Positioning device and production line

Abstract

The utility model provides a positioning device and a production line. The positioning device comprises a bearing part, a positioning part and a driving part, the bearing part is suitable for bearing the wafer in the reverse direction of the gravity direction. The positioning part is arranged on one side, close to the bearing part, of the wafer in the gravity direction; the driving part is configured to drive the positioning part to rotate around a rotating axis, and the rotating axis is perpendicular to the gravity direction. The peripheral wall of the wafer comprises a first part and a second part, the second part is concave relative to the first part, the positioning part is in contact with the first part when the positioning part rotates to face the first part, and the positioning part is separated from the second part when the positioning part rotates to face the second part. According to the scheme of the utility model, the positioning can be completed only by utilizing the structural characteristics of the wafer, other settings do not need to be additionally made for the wafer, and the positioning device is simple in structure and convenient to operate. Therefore, the adjusting device provided by the utility model realizes a more efficient and convenient wafer positioning mode.

Description

Technical Field

[0001] The utility model relates to the technical field of positioning devices, and particularly relates to a positioning device and a production line. Background Art

[0002] In the test applications of the semiconductor industry, most wafers have directional requirements. To meet the requirements of confirming the directionality, a positioning device is needed to adjust the wafer to a specific orientation. In the related art, the structure of the positioning device for wafers is relatively complex, and it is necessary to additionally provide a positioning structure or a sensor on the wafer that cooperates with the positioning device, and the positioning operation is relatively cumbersome. Summary of the Utility Model

[0003] The main purpose of the utility model is to propose a positioning device and a production line, which can make the way for the adjusting device to realize wafer positioning more efficient and convenient.

[0004] To achieve the above purpose, the embodiments of the utility model adopt the following technical solutions:

[0005] A positioning device for positioning a wafer, the positioning device comprising:

[0006] A carrying part adapted to carry the wafer in the direction opposite to the gravity direction;

[0007] A positioning part provided on the side of the wafer close to the carrying part along the gravity direction;

[0008] A driving part configured to drive the positioning part to rotate around a rotation axis perpendicular to the gravity direction;

[0009] Wherein, the outer peripheral wall of the wafer comprises a first part and a second part, the second part is concave relative to the first part, when the positioning part rotates to face the first part, the positioning part contacts the first part, and when the positioning part rotates to face the second part, the positioning part is spaced from the second part.

[0010] In some embodiments, the outer shape of the positioning part is a cylinder and extends along a direction parallel to the rotation axis.

[0011] In some embodiments, the carrying part comprises a first carrying member and a second carrying member arranged oppositely in the horizontal direction perpendicular to the gravity direction. Along the horizontal direction, the positioning part is located between the first carrying member and the second carrying member. The outer shapes of the first carrying member and the second carrying member are both cylinders and both extend along a direction parallel to the rotation axis.

[0012] In some embodiments, the carrying part has a carrying surface adapted to carry the wafer. During the rotation of the positioning part, in the direction opposite to the gravity direction, the minimum distance between each part of the positioning part facing the carrying surface in turn is equal.

[0013] In some embodiments, the positioning device further includes an adjusting portion, which is connected to the positioning portion and configured to be able to adjust the distance of the positioning portion relative to the bearing portion along the direction of gravity.

[0014] In some embodiments, the driving portion includes a coupling, a bearing, and a rocker. The coupling is connected to the positioning portion and rotatably connected to the bearing. The rocker is connected to the coupling so that when the rocker rotates around the rotation axis, it drives the coupling and the positioning portion to rotate synchronously.

[0015] An embodiment of the second aspect of the present invention further provides a device, including the positioning device of any of the above embodiments and a wafer.

[0016] In some embodiments, the extension trajectory of the first portion around the rotation axis is an arc, the second portion connects the two ends of the arc, and the extension trajectory of the second portion around the rotation axis is a straight line;

[0017] Or,

[0018] The extension trajectory of the outer peripheral wall of the first portion extending around the rotation axis is an arc, the second portion connects the two ends of the arc, and the extension trajectory of the second portion is V-shaped to define a notch.

[0019] In some embodiments, the extension trajectory of the outer peripheral wall of the first portion extending around the rotation axis is an arc, the second portion connects the two ends of the arc, and the extension trajectory of the second portion is V-shaped to define a notch;

[0020] Along the circumferential direction around the rotation axis, the size of the notch is larger than the size of the positioning portion.

[0021] In some embodiments, the production line further includes a cassette, which is detachably connected to the bearing portion and detachably connected to the wafer.

[0022] Compared with the prior art, the beneficial effects of the present invention are:

[0023] The positioning device of the present invention includes a bearing portion, a positioning portion, and a driving portion. On the premise that the bearing portion can carry the wafer in the reverse direction of the gravity direction, through the driving action of the driving portion on the positioning portion, when the positioning portion faces the first portion of the wafer, the positioning portion can rotate the first portion, and when the positioning portion faces the second portion of the wafer, the wafer is no longer driven by the positioning portion and remains in this position. Compared with the related art, in which an additional positioning structure or sensor cooperating with the positioning device is provided on the wafer to adjust the orientation of the wafer, the solution of the present invention only needs to utilize the structural characteristics of the wafer itself to complete the positioning, without the need for additional settings on the wafer, and the positioning device has a simple structure and convenient operation. Therefore, the method of the present invention for realizing wafer positioning by the adjusting device is more efficient and convenient. Description of the Drawings

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0025] Figure 1 A three-dimensional schematic diagram of the positioning device provided in the first embodiment of the present invention;

[0026] Figure 2 A three-dimensional schematic diagram of the combination of the positioning device, the wafer, and the cassette provided in the first embodiment of the present invention;

[0027] Figure 3 A schematic diagram of the wafer positioning state provided in the first embodiment of the present invention; wherein, the positioning part faces the first part;

[0028] Figure 4 A schematic diagram of the wafer positioning state provided in the first embodiment of the present invention; wherein, the positioning part faces the second part;

[0029] Figure 5 A schematic diagram of the wafer positioning state provided in the second embodiment of the present invention; wherein, the positioning part faces the first part;

[0030] Figure 6 A schematic diagram of the wafer positioning state provided in the second embodiment of the present invention; wherein, the positioning part faces the second part.

[0031] Explanation of the reference numerals in the drawings:

[0032] 100 - positioning device;

[0033] 110 - bearing part; 111 - first bearing member; 112 - second bearing member;

[0034] 120 - positioning part;

[0035] 130 - driving part; 131 - coupling; 132 - bearing; 133 - rocker;

[0036] 140 - adjusting part;

[0037] 200 - wafer; 210 - first part; 220 - second part; 230 - notch;

[0038] 300 - cassette;

[0039] L - rotation axis;

[0040] X - horizontal direction;

[0041] Y - gravity direction.

[0042] The realization, functional features and advantages of the present utility model will be further described in conjunction with embodiments with reference to the accompanying drawings. Specific embodiments

[0043] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts fall within the protection scope of the present utility model.

[0044] It should be noted that if there are directional indications (such as up, down, left, right, front, back,...) involved in the embodiments of the present utility model, the directional indications are only used to explain the relative positional relationship and movement conditions between components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0045] In addition, if there are descriptions such as "first", "second", etc. involved in the embodiments of the present utility model, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or", "or / and" or "and / or" appear throughout the text, their meanings include three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or a solution where A and B are satisfied simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present utility model.

[0046] In the semiconductor industry, most wafers have directional requirements. To meet the requirements for confirming the direction, it is necessary to use a positioning device to adjust the wafer to a specific orientation. In the related art, the structure of the positioning device for wafers is relatively complex, and it is necessary to additionally provide a positioning structure or sensor on the wafer that cooperates with the positioning device, and the positioning operation is relatively cumbersome.

[0047] More specifically, the applicant has found that when the wafer is produced, "trim edges" or "V-grooves" can be machined on the outer peripheral wall of the wafer according to the directional requirements. In the subsequent testing process, the "trim edges" or "V-grooves" are used as direction identification marks. In the testing process, the wafers are stored in a cassette. For those that do not have the function of automatically finding the trim edges and have requirements for the testing direction, it is necessary to unify the directions of the "trim edges" or "V-grooves" of the wafers in the cassette.

[0048] In view of this, referring to Figures 1-6 , in the embodiment of the present utility model, a positioning device 100 is provided for positioning the wafer 200. Among them, the wafer 200 is a silicon wafer used for manufacturing silicon semiconductor circuits and can be applied to the semiconductor industry. Specifically, the raw material of the wafer 200 is silicon. In the preparation process, large single crystals are made from high-purity polysilicon. After crystal growth, a silicon ingot is obtained, and then through processes such as grinding, polishing, and slicing, the wafer 200 is formed. The wafer 200 in the present utility model can be a completed wafer 200 or an incompletely prepared wafer 200. On the premise of being able to achieve the positioning function, the wafer 200 can be of any suitable type, shape, and size. The positioning device 100 includes a bearing portion 110, a positioning portion 120, and a driving portion 130.

[0049] Referring to Figures 1-2 , the bearing portion 110 is adapted to bear the wafer 200 in the reverse direction of the gravity direction Y. Thus, the bearing portion 110 can be any structure suitable for supporting the wafer 200, which is not limited here, and the bearing portion 110 can be adapted to bear multiple wafers 200.

[0050] Referring to Figures 1-2 , the positioning portion 120 is provided on the side of the wafer 200 close to the bearing portion 110 along the gravity direction Y. The driving portion 130 is configured to drive the positioning portion 120 to rotate around the rotation axis L, and the rotation axis L is perpendicular to the gravity direction Y. Among them, the driving portion 130 can drive the positioning portion 120 to rotate in any suitable manner, and the driving action of the driving portion 130 can be manually controlled or automatically controlled (more specifically, it can be that after the driving portion 130 is manually started, the driving portion 130 automatically drives, or it can be that through the setting of devices such as a controller or a sensor, the driving portion 130 is automatically started and automatically driven).

[0051] Particularly, referring to Figures 1-4, the outer peripheral wall of the wafer 200 includes a first portion 210 and a second portion 220. The second portion 220 is concave relative to the first portion 210. When the positioning portion 120 rotates to face the first portion 210, the positioning portion 120 contacts the first portion 210 and drives the wafer 200 to rotate. When the positioning portion 120 rotates to face the second portion 220, the positioning portion 120 is spaced from the second portion 220. It can be understood that the positioning portion 120 can rotate relative to the carrying portion 110, so that the outer peripheral walls of the respective portions of the positioning portion 120 can face the wafer 200 in sequence during the overall rotation of the positioning portion 120. When the positioning portion 120 faces the first portion 210, under the action of the tangential force brought by the contact between the two, the positioning portion 120 can drive the wafer 200 to rotate. Thereafter, when the second portion 220 faces the wafer 200, since the two are spaced apart, the wafer 200 is no longer under the action of the tangential driving force. Thus, when the driving portion 130 continuously drives the positioning portion 120 to rotate, if the first portion 210 of the original wafer 200 faces the positioning portion 120, the wafer 200 will be driven to a state where the second portion 220 faces the positioning portion 120 under the action of the tangential driving force. If the second portion 220 of the original wafer 200 faces the positioning portion 120, the wafer 200 will not be driven by the positioning portion 120, and the wafer 200 still maintains the state where the second portion 220 faces the positioning portion 120.

[0052] In addition, referring to Figures 1-2 , when the carrying portion 110 is adapted to carry a plurality of wafers 200, the carrying surface of the carrying portion 110 adapted to carry the wafers 200 can extend in a direction parallel to the rotation axis L, so that when the carrying portion 110 carries the respective wafers 200 at the same time, the respective wafers 200 are aligned in a direction parallel to the rotation axis L.

[0053] According to the combination of the above respective embodiments, it can be seen that the positioning device 100 of the present invention includes a carrying portion 110, a positioning portion 120, and a driving portion 130. On the premise that the carrying portion 110 can carry the wafer 200 in the reverse direction of the gravity direction Y, through the driving action of the driving portion 130 on the positioning portion 120, when the positioning portion 120 faces the first portion 210 of the wafer 200, the positioning portion 120 can rotate the first portion 210, and when the positioning portion 120 faces the second portion 220 of the wafer 200, the wafer 200 is no longer under the driving action of the positioning portion 120 and remains in this position. Compared with the related art, where an additional positioning structure or sensor cooperating with the positioning device 100 is provided on the wafer 200 to adjust the orientation of the wafer 200, the solution of the present invention only needs to utilize the structural characteristics of the wafer 200 itself to complete the positioning, without the need to make other settings for the wafer 200 additionally, and the positioning device 100 has a simple structure and convenient operation. Therefore, the way of the adjusting device of the present invention to realize the positioning of the wafer 200 is more efficient and convenient.

[0054] To make the function of the positioning part 120 to contact the wafer 200 and drive the wafer 200, and the function of the carrying part 110 to carry the wafer 200 more stable and reliable, refer to Figures 1-2 , in some embodiments, the outer shape of the positioning part 120 is a cylinder and extends along a direction parallel to the rotation axis L. In some embodiments, the carrying part 110 includes a first carrying member 111 and a second carrying member 112 arranged oppositely along the horizontal direction X perpendicular to the gravity direction. Along the horizontal direction X, the positioning part 120 is located between the first carrying member 111 and the second carrying member 112 (the positioning part 120 can be exactly in the middle of the first carrying member 111 and the second carrying member 112 along the horizontal direction X, or offset). Thus, the first carrying member 111 and the second carrying member 112 can jointly support the wafer 200, and the positioning part 120 is located between them and drives the wafer 200, which can make the driving function of the positioning part 120 more stable. Similar to the outer shape setting of the positioning part 120, the outer shapes of the first carrying member 111 and the second carrying member 112 are both cylinders and both extend along a direction parallel to the rotation axis L. In the above setting, setting the outer shapes of the positioning part 120 and / or the carrying part 110 as cylinders can drive the wafer 200 by using the outer peripheral wall of the cylinder, or support the wafer 200 by using the outer peripheral wall of the cylinder. Thus, the above outer shape setting makes the driving function or the supporting function for the wafer 200 more stable and reliable.

[0055] In addition, in some embodiments, the carrying part 110 can be fixedly arranged relative to the positioning part 120. Especially for the carrying part 110 with a cylindrical outer shape, the outer peripheral wall of the carrying part 110 can not only support the wafer 200, but also is not easy to hinder the rotation of the wafer 200. Thus, the fixedly arranged carrying part 110 can make the wafer 200 be supported more stably and will not affect the driving function of the positioning part 120 due to the slipping of the wafer 200. On the contrary, in some other embodiments, the carrying part 110 can be set to be freely rotatable, which can assist the driving function of the positioning part 120 for the first part 210 and avoid the phenomenon that the first part 210 cannot be driven.

[0056] Refer to Figures 1-4, in some embodiments, the carrying part 110 has a carrying surface adapted to carry the wafer 200. During the rotation of the positioning part 120, along the reverse direction of the gravity direction Y, the minimum distance between each part of the positioning part 120 facing the positioning part 120 and the carrying surface is equal. It can be understood that the shape of the outer peripheral wall of the positioning part 120 facing the wafer 200 is uniform, that is, the positioning part 120 can have a circular outer peripheral wall. Thus, during the rotation of the positioning part 120, whether the positioning part 120 can contact the wafer 200 is only determined by the structure of the wafer 200 itself (i.e., the structure of the first part 210 and the second part 220), thereby avoiding interference from other factors to the positioning effect of the wafer 200 and simplifying the structure of the positioning part 120.

[0057] In order to make the position of the positioning part 120 relative to the wafer 200 more accurate and stable, so as to obtain a better positioning effect of the wafer 200. Refer to Figures 1-4 , in some embodiments, the positioning device 100 further includes an adjusting part 140. The adjusting part 140 is connected to the positioning part 120 and is configured to be able to adjust the distance of the positioning part 120 along the gravity direction Y relative to the carrying part 110. It can be understood that through the adjustment of the adjusting part 140 on the positioning part 120, the height of the positioning part 120 relative to the carrying part 110 can be adjusted according to requirements (it can be adjusted when the wafer 200 is not placed, or it can be adjusted with the wafer 200 as a reference after the wafer 200 is placed), so as to ensure that the positioning part 120 can reliably contact the first part 210 during rotation, drive the wafer 200, and ensure that the positioning part 120 can be spaced from the second part 220. More specifically, in some embodiments, the adjusting part 140 can be a lifting slide table. The lifting slide table includes a driving part, a linkage part and a connecting part. The driving part can drive the linkage part in any way and make the linkage part drive the connecting part and the positioning part 120 to move. Exemplarily, the linkage part can be a screw rod. Thus, the driving part can drive the screw rod to rotate, and the rotation of the screw rod further drives the connecting part to move translationally; or the linkage part can include a slider and a chute, the slider is slidably connected to the chute, and the driving part can drive the slider and the connecting part to move translationally along the extension direction of the chute together.

[0058] Through the above-mentioned adjusting part 140, the height of the positioning part 120 can be adjusted to a suitable position according to requirements. In some embodiments, after the wafer 200 is placed on the positioning device 100, the bearing part 110 and the positioning part 120 can both be attached to the wafer 200 (when the positioning part 120 faces the first part 210), so as to jointly support the wafer 200. In other embodiments, along the reverse direction of the gravity direction Y, the minimum distance between the positioning part 120 and the wafer 200 can be less than the minimum distance between the bearing part 110 and the wafer 200, that is, the positioning part 120 can be higher than the bearing part 110. Thus, according to requirements, only the positioning part 120 can carry the wafer 200 and drive the wafer 200 to rotate.

[0059] For the specific structure of the driving part 130, refer to Figures 1-2 , in some embodiments, the driving part 130 includes a coupling 131, a bearing 132 and a rocker 133. Specifically, in some embodiments, the coupling 131 is connected to the positioning part 120 and is rotationally connected to the bearing 132, and the rocker 133 is connected to the coupling 131. When the rocker 133 rotates around the rotation axis L, the coupling 131 and the positioning part 120 are driven to rotate synchronously. It can be understood that through the above arrangement of the driving part 130, the user can operate the rocker 133 to rotate, and further drive the coupling 131 and the positioning part 120 to rotate, so as to make the driving of the positioning part 120 more simple and efficient. In addition, the above arrangement is also beneficial to reducing the overall weight of the positioning device 100, that is, the weights of the coupling 131, the bearing 132 and the rocker 133 can be set to be lighter, so as to more easily drive the positioning part 120. In other embodiments, the driving part 130 includes a motor, and the output shaft of the motor is connected to the positioning part 120 to drive the positioning part 120 to rotate.

[0060] An embodiment of the second aspect of the present invention further provides a wafer 200 production line, including the positioning device 100 and the wafer 200 in any of the above embodiments. The setting of the wafer 200 can refer to the relevant descriptions of the above embodiments, and no limitation is made here. In some embodiments, the wafer 200 production line may include a conveying device, and the conveying device can convey the wafer 200 above the bearing part 110, so that the bearing part 110 bears the wafer 200 along the reverse direction of the gravity direction Y, or the conveying device can also convey the positioned wafer 200 from the positioning device 100 to other positions.

[0061] Furthermore, for the specific structures of the first part 210 and the second part 220 of the wafer 200, refer to Figures 3-4, in one type of setting, the extension trajectory of the first part 210 around the rotation axis L is an arc, the second part 220 connects the two ends of the arc, and the extension trajectory of the second part 220 around the rotation axis L is a straight line. It can be understood that this type of wafer 200 is a trimmed wafer 200, which can be formed by horizontally cutting a circular wafer 200 along a straight-line trajectory, or can be integrally manufactured. Or, referring to Figures 5-6 , in another type of setting, the extension trajectory of the outer peripheral wall of the first part 210 extending around the rotation axis L around the rotation axis L is an arc, the second part 220 connects the two ends of the arc, and the extension trajectory of the second part 220 is V-shaped to define a notch 230. In addition to the second part 220 extending in a V-shape to define a V-shaped notch 230, the second part 220 can also have other extension trajectories to form a notch 230 with a corresponding shape. It can be understood that this type of wafer 200 is a notched wafer 200, which can be formed by cutting a part of a circular wafer 200, or can be integrally manufactured. The above two types of settings for the wafer 200 can both make the second part 220 concave relative to the first part 210, and the processing of both types of wafers 200 is relatively convenient and the processing cost is relatively low.

[0062] Based on the above embodiment in which the extension trajectory of the outer peripheral wall of the first part 210 extending around the rotation axis L is an arc, the second part 220 connects the two ends of the arc, and the extension trajectory of the second part 220 is V-shaped to define a notch 230, further, referring to Figures 5-6 , in some embodiments, along the circumferential direction around the rotation axis L, the size of the notch 230 is larger than the size of the positioning portion 120. Thereby, it can be ensured that while the size of the notch 230 is small, the positioning portion 120 will not contact the second part 220 when facing it, and thus the positioning effect can be ensured to be good.

[0063] Further, in some embodiments, the wafer 200 production line includes two positioning devices 100, and the sizes and / or shapes of the positioning portions 120 of the two positioning devices 100 are different. Thus, one of the positioning devices 100 can be used to position wafers 200 of one type of structure or size, and the other positioning device 100 can be used to position wafers 200 of another type of structure or size. Combining with the foregoing embodiments, the two positioning devices 100 can be set corresponding to the two types of wafers 200 described in the above embodiments, that is, the positioning device 100 with a larger size of the positioning portion 120 can be responsible for positioning the wafer 200 (trimmed wafer 200) whose extension trajectory of the second part 220 around the rotation axis L is a straight line, and the positioning device 100 with a smaller size of the positioning portion 120 can be responsible for positioning the wafer 200 (notched wafer 200) whose extension trajectory of the second part 220 is V-shaped.

[0064] In addition, referring to Figure 2, in some embodiments, the wafer 200 production line may further include a cassette 300. The cassette 300 can be used to store or transport the wafer 200, and the size specifications of the cassette 300 can correspond to those of the wafer 200. Thus, the cassette 300 can be in any suitable size and shape. In some embodiments, the cassette 300 is detachably connected to the carrier part 110 and detachably connected to the wafer 200. Specifically, it can be a slot connection. For example, the carrier part 110 is provided with a mounting groove, and the cassette 300 is provided with a mounting protrusion, and the mounting protrusion extends into the mounting groove to achieve the connection between the cassette 300 and the carrier part 110. With the above arrangement, the cassette 300 can play a role in carrying the wafer 200. At this time, the carrier part 110 can also carry the wafer 200; the carrier part 110 can also be spaced from the wafer 200 and indirectly carry the wafer 200 by connecting the cassette 300. In addition, the detachable cassette 300 enables the positioning device 100 to be adapted to various size specifications of the cassette 300, and the cassette 300 can be standard or customized. With the above arrangement, before positioning, only the cassette 300 needs to be placed on the carrier part 110 to start positioning. After positioning is completed, the cassette 300 can be directly taken out, so that the positioning operation is more convenient.

[0065] Benefiting from the improvements to the positioning device 100 in the above embodiments, the wafer 200 production line in the second aspect embodiment of the present invention has the same technical effects as the positioning device 100 in the above embodiments. Details are not described herein again.

[0066] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. All equivalent structural transformations made under the application concept of the present invention by using the content of the specification and drawings of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A positioning device for positioning a wafer, characterized in that, The positioning device includes: a bearing part, adapted to bear the wafer in the direction opposite to the gravity direction; a positioning part, provided on a side of the wafer close to the bearing part along the gravity direction; a driving part, configured to drive the positioning part to rotate around a rotation axis, and the rotation axis is perpendicular to the gravity direction; wherein, an outer peripheral wall of the wafer includes a first part and a second part, the second part is concave relative to the first part, when the positioning part rotates to face the first part, the positioning part contacts the first part, and when the positioning part rotates to face the second part, the positioning part is spaced from the second part.

2. The positioning device according to claim 1, wherein the outer shape of the positioning part is a cylinder and extends along a direction parallel to the rotation axis.

3. The positioning device according to claim 1, wherein the bearing part includes a first bearing member and a second bearing member arranged oppositely in a horizontal direction perpendicular to the gravity direction, along the horizontal direction, the positioning part is located between the first bearing member and the second bearing member, the outer shapes of the first bearing member and the second bearing member are both cylinders and both extend along a direction parallel to the rotation axis.

4. The positioning device according to claim 1, wherein the bearing part has a bearing surface adapted to bear the wafer, during the rotation of the positioning part, in the direction opposite to the gravity direction, the minimum distances between each part of the positioning part facing the bearing surface are all equal.

5. The positioning device according to claim 1, wherein the positioning device further includes an adjusting part, the adjusting part is connected to the positioning part and is configured to be able to adjust the distance of the positioning part relative to the bearing part along the gravity direction.

6. The positioning device according to claim 1, wherein the driving part includes a coupling, a bearing and a rocker, the coupling is connected to the positioning part and is rotatably connected to the bearing, the rocker is connected to the coupling, so that when the rocker rotates around the rotation axis, it drives the coupling and the positioning part to rotate synchronously.

7. Production line, characterized in that, including: the positioning device according to any one of claims 1-6; and, the wafer.

8. The production line according to claim 7, wherein the extension trajectory of the first part around the rotation axis is an arc, the second part connects the two ends of the arc, and the extension trajectory of the second part around the rotation axis is a straight line; or, the extension trajectory of the outer peripheral wall of the first part extending around the rotation axis around the rotation axis is an arc, the second part connects the two ends of the arc, and the extension trajectory of the second part is V-shaped to define a notch.

9. The production line according to claim 7, wherein the extension trajectory of the outer peripheral wall of the first part extending around the rotation axis around the rotation axis is an arc, the second part connects the two ends of the arc, and the extension trajectory of the second part is V-shaped to define a notch; Circumferentially along the circumferential direction around the rotation axis, the size of the notch is larger than the size of the positioning portion.

10. The production line according to claim 7, characterized in that the production line further includes a cartridge, the cartridge being detachably connected to the carrying portion and detachably connected to the wafer.

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