Wireless optical communication module

Abstract

The wireless optical communication module comprises an optical transmitting assembly, an optical receiving assembly and an optical fiber interface, and further comprises a wireless communication chip, a driving chip and a trans-impedance amplifier, the wireless communication chip is respectively connected with the input end of the driving chip and the output end of the trans-impedance amplifier, the output end of the driving chip is connected with the input end of the optical transmitting assembly, and the output end of the trans-impedance amplifier is connected with the input end of the optical receiving assembly. The input end of the transimpedance amplifier is connected with the output end of the optical receiving assembly, and the output end of the optical transmitting assembly and the input end of the optical receiving assembly are connected with the optical fiber interface. The wireless communication module is wirelessly connected with an external data center through the wireless communication chip, so that the problems of unreliable data transmission and the like caused by physical connection of the existing optical communication module are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of optical communication, in particular to a wireless optical communication module. Background Art

[0002] As the core device of optical fiber communication, the optical communication module is widely used in fields such as data centers, Ethernet, and optical transmission networks. With the explosion of technologies such as 5G, blockchain, cloud computing, Internet of Things, and AI, the requirements for the rate and stability of data transmission are also continuously increasing, and the characteristics of high-speed and long-distance data transmission of the optical communication module can just meet this demand. The current optical communication module, such as the SFP optical module, generally sets a gold finger interface and is connected to the connector of the host through the gold finger interface. However, with the continuous improvement of the data transmission rate, this physical connection scheme of gold finger + connector gradually reveals the following disadvantages:

[0003] 1. There is insertion and extraction loss in physical connection, and it is easy to affect the stability and reliability of data transmission due to contact problems.

[0004] 2. The physical connection method will cause signal loss and signal jitter due to impedance matching problems, thus limiting the signal transmission rate.

[0005] 3. The physical connection method requires an open window to be reserved in the structure of the optical communication module, which is easy to get dusty and dirty, and there is a high risk of electrostatic discharge (ESD).

[0006] 4. The physical connection method belongs to direct electrical connection without isolation protection. Once a certain link is damaged, it is easy to cause the damage of the entire signal chain. Summary of the Utility Model

[0007] In view of the above deficiencies of the prior art, the purpose of the present utility model is to provide a wireless optical communication module, which is connected to the host in a wireless manner.

[0008] To achieve the above purpose, the technical solution adopted by the present utility model is:

[0009] A wireless optical communication module includes an optical emission component, an optical reception component, and an optical fiber interface, and further includes a wireless communication chip, a driver chip, and a transimpedance amplifier. The wireless communication chip is respectively connected to the input end of the driver chip and the output end of the transimpedance amplifier. The output end of the driver chip is connected to the input end of the optical emission component, the input end of the transimpedance amplifier is connected to the output end of the optical reception component, and the output end of the optical emission component and the input end of the optical reception component are connected to the optical fiber interface.

[0010] Optionally, the wireless communication module includes a wireless transmission chip and a wireless reception chip. The wireless transmission chip is connected to the input end of the driver chip, and the wireless reception chip is connected to the output end of the transimpedance amplifier.

[0011] Optionally, it further includes a first serial-to-parallel converter and a second serial-to-parallel converter. The number of the wireless transmission chips and wireless reception chips is more than two. Each wireless transmission chip is connected to the input end of the first serial-to-parallel converter. The output end of the first serial-to-parallel converter is connected to the input end of the driving chip. The output end of the transimpedance amplifier is connected to the input end of the second serial-to-parallel converter. The output ends of the second serial-to-parallel converter are respectively connected to each wireless reception chip.

[0012] Optionally, it further includes a first serial-to-parallel converter and a second serial-to-parallel converter. The number of the wireless communication chips is more than two. The wireless transmission chips in each wireless communication chip are all connected to the input end of the first serial-to-parallel converter. The output end of the first serial-to-parallel converter is connected to the input end of the driving chip. The output end of the transimpedance amplifier is connected to the input end of the second serial-to-parallel converter. The output ends of the second serial-to-parallel converter are respectively connected to the wireless reception chips in each wireless communication chip.

[0013] Optionally, the number of the wireless communication chips is more than two. The number of the driving chips, optical emission components, transimpedance amplifiers, optical reception components and optical fiber interfaces is the same as that of the wireless communication chips. The wireless communication chips, driving chips, optical emission components, transimpedance amplifiers, optical reception components and optical fiber interfaces are connected in one-to-one correspondence to form multiple groups of data transmission links.

[0014] The beneficial effects of the present utility model are as follows: By setting the wireless communication chip and the cooperative connection between the wireless communication chip and other devices, a wireless connection is realized between the optical communication module and an external host (data center), and it has the following advantages:

[0015] 1. The wireless connection avoids direct contact, has a longer service life, is easier to disassemble and assemble, and the data transmission is more reliable.

[0016] 2. The wireless connection has no signal plugging loss, and impedance matching can be achieved at the wireless communication chip end, thus ensuring the signal transmission quality and enabling a higher-speed signal transmission.

[0017] 3. The wireless connection can realize the sealed structure design of the optical communication module, thereby ensuring that the internal operating environment of the module is not affected by external pollution such as dust and water vapor, and at the same time eliminating the electrostatic discharge (ESD) risk of the module.

[0018] 4. The wireless connection has the inherent advantage of signal isolation, ensuring the independence and security of each component of the signal chain. Description of the Drawings

[0019] Figure 1 The figure shows a connection schematic diagram of the wireless optical communication module according to an embodiment of the present utility model;

[0020] Figure 2 The figure shows an application schematic diagram of the wireless optical communication module according to the first embodiment of the present utility model;

[0021] Figure 3 The figure shows a connection schematic diagram of the wireless optical communication module according to the second embodiment of the present utility model;

[0022] Figure 4 The figure shows a connection schematic diagram of the wireless optical communication module according to the third embodiment of the present utility model. Specific embodiments

[0023] In order to more clearly understand the technical content, achieved objectives and effects of the present utility model, the present utility model will be described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be noted that, without conflict, the embodiments of the present utility model and the features in the embodiments can be combined with each other. Many specific details are set forth in the following description in order to fully understand the present utility model. The described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0024] Please refer to Figures 1-4 as shown in the figure, the technical solution provided by the present utility model:

[0025] A wireless optical communication module includes an optical transmitting component, an optical receiving component and an optical fiber interface, and further includes a wireless communication chip, a driving chip and a transimpedance amplifier. The wireless communication chip is respectively connected to the input end of the driving chip and the output end of the transimpedance amplifier. The output end of the driving chip is connected to the input end of the optical transmitting component. The input end of the transimpedance amplifier is connected to the output end of the optical receiving component. The output end of the optical transmitting component and the input end of the optical receiving component are connected to the optical fiber interface.

[0026] Specifically, the optical receiving component (Receiver Optical Sub-Assembly, ROSA) mainly completes the conversion of optical signals into electrical signals; the optical transmitting component (Transmiter Optical Sub-Assembly, TOSA) mainly completes the conversion of electrical signals into optical signals; the transimpedance amplifier (TIA) is used to amplify the electrical signals converted by the optical receiving component to a specified range; the driving chip (Driver) is used to convert data signals into driving signals for the optical transmitting component.

[0027] Optionally, the wireless communication module includes a wireless transmitting chip and a wireless receiving chip. The wireless transmitting chip is connected to the input end of the driving chip, and the wireless receiving chip is connected to the output end of the transimpedance amplifier.

[0028] Optionally, it further includes a first serial-parallel converter and a second serial-parallel converter. The number of the wireless transmission chips and the wireless reception chips is more than two. Each wireless transmission chip is connected to the input end of the first serial-parallel converter. The output end of the first serial-parallel converter is connected to the input end of the driving chip. The output end of the transimpedance amplifier is connected to the input end of the second serial-parallel converter. The output end of the second serial-parallel converter is respectively connected to each wireless reception chip.

[0029] Optionally, it further includes a first serial-parallel converter and a second serial-parallel converter. The number of the wireless communication chips is more than two. The wireless transmission chips in each wireless communication chip are all connected to the input end of the first serial-parallel converter. The output end of the first serial-parallel converter is connected to the input end of the driving chip. The output end of the transimpedance amplifier is connected to the input end of the second serial-parallel converter. The output end of the second serial-parallel converter is respectively connected to the wireless reception chips in each wireless communication chip.

[0030] As can be seen from the above description, by setting the serial-parallel converter to perform serial-parallel conversion of data, only one set of optical fiber interfaces is needed to complete large data bandwidth. The large data transmission is realized by multiple groups of wireless transmission chips and wireless reception chips. Specifically, multiple wireless communication chips integrated with one wireless transmission chip and one wireless reception chip can be adopted, or wireless communication chips integrated with multiple groups of wireless transmission chips and wireless reception chips can be adopted.

[0031] Optionally, the number of the wireless communication chips is more than two. The number of the driving chips, the optical transmitting components, the transimpedance amplifiers, the optical receiving components and the optical fiber interfaces is the same as that of the wireless communication chips. The wireless communication chips, the driving chips, the optical transmitting components, the transimpedance amplifiers, the optical receiving components and the optical fiber interfaces are connected in one-to-one correspondence to form multiple groups of data transmission links.

[0032] As can be seen from the above description, by setting multiple groups of driving chips + optical transmitting components, transimpedance amplifiers + optical receiving components, and optical fiber interfaces, large data bandwidth is realized by using multi-channel optical fibers, and the design complexity of the actual product is reduced.

[0033] Please refer to Figure 1 and 2 , the first embodiment of the present utility model is:

[0034] A wireless optical communication module 100 includes an optical transmitting component (TOSA), an optical receiving component (ROSA), and an optical fiber interface, and further includes a wireless communication chip, a driver chip (Driver), and a transimpedance amplifier (TIA). The wireless communication chip is respectively connected to the input end of the driver chip (Driver) and the output end of the transimpedance amplifier (TIA). The output end of the driver chip (Driver) is connected to the input end of the optical transmitting component (TOSA). The input end of the transimpedance amplifier (TIA) is connected to the output end of the optical receiving component (ROSA). The output end of the optical transmitting component (TOSA) and the input end of the optical receiving component (ROSA) are connected to the optical fiber interface. The wireless communication chip communicates with the wireless communication chip of an external data center. As Figure 1 shown.

[0035] As Figure 2 shown is an actual application mode of the wireless optical communication module of this embodiment. Two wireless optical communication modules 100 are used to transmit data between data center 1 and data center 2. The optical fiber interfaces of the two wireless optical communication modules 100 are connected to each other. The wireless communication chip of one wireless optical communication module 100 communicates with the wireless communication chip of data center 1, and the wireless communication chip of the other wireless optical communication module 100 communicates with the wireless communication chip of data center 2.

[0036] Please refer to Figure 3 , and the second embodiment of the present utility model is:

[0037] A wireless optical communication module 100, different from the first embodiment in that it further includes a first serializer / deserializer (Serdes1) and a second serializer / deserializer (Serdes2). The wireless communication module includes a wireless transmitting chip (TX) and a wireless receiving chip (RX). The number of the wireless transmitting chips (TX) and the wireless receiving chips (RX) is the same and more than two. Each wireless transmitting chip (TX) is connected to the input end of the first serializer / deserializer (Serdes1). The output end of the first serializer / deserializer (Serdes1) is connected to the input end of the driver chip (Driver). The output end of the transimpedance amplifier (TIA) is connected to the input end of the second serializer / deserializer (Serdes2). The output end of the second serializer / deserializer (Serdes2) is respectively connected to each wireless receiving chip (RX). Each wireless transmitting chip (TX) communicates with the wireless receiving chip (RX) of an external data center, and each wireless receiving chip (RX) communicates with the wireless transmitting chip (TX) of an external data center.

[0038] The serializer / deserializer in this embodiment is mainly responsible for the serial-parallel conversion of data. The wireless optical communication module of this embodiment can complete a large data bandwidth, such as 100 Gbps, with a group of optical fiber interfaces.

[0039] Please refer to Figure 4 , and the third embodiment of the present utility model is as follows:

[0040] A wireless optical communication module 100, which is different from the first embodiment in that the wireless communication module includes a wireless transmission chip (TX) and a wireless reception chip (RX). The wireless transmission chip (TX) is connected to the input end of the driving chip (Driver), and the wireless reception chip (RX) is connected to the output end of the transimpedance amplifier (TIA). The number of the wireless communication chips is more than two, and the numbers of the driving chip (Driver), the optical transmitting component (TOSA), the transimpedance amplifier (TIA), the optical receiving component (ROSA), and the optical fiber interface are the same as the number of the wireless communication chips. The wireless communication chips, the driving chip (Driver), the optical transmitting component (TOSA), the transimpedance amplifier (TIA), the optical receiving component (ROSA), and the optical fiber interface are connected in one-to-one correspondence to form multiple groups of data transmission links. Each wireless transmission chip (TX) is communicatively connected to the wireless reception chip (RX) of an external data center, and each wireless reception chip (RX) is communicatively connected to the wireless transmission chip (TX) of the external data center.

[0041] This embodiment uses multi-channel optical fibers to achieve large data bandwidth, and sets multiple groups of driving chip + optical transmitting component, transimpedance amplifier + optical receiving component, and optical fiber interface. Since there is no ultra-high-speed serial-parallel converter, the product design complexity will be reduced.

[0042] In summary, the wireless optical communication module of the present utility model uses wireless connection with an external host (data center) and has the following advantages:

[0043] 1. Wireless connection avoids direct contact, has a longer service life, is easier to disassemble and assemble, and data transmission is more reliable.

[0044] 2. Wireless connection has no signal plugging loss, and impedance matching can be achieved at the wireless communication chip end, thus ensuring the signal transmission quality and enabling higher-rate signal transmission.

[0045] 3. Wireless connection can realize the sealed structure design of the optical communication module, thus ensuring that the internal operating environment of the module is not affected by external pollution such as dust and water vapor, and at the same time eliminating the electrostatic discharge (ESD) risk of the module.

[0046] 4. Wireless connection has the inherent advantage of signal isolation, ensuring the independence and security of each component of the signal chain.

[0047] The above are only embodiments of the present utility model, and thus do not limit the patent scope of the present utility model. Therefore, any modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the content of the technical solution of the present utility model still fall within the scope of the technical solution of the present utility model.

Claims

1. A wireless optical communication module, comprising an optical transmitting component, an optical receiving component and an optical fiber interface, characterized in that, It further includes a wireless communication chip, a driver chip, and a transimpedance amplifier. The wireless communication chip is respectively connected to the input end of the driver chip and the output end of the transimpedance amplifier. The output end of the driver chip is connected to the input end of the optical emission component, and the input end of the transimpedance amplifier is connected to the output end of the optical reception component. The output end of the optical emission component and the input end of the optical reception component are connected to the optical fiber interface.

2. The wireless optical communication module according to claim 1, wherein The wireless communication chip includes a wireless transmission chip and a wireless reception chip. The wireless transmission chip is connected to the input end of the driver chip, and the wireless reception chip is connected to the output end of the transimpedance amplifier.

3. The wireless optical communication module according to claim 2, wherein It further includes a first serial-to-parallel converter and a second serial-to-parallel converter. The number of the wireless transmission chips and the wireless reception chips is more than two. Each wireless transmission chip is connected to the input end of the first serial-to-parallel converter. The output end of the first serial-to-parallel converter is connected to the input end of the driver chip. The output end of the transimpedance amplifier is connected to the input end of the second serial-to-parallel converter. The output end of the second serial-to-parallel converter is respectively connected to each wireless reception chip.

4. The wireless optical communication module according to claim 3, wherein It further includes a first serial-to-parallel converter and a second serial-to-parallel converter. The number of the wireless communication chips is more than two. The wireless transmission chips in each wireless communication chip are all connected to the input end of the first serial-to-parallel converter. The output end of the first serial-to-parallel converter is connected to the input end of the driver chip. The output end of the transimpedance amplifier is connected to the input end of the second serial-to-parallel converter. The output end of the second serial-to-parallel converter is respectively connected to the wireless reception chips in each wireless communication chip.

5. The wireless optical communication module according to claim 2, characterized in that, The number of the wireless communication chips is more than two. The number of the driver chip, the optical emission component, the transimpedance amplifier, the optical reception component, and the optical fiber interface is the same as that of the wireless communication chips. The wireless communication chips, the driver chip, the optical emission component, the transimpedance amplifier, the optical reception component, and the optical fiber interface are connected in one-to-one correspondence to form multiple groups of data transmission links.

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