different degrees of horizontal inclination of the four wafer support arms, are compensated. This ensures that when the four wafer support arms open and close to different degrees, the spacings between the four wafer support arms remain equal. The bearing fixing ring (19) avoids the situation where, under the influence of the upward axial tension of the left double - lead ball screw (9) and the right double - lead ball screw (10), the second wafer support arm (2) and the third wafer support arm (4) connected to the left double - lead ball screw (19), the first wafer support arm and the fourth wafer support arm connected to the right double - lead ball screw (19), and the bearings (18) as a whole will have different degrees of upward displacement, ensuring that when the four wafer support arms open and close to different degrees, the spacings between the four wafer support arms are equal.

[0025] The basic principles, main features and advantages of the present utility model have been shown and described above. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. What is described in the above embodiments and the specification is only the principle of the present utility model. Without departing from the spirit and scope of the present utility model, various changes and improvements will occur to the present utility model, and all these changes and improvements fall within the scope of the present utility model claimed. The scope of protection required by the present utility model is defined by the appended claims and their equivalents.

Claims

1. A horizontal adjustment device for a wafer handling robot in a semiconductor atomic layer deposition process, characterized in that, It includes four wafer support arms, namely the first wafer support arm (1), the second wafer support arm (2), the third wafer support arm (3), and the fourth wafer support arm (4). Wafer support arm setscrew holes (13) for adjusting the level of the wafer support arms are provided on all of the four wafer support arms. A horizontal adjustment table (5) is connected to each of the four wafer support arms. Horizontal adjustment table setscrew holes (14) for adjusting the level of the horizontal adjustment table are provided on each of the horizontal adjustment tables (5). A connecting slider (6) is connected to the horizontal adjustment table. A guide rail and guide rail slider (12), a left double lead screw (9), and a right double lead screw (10) are connected to the connecting slider (6).

2. The horizontal adjustment device for a wafer handling robot in a semiconductor atomic layer deposition process according to claim 1, characterized in that, A guide rail support frame (11) is connected to the guide rail and guide rail slider (12). Bearings (18) and bearing fixing rings (19) are connected to both the left double lead screw (9) and the right double lead screw (10). A bottom connecting piece (7) and an upper connecting piece (8) are connected to the guide rail support frame (11) and the bearing (18). A motor (17) is connected to the upper connecting piece (8). Pulleys (15) are connected to the output shaft of the motor (17), the upper parts of the left double lead screw (9), and the upper parts of the right double lead screw (10). The pulleys (15) rotate synchronously through a belt (16).

3. The horizontal adjustment device for a wafer handling robot in a semiconductor atomic layer deposition process according to claim 2, characterized in that, Bearings (18) and bearing fixing rings (19) that play a role in fixing the bearings (18) are provided at both the upper and lower ends of the left double lead screw (9) and the right double lead screw (10).

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