Square rectifier bridge

Abstract

The utility model discloses a square rectifier bridge, which belongs to the technical field of rectifier bridges and comprises a rubber shell with a containing groove on the top surface. The rectifier bridge body comprises a frame and a plurality of pins, the frame is arranged in the accommodating groove, and the pins are arranged at the top of the frame and extend out of the accommodating groove upwards; the soft pouring sealant is encapsulated in the accommodating groove and wraps the frame; the hard pouring sealant is encapsulated in the accommodating groove and is positioned on the top surface of the soft pouring sealant; according to the utility model, the soft pouring sealant is arranged to protect the chip on the frame, so that when the working temperature changes drastically, the soft and elastic characteristics of the soft pouring sealant are used as a buffer zone to reduce the stress on the chip, thereby reducing the risk of fracture, avoiding the failure of the product, prolonging the service life, and reducing the production cost. And by arranging the hard pouring sealant, the frame can be protected from being influenced by the external environment, and the composite functions of heat conduction, insulation, moisture resistance, pressure resistance, supporting and the like are realized.

Description

Technical Field

[0001] The utility model relates to the technical field of rectifier bridges, and particularly relates to a square rectifier bridge. Background Art

[0002] A square rectifier bridge is a circuit that uses the one-way conduction property of diodes for rectification and is commonly used to convert alternating current into direct current. The potting process of a traditional square rectifier bridge is to place the rectifier bridge body into a plastic case, then fill the plastic case with epoxy resin glue and cure it to complete the encapsulation of the frame. Among them, the epoxy resin glue has the characteristics of high hardness and good strength after curing, and has strong anti-environmental interference ability.

[0003] However, the current square rectifier bridge has poor temperature change resistance. Specifically, when the temperature changes violently during operation, it will cause the molecular structure of the epoxy resin glue to change, thereby applying stress to the chips on the frame, resulting in a risk of fracture and even product failure, thus reducing the service life of the product. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a square rectifier bridge, which solves the technical problem that the existing square rectifier bridge has poor temperature change resistance and low service life.

[0005] The utility model discloses a square rectifier bridge, comprising:

[0006] A plastic case with a receiving groove on the top surface;

[0007] A rectifier bridge body, including a frame and a plurality of pins, and the frame is placed in the receiving groove, and the pins are all arranged on the top of the frame and extend upward out of the receiving groove;

[0008] A soft potting glue, potted in the receiving groove and wrapping the frame;

[0009] A hard potting glue, potted in the receiving groove and located on the top surface of the soft potting glue.

[0010] In this application, a soft potting glue is provided to protect the chips on the frame. Thus, when the working temperature changes violently, the soft and elastic texture of the soft potting glue is used as a buffer zone to reduce the stress on the chips, thereby reducing the risk of fracture and avoiding product failure, and further extending the service life. By setting the hard potting glue, the frame can be protected from the external environment, and composite functions such as heat conduction, insulation, moisture resistance, voltage resistance, and support can be achieved.

[0011] Based on the above technical solutions, the solution of this application can be further improved as follows:

[0012] Preferably, the soft potting adhesive is a silicone potting adhesive, and the hard potting adhesive is an epoxy black adhesive; with this solution, a soft elastomeric protective layer can be formed to resist the mechanical shock and thermal shock suffered by the components, and has good weather resistance, durability, insulation, compressive resistance, flame retardancy and safety.

[0013] Preferably, the center of the bottom of the receiving groove has a first convex post, and a positioning through hole is coaxially provided on the top surface of the first convex post; with this solution, it is convenient for the positioning of the square rectifier bridge, improving the accuracy and portability of installation, and the stability after installation.

[0014] Preferably, it further includes:

[0015] A heat sink, embedded in the bottom surface of the plastic case; with this solution, the heat generated by the rectifier bridge can be effectively conducted to the air, thereby reducing the working temperature, reducing the failures of the rectifier bridge caused by overheating, improving the stability and reliability of the device, optimizing the working environment, enabling it to work at a lower temperature, thereby improving the rectification efficiency, and accelerating the response speed and performance.

[0016] Preferably, an embedding groove matching the heat sink is provided on the bottom surface of the plastic case, the center of the bottom of the embedding groove has a second convex post, the positioning through hole coaxially penetrates the second convex post, and an installation through hole for sleeving on the second convex post is provided on the bottom surface of the heat sink; with this solution, it not only avoids interfering with the insertion of the positioning through hole, but also improves the stability of the heat sink embedding, reducing the probability of its falling off.

[0017] Preferably, a plurality of positioning blocks are provided on the outer periphery of the second convex post, and a plurality of positioning grooves are provided on the inner periphery of the installation through hole, and the positioning blocks and the positioning grooves correspond one by one; with this solution, the contact area with the installation through hole is enhanced, thereby improving the installation stability of the heat sink and further reducing the probability of its falling off.

[0018] Through the above technical solutions, the following beneficial effects are achieved by the present utility model:

[0019] In this application, by providing a soft potting adhesive to protect the chips on the frame, when the working temperature changes drastically, the soft and elastic texture is used as a buffer zone to reduce the stress on the chips, thereby reducing the risk of fracture and avoiding product failure, and then extending the service life. By further providing a hard potting adhesive, the frame can be protected from the external environment, and composite functions such as heat conduction, insulation, moisture resistance, pressure resistance, and support can be achieved. Description of the Drawings

[0020] In order to more clearly illustrate the specific embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0021] Figure 1 The front view sectional view of the square rectifier bridge according to the specific embodiment of the present utility model;

[0022] Figure 2 For Figure 1 The top view of the plastic case in the shown square rectifier bridge;

[0023] Figure 3 For Figure 1 The bottom view of the plastic case in the shown square rectifier bridge;

[0024] Figure 4 For Figure 1 The top view of the rectifier bridge body in the shown square rectifier bridge;

[0025] Figure 5 For Figure 1 The front view sectional view of the rectifier bridge body in the shown square rectifier bridge;

[0026] Figure 6 For Figure 1 The bottom view of the heat sink in the shown square rectifier bridge;

[0027] Figure 7 For Figure 1 The front view sectional view of the square rectifier bridge before potting;

[0028] Explanation of reference numerals:

[0029] 1. Plastic case; 2. Rectifier bridge body; 3. Soft potting compound; 4. Hard potting compound; 5. Heat sink;

[0030] 11. Accommodating groove; 12. First convex column; 13. Positioning through hole; 14. Embedding groove; 15. Second convex column; 16. Positioning block; 21. Frame; 22. Pin; 51. Mounting through hole; 52. Positioning groove. Specific embodiments

[0031] The following will describe in detail the embodiments of the technical solutions of the present utility model in conjunction with the drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present utility model, so they are only examples and cannot be used to limit the protection scope of the present utility model.

[0032] First of all, it should be noted that some orientation terms involved in the following description to clearly illustrate the technical solution of the present utility model, such as the terms "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., are all meanings analogized according to the normal orientation of the components in the square rectifier bridge. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model.

[0033] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Therefore, the features defined with "first" and "second" may explicitly or implicitly include one or more of the said features.

[0034] In this application, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0035] To better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the specification drawings and specific embodiments.

[0036] Embodiment:

[0037] As Figure 1 shown, the embodiment of the present application discloses a square rectifier bridge, which can reduce the stress suffered by the chip due to the change of the molecular structure of the material caused by temperature change, thereby improving the stress resistance of the product and the service life. Its specific structure includes: a plastic case 1, a rectifier bridge body 2, a soft potting compound 3 and a hard potting compound 4.

[0038] As Figure 2 and Figure 3 shown, the top surface of the plastic case 1 has a receiving groove 11. The plastic case 1 is specifically square, and there is a cut corner for positioning at one corner; the shape of the receiving groove 11 is consistent with that of the plastic case 1, thereby improving the volume; the plastic case 1 is preferably an epoxy resin plastic case, which has good corrosion resistance, can provide excellent protection, avoid damage to internal components caused by the external environment, and has high strength and hardness, can withstand a certain impact and pressure, improving the durability and reliability, and also has good electrical insulation performance, which is suitable for the protection and insulation of electronic devices.

[0039] AsFigure 4 and Figure 5 As shown in Figure 5 , the rectifier bridge body 2 includes a frame 21 and a plurality of pins 22. The frame 21 is placed in the receiving groove 11, and the pins 22 are all arranged on the top of the frame 21 and extend upward out of the receiving groove 11. Specifically, the frame 21 is formed by making a bridge connection of four rectifier silicon chips and has a square structure that matches the receiving groove 11 as a whole.

[0040] As Figure 1 shown in Figure 1 , the soft potting glue 3 is potted in the receiving groove 11 and wraps the frame 21. After curing, it exhibits higher elasticity and toughness, so that it can effectively absorb and disperse stress when subjected to external impact or vibration, protect the potted electronic components from damage, and has good heat resistance, and can maintain stable performance within a wide temperature range, and is suitable for applications under various extreme temperature conditions.

[0041] As Figure 1 shown in Figure 1 , the hard potting glue 4 is potted in the receiving groove 11 and is located on the top surface of the soft potting glue 3. After curing, it exhibits relatively high hardness, thus providing excellent mechanical strength, being able to effectively resist external impact and extrusion, and also having excellent adhesion, being able to adhere firmly to ensure the stability and reliability of the potting effect.

[0042] In this application, by setting the soft potting glue 3 to protect the chips on the frame 21, when the working temperature changes violently, the soft and elastic characteristics are used as a buffer zone to reduce the stress on the chips, thereby reducing the risk of fracture and avoiding product failure, and further extending the service life. By setting the hard potting glue 4, the frame 21 can be protected from the external environment, and composite functions such as heat conduction, insulation, moisture resistance, voltage resistance, and support can be achieved.

[0043] In some embodiments, the soft potting glue 3 is silicone potting glue.

[0044] Specifically, the silicone potting glue is preferably: Dow Corning 4195L silicone coating material - low viscosity type, which can be used to protect and passivate the surface of high - voltage semiconductor junctions and form a soft elastomeric protective layer to resist the mechanical shock and thermal shock suffered by the components, but is not limited to this and no specific limitation is made.

[0045] In this embodiment, the hard potting glue 4 is epoxy black glue.

[0046] Specifically, the epoxy black glue includes epoxy resin and a curing agent, which has excellent bonding strength, can firmly bond various materials to ensure the potting effect; has low viscosity, good fluidity, and is easy to penetrate into the gaps of the product to ensure the integrity and sealing of the potting; and has no bubbles after curing, with a flat, shiny, and high-hardness surface; in addition, it also has good weather resistance, durability, insulation, compressive resistance, flame retardancy, and safety, and has good use effects.

[0047] In some embodiments, as Figure 1 , Figure 2 and Figure 7 shown, the center of the bottom of the receiving groove 11 has a first convex column 12, and a positioning through hole 13 coaxial with it is provided on the top surface of the first convex column 12, which facilitates the positioning of the square rectifier bridge, improves the accuracy and portability of installation, and the stability after installation.

[0048] In some embodiments, as Figure 1 and Figure 7 shown, it further includes: a heat sink 5, which is embedded in the bottom surface of the plastic case 1. The heat sink 5 is preferably an aluminum sheet, but it can also be others, without specific limitation; it can effectively conduct the heat generated by the rectifier bridge to the air, thereby reducing the working temperature, reducing the failures of the rectifier bridge due to overheating, improving the stability and reliability of the device, optimizing the working environment, enabling it to work at a lower temperature, thereby improving the rectification efficiency, and accelerating the response speed and performance.

[0049] Based on the above embodiments, as Figure 3 and Figure 6 shown, an embedding groove 14 matching the heat sink 5 is provided on the bottom surface of the plastic case 1. The center of the bottom of the embedding groove 14 has a second convex column 15, and the positioning through hole 13 coaxially penetrates the second convex column 15. An installation through hole 51 for sleeving on the second convex column 15 is provided on the bottom surface of the heat sink 5.

[0050] Through the above settings, it not only avoids interfering with the insertion of the positioning through hole 13, but also improves the stability of the embedding of the heat sink 5 and reduces the probability of its falling off.

[0051] In this embodiment, as Figure 3 and Figure 6 shown, a plurality of positioning blocks 16 are provided on the outer periphery of the second convex column 15, and a plurality of positioning grooves 52 are provided on the inner periphery of the installation through hole 51, and the positioning blocks 16 and the positioning grooves 52 correspond to each other one by one.

[0052] Specifically, the positioning blocks 16 are rectangular, the number is four, and they are arranged in a cross shape, and their distribution is uniform and highly regular, but it is not limited to this, and they can also be other shapes, numbers, or arrangement methods, without specific limitation.

[0053] With the above settings, the contact area with the installation through-hole 51 is increased, thereby improving the installation stability of the heat sink 5 and further reducing the probability of its detachment.

[0054] In the description of the present utility model, a large number of specific details are illustrated. However, it can be understood that the embodiments of the present utility model can be practiced without these specific details. In some instances, well-known methods, structures, and technologies are not shown in detail so as not to obscure the understanding of this description.

[0055] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0056] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present utility model, rather than to limit it; although the present utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present utility model, and they should all be covered by the scope of the claims and the description of the present utility model.

Claims

1. A square rectifier bridge, characterized in that, Comprising: A plastic shell with a receiving groove on its top surface; A rectifier bridge body, including a frame and a plurality of pins, and the frame is placed in the receiving groove, and the pins are all arranged on the top of the frame and extend upward out of the receiving groove; A soft potting compound, potted in the receiving groove and wrapping the frame; A hard potting compound, potted in the receiving groove and located on the top surface of the soft potting compound.

2. The square rectifier bridge according to claim 1, characterized in that, The soft potting compound is a silicone potting compound, and the hard potting compound is an epoxy black glue.

3. The square rectifier bridge according to claim 1, wherein The center of the bottom of the receiving groove has a first convex post, and a positioning through hole is coaxially provided on the top surface of the first convex post.

4. The square rectifier bridge according to claim 3, characterized in that, Further comprising: A heat sink, embedded in the bottom surface of the plastic shell.

5. The square rectifier bridge according to claim 4, wherein, The bottom surface of the plastic shell is provided with an embedding groove matching the heat sink. The center of the bottom of the embedding groove has a second convex post, the positioning through hole coaxially penetrates the second convex post, and the bottom surface of the heat sink is provided with a mounting through hole for sleeving on the second convex post.

6. The square rectifier bridge according to claim 5, wherein, A plurality of positioning blocks are provided on the outer periphery of the second convex post, and a plurality of positioning grooves are provided on the inner periphery of the mounting through hole, and the positioning blocks and the positioning grooves correspond to each other one by one.

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