Packaging structure of sensing device
Through the reasonable layout of BOX shells, pads, semiconductor refrigerators and chip heat sinks, the problem of space occupation and high cost of high power narrow linewidth devices is solved, space reduction and cost reduction are achieved, and production efficiency is improved.
Patent Information
- Application Number
- CN202422215944.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-10
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2034-09-10
AI Technical Summary
In the prior art, high-power narrow linewidth devices adopt a large butterfly package form, occupying a large space, increasing production costs and compressing the space for subsequent processing, and operating at the same time difficult.
The reasonable layout of BOX shells, pads, semiconductor refrigerators, chip heat sinks and chips is adopted, and space reduction and cost reduction are achieved through the coordination of eutectic welding and lenses.
Effectively make room for subsequent processing, reduce production costs and improve production efficiency.
Smart Images
Figure CN223123898U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of storage of sensing devices, in particular to a packaging structure for sensing devices. Background Technique
[0002] Sensing devices are devices used to detect and measure physical, chemical or biological quantities and convert them into processable electrical signals or other forms of signals. High-power narrow-linewidth devices belong to a type of sensing device. High-power narrow-linewidth devices generally refer to electronic or optical devices that simultaneously possess high-power output and narrow-linewidth characteristics, and are utilized in fields such as microwave communication, analog communication, gravitational detection, nonlinear frequency conversion, and lidar.
[0003] Existing technologies for high-power narrow-linewidth devices used in directions such as radar and sensing adopt a relatively large butterfly packaging form, which occupies a large amount of space, compresses the implementation space for subsequent processing, and at the same time has a relatively high raw material cost, large production losses, and difficult production operations. Therefore, there is a need to provide a packaging structure that saves space and has a lower cost to ensure the subsequent processing space and save manufacturing costs. Summary of the Utility Model
[0004] The purpose of the utility model is to provide a packaging structure for sensing devices to solve the problems raised in the above background technique, that is, existing technologies for high-power narrow-linewidth devices used in directions such as radar and sensing adopt a relatively large butterfly packaging form, which occupies a large amount of space, compresses the implementation space for subsequent processing, and at the same time has a relatively high raw material cost, large production losses, and difficult production operations.
[0005] To solve the above technical problems, the utility model is realized through the following technical solutions:
[0006] The utility model is a packaging structure for sensing devices, including:
[0007] BOX package, spacer, thermoelectric cooler, chip heat sink and chip;
[0008] The spacer is mounted on the bottom of the BOX package, the thermoelectric cooler is mounted at the tail of the spacer, the chip and the chip heat sink are welded by eutectic, and the completed product after eutectic is mounted on the thermoelectric cooler.
[0009] Further, the chip heat sink is located on the side of the thermoelectric cooler, and the chip is located in the middle of the thermoelectric cooler.
[0010] Further, an isolator is mounted on the top of the spacer.
[0011] Further, a converging lens and a collimating lens are mounted on the top of the spacer block, and the converging lens and the collimating lens are respectively located on both sides of the isolator.
[0012] Further, a pigtail slot is mounted on the spacer block, and a pigtail is assembled in the pigtail slot.
[0013] Compared with the prior art, the advantages of the present utility model are as follows:
[0014] In the present utility model, the distribution of the positions of components such as the semiconductor cooler, the chip heat sink, and the chip in the BOX package is relatively reasonable, and the overall installation layout realizes the reduction of the occupied space, so as to free up space for subsequent processing.
[0015] Based on the above beneficial effects, the production cost of the related components is relatively low, the overall production cost is reduced, the cost is effectively controlled, and at the same time, the production efficiency of the device is greatly improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present utility model, and those of ordinary skill in the art can also obtain other drawings according to these drawings without creative efforts.
[0017] Figure 1 It is the overall schematic diagram of the present utility model.
[0018] 1. BOX package; 2. Spacer block; 3. Semiconductor cooler; 4. Chip heat sink; 5. Chip; 6. Converging lens; 7. Isolator; 8. Collimating lens; 9. Pigtail; 10. Pigtail slot. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0019] In order to make the above objects, features, and advantages of the present utility model more obvious and understandable, the specific embodiments of the present utility model will be described in detail below with reference to the drawings.
[0020] In the following description, many specific details are set forth in order to fully understand the present utility model, but the present utility model can also be implemented in other ways different from those described herein. Those skilled in the art can make similar promotions without departing from the connotation of the present utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed below.
[0021] In order to make the objects, technical solutions, and advantages of the present utility model clearer, the embodiments of the present utility model will be further described in detail below with reference to the drawings.
[0022] Please refer to Figure 1As shown, this embodiment is a packaging structure for a sensing device, including:
[0023] BOX housing 1, spacer 2, thermoelectric cooler 3, chip heat sink 4, and chip 5;
[0024] The BOX housing 1 is mounted with the spacer 2 at the bottom, the thermoelectric cooler 3 is mounted to the tail of the spacer 2, the chip 5 and the chip heat sink 4 are welded by eutectic, and the completed product after eutectic is mounted on the thermoelectric cooler 3;
[0025] The BOX housing 1 can be applied to high-speed optical modules, has good heat dissipation performance, and has high airtightness, so as to effectively protect the internal optical components. The spacer 2 is provided for mounting the thermoelectric cooler 3, the chip heat sink 4, and the chip 5. The thermoelectric cooler 3 can achieve precise temperature regulation and control in a small space, thereby cooling the heat of the BOX housing 1. The chip heat sink 4 can cool and dissipate heat for the chip 5 separately;
[0026] The chip heat sink 4 is located on the side of the thermoelectric cooler 3, and the chip 5 is located in the middle of the thermoelectric cooler 3;
[0027] The chip heat sink 4 is close to the chip 5, so as to cool the heat generated by the chip 5 in time;
[0028] An isolator 7 is mounted on the top of the spacer 2;
[0029] The isolator 7 can separate the focusing lens 6 and the collimating lens 8;
[0030] The focusing lens 6 and the collimating lens 8 are mounted on the top of the spacer 2, and the focusing lens 6 and the collimating lens 8 are located on both sides of the isolator 7 respectively;
[0031] The focusing lens 6 can converge light from different directions to a specific point or area, enhance the energy density of light, and at the same time, at the sensor receiving end, converge the light to the detector to increase the intensity of the received optical signal, thereby improving the sensitivity and responsivity of the sensor. The collimating lens 8 can collimate the light beam, reduce the scattering and diffusion of light, thereby improving the accuracy and repeatability of sensor measurement. The focusing lens 6 and the collimating lens 8 are used in combination to enhance the signal acquisition ability, improve the measurement accuracy, and at the same time can expand the measurement range and adaptability;
[0032] A fiber optic ferrule slot 10 is mounted on the spacer 2, and a fiber optic cable 9 is assembled in the fiber optic ferrule slot 10;
[0033] The setting of the pigtail slot 10 provides guarantee for the installation and disassembly of the pigtail 9. The pigtail 9 can transmit the light generated by the chip 5, and at the same time provides a certain degree of physical protection for the optical signal, reducing the influence of external environmental factors (such as dust, humidity, electromagnetic interference, etc.) on optical transmission, and ensuring the quality and stability of the signal.
[0034] Working principle: Mount the cushion block 2 on the bottom of the BOX housing 1, then mount the semiconductor cooler 3 to the tail of the cushion block 2, weld the chip 5 and the chip heat sink 4 by eutectic, and mount the eutectic finished product to the semiconductor cooler 3. Then mount the converging lens 6 and the collimating lens 8 on the top of the cushion block 2, and mount the isolator 7 at the position of the cushion block 2 between the converging lens 6 and the collimating lens 8. Then mount the pigtail slot 10 on the cushion block 2, and assemble the pigtail 9 in the pigtail slot 10;
[0035] In this step, the installation positions of components such as the semiconductor cooler, the chip heat sink and the chip in the BOX housing are reasonably allocated, and the overall installation layout realizes the reduction of the occupied space, so as to free up space for subsequent processing. At the same time, the production preparation cost of related components is relatively low, which reduces the production cost as a whole, effectively controls the cost, and greatly improves the production efficiency of the device.
[0036] In the description of the present utility model, it should also be noted that, unless otherwise clearly defined and limited, the terms "set", "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.
[0037] Finally, it should be noted that the above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.
Claims
1. A packaging structure of a sensing device, characterized in that, Including: BOX package (1), spacer (2), thermoelectric cooler (3), chip heat sink (4) and chip (5); The spacer (2) is mounted on the bottom of the BOX package (1), the thermoelectric cooler (3) is mounted at the tail of the spacer (2), the chip (5) and the chip heat sink (4) are welded by eutectic, and the completed product after eutectic is mounted on the thermoelectric cooler (3).
2. The encapsulation structure of a sensing device according to claim 1, characterized in that, The chip heat sink (4) is located on the side of the thermoelectric cooler (3), and the chip (5) is located in the middle of the thermoelectric cooler (3).
3. The encapsulation structure of a sensing device according to claim 1, characterized in that, An isolator (7) is mounted on the top of the spacer (2).
4. The encapsulation structure of a sensing device according to claim 3, characterized in that, A converging lens (6) and a collimating lens (8) are mounted on the top of the spacer (2), and the converging lens (6) and the collimating lens (8) are respectively located on both sides of the isolator (7).
5. The encapsulation structure of a sensing device according to claim 1, characterized in that, A pigtail slot (10) is mounted on the spacer (2), and a pigtail (9) is assembled in the pigtail slot (10).