Packaging structure

Abstract

The utility model provides a packaging structure. The packaging structure comprises an insulating layer; the top of the wire is exposed from the insulating layer, and the shape of the top of the wire is wide at the top and narrow at the bottom; the conductor layer covers the top of the wire and the insulating layer around the top of the wire; and the electric connecting piece is arranged on one side, opposite to the wire, of the conductor layer. The method has the advantages that the contact area between the solder ball and the wire is enlarged, the size of the solder ball is increased, and the problem that the solder ball falls off due to insufficient bonding force caused by too small contact area between the solder ball and the wire is solved; the size of the positions of the solder balls can be adjusted, the solder balls are distributed more uniformly, and the yield is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging, and more particularly, to a packaging structure. Background Art

[0002] With the development of packaging technology and the trend of miniaturization of packaging structures, and in order to reduce production costs, wires have begun to be used instead of conductive posts in packaging structures. Figure 1 The schematic diagram of an existing packaging structure is shown. As Figure 1 shown, the existing packaging structure includes an insulating layer 901, a first electrical connector 902, a second electrical connector 903, an electronic component 904, and a substrate 905. The electronic component 904 is disposed on the substrate 905. The insulating layer 901 surrounds the electronic component 904 and the first electrical connector 902. One end of the first electrical connector 902 is connected to the substrate 905, and the other end of the first electrical connector 902 is connected to the second electrical connector 903. Among them, the first electrical connector 902 is a wire. It can be seen that the cross-section of the wire is smaller, so it can better meet the requirements of miniaturization of the packaging structure. However, the smaller cross-sectional area also results in a smaller contact area between the wire and the solder, leading to insufficient bonding force between the two, and making the solder prone to fall off from the packaged product.

[0003] In summary, there is a need in the art to provide a packaging structure that can overcome the deficiencies of the prior art. Summary of the Utility Model

[0004] The present application provides a packaging structure that can solve the problems of the prior art. The objectives of the present application are achieved through the following technical solutions.

[0005] An embodiment of the present application provides a packaging structure, which includes: an insulating layer; a wire, the top of the wire exposes from the insulating layer, and the shape of the top of the wire is wider at the top and narrower at the bottom; a conductor layer, the conductor layer covers the top of the wire and the insulating layer around the top of the wire; and an electrical connector, the electrical connector is disposed on a side of the conductor layer opposite to the wire.

[0006] In some alternative embodiments, according to the packaging structure provided by the above embodiment of the present application, the packaging structure further includes an electronic component, the insulating layer covers the electronic component, and the wire is disposed on the side of the electronic component.

[0007] In some alternative embodiments, according to the packaging structure provided by the above embodiment of the present application, the packaging structure further includes a substrate, the electronic component is disposed on the substrate, one end of the wire is connected to the substrate, and the other end of the wire is connected to the conductor layer.

[0008] In some alternative embodiments, there is provided a packaging structure according to the above - mentioned one embodiment of the present application, wherein the substrate includes a circuit layer, and the circuit is disposed on the surface of the substrate and electrically connected to the wire.

[0009] In some alternative embodiments, there is provided a packaging structure according to the above - mentioned one embodiment of the present application, wherein the conductor layer includes a first metal layer and a second metal layer. The first metal layer and the second metal layer are stacked to form the conductor layer. The first metal layer is connected to the wire, and the second metal layer is connected to the electrical connector.

[0010] In some alternative embodiments, there is provided a packaging structure according to the above - mentioned one embodiment of the present application, wherein the electronic component is an active component or a passive component.

[0011] In some alternative embodiments, there is provided a packaging structure according to the above - mentioned one embodiment of the present application, wherein the insulating layer further includes a groove. The groove is disposed around the top of the wire, and the side surface of the top of the wire and the side surface of the wire near the top of the wire are exposed from the groove.

[0012] In some alternative embodiments, there is provided a packaging structure according to the above - mentioned one embodiment of the present application, wherein the conductor layer further covers the side surface of the top of the wire exposed from the groove and the side surface of the wire near the top of the wire, and the conductor layer also covers the groove.

[0013] In some alternative embodiments, there is provided a packaging structure according to the above - mentioned one embodiment of the present application, wherein the thickness of the conductor layer covering the insulating layer is greater than the thickness of the conductor layer covering the side surface of the top of the wire exposed from the groove and the side surface of the wire near the top of the wire.

[0014] In some alternative embodiments, there is provided a packaging structure according to the above - mentioned one embodiment of the present application, wherein the electrical connector fills the groove and is connected to the conductor layer within the groove.

[0015] The advantages of the packaging structure according to the embodiments of the present application are as follows: The contact area between the solder ball and the wire is enlarged, thus solving the problem of insufficient bonding force caused by increasing the volume of the solder ball and avoiding too small contact area between the solder ball and the wire, which may further lead to the solder ball falling off; It is beneficial to adjust the position and size of the solder ball, making the distribution of the solder balls more uniform and improving the yield rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Other features, objects, and advantages of the present application will become more apparent from the following detailed description of non - restrictive embodiments of the present application with reference to the accompanying drawings.

[0017] Figure 1 A schematic diagram showing a packaging structure of the prior art is shown;

[0018] Figure 2Shows a side schematic view of a packaging structure according to an embodiment of the present application;

[0019] Figure 3 Shows as Figure 2 A schematic view of a part labeled A in the packaging structure according to an embodiment of the present application as shown;

[0020] Figure 4 Shows as Figure 2 A top schematic view of the packaging structure according to an embodiment of the present application as shown;

[0021] Figure 5 Shows as Figure 2 A schematic view of the production process of the packaging structure according to an embodiment of the present application as shown;

[0022] Figure 6 Shows a side schematic view of a packaging structure according to another embodiment of the present application;

[0023] Figure 7 Shows as Figure 6 A schematic view of a part labeled A in the packaging structure according to another embodiment of the present application as shown;

[0024] Figure 8 Shows as Figure 6 A schematic view of the production process of the packaging structure according to another embodiment of the present application as shown.

[0025] Reference numerals and component names: 1 - insulating layer, 2 - wire, 3 - conductor layer, 4 - electrical connector, 5 - electronic component, 6 - substrate, 11 - trench, 21 - top of wire, 31 - first metal layer, 32 - second metal layer, 61 - circuit layer, 101 - substrate, 101a - circuit layer, 102 - first electronic component, 103 - second electronic component, 104 - first insulating layer, 105 - metal layer, 106 - third electronic component, 107 - wire, 107a - top of wire, 108 - second insulating layer, 108a - trench, 109 - isolation layer, 110 - second metal layer, 111 - first metal layer, 112 - electrical connector, 113 - encapsulant, 901 - insulating layer, 902 - first electrical connector, 903 - second electrical connector, 904 - electronic component, 905 - substrate. Detailed implementation manners

[0026] The following describes the specific implementation manners of the present application in conjunction with the accompanying drawings and embodiments. Through the content described in this specification, those skilled in the art can clearly and completely understand the technical solutions of the present application, the technical problems solved, and the technical effects produced. It can be understood that the specific embodiments described herein are only used to explain the present application, rather than limiting the present application. Additionally, for ease of description, only the parts related to the present application are shown in the accompanying drawings.

[0027] It should be easily understood that the meanings of "on", "above", and "over" in the present application should be interpreted in the broadest sense, such that "on" not only means "directly on something", but also means "on something" including intermediate components or layers therebetween.

[0028] In addition, for ease of description, spatial relative terms such as "under", "below", "lower part", "above", "upper part", etc. may be used herein to describe the relationship between one element or component and another element or component shown in the accompanying drawings. Besides the orientations described in the figures, the spatial relative terms are also intended to cover different orientations during the use or operation of the device. The device can be oriented in other ways (rotated 90° or in other orientations), and the spatial relative descriptive terms used herein can be correspondingly interpreted in the same way.

[0029] It should be noted that the structures, proportions, sizes, etc. shown in the drawings of the specification are only used to cooperate with the content recorded in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of the present application. Therefore, they do not have technical substance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects that the present application can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in the present application. At the same time, the terms such as "upper", "first", "second", and "one" cited in this specification are only for the convenience of clear narration, rather than used to limit the scope of implementation of the present application. The change or adjustment of their relative relationships, without substantial change in the technical content, should also be regarded as the scope within which the present application can be implemented.

[0030] As used herein, the term "layer" refers to a portion of a material that includes a region having a certain thickness. A layer can extend over the entire underlying or overlying structure, or can have an extent less than that of the underlying or overlying structure. In addition, a layer can be a region of a homogeneous or heterogeneous continuous structure, the thickness of which is less than the thickness of the continuous structure. For example, a layer can be located between the top and bottom surfaces of a continuous structure or between any pair of horizontal planes therebetween. A layer can extend horizontally, vertically, and / or along a tapered surface. A substrate can be a layer, can include one or more layers therein, and / or can have one or more layers thereon, thereabove, and / or therebelow. A layer can include multiple layers. For example, a semiconductor layer can include one or more doped or undoped semiconductor layers and can have the same or different materials.

[0031] As used herein, the term "molding material" can be formed from various molding compounds. For example, the molding compound can include epoxy resin, filler, catalyst, pigment, release agent, flame retardant, coupling agent, hardener, low stress absorber, adhesion promoter, ion trapping agent, etc.

[0032] In addition, without conflict, the embodiments in this application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0033] Figure 2 A side schematic view of a packaging structure according to an embodiment of the present application is shown; Figure 3 As shown in Figure 2 A schematic view of a portion identified as A in the packaging structure according to an embodiment of the present application is shown; Figure 4 As shown in Figure 2 A top schematic view of the packaging structure according to an embodiment of the present application is shown. As Figures 2 to 4 shown, the packaging structure includes an insulating layer 1; a wire 2, the top 21 of the wire protruding from the insulating layer 1, and the shape of the top 21 of the wire being wider at the top and narrower at the bottom; a conductor layer 3, the conductor layer 3 covering the top 21 of the wire and the insulating layer 1 around the top 21 of the wire; and an electrical connector 4, the electrical connector 4 being disposed on one side of the conductor layer 3 opposite to the wire 2.

[0034] In some alternative embodiments, there is provided a packaging structure according to the above-described one embodiment of the present application, wherein the wider top portion 21 of the wire can be formed by means such as grinding; the wider top portion 21 of the wire can increase the contact area between the wire 2 and the conductor layer 3, which is beneficial to improving the electrical conductivity.

[0035] In some alternative embodiments, there is provided a packaging structure according to the above-described one embodiment of the present application, wherein the packaging structure further includes an electronic component 5, the insulating layer 1 covers the electronic component 5, and the wire 2 is disposed on the side of the electronic component 5.

[0036] In some alternative embodiments, there is provided a packaging structure according to the above-described one embodiment of the present application, wherein the packaging structure further includes a substrate 6, the electronic component 5 is disposed on the substrate 6, one end of the wire 2 is connected to the substrate 6, and the other end of the wire 2 is connected to the conductor layer 3.

[0037] In some alternative embodiments, there is provided a packaging structure according to the above-described one embodiment of the present application, wherein the substrate 6 includes a circuit layer 61, and the circuit is disposed on the surface of the substrate 6 and is electrically connected to the wire 2.

[0038] In some alternative embodiments, there is provided a packaging structure according to the above-described one embodiment of the present application, wherein the conductor layer 3 includes a first metal layer 31 and a second metal layer 32, the first metal layer 31 and the second metal layer 32 are stacked to form the conductor layer 3, the first metal layer 31 is connected to the wire 2, and the second metal layer 32 is connected to the electrical connector 4.

[0039] In some alternative embodiments, there is provided a packaging structure according to the above-described one embodiment of the present application, wherein the wire 2 is a copper wire.

[0040] In some alternative embodiments, there is provided a packaging structure according to the above-described one embodiment of the present application, wherein the electrical connector 4 can be solder (usually circular, copper plus tin).

[0041] In some alternative embodiments, there is provided a packaging structure according to the above-described one embodiment of the present application, wherein the first metal layer 31 is made of a material having good bonding performance with the wire 2, including but not limited to stainless steel and titanium.

[0042] In some alternative embodiments, there is provided a packaging structure according to the above-described one embodiment of the present application, wherein the second metal layer 32 is made of a material having good bonding performance with the electrical connector 4, including but not limited to gold, copper, silver, palladium, and nickel.

[0043] In some alternative embodiments, there is provided a packaging structure according to the above-described one embodiment of the present application, wherein the electronic component 5 is an active component or a passive component.

[0044] Figure 5 shows the production process schematic diagram of a packaging structure according to an embodiment of the present application as Figure 2 shown. As Figure 5 described, the production process of the packaging structure includes the following steps:

[0045] Step 1001: Provide a substrate 101, and respectively arrange a first electronic component 102 and a second electronic component 103 on the substrate 101; wherein, a circuit layer 101a is arranged on the other side of the substrate 101 opposite to the side where the first electronic component 102 and the second electronic component 103 are arranged, and the thickness of the first electronic component 102 is greater than the thickness of the second electronic component 103;

[0046] Step 1002: Arrange a first insulating layer 104 on the side of the substrate 101 where the first electronic component 102 and the second electronic component 103 are arranged; wherein, the first insulating layer 104 covers the first electronic component 102 and the second electronic component 103;

[0047] Step 1003: Grind the first insulating layer 104 to expose the top of the first electronic component 102;

[0048] Step 1004: Flip the product obtained in Step 1003, and arrange a third electronic component 106 on the side of the substrate 101 where the circuit layer 101a is arranged;

[0049] Step 1005: Arrange a wire 107 on the circuit layer 101a; wherein, the wire 107 can be a wire;

[0050] Step 1006: Arrange a second insulating layer 108 on the side of the substrate 101 where the third electronic component 106 is arranged; wherein, the second insulating layer 108 covers the third electronic component 106 and the wire 107;

[0051] Step 1007: Grind the second insulating layer 108 to expose the top of the wire 107a; wherein, the shape of the top of the wire 107 is wider at the top and narrower at the bottom;

[0052] Step 1008: Arrange an isolation layer 109 on the second insulating layer 108, so that the top of the wire 107 is exposed from the isolation layer 109 and arrange a first metal layer 111 and a second metal layer 110 on the top of the wire 107; wherein, the method of arranging the first metal layer 111 and the second metal layer 110 includes but is not limited to electroplating;

[0053] Step 1009: Remove the isolation layer 109, and arrange an electrical connector 112 on the second metal layer 110;

[0054] Step 1010: Cut the product obtained in Step 1009; and

[0055] Step 1011: Wrap the product obtained in step 1010 with the molding encapsulant 113; wherein, the molding encapsulant 113 wraps all the surfaces of the product where the electrical connector 112 is not provided.

[0056] Figure 6 FIG. shows a side schematic view of an encapsulation structure according to another embodiment of the present application. Figure 7 As shown in Figure 6 FIG., a schematic view of a portion identified as A in the encapsulation structure according to another embodiment of the present application is shown. As Figures 6 to 7 shown, the insulating layer 1 further includes a trench 11, the trench 11 is disposed around the top of the wire 21, and the sides of the top of the wire 21 and the sides of the wire 2 close to the top of the wire 21 are exposed from the trench 11.

[0057] In some alternative embodiments, for the encapsulation structure provided according to the above-mentioned one embodiment of the present application, the conductor layer 3 further covers the sides of the top of the wire 21 exposed from the trench 11 and the sides of the wire 2 close to the top of the wire 21, and the conductor layer 3 further covers the trench 11.

[0058] In some alternative embodiments, for the encapsulation structure provided according to the above-mentioned one embodiment of the present application, the thickness of the conductor layer 3 covering the insulating layer 1 and the upper surface of the top of the wire 21 (i.e., Figure 7 the portion identified as 3A in the figure) is greater than the thickness of the conductor layer 3 covering the sides of the top of the wire 21 exposed from the trench 11 and the sides of the top of the wire 2 close to the top of the wire 21 (i.e., the portion identified as 3B in the figure marked 7 in the figure).

[0059] In some alternative embodiments, for the encapsulation structure provided according to the above-mentioned one embodiment of the present application, the electrical connector 4 fills the trench 11 and is connected to the conductor layer 3 within the trench 11.

[0060] In some alternative embodiments, for the encapsulation structure provided according to the above-mentioned one embodiment of the present application, the trench 11 and the rivet-shaped top of the wire 21 exposed from the trench 11 can increase the contact area between the wire 2 and the conductor layer 3, which is beneficial to improving the electrical conductivity; in addition, the electrical connector 4 filled into the trench 11 can increase the firmness of the connection between the electrical connector 4 and the conductor layer 3, and reduce the probability of the electrical connector 4 falling off.

[0061] Figure 8 As shown in Figure 6 FIG., a schematic diagram of the production process of the encapsulation structure according to another embodiment of the present application is shown. As Figure 8 shown, the production process of the encapsulation structure of another embodiment includes the following steps:

[0062] Step 2001: Provide a substrate 101, and respectively dispose a first electronic component 102 and a second electronic component 103 on the substrate 101; wherein, a circuit layer 101a is disposed on the other side of the substrate 101 opposite to the side where the first electronic component 102 and the second electronic component 103 are disposed, and the thickness of the first electronic component 102 is greater than the thickness of the second electronic component 103;

[0063] Step 2002: Dispose a first insulating layer 104 on the side of the substrate 101 where the first electronic component 102 and the second electronic component 103 are disposed; wherein, the first insulating layer 104 covers the first electronic component 102 and the second electronic component 103;

[0064] Step 2003: Grind the first insulating layer 104 to expose the top of the first electronic component 102;

[0065] Step 2004: Flip the product obtained in step 1003, and dispose a third electronic component 106 on the side of the substrate 101 where the circuit layer 101a is disposed;

[0066] Step 2005: Dispose a wire 107 on the circuit layer 101a; wherein, the wire 107 can be a wire;

[0067] Step 2006: Dispose a second insulating layer 108 on the side of the substrate 101 where the third electronic component 106 is disposed; wherein, the second insulating layer 108 covers the third electronic component 106 and the wire 107;

[0068] Step 2007: Grind the second insulating layer 108 to expose the top of the wire 107a; wherein, the shape of the top of the wire 107 is wider at the top and narrower at the bottom;

[0069] Step 2008: Use a laser to etch the second insulating layer 108 around the top of the wire 107a to form a groove 108a;

[0070] Step 2009: Dispose an isolation layer 109 on the second insulating layer 108, so that the top of the wire 107 is exposed from the isolation layer 109 and a metal layer 105 is disposed on the top of the wire 107 and in the groove 108a, wherein, the metal layer 105 can include a first metal layer and a second metal layer;

[0071] Step 2010: Remove the isolation layer 109, and dispose an electrical connector 112 on the metal layer 105;

[0072] Step 2011: Cut the product obtained in step 2010; and

[0073] Step 2012: Use a molding compound 113 to cover the product obtained in step 2011; wherein, the molding compound 113 covers each surface of the product where the electrical connector 112 is not disposed.

[0074] The advantages of the encapsulation structure according to the embodiments of the present application are as follows: the contact area between the solder balls and the wires is enlarged, thus avoiding the problem of insufficient bonding force caused by increasing the volume of the solder balls and the too small contact area between the solder balls and the wires, which may further lead to the solder ball falling off; it is beneficial to adjust the position and size of the solder balls, making the solder balls more evenly distributed and improving the yield rate.

[0075] Although the present application has been described and illustrated with reference to specific embodiments of the present application, such descriptions and illustrations are not intended to limit the present application. Those skilled in the art can clearly understand that various changes can be made, and equivalent elements can be substituted within the embodiments without departing from the scope of protection of the present application as defined by the claims. Due to variables in the manufacturing process, etc., there may be differences between the technical reproduction in the present application and the actual device. There may be other embodiments of the present application that are not specifically described. The specification and the drawings should be regarded as illustrative rather than restrictive, and modifications can be made in accordance with the purpose and spirit of the present application, and all such modifications are within the scope of protection of the claims. Although the methods disclosed herein have been described with reference to specific operations performed in a specific order, it should be understood that, without departing from the disclosure of the present application, these operations can be recombined, subdivided, or arranged to form equivalent methods. Therefore, unless specifically indicated herein, the order and grouping of operations do not limit the present application.

Claims

1. An encapsulation structure, characterized in that, Comprising: An insulating layer; A wire, the top of which is exposed from the insulating layer, and the shape of the top of the wire is wider at the top and narrower at the bottom; A conductor layer, which covers the top of the wire and the insulating layer around the top of the wire; And An electrical connector, which is arranged on one side of the conductor layer opposite to the wire.

2. The encapsulation structure according to claim 1, wherein The packaging structure further includes an electronic component, the insulating layer covers the electronic component, and the wire is arranged on the side of the electronic component.

3. The encapsulation structure according to claim 2, wherein The packaging structure further includes a substrate, the electronic component is arranged on the substrate, one end of the wire is connected to the substrate, and the other end of the wire is connected to the conductor layer.

4. The encapsulation structure according to claim 3, wherein The substrate includes a circuit layer, and the circuit is arranged on the surface of the substrate and electrically connected to the wire.

5. The encapsulation structure according to claim 1, characterized in that The conductor layer includes a first metal layer and a second metal layer, the first metal layer and the second metal layer are stacked to form the conductor layer, the first metal layer is connected to the wire, and the second metal layer is connected to the electrical connector.

6. The encapsulation structure according to claim 2, wherein The electronic component is an active component or a passive component.

7. The encapsulation structure according to any one of claims 1 to 6, characterized in that, The insulating layer further includes a groove, the groove is arranged around the top of the wire, and the side surface of the top of the wire and the side surface of the wire close to the top of the wire are exposed from the groove.

8. The encapsulation structure according to claim 7, wherein, The conductor layer also covers the side surface of the top of the wire and the side surface of the wire close to the top of the wire exposed from the groove, and the conductor layer also covers the groove.

9. The encapsulation structure according to claim 8, wherein The thickness of the conductor layer covering the insulating layer is greater than the thickness of the conductor layer covering the side surface of the top of the wire and the side surface of the wire close to the top of the wire exposed from the groove.

10. The encapsulation structure according to claim 7, wherein The electrical connector fills the groove and is connected to the conductor layer in the groove.

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