Series-parallel connection structure of optical isolation driving semiconductor device

Abstract

The utility model discloses a series-parallel connection structure of optical isolation driving semiconductor devices, which relates to the technical field of laser pulse triggering semiconductor devices and comprises clamp metal plates which are arranged in a matched mode, the clamp metal plates are fixedly connected through screws and nuts, and a plurality of optical isolation driving semiconductor devices are arranged between the clamp metal plates. The optical isolation driving semiconductor devices are electrically connected through the series-parallel metal plates, the metal electrode plates are installed at the input ends and the output ends of the electrically-connected optical isolation driving semiconductor devices respectively, insulators are arranged between the metal electrode plates and the clamp metal plates, one sides of the optical isolation driving semiconductor devices are electrically connected with the driving plates respectively, and the other sides of the optical isolation driving semiconductor devices are electrically connected with the clamp metal plates. The driving plates are fixedly connected through the supporting columns. The beneficial effects are that the application cost of the optical isolation driving semiconductor device is substantially reduced, and the economical efficiency of the optical isolation driving semiconductor device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of laser pulse triggered semiconductor devices, in particular to a series-parallel structure of optically isolated driven semiconductor devices. Background Art

[0002] Optically isolated semiconductor devices are semiconductor devices that use light energy technology to control the on and off of semiconductor devices. Traditional semiconductor devices require external trigger voltages to control their on and off, while optically isolated semiconductor devices use optical signals instead of electrical signals to trigger on. Because it uses optical signal triggering, it avoids interference from the main circuit (high voltage, high current) to the control circuit, and is suitable for high-power and high-voltage places where the trigger signal source is highly isolated from the main circuit, such as high-voltage DC transmission equipment, high-power pulse devices, high-voltage nuclear fusion devices, etc.

[0003] Optically isolated semiconductor devices have good performance and reliability in complex environments such as high voltage, high current, and strong electromagnetic fields, and are widely used in strong field fields such as power electronics and pulse power. With the continuous development and maturity of optical isolation drive technology, the application scope of optical isolation drive semiconductor devices will be further expanded, providing more possibilities for improving the performance and energy efficiency of electronic equipment. Optically isolated semiconductor devices are devices controlled by light signals of a certain wavelength. In addition to an anode and a cathode, they also need to be used in conjunction with energy optical fibers and lasers.

[0004] Various types of lasers can be used as trigger light sources, and energy optical fibers are used as transmission media for light sources. In actual application scenarios, energy optical fibers have low transmission efficiency and large losses, so it is necessary to increase the core diameter of the energy optical fibers, and high-power lasers are required as light sources. Optical isolation drives semiconductor devices to enable stable triggering. This undoubtedly increases the waste of space utilization and increases the cost of use.

[0005] There is an urgent need for a series-parallel structure of optically isolated driving semiconductor devices.

[0006] Currently, no effective solution has been proposed for the problems in the related technologies. Utility Model Content

[0007] In view of the problems in the related art, the purpose of the utility model is to propose a series-parallel structure of optical isolation driving semiconductor devices to overcome the above technical problems existing in the existing related art.

[0008] The technical solution of the utility model is achieved in this way:

[0009] A series-parallel structure of an optically isolated drive semiconductor device, comprising: a fixture metal plate arranged adaptively, the fixture metal plates are fixedly connected by screws and nuts, and a plurality of optically isolated drive semiconductor devices are arranged between the fixture metal plates. The plurality of optically isolated drive semiconductor devices are electrically connected by series-parallel metal plates respectively, and metal electrode plates are installed at the input end and the output end of the electrically connected optically isolated drive semiconductor devices respectively. An insulator is arranged between the metal electrode plate and the fixture metal plate. One side of each optically isolated drive semiconductor device is electrically connected to a drive plate respectively, and the plurality of drive plates are fixedly connected by support columns respectively.

[0010] Further, the optically isolated drive semiconductor device comprises: a metallized ceramic package,

[0011] A semiconductor component and a cathode metal electrode are arranged in the metallized ceramic package. Wherein, the anode of the semiconductor component is attached to the metallized ceramic package, the cathode of the semiconductor component is attached to the cathode metal electrode, a through hole is formed in the cathode metal electrode, a lens is installed in the through hole, and a cathode metal extension part is arranged at the top end of the cathode metal electrode. A laser diode array PCB board is arranged between the cathode metal electrode and the cathode metal extension part. The output end of the laser diode array PCB board is adapted to the through hole, and the cathode metal electrode and the cathode metal extension part are fixed by fastening screws.

[0012] Further, the metallized ceramic package comprises: a ceramic part and an anode metal part. Wherein, the anode of the semiconductor component is attached to the anode metal part, and the cathode of the semiconductor component is attached to the cathode metal electrode.

[0013] Further, the ceramic part is arranged on one side of the metallized ceramic package and is arranged in a circular pattern, and the anode metal part is arranged at the bottom end of the metallized ceramic package.

[0014] Further, an optical window is arranged on the semiconductor component, and the optical windows are uniformly distributed on the cathode of the semiconductor component.

[0015] Further, the through hole is adapted to the optical window, and the diameter of the through hole is larger than the diameter of the optical window.

[0016] The beneficial effects of the present utility model:

[0017] The present utility model pre-drives a laser diode array PCB board through a trigger signal input, uses a laser diode as the light source of a semiconductor device, and can drive the semiconductor device by utilizing the received optical signal from the laser diode array PCB board, without a transmission optical fiber and a high-power laser. Meanwhile, the series-parallel metal plates can be used to connect the optically isolated drive semiconductor devices in parallel on the same layer and connect the optically isolated drive semiconductor devices in series between the upper and lower layers, significantly reducing the application cost of the optically isolated drive semiconductor devices and improving the economy of the optically isolated drive semiconductor devices.

[0018] Other features and advantages of the present utility model will be described in the following specification, and some of them will become obvious from the specification or be understood by implementing the present utility model. The objectives and other advantages of the present utility model are achieved and obtained by the structures specifically pointed out in the specification and the drawings.

[0019] To make the above objectives, features, and advantages of the present utility model more obvious and understandable, the following specifically provides preferred embodiments and, in conjunction with the accompanying drawings, the detailed description is as follows. Description of the Drawings

[0020] To more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the following-described drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0021] Figure 1 is a schematic structural diagram of an optically isolated drive semiconductor device according to an embodiment of the present utility model;

[0022] Figure 2 is an exploded schematic diagram of an optically isolated drive semiconductor device according to an embodiment of the present utility model;

[0023] Figure 3 is a schematic diagram of the cathode metal electrode of an optically isolated drive semiconductor device according to an embodiment of the present utility model;

[0024] Figure 4 is a schematic diagram of the semiconductor structure of an optically isolated drive semiconductor device according to an embodiment of the present utility model;

[0025] Figure 5 is a schematic structural diagram of the series-parallel structure of an optically isolated drive semiconductor device according to an embodiment of the present utility model;

[0026] Figure 6 is an exploded schematic diagram of the series-parallel structure of an optically isolated drive semiconductor device according to an embodiment of the present utility model;

[0027] Figure 7 It is a schematic diagram of the metal electrode plate structure of the series-parallel structure of the optically isolated drive semiconductor device according to an embodiment of the present invention.

[0028] In the figure:

[0029] 1. Optically isolated drive semiconductor device; 2. Series-parallel metal plate; 3. Screw; 4. Nut; 5. Clamping metal plate; 6. Insulator; 7. Metal electrode plate; 8. Drive plate; 9. Support column;

[0030] 10. Metallized ceramic package; 11. Ceramic part; 12. Semiconductor component; 13. Cathode metal electrode; 14. Lens; 15. Laser diode array PCB board; 16. Anode metal part; 17. Cathode metal extension; 18. Fastening screw; 19. Through hole. Specific embodiments

[0031] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present invention.

[0032] According to an embodiment of the present invention, a series-parallel structure of an optically isolated drive semiconductor device is provided.

[0033] Embodiment 1

[0034] As Figures 1 - 4 shown, Embodiment 1 of the present invention is:

[0035] A series-parallel structure of an optically isolated drive semiconductor device, including: an optically isolated drive semiconductor device 1, and the optically isolated drive semiconductor device 1 includes: a metallized ceramic package 10, a semiconductor component 12 and a cathode metal electrode 13 are provided in the metallized ceramic package 10. Among them, the anode of the semiconductor component 12 is attached to the metallized ceramic package 10, the cathode of the semiconductor component 12 is attached to the cathode metal electrode 13, a through hole 19 is opened on the cathode metal electrode 13, a lens 14 is installed in the through hole 19, and a cathode metal extension 17 is provided at the top of the cathode metal electrode 13. A laser diode array PCB board 15 is provided between the cathode metal electrode 13 and the cathode metal extension 17. The output end of the laser diode array PCB board 15 is adapted to the through hole 19, and the cathode metal electrode 13 and the cathode metal extension 17 are fixed by a fastening screw 18.

[0036] Among them, the metallized ceramic package 10 includes a ceramic part 11 and an anode metal part 16. The ceramic part 11 is located on one side of the metallized ceramic package 10 and is arranged in a ring shape, and the anode metal part 16 is located at the bottom end of the metallized ceramic package 10.

[0037] Among them, the anode of the semiconductor device 12 is attached to the anode metal part 16, and the cathode of the semiconductor device 12 is attached to the cathode metal electrode 13.

[0038] With the above solution, the laser diode array PCB board 15 is driven by pre-inputting a trigger signal. A laser diode is used as the light source of the semiconductor device 12. By using the received optical signal from the laser diode array PCB board 15, the semiconductor device 12 can be driven without a transmission optical fiber and a high-power laser, significantly reducing the application cost of optically isolated driving of semiconductor devices and improving the economy of optically isolated driving of semiconductor devices.

[0039] In addition, an optical window is provided on the semiconductor device 12, and the optical windows are evenly distributed on the cathode of the semiconductor device 12. The through hole 19 is adapted to the optical window, and the diameter of the through hole 19 is larger than the diameter of the optical window.

[0040] Specifically, there are optical windows on the semiconductor device 12, which are evenly distributed on the cathode of the semiconductor device 12. And a step for installing the laser diode array PCB board 15 and a through hole 19 that is aligned and slightly larger than the optical window are machined on the upper part of the cathode metal electrode 13. The through hole 19 is aligned with the optical window, a lens 14 is installed on the through hole, the laser diode array PCB board 15 is attached to the step on the cathode metal electrode 13, and the laser diode on the laser diode array PCB board 15 is aligned with the through hole 19.

[0041] In addition, for the above-mentioned lens 14, it is made of special materials and processes, and can magnify, reduce or focus the light emitted by the laser diode array PCB board 15 so that it evenly covers the optical window of the semiconductor device 12.

[0042] In addition, the laser diode array PCB board 15 is arranged with special laser diodes according to the shape and size of the optical window to ensure that the light emitted by the laser diodes can completely cover the optical window of the laser diode.

[0043] In addition, for the above-mentioned cathode metal extension part 17, the cathode metal extension part 17 is installed on the cathode metal extension part 17 by using a fastening screw 18. Its function is to protect the laser diode array PCB board 15 when optically isolated driving semiconductor devices are connected in series or parallel, and can also be used as a connecting part for series and parallel connections, providing hole positions for installation and wiring.

[0044] In addition, for the above-mentioned fastening screw 18, an internal hexagonal cylindrical head M5 standard metal screw can be used to connect the cathode metal electrode 13 and the cathode metal extension part 17.

[0045] Example 2

[0046] As Figures 5 - 7 shown, Embodiment 3 of the present invention is as follows:

[0047] A series - parallel structure of an optically isolated drive semiconductor device, on the basis of Embodiment 1, further includes: a fixture metal plate 5 arranged adaptively. The fixture metal plates 5 are fixedly connected by a screw 3 and a nut 4. And between the fixture metal plates 5, there are several optically isolated drive semiconductor devices 1. The several optically isolated drive semiconductor devices 1 are electrically connected through series - parallel metal plates 2 respectively. And for the optically isolated drive semiconductor devices 1 that are electrically connected, metal electrode plates 7 are installed at the input end and the output end respectively. Between the metal electrode plate 7 and the fixture metal plate 5, there is an insulator 6. On one side of the optically isolated drive semiconductor device 1, drive plates 8 are electrically connected respectively. The several drive plates 8 are fixedly connected through support columns 9 respectively.

[0048] In this technical solution, the optically isolated drive semiconductor devices 1 are connected in series and parallel by using a customized fixture. Stainless steel materials with a certain thickness are used as the fixture metal plates 5 up and down. The several optically isolated drive semiconductor devices 1 are connected by series - parallel metal plates 2. Metal electrode plates 7 are installed at the input end and the output end of the optically isolated drive semiconductor devices 1 after series and parallel connection. Then, the metal electrode plate 7 and the fixture metal plate 5 are separated by an insulator 6. A certain pressure is applied to the fixture metal plate 5 to compress the optically isolated drive semiconductor devices 1, and they are locked by a screw 3 and a nut 4.

[0049] Meanwhile, the drive plates 8 are installed through support columns 9. The drive plates 8 installed on each layer can drive a layer of parallel - connected optically isolated drive semiconductor devices 1. And the drive plates 8 are used to provide drive signals for the laser diode array PCB board 15 of the optically isolated drive semiconductor devices 1. The support columns 9 are used to install and support the drive plates 8 and are made of insulating materials.

[0050] In addition, for the above - mentioned series - parallel metal plates 2, they are used to connect the optically isolated drive semiconductor devices 1 in parallel on the same layer, and connect the upper and lower two layers, that is, connect the optically isolated drive semiconductor devices 1 in series. At the same time, they can be used for the installation and positioning of the optically isolated drive semiconductor devices 1. They are processed according to the size of the optically isolated drive semiconductor devices 1, made of brass, and surface - nickel - plated to prevent oxidation.

[0051] In this embodiment, a triangular structure can be preferably adopted.

[0052] In addition, the insulator 6 is used to separate the metal electrode plate 7 and the fixture metal plate 5; to prevent the occurrence of creepage due to too high voltage. And the metal electrode plate 7 is used to connect the external voltage and the optically isolated drive semiconductor devices 1, and serves as the anode and cathode of the series - parallel assembly of the optically isolated drive semiconductor devices 1.

[0053] It should be specifically noted that the optical isolation drive semiconductor device assembly in this embodiment is formed by connecting six groups of optical isolation drive semiconductor device strings in series and parallel. However, in applications, it includes, but is not limited to, the series and parallel structural forms of six groups of optical isolation drive semiconductor device strings.

[0054] In summary, by means of the above technical solution of the present invention, the following effects can be achieved: The laser diode array PCB board 15 is driven by inputting a trigger signal in advance. Using a laser diode as the light source of the semiconductor device 12, it can drive the semiconductor device 12 by using the received optical signal from the laser diode array PCB board 15, without the need for a transmission optical fiber and a high-power laser. At the same time, the series and parallel metal plates 2 can be used to connect the optically isolated drive semiconductor devices 1 in parallel on the same layer, as well as to connect the optically isolated drive semiconductor devices 1 in series on the upper and lower layers, significantly reducing the application cost of the optically isolated drive semiconductor devices and improving the economy of the optically isolated drive semiconductor devices.

[0055] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A series-parallel structure of an optically isolated drive semiconductor device, characterized in that, Comprising: A fixture metal plate (5) adapted to the setting, the fixture metal plates (5) are fixedly connected by screws (3) and nuts (4), and a plurality of optically isolated drive semiconductor devices (1) are provided between the fixture metal plates (5). The plurality of optically isolated drive semiconductor devices (1) are electrically connected through series-parallel metal plates (2) respectively, and metal electrode plates (7) are installed at the input and output ends of the electrically connected optically isolated drive semiconductor devices (1). Insulators (6) are provided between the metal electrode plates (7) and the fixture metal plates (5). One side of the optically isolated drive semiconductor device (1) is electrically connected to a drive board (8) respectively, and the plurality of drive boards (8) are fixedly connected by support columns (9) respectively.

2. The series-parallel structure of an optically isolated drive semiconductor device according to claim 1, characterized in that, The optically isolated drive semiconductor device (1) comprises: a metallized ceramic package (10), A semiconductor component (12) and a cathode metal electrode (13) are provided in the metallized ceramic package (10). Among them, the anode of the semiconductor component (12) is attached to the metallized ceramic package (10), the cathode of the semiconductor component (12) is attached to the cathode metal electrode (13), a through hole (19) is formed in the cathode metal electrode (13), a lens (14) is installed in the through hole (19), and a cathode metal extension (17) is provided at the top of the cathode metal electrode (13). A laser diode array PCB board (15) is provided between the cathode metal electrode (13) and the cathode metal extension (17). The output end of the laser diode array PCB board (15) is adapted to the through hole (19), and the cathode metal electrode (13) and the cathode metal extension (17) are fixed by a fastening screw (18).

3. The series-parallel structure of an optically isolated drive semiconductor device according to claim 2, characterized in that, The metallized ceramic package (10) comprises: a ceramic part (11) and an anode metal part (16). Among them, the anode of the semiconductor component (12) is attached to the anode metal part (16), and the cathode of the semiconductor component (12) is attached to the cathode metal electrode (13).

4. The series-parallel structure of an optically isolated drive semiconductor device according to claim 3, wherein The ceramic part (11) is located on one side of the metallized ceramic package (10) and is arranged in a ring shape, and the anode metal part (16) is located at the bottom end of the metallized ceramic package (10).

5. The series and parallel structure of an optically isolated drive semiconductor device according to claim 2, characterized in that, The semiconductor component (12) is provided with optical windows, and the optical windows are evenly distributed on the cathode of the semiconductor component (12).

6. The series-parallel structure of an optically isolated drive semiconductor device according to claim 5, characterized in that The through hole (19) is adapted to the optical window, and the diameter of the through hole (19) is larger than the diameter of the optical window.

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